CN109328487B - Electronic device - Google Patents
Electronic device Download PDFInfo
- Publication number
- CN109328487B CN109328487B CN201780038298.7A CN201780038298A CN109328487B CN 109328487 B CN109328487 B CN 109328487B CN 201780038298 A CN201780038298 A CN 201780038298A CN 109328487 B CN109328487 B CN 109328487B
- Authority
- CN
- China
- Prior art keywords
- cooling target
- wall
- flow path
- air blowing
- cover wall
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20145—Means for directing air flow, e.g. ducts, deflectors, plenum or guides
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
- H05K7/20172—Fan mounting or fan specifications
Abstract
An electronic device according to an embodiment includes: a cooling target unit disposed in the housing and including a 1 st cooling target portion and a 2 nd cooling target portion; and a flow path guide portion disposed above the unit to be cooled, having a wall-like member dividing a space in the housing into a plurality of sections, and forming a 1 st flow path passing through the 1 st section to be cooled and a 2 nd flow path passing through the 2 nd section to be cooled.
Description
Technical Field
Embodiments of the present invention relate to an electronic device.
Background
For example, in an electronic apparatus, a structure is known in which a cooling target portion such as a CPU and a cooling device for cooling the cooling target portion are provided in a casing. Further, an electronic apparatus in which cooling target portions are provided at a plurality of locations is also known.
Documents of the prior art
Patent document
Patent document 1: japanese laid-open patent publication No. 6-125187
Patent document 2: japanese laid-open patent application No. 2010-198185
Disclosure of Invention
Embodiments of the present invention aim to provide an electronic device with high cooling performance.
An electronic device according to an embodiment is disposed in a case, and includes: a cooling target unit provided with a 1 st cooling target part and a 2 nd cooling target part; and a flow path guide unit disposed above the unit to be cooled, having a wall-shaped member dividing a space in the casing into a plurality of sections, and forming a 1 st flow path passing through the 1 st section to be cooled and a 2 nd flow path passing through the 2 nd section to be cooled.
Drawings
Fig. 1 is a perspective view showing a configuration of an electronic device according to an embodiment.
Fig. 2 is a plan view of the electronic apparatus.
Fig. 3 is a sectional view showing a configuration of a part of the electronic apparatus.
Fig. 4 is a perspective view showing a configuration of a flow path guide unit of the electronic apparatus.
Fig. 5 is a plan view showing a configuration of a flow path guide unit of the electronic apparatus.
Detailed Description
The configuration of the electronic device 10 according to an embodiment of the present invention will be described below with reference to fig. 1 to 5. Fig. 1 is a perspective view showing a configuration of an electronic device 10 according to an embodiment, and fig. 2 is a plan view of the electronic device 10. Fig. 3 is a sectional view showing a configuration of a part of the electronic apparatus 10. Fig. 4 is a perspective view showing the structure of the flow path guide section 20, and fig. 5 is a plan view showing the structure of the flow path guide section 20.
In the drawings, the top plate is omitted for the sake of explanation, and the internal structure of the housing is shown. In the figure, arrows X, Y, Z indicate mutually orthogonal 3 directions, X being along the 1 st direction, Y being along the 2 nd direction, and Z being along the 3 rd direction, respectively. In the present embodiment, the orientation in which the bottom plate is provided below is shown as an example in terms of the directions of up, down, left, right, front, and the like, but it may be changed as appropriate depending on the orientation of the electronic device 10.
As shown in fig. 1 and 2, the electronic device 10 includes: a housing 11; a substrate unit 12 and an HDD unit 13 as cooling target units; an IC chip unit 15; a power supply unit 16; a cooling unit 17; and a flow path guide section 20.
The housing 11 includes, for example: a rectangular bottom plate 11 a; a front side plate 11 b; a pair of left and right side plates 11c, 11 d; a rear side plate 11 e; and a top plate 11f disposed opposite to the bottom plate 11 a. The housing 11 is formed as a rectangular parallelepiped housing space 11g surrounded by a bottom plate 11a, a top plate 11f, and 2 sets of side plates 11b to 11 e. The housing 11 accommodates various electronic components such as the HDD unit 13, the cooling unit 17, and the board unit 12 in the accommodation space 11 g.
