JP7309454B2 - Electronic units and electronic equipment - Google Patents

Description

TECHNICAL FIELD Embodiments of the present invention relate to electronic units and electronic devices.

For example, among electronic devices, there is known a package-type electronic device in which a plurality of subracks, each having a plurality of electronic units housed in a subrack chassis, which is a box-shaped frame, are housed in a rack, which is a box-shaped frame. For example, a subrack is constructed by inserting a plurality of electronic units into a subrack chassis by sliding. Each electronic unit includes, for example, a substrate on which electronic components are mounted, and a heat sink provided with radiation fins on the electronic components serving as heat generators.

JP-A-2001-144236

The problem to be solved by the present invention is to provide an electronic unit and an electronic device that are excellent in heat dissipation.

In an electronic device according to an embodiment, a plurality of electronic units are arranged in parallel in a predetermined direction. The electronic unit includes a substrate, a heat-dissipating part, a heat-dissipating plate, and a guide plate . The heat-dissipating part has an electronic component arranged on one side surface of the substrate and a heat sink arranged on one side of the electronic component. A radiator plate is arranged to face one side of the substrate with the heat-dissipating target part interposed therebetween. The guide plate is fixed to the heat sink, has a shielding wall extending from the heat sink, and blocks a ventilation path formed around the heat-dissipating portion between the substrate and the heat sink. A part opens.

1 is a perspective view showing the configuration of a rack according to an embodiment; FIG. The perspective view which shows the structure of the subrack concerning the same embodiment. The side view of the electronic unit concerning the same embodiment. The side view of the same electronic unit. Sectional drawing of the same electronic unit. The perspective view which shows the structure of the guide plate of the same electronic unit.

An electronic unit 30 and an electronic device 1 according to an embodiment of the present invention will be described below with reference to FIGS. 1 to 6. FIG. FIG. 1 is a perspective view showing a schematic configuration of a rack 10 according to this embodiment, and FIG. 2 is a perspective view showing a schematic configuration of a sub-rack 20. As shown in FIG. FIG. 3 is a side view of the electronic unit 30 viewed from one side in the parallel direction, showing the internal configuration with a part of the heat sink 34 cut away. FIG. 4 is a side view of the electronic unit 30 viewed from one side of the Z axis. FIG. 5 is a cross-sectional view of the electronic unit 30, showing a state in which two electronic units 30 are arranged side by side. FIG. 6 is a perspective view showing the configuration of the guide plate 36. As shown in FIG. Arrows X, Y and Z in the drawing indicate three directions perpendicular to each other. In this embodiment, the parallel direction of the electronic units 30 is the X axis, the insertion direction is the Y axis, and the stacking direction of the subracks 20 is the Z axis.

As shown in FIGS. 1 and 2, the electronic device 1 includes a rack 10, a plurality of subracks 20 accommodated in the rack 10, a plurality of electronic units 30 accommodated in each subrack 20, and a plurality of A blower unit 40 is provided.

The rack 10 includes a rack case 11 configured in the shape of a rectangular housing that is open on at least one side. The rack case 11 includes two sets of side plates 11a and 11b arranged to face each other, and a flange 12 formed on the periphery of the opening. A plurality of sub-rack slots, which are spaces in which sub-racks can be accommodated, are formed in a predetermined direction inside the rack case 11 .

As an example, in the posture shown in FIG. 1, four stages of sub-rack slots are arranged in the vertical direction, and a sub-rack 20 is arranged in each sub-rack slot. A plurality of stages of sub-rack slots may be separated from each other by a partition plate or the like, or may be formed as one space. Subracks 20 are inserted and accommodated in some or all of the plurality of subrack slots.

The flange 12 is provided on the periphery of the opening formed on the primary side in the insertion direction. A plurality of fastening holes are formed in the flange 12 . The flange 12 is fastened to the flange 23 of the subrack 20 at the fastening hole by fastening members such as screws.

As shown in FIG. 2 , the subrack 20 includes a subrack chassis 21 and subrack rails 22 . The subrack chassis 21 is a rectangular box having two sets of side plates 21a and 21b arranged opposite to each other in the stacking direction of the subracks 20 and the parallel direction of the electronic units 30, and having an opening 21c in at least one of the insertion directions. structured in a body shape. A flange 23 is formed around the opening 21c of the subrack chassis 21 . In this embodiment, as an example, the subrack 20 has a configuration in which, for example, the electronic units 30 are horizontally arranged in eight rows in a subrack chassis 21 of, for example, a 19-inch type used for broadcasting.