The front side plate 11b includes a ventilation structure portion 31 having a plurality of ventilation holes and configured to be capable of air suction, and also includes a disk port for an optical disk drive, an insertion port for the HDD unit 13, and various terminals to which various lines such as USB are connected.
The rear side plate 11e includes a ventilation structure portion 31 having a plurality of ventilation holes, and various terminals to which various lines such as USB are connected.
A plurality of HDD units 13 are arranged in parallel in the X direction on one end side in the storage space 11 g. Further, in the housing space 11g, the cooling unit 17 is provided adjacent to the rear of the HDD unit 13. In the housing space 11g, the substrate unit 12 is disposed behind the cooling unit 17.
The HDD unit 13 includes a plurality of HDDs and HDD housings that fix the HDDs, respectively. A cooling unit 17 is disposed behind the HDD unit 13, in other words, on the secondary side of the air flow path. A ventilation path is formed from the ventilation structure portion 31 of the front side plate 11b to the air intake portion of the cooling unit 17. Here, in the air flow path, the upstream side in the air blowing direction is referred to as the primary side, and the downstream side is referred to as the secondary side.
As shown in fig. 1 to 4, the cooling unit 17 includes a fan base 32 disposed on the bottom plate 11a of the casing 11, and a plurality of fan units 34a to 34c supported by the fan base 32. In the present embodiment, 31 st fan units 34a, 2 nd fan units 34b, and 3 rd fan units 34c are arranged in parallel in the X direction.
The fan base 32 is a frame disposed on the bottom plate 11a of the casing 11, and has a plurality of fan housing portions for fixing the fan units 34a to 34c, respectively.
Each of the fan units 34a to 34c includes a fan cover 35 having an air-supply opening 35a, and an air-supply fan 36 disposed in the fan cover 35. The blower fan 36 is connected to an output shaft of the fan motor and is rotationally driven. The cooling unit 17 includes an air inlet on the HDD unit 13 side and an air outlet 35a on the opposite side. In the present embodiment, the 1 st fan unit 34a and the 2 nd fan unit 34b are disposed to face the substrate unit 12, and the 3 rd fan unit 34c is disposed to face the IC chip unit 15.
The substrate unit 12 includes: a substrate 41 disposed above a bottom plate 11a serving as a bottom of the housing 11; a 1 st CPU unit 42 mounted above the substrate 41; a 2 nd CPU unit 43 disposed on the secondary side of the 1 st CPU unit 42; and a RAID card unit 44 disposed behind the 1 st CPU unit 42 and on the side of the 2 nd CPU unit 43. In the present embodiment, the substrate 41 or the 1 st CPU unit 42 above the substrate 41 is the 1 st cooling target portion, the 2 nd CPU unit 43 is the 2 nd cooling target portion, and the RAID card unit 44 is the 3 rd cooling target portion.
The substrate 41 is a PCB substrate, and is disposed parallel to the bottom plate 11a along the XY plane.
The 1 st CPU unit 42 is disposed near the air blowing port 35a of the 2 nd fan unit 34 b. The 1 st CPU unit 42 includes a 1 st CPU45 mounted on the substrate 41 and a 1 st heat sink 47 mounted on the 1 st CPU 45. The 1 st heat sink 47 includes a plurality of heat dissipating fins erected at a predetermined pitch Pt 1.
The 2 nd CPU unit 43 is located behind the 1 st fan unit 34a on the right side and is disposed behind the 1 st CPU unit 42.
The 2 nd CPU unit 43 includes a 2 nd CPU46 mounted on the substrate 41 and a 2 nd heat sink 48 mounted on the 2 nd CPU 46. The 2 nd heat radiation fin 48 includes a plurality of heat radiation fins erected at a predetermined pitch Pt 2. The upper ends of the 2 nd fins 48 are arranged at predetermined positions higher than the 1 st fins 47.
The RAID card unit 44 is disposed behind the 1 st CPU unit 42. The RAID card unit 44 is provided upright on the substrate 41, and includes a plurality of RAID cards 44a on which various electronic components are mounted. The upper end of the RAID card 44a is higher than the upper end of the 1 st heat sink 47, for example, and has the same height as the upper end of the 2 nd heat sink 48.
The flow path guide 20 is molded from a transparent resin material having excellent heat resistance and workability. The flow path guide 20 is formed in accordance with the outer shape of the substrate unit 12, and integrally includes a plurality of wall-like members that cover the substrate unit 12 and divide the flow path into a plurality of sections. The passage guide 20 is disposed on the substrate unit 12, and has a plurality of passages F1, F2, and F3 formed therein, which pass through the substrate unit 12 from the cooling unit 17 and pass rearward.
The flow path guide 20 is integrally provided with: a 1 st cover wall 21, the 1 st cover wall 21 being a partition wall disposed on the 1 st heat sink 47 on the secondary side of the 2 nd fan unit 34 b; a duct section 22 that partitions a 2 nd flow path from the secondary side of the 1 st fan unit 34a to the 2 nd fin 48; the power supply cover 23 covers the power supply unit.
The 1 st cover wall 21 is a plate-like member extending in the height direction while intersecting the secondary side of the air blowing port 35a of the 2 nd fan unit 34b, and partitions a space vertically. The 1 st cover wall 21 is arranged along the XY plane in accordance with the height of the vicinity of the center of the blowing port 35a of the 2 nd fan unit 34b in the Z direction. The 1 st cover wall 21 is disposed to face the upper end of the 1 st heat sink 47 with a slight gap therebetween. A plurality of attachment pieces to which the housing 11 is connected by a coupling member are provided at an end portion of the 1 st cover wall 21.
The 1 st cover wall 21 has a throttle portion 21a slightly forward of the center portion of the 1 st CPU 45. The throttle portion 21a is formed by a level difference that continues through a part of the 1 st cover wall 21 inclined downward. That is, the surfaces of the 1 st lid wall 21 having different heights are continued by the throttle portion 21a as an inclined surface. The distance of the gap between the 1 st fin 47 on the secondary side and the 1 st cover wall 21 is also reduced as compared with the throttle portion 21 a. In the rear portion of the throttle portion 21a, for example, the distance S1 between the 1 st fin 47 and the 1 st cover wall 21 is configured to be narrower than the fin pitch Pt1 of the fins.
A 1 st guide rib 21b and a 2 nd guide rib 21c are formed upright on the upper surface of the 1 st cover wall 21. The 1 st guide rib 21b and the 2 nd guide rib 21c have a predetermined thickness, and are wall-like members extending obliquely so as to be displaced toward the center side toward the rear. The 1 st guide rib 21b and the 2 nd guide rib 21c are formed to have the same height as the 2 nd cover wall 24. A 1 st opening 21d is formed between the 1 st guide rib 21b and the 2 nd guide rib 21c, which are disposed at a predetermined distance from each other and through which cooling air can pass.
On the lower side of the 1 st cover wall 21, the 1 st flow path F1 from the cooling unit 17 to the 1 st fin 47 is formed.
The duct portion 22 includes a 2 nd cover wall 24, and a pair of guide side walls 25 and 26 disposed on both side edges of the 2 nd cover wall 24. The duct portion 22 forms a 2 nd flow path F2 from the vicinity of the air blowing port 35a of the 1 st fan unit 34a to the 2 nd fins 48.
The 2 nd cover wall 24 is disposed in front of the air blowing port 35a of the 1 st fan unit 34a and at a height position higher than the air blowing port 35 a. The 2 nd cover wall 24 is a wall-like member arranged to intersect the height direction and dividing the space into upper and lower sections. The 2 nd lid wall 24 is disposed above the 1 st lid wall 21 by a predetermined distance and extends parallel to the bottom plate 11a along the XY plane.
A throttle portion 24a is formed at a position facing a predetermined position forward of the center of the 2 nd CPU unit 43 of the 2 nd cover wall 24. The throttle portion 24a is formed by a step that is inclined and lowered so as to be lowered in position at a predetermined portion of the 2 nd cover wall 24. The region behind the throttle portion 24a of the 2 nd cover wall 24 is disposed to face the upper end of the 2 nd heat sink 48 with a slight gap. At the secondary side than the throttle portion 24a, a distance S2 between the 2 nd fin 48 and the 2 nd cover wall 24 is set narrower than a pitch Pt2 of the heat radiating fins of the 2 nd fin 48.