A plurality of rows of sub-rack rails 22 are provided on the inner surfaces of a pair of side plates 21a of the sub-rack chassis 21, which are opposed to each other in the stacking direction of the sub-racks 20 and constitute a bottom wall portion and a top wall portion. The sub-rack rail 22 is, for example, a rib-shaped member extending along the insertion direction, guides the insertion direction of each electronic unit 30, and supports the sub-rack 20 by controlling its posture.

As an example, in the posture shown in FIG. 2 , a plurality of substrate slots are formed inside the subrack chassis 21 so as to be horizontally aligned and communicate with each other. The electronic units 30 are respectively inserted and housed in some or all of the plurality of board slots.

The flange 23 is formed along the periphery of the opening on one end side of the subrack chassis 21 . A plurality of fastening holes are formed in the flange 23, and the flange 23 is fixed to the flange 12 of the rack 10 by fastening members such as screws in the fastening holes.

In the accommodation space within the subrack chassis 21, the blower unit 40 is accommodated on the secondary side of the electronic unit 30 in the insertion direction. The blower unit 40 includes a plurality of blower fans 41 arranged adjacent to the secondary side in the insertion direction of the electronic unit 30 accommodated in the board slot.

The plurality of blower fans 41 are arranged in a plurality in the parallel direction of the electronic units 30, and have air outlets facing the electronic units 30 in front.

As shown in FIGS. 3 to 6, the electronic unit 30 includes a substrate 31 having a pair of opposing principal surfaces, an electronic component 32 mounted on one principal surface of the substrate 31, and a pair of electronic components 32 mounted on the electronic component 32. a pair of heat sinks 33 arranged in a pair of heat sinks 33, a heat dissipation plate 34 facing the substrate 31 with the electronic component 32 and the heat sink 33 interposed therebetween, a pair of heat transfer sheets 35 interposed between the heat dissipation plate 34 and the heat sink 33, respectively; A guide plate 36 as a guide member and a pair of side plates 37 are provided.

Each electronic unit 30 is arranged in a posture in which the substrate 31 and the heat sink 34 are erected along a plane perpendicular to the bottom wall of the subrack chassis 21 .

The board 31 is, for example, a PCB board having a pair of main surfaces, and a plurality of electronic components 32 are mounted on one of the main surfaces. The electronic component 32 is, for example, a heat-generating component such as a CPU. A connector 39 that engages with the subrack chassis 21 and an ejector 38 for facilitating insertion/removal of the substrate 31 are provided at the primary and secondary ends in the insertion direction of the substrate 31 .

A heat sink 33 is provided on the upper surface of at least one electronic component 32 among the electronic components 32 . The heat sink 33 has a plurality of heat radiation fins 33a arranged at a predetermined pitch. The radiation fins 33a are, for example, pin fins.

The radiator plate 34 is formed in the same rectangular plate shape as the substrate 31 and is made of a material with high thermal conductivity such as metal. The heat sink 34 has a predetermined thickness that can ensure desired heat dissipation, and is configured to be thicker than the substrate 31, for example. The heat sink 34 is arranged to face the substrate 31 with the electronic component 32 , the heat sink 33 and the heat transfer sheet 35 interposed therebetween. The radiator plate 34 is configured to be larger than, for example, the upper surfaces of the electronic component 32 and the heat sink 33 serving as heat-dissipating portions, and diffuses heat in the planar direction.

The heat transfer sheets 35 are arranged, for example, at the upper end portions of the two heat sinks 33 . Each heat transfer sheet 35 is made of a polymeric material having high thermal conductivity and high conformability. For example, the heat transfer sheet 35 is made of a cushioning material such as a gel sheet. In this embodiment, the heat transfer sheet 35 is configured in a rectangular shape similar to the heat sinks 33 . One surface of the heat transfer sheet 35 is in contact with the surface of the heat sink 34 on the substrate 31 side, and the other surface is in contact with the upper ends of the heat radiating fins 33 a of the heat sink 33 .

The guide plate 36 is composed of, for example, a bent metal plate material with high thermal conductivity, and includes a fixed piece 36a attached to the heat sink 34 and a plurality of shield walls 36b, 36c, and 36d extending from the fixed piece 36a. and are integrated.

The fixed piece 36a has, for example, a belt-like portion extending in the width direction of the substrate 31, and is fixed to the heat sink 34 with a fastening member such as a bolt.

The plurality of shielding walls 36b, 36c, and 36d extend toward the substrate 31 from predetermined positions on the edge of the fixed piece 36a on the primary side in the insertion direction. The shielding walls 36b, 36c, and 36d block the ventilation paths formed around the electronic component 32 and the heat sink 33, which are the parts to be cooled, between the substrate 31 and the radiator plate . The guide plate 36 is opened by notching the upper side of the heat sink 33 and the primary side in the insertion direction. That is, openings 36e and 36f are formed between the plurality of shielding walls 36b, 36c and 36d to allow ventilation.