The guide side walls 25 and 26 are wall-shaped members extending along the ZY plane, and divide a space into a plurality of spaces in the X direction, which is a parallel direction of the blower fans. One guide sidewall 25 (1 st sidewall) extends downward from one side edge of the 2 nd lid wall 24. The guide sidewall 25 is divided at two places, and has a front sidewall 25a and a rear sidewall 25 b. The lower end of the front wall 25a of the guide wall 25 extends to a part of the other side edge of the 1 st lid wall 21. In other words, the front wall 25a of the guide wall 25 is erected from the side edge of the 1 st cover wall 21. A 2 nd opening 25c having a predetermined width is formed between the front wall 25a and the rear wall 25 b. The 2 nd flow path F2 in the duct portion 22 communicates with the space above the 1 st cover wall 21 through the 2 nd opening 25 c. The other guide sidewall 26 is formed to span the entire length of the 2 nd lid wall 24.
A 2 nd flow path F2 from the 1 st fan unit 34a to the 2 nd fin 48 is formed below the duct portion 22 in a region surrounded by the guide sidewalls 25, 26.
At the rear of the guide sidewall 25, there are integrally provided: a rear side wall 25b as an inner wall along the side walls of the 2 nd fin 48; a bottom wall portion 25d of a predetermined width extending along the outer side of the rear wall 25 b; and an outer wall portion 25e erected from the other end of the bottom wall portion 25d, forming a double structure. The guide sidewall 25 has a predetermined width. The guide side wall 25 guides the air blowing direction by narrowing the gap between the 2 nd heat sink 48 and the RAID card unit 44 so that the air is suppressed from escaping from the gap, and the RAID card unit 44 is cooled efficiently.
On the outside of the guide sidewall 25, a 3 rd flow path F3 is formed from the vicinity of the blowing port 35a of the 2 nd fan unit 34b to the RAID card unit 44 through the upper side of the 1 st cover wall 21.
The guide sidewall 26 (the 2 nd sidewall) integrally includes: inner wall portions 26c along the side portions of the 2 nd fins 48; and an outer wall portion 26e opposed to the bottom wall portion 26d having a predetermined width and an inner wall portion 26c provided upright from the other end of the bottom wall portion 26 d. The guide sidewall 26 has a predetermined width that fills the gap between the No. 2 heat sink 48 and the power supply unit 16. The air-guiding wall 26 guides the air-blowing direction so that the air is suppressed from escaping from the gap, and the 2 nd heat dissipation fins 48 are effectively cooled. The upper end edge of the outer wall portion 26e is continuous at the power supply housing portion 23.
The throttle portion 24a is inclined so as to be displaced toward the center of the duct portion 22 toward the inner wall portion 26c of the guide side wall 26. That is, in the throttle portion 24a, the flow path of the duct portion 22 is configured to pass through the inner wall portion 26c, and to be narrowed in the X direction in addition to the Z direction, so that the flow velocity is increased.
The power supply cover 23 is a plate-like member that faces and covers the upper side of the power supply unit 16. A plurality of attachment pieces for coupling the case 11 with a coupling member are provided at an end edge portion of the power supply cover 23.
The flow path guide 20 configured as described above is covered from above the substrate unit 12, and is fixed to the housing 11 by a fastening member such as a bolt at the plurality of attachment pieces 28 provided at the outer peripheral portion.
The shape and size of each part of the flow path guide 20 are determined based on the air blowing allocation ratio according to the heat generation amounts of the plurality of cooling target parts. That is, the air flows from the 2 fan units 34a, 34b are set to be guided to the 3 flow paths F1, F2, F3 in proportion to the amounts of heat generation of the respective units 42, 43, 44. Here, for example, the heat generation amount of the 1 st CPU unit 42 is about the same as that of the 2 nd CPU unit 43, and the heat generation amount of the RAID card unit 44 is about 1/3.
In the present embodiment, the fan motor 55 is rotationally driven by the control unit, and air is sucked into the fan cover from the air inlet after passing through the air passage on the air suction side formed above and below the HDD unit 13, and is blown rearward from the air blowing port 35a toward the board unit 12.
At this time, the air sent from the air outlet 35a is guided to the guide 20 by a flow path provided in front of the air outlet 35 a. That is, the air from the 2 fan units 34a and 34b is divided vertically by the 1 st cover wall 21 on one side and is guided to the duct portion 22 on the other side.
The air guided above the 1 st cover wall 21 is also guided by the 1 st guide rib 21b and the 2 nd guide rib 21c, and is partly guided from the 1 st opening 21d to the 3 rd flow path F3 and partly guided from the 2 nd opening 25c into the duct portion 22. The air guided to the 1 st flow path F1 cools the 1 st CPU unit 42. Further, the air guided to the 2 nd flow path F2 cools the 2 nd CPU unit 43. And the air directed to flow path 3F 3 cools the RAID card unit 44.
In this case, the throttle portions 21a and 24a formed in the 1 st and 2 nd cover walls 21 and 24 can increase the flow velocity of the air, thereby improving the cooling performance particularly in the portion where the amount of heat generation is large.
According to the electronic apparatus 10 configured as described above, by providing the flow path guide 20 that covers the substrate unit 12 and divides the flow path into a plurality of flow paths, the amount of air from the cooling unit 17 can be appropriately distributed to the cooling target at a plurality of locations, and effective cooling can be achieved.
Specifically, the duct portion 22 and the 1 st cover wall 21 divide the air flow in the vertical direction and the horizontal direction, and thereby the air flow can be effectively guided to the fins provided at different positions.
Further, by setting the height of the secondary-side 2 nd fins 48 to be higher than that of the primary-side 1 st fins 47, a desired air volume can be distributed to the secondary-side 2 nd fins 48. That is, for example, in general, in the arrangement in which a plurality of fins having the same height are arranged in parallel in the front-rear direction, the air warmed by the 1 st fin 47 on the primary side is supplied to the fins on the secondary side, and therefore the cooling efficiency is lowered, but according to the present embodiment, the cold air can be reliably supplied to the 2 nd fin 48 on the secondary side.
In the above embodiment, the cooling effect can be improved by covering the upper portions of the heat radiating fins 47 and 48 with the 1 st cover wall 21 and the 2 nd cover wall 24, thereby suppressing the upward dissipation of the cooling air. Also, by raising the flow velocity at a desired portion of high heat generation amount by forming the throttles 21a, 24a at the 1 st and 2 nd head walls 21, 24, efficient cooling is made possible.
In the present embodiment, although the plurality of fan units 34a and 34b are arranged in parallel, the configuration in which the 1 st flow path F1 and the 2 nd flow path F2 communicate with the fan units 34a and 34b, respectively, makes it possible to distribute the cool air of the remaining fan units 34a and 34b and maintain the cooling performance in the case where any of the fan units 34a and 34b fails.
In the above embodiment, for example, the guide sidewalls 25 and 26 have a double structure to eliminate the dead space, and the flow path guide 20 has a shape conforming to the outer shape of the substrate unit 12, so that the dissipation of the cooling air can be suppressed, and the cooling air can be effectively utilized.
Further, since the channel guide 20 is made of a transparent resin, the wiring state of the channel guide 20 can be checked even in the mounted state. Further, since the positions of the various lines can be defined in addition to the sections of the flow path by the plurality of wall-like members provided in the flow path guide 20, the workability of the wiring operation can be improved.
The present invention is not limited to the above-described embodiments.
For example, the passage guide 20 is made of a transparent resin material, but is not limited thereto, and may be made of another material such as metal.
For example, although the flow path guide 20 is formed in the above-described shape according to the shape of the substrate unit 12 or the amount of heat generated in each part in the above-described embodiment, the invention is not limited thereto. For example, the position or shape of the wall-like member can be appropriately changed according to the positional relationship or the number of the units 42, 43, and 44. In addition, the flow path can be increased or decreased depending on the position or the number of the cooling target portions.
Although the embodiments of the present invention have been described, these embodiments are given as examples and are not intended to limit the scope of the invention. These new embodiments can be implemented in other various embodiments, and various omissions, substitutions, and changes can be made without departing from the spirit of the invention. These embodiments and modifications thereof are included in the scope and gist of the invention, and are included in the scope equivalent to the invention described in the patent claims.