The shielding walls 36 b , 36 c , 36 d block the air from the blower unit 40 and guide the air to pass through the openings 36 e , 36 f , thereby guiding the air to the heat sink 33 . That is, the guide plate 36 closes the airflow path between the heat sinks 33, suppresses the air from escaping into the gap, and narrows the airflow path to guide the airflow direction so that the heat sinks 33 are effectively cooled. The shielding walls 36b, 36c, and 36d are arranged in the vicinity of the edges on the primary side in the insertion direction of the electronic component 32 and the heat sink 33, which are the portions to be dissipated, on the secondary side in the blowing direction.

The guide plate 36 is mounted to cover one side of the heat sink 33 of the electronic unit 30, and is fixed to the heat sink 34 by fastening members such as screws in a plurality of mounting holes formed in the fixing piece 36a.

The shape and size of each part of the guide plate 36 are determined based on the air blow distribution ratio according to the heat generation amount of the plurality of cooling target parts.

The side plate 37 is arranged between the substrate 31 and the heat sink 34 . The side plate 37 is made of, for example, a metal material with high thermal conductivity like the radiator plate 34, and is shaped like a rectangular plate extending in the insertion direction. The side plates 37 are bent at both edges in the width direction along the parallel direction of the electronic units 30 and fastened to the substrate 31 and the radiator plate 34, respectively. The board 31 , the radiator plate 34 , and the pair of side plates 37 form a ventilation path penetrating inside the electronic unit 30 in the insertion direction. In the electronic device 1 according to the present embodiment, air is blown toward the primary side in the insertion direction from the blower fan 41 arranged on the secondary side in the insertion direction of the electronic unit 30 .

In the electronic device 1, the heat from the electronic component 32, which generates a large amount of heat such as a CPU, is exchanged through the heat sink 33 through cooling air passing through the heat sink 33, and to the heat transfer sheet 35 and the heat dissipation plate 34. It is diffused by being transmitted. In the electronic device 1 , when the motor of the blower fan is rotationally driven by the control unit, air is blown toward the electronic unit 30 from the blower port. The air sent from the air blowing port is blocked by the shielding walls 36b, 36c, 36d of the guide plate 36 provided ahead of the air blowing port, and is guided to the openings 36e, 36f.

According to the electronic device 1 configured as described above, in the electronic unit 30, by providing the heat sink 34 in contact with the heat sink 33, the heat of the heat sink 33 is diffused in the planar direction, thereby improving the heat dissipation effect. In particular, in a configuration in which the electronic units 30 having the same shape are arranged side by side in a predetermined direction and housed in the subrack chassis 21, when the positions of the heat-generating components are aligned, the waste heat from the electronic units 30 hinders the heat dissipation of the adjacent electronic units 30. However, the heat radiating plate 34, which diffuses heat in the plane direction intersecting the parallel direction, can effectively diffuse the heat, and a high heat radiation effect can be obtained.

Further, in the electronic device 1, the heat dissipation plate 34 facing the substrate 31 is provided, and the side plate 37 is provided between the heat dissipation plate 34 and the substrate 31 for assembly, thereby improving the rigidity.

Further, in the electronic device 1, the heat transfer sheet 35 in contact with the heat sink 33 and the heat dissipation plate 34 is interposed, so that the heat transfer performance from the heat sink 33 to the heat dissipation plate 34 can be secured and the heat dissipation effect can be improved. In addition, since the heat radiation effect is improved, the installation area of the heat sink 33 can be reduced, so that the mounting area of electronic components can be increased. Furthermore, since the heat transfer sheet 35 has a cushioning structure, it is easy to secure the adhesion and contact area to the heat sink 33 and the heat sink 34, and the dimensional tolerance can be absorbed, so that the dimensional accuracy required at the time of manufacturing is relaxed. can do.

In addition, since the heat transfer sheet 35 closes the gap on one side of the heat sink 33, the cooling air is prevented from escaping into the gap on the one side of the heat sink 33, and the cooling effect can be enhanced.

According to the electronic device 1 of the above-described embodiment, it is possible to obtain high heat dissipation by having the heat dissipation plate 34 facing the substrate 31 with the heat dissipation target portion interposed therebetween.

The present invention is not limited to the above embodiments, and can be implemented by appropriately changing the configuration of each part. For example, in the above-described embodiment, the guide plate 36 is formed in the above-described shape according to the shape of the electronic unit 30 and the amount of heat generated by each part, but the present invention is not limited to this. For example, it is possible to appropriately change the shape and position of the guide plate 36 in accordance with the shape and position of the electronic component 32 and the heat sink 33 that are heat-dissipating portions.