Claims (5)
1. An electronic device, wherein,
the disclosed device is provided with: a cooling target unit disposed in the housing and including a 1 st cooling target portion and a 2 nd cooling target portion;
a flow path guide section which is disposed above the cooling target unit, has a wall-like member dividing a space in the housing into a plurality of sections, and forms a 1 st flow path passing through the 1 st cooling target section and a 2 nd flow path passing through the 2 nd cooling target section; and
an air supply device is arranged on the air supply device,
the 1 st cooling target part is arranged at the downstream side of the air blowing direction of the air blowing device,
the 2 nd cooling target portion is disposed on the downstream side of the 1 st cooling target portion in the air blowing direction,
the 1 st cooling target portion and the 2 nd cooling target portion are disposed at overlapping positions when projected to the air blowing device toward the upstream side of the air blowing direction,
the flow path guide section includes: a 1 st side wall portion that divides a space on a downstream side in an air blowing direction of the air blowing device into a plurality of spaces along a 1 st direction intersecting the air blowing direction; a 1 st cover wall extending along one side of the 1 st side wall in the 1 st direction and covering an upper side of the 1 st cooling target portion; and a 2 nd cover wall extending along the other side of the 1 st side wall portion in the 1 st direction,
the 1 st side wall portion and the 2 nd cover wall extend further toward the downstream side in the air blowing direction than the 1 st part to be cooled, the 2 nd cover wall covers the 2 nd part to be cooled at a position on the downstream side in the air blowing direction, and the 1 st side wall portion covers a side of the 2 nd part to be cooled on the 1 st direction side,
the air supply device is provided with a plurality of air supply fans which are arranged in parallel in the 1 st direction,
the cooling target unit is a substrate unit having a substrate disposed at the bottom in the housing,
the 1 st cooling target part is a 1 st CPU unit provided with a 1 st CPU arranged above the substrate and a 1 st radiating fin arranged above the 1 st CPU,
the 2 nd cooling target portion is a 2 nd CPU unit including a 2 nd CPU arranged on the downstream side of the 1 st CPU of the substrate in the air blowing direction and a 2 nd radiating fin arranged above the 2 nd CPU and having a height higher than that of the 1 st radiating fin,
the 2 nd cover wall is provided at a position higher than the 1 st cover wall,
the 1 st flow path reaching the 1 st cooling target portion is formed below the 1 st lid wall,
the 1 st side wall portion extends downward from one side edge in the 1 st direction of the 2 nd cover wall and connects to the other side edge in the 1 st direction of the 1 st cover wall,
a 2 nd side wall part extending downward from the side edge of the 2 nd cover wall on the other side in the 1 st direction,
the 2 nd flow path extending from the other side in the 1 st direction of the 1 st flow path to the downstream side in the air blowing direction and reaching the 2 nd cooling target portion is formed by the duct portion constituted by the 2 nd cover wall, the 1 st side wall portion, and the 2 nd side wall portion.
2. The electronic device of claim 1,
the 1 st cover wall or the 2 nd cover wall includes a throttle portion that is displaced downward so as to narrow the 1 st flow path or the 2 nd flow path on the upstream side in the air blowing direction from the center of the 1 st cooling target portion or the 2 nd cooling target portion.
3. The electronic device of claim 1,
the 1 st side wall portion has a front side wall and a rear side wall, and has an opening that is provided between the space above the 1 st cover wall and the 2 nd flow path and that communicates the space above the 1 st cover wall and the 2 nd flow path below the 2 nd cover wall between the front side wall and the rear side wall,
a guide rib is provided as a wall-like member extending upward on the upper surface of the 1 st cover wall, and a downstream side in the air blowing direction of the guide rib extends toward the 2 nd flow path side and toward the opening of the 1 st side wall portion.
4. The electronic device of claim 1,
the flow path guide portion integrally has a plurality of wall-shaped members made of a transparent material, and integrally includes a mounting portion that connects the housing in a state of being covered from above the cooling target portion.
5. An electronic device, wherein,
the disclosed device is provided with: a cooling target unit disposed in the housing and including a 1 st cooling target portion and a 2 nd cooling target portion;
a flow path guide section which is disposed above the cooling target unit, has a wall-like member dividing a space in the housing into a plurality of sections, and forms a 1 st flow path passing through the 1 st cooling target section and a 2 nd flow path passing through the 2 nd cooling target section; and
an air supply device is arranged on the air supply device,
the 1 st cooling target part is arranged at the downstream side of the air blowing direction of the air blowing device,
the 2 nd cooling target portion is disposed on the downstream side of the 1 st cooling target portion in the air blowing direction,
the 1 st cooling target portion and the 2 nd cooling target portion are disposed at overlapping positions when projected to the air blowing device toward the upstream side of the air blowing direction,
the flow path guide section includes: a 1 st side wall portion that divides a space on a downstream side in an air blowing direction of the air blowing device into a plurality of spaces along a 1 st direction intersecting the air blowing direction; a 1 st cover wall extending along one side of the 1 st side wall in the 1 st direction and covering an upper side of the 1 st cooling target portion; and a 2 nd cover wall extending along the other side of the 1 st side wall portion in the 1 st direction,
the 1 st side wall portion and the 2 nd cover wall extend further toward the downstream side in the air blowing direction than the 1 st part to be cooled, the 2 nd cover wall covers the 2 nd part to be cooled at a position on the downstream side in the air blowing direction, and the 1 st side wall portion covers a side of the 2 nd part to be cooled on the 1 st direction side,
further comprising a 3 rd cooling target portion disposed on the downstream side in the air blowing direction from the 1 st cover wall and the 1 st cooling target portion,
the 1 st cover wall divides the space in the height direction,
a3 rd flow path is formed on the 1 st side wall portion in the 1 st direction, the 3 rd flow path passing through the 1 st cover wall and reaching a 3 rd cooling target portion.
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2016-216464 | 2016-11-04 | ||
| JP2016216464 | 2016-11-04 | ||
| PCT/JP2017/038206 WO2018084016A1 (en) | 2016-11-04 | 2017-10-23 | Electronic apparatus |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN109328487A CN109328487A (en) | 2019-02-12 |
| CN109328487B true CN109328487B (en) | 2020-06-05 |
Family
ID=62075793
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201780038298.7A Active CN109328487B (en) | 2016-11-04 | 2017-10-23 | Electronic device |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JP6730444B2 (en) |
| KR (1) | KR102149444B1 (en) |
| CN (1) | CN109328487B (en) |
| SG (1) | SG11201902293WA (en) |
| TW (1) | TWI669049B (en) |
| WO (1) | WO2018084016A1 (en) |
Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005063024A1 (en) * | 2005-12-30 | 2007-07-05 | Fujitsu Siemens Computers Gmbh | Air guide hood for cooling e.g. memory module, has flexible unit including strips arranged next to each other and bypassing gap between hood and heat-generating components, where free ends of strips have rounding or bending |
| JP2008147299A (en) * | 2006-12-07 | 2008-06-26 | Toshiba Corp | Cooling structure for heating body in electronic apparatus |
| JP2009200144A (en) * | 2008-02-20 | 2009-09-03 | Mitsubishi Electric Corp | Cooling apparatus |
| CN101644946A (en) * | 2008-08-08 | 2010-02-10 | 英业达股份有限公司 | Wind scooper |
| CN101959390A (en) * | 2009-07-20 | 2011-01-26 | 鸿富锦精密工业（深圳）有限公司 | Combined wind scooper |
| CN102781198A (en) * | 2011-05-10 | 2012-11-14 | 鸿富锦精密工业（深圳）有限公司 | Electronic product with wind scooper |
| JP2013016569A (en) * | 2011-07-01 | 2013-01-24 | Nippon Telegr & Teleph Corp <Ntt> | Cooling mechanism |
Family Cites Families (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3254756B2 (en) | 1992-10-13 | 2002-02-12 | 株式会社日立製作所 | Electronic equipment |