In the above embodiment, an example in which the blower unit 40 is arranged on the secondary side in the insertion direction of the electronic unit 30 is shown, but this is not a limitation, and the blower unit 40 is provided as a part of the electronic unit 30, for example. may have been That is, for example, a configuration in which a fan is mounted on one main surface of the substrate 31 may be employed.

Further, as an example of the arrangement of the shielding walls 36b, 36c, and 36d in the insertion direction in the above-described embodiment, the end of the secondary side in the air blowing direction that is the primary side in the insertion direction of the electronic component 32 and the heat sink 33, which are the portions to be dissipated, is Although an example of arranging it near the edge has been shown, it is not limited to this, and it may be arranged, for example, on the secondary side in the insertion direction, or may be arranged in the central part.

Further, for example, the ends of the rack case 11 and the sub-rack chassis 21 on the secondary side in the insertion direction may be provided with a panel or may be open. Further, the space inside the rack case 11 and the space inside the sub-rack chassis 21 may be partitioned into a plurality of sections by rail members or partition members, or may communicate with each other. Furthermore, a heat insulating sheet, heat radiating fins, or the like may be provided on the heat radiating plate 34 .

According to the electronic device of at least one of the embodiments described above, it is possible to obtain high heat dissipation by having the heat dissipation plate 34 facing the substrate 31 with the heat dissipation target portion interposed therebetween.

It should be noted that although several embodiments of the invention have been described, these embodiments are provided by way of example and are not intended to limit the scope of the invention. These novel embodiments can be implemented in various other forms, and various omissions, replacements, and modifications can be made without departing from the scope of the invention. These embodiments and their modifications are included in the scope and gist of the invention, and are included in the scope of the invention described in the claims and equivalents thereof. The invention described in the original claims of the present application is appended below.
(1)
A heat dissipation target portion having a substrate, an electronic component arranged on one side surface of the substrate, and a heat sink arranged on one side of the electronic component, and opposed to the one side of the substrate with the heat dissipation target portion interposed therebetween. and a disposed heat sink.
(2)
The electronic unit according to (1), further comprising a heat transfer sheet having cushioning properties and interposed between the heat-dissipating portion and the heat sink.
(3)
A plurality of the electronic units are arranged in parallel in a predetermined direction,
The electronic unit according to (1) or (2), further comprising a guide member having a shielding wall that blocks a ventilation path formed around the heat-dissipating portion between the substrate and the heat-dissipating plate.
(4)
a side plate disposed between the substrate and the heat sink,
The electronic unit according to any one of (1) to (3), wherein the radiator plate includes a metal material.
(5)
the electronic unit according to any one of (1) to (4);
a blower unit having a blower opening directed toward the heat-dissipating target;
a plurality of subracks that accommodate the plurality of electronic units arranged in a predetermined direction;
a rack that accommodates the plurality of subracks;
electronic equipment.

DESCRIPTION OF SYMBOLS 1... Electronic equipment, 10... Rack, 11... Rack case, 11a, 11b... Side plate, 12... Flange, 20... Sub rack, 21... Sub rack chassis, 21a, 21b... Side plate, 21c... Opening, 22... Sub rack rail , 23... Flange 30... Electronic unit 31... Board 32... Electronic component 33... Heat sink 33a... Radiation fin 34... Radiation plate 35... Heat transfer sheet 36... Guide plate 36a... Fixed piece 36b , 36c, 36d...shielding wall, 36e...opening, 36f...opening, 37...side plate, 38...ejector, 39...connector, 40...blowing unit, 41...blowing fan.

Claims (6)

A heat dissipation target portion having a substrate, an electronic component arranged on one side surface of the substrate, and a heat sink arranged on one side of the electronic component, and facing the one side of the substrate with the heat dissipation target portion interposed therebetween. a radiator plate to be arranged;
a guide plate that is fixed to the heat sink, has a shielding wall that blocks a ventilation path formed around the heat-dissipating part between the substrate and the heat sink, and has an opening at the heat sink;
Electronic equipment in which a plurality of electronic units are arranged in parallel in a predetermined direction . 2. The electronic device according to claim 1, further comprising a heat transfer sheet having cushioning properties and interposed between said heat radiating target portion and said heat radiating plate. a side plate disposed between the substrate and the heat sink,
3. The electronic device according to claim 1 , wherein said radiator plate comprises a metallic material. a plurality of said electronic units;
a blower unit having a blower opening directed toward the heat-dissipating target;
a plurality of subracks that accommodate the plurality of electronic units arranged in a predetermined direction;
a rack that accommodates the plurality of subracks;
The electronic device according to any one of claims 1 to 3, comprising : The subrack has an opening for inserting the electronic unit,
The blower unit is arranged in the subrack on the secondary side in