| US6643131B1 (en) * | 2002-10-10 | 2003-11-04 | First International Computer, Inc. | Wind guide device for CPU cooler |
| CN100543639C (en) * | 2005-11-01 | 2009-09-23 | 鸿富锦精密工业（深圳）有限公司 | Cooling system |
| US7768781B2 (en) * | 2007-12-18 | 2010-08-03 | Lenovo Singapore Pte. Ltd | Computer with improved cooling features |
| JP2010198185A (en) | 2009-02-24 | 2010-09-09 | Nec System Technologies Ltd | Cooling system, computer device, cooling fan control device, cooling fan control method, and cooling fan control program |
| US8369083B2 (en) * | 2010-02-16 | 2013-02-05 | Manufacturing Resources International, Inc. | System and method for selectively engaging cooling fans within an electronic display |
| JP5702962B2 (en) * | 2010-07-20 | 2015-04-15 | 株式会社東芝 | Heat dissipation structure of electronic equipment |
| JP5920074B2 (en) * | 2012-07-12 | 2016-05-18 | 富士通株式会社 | Cooling method of electronic equipment and heat generating parts |
-
2017
- 2017-10-23 WO PCT/JP2017/038206 patent/WO2018084016A1/en active Application Filing
- 2017-10-23 JP JP2018548946A patent/JP6730444B2/en active Active
- 2017-10-23 CN CN201780038298.7A patent/CN109328487B/en active Active
- 2017-10-23 SG SG11201902293WA patent/SG11201902293WA/en unknown
- 2017-10-23 KR KR1020187036199A patent/KR102149444B1/en active IP Right Grant
- 2017-10-24 TW TW106136461A patent/TWI669049B/en active
Patent Citations (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE102005063024A1 (en) * | 2005-12-30 | 2007-07-05 | Fujitsu Siemens Computers Gmbh | Air guide hood for cooling e.g. memory module, has flexible unit including strips arranged next to each other and bypassing gap between hood and heat-generating components, where free ends of strips have rounding or bending |
| JP2008147299A (en) * | 2006-12-07 | 2008-06-26 | Toshiba Corp | Cooling structure for heating body in electronic apparatus |
| JP2009200144A (en) * | 2008-02-20 | 2009-09-03 | Mitsubishi Electric Corp | Cooling apparatus |
| CN101644946A (en) * | 2008-08-08 | 2010-02-10 | 英业达股份有限公司 | Wind scooper |
| CN101959390A (en) * | 2009-07-20 | 2011-01-26 | 鸿富锦精密工业（深圳）有限公司 | Combined wind scooper |
| CN102781198A (en) * | 2011-05-10 | 2012-11-14 | 鸿富锦精密工业（深圳）有限公司 | Electronic product with wind scooper |
| JP2013016569A (en) * | 2011-07-01 | 2013-01-24 | Nippon Telegr & Teleph Corp <Ntt> | Cooling mechanism |
Also Published As
| Publication number | Publication date |
|---|---|
| KR20190008328A (en) | 2019-01-23 |
| WO2018084016A1 (en) | 2018-05-11 |
| JPWO2018084016A1 (en) | 2019-09-19 |
| JP6730444B2 (en) | 2020-07-29 |
| CN109328487A (en) | 2019-02-12 |
| SG11201902293WA (en) | 2019-05-30 |
| KR102149444B1 (en) | 2020-08-28 |
| TWI669049B (en) | 2019-08-11 |
| TW201831072A (en) | 2018-08-16 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| US8228671B2 (en) | Electronic apparatus including a cooling unit and a wall member | |
| US7426111B2 (en) | Communication apparatus and rack structure | |
| US8300409B2 (en) | Fan duct for electronic components of electronic device | |
| JP2012019212A (en) | Air guiding cover and electronic device having air guiding cover | |
| TW201408179A (en) | Airflow guiding member and electronic device having the same | |
| CN109328487B (en) | Electronic device | |
| JP2013074083A (en) | Shield box and image formation apparatus having the same | |
| CN109845425B (en) | Electronic device | |
| US20050189088A1 (en) | Circulation structure of heat dissipation device | |
| JP6942267B2 (en) | Outdoor unit | |
| JP7313555B2 (en) | Light irradiation device | |
| JP2019054055A (en) | Fan unit and electronic apparatus | |
| TWI812193B (en) | Desktop computer | |
| JP7309454B2 (en) | Electronic units and electronic equipment | |
| CN213841139U (en) | Outdoor unit of refrigeration cycle device | |
| TW202211776A (en) | Electronic device | |
| JP2022075116A (en) | Electronic apparatus | |
| CN114189976A (en) | Electronic device | |
| CN118012240A (en) | Cooling device for electronic equipment | |
| JP2014130869A (en) | Electronic apparatus housing device | |
| TW201143591A (en) | Heat dissipating apparatus |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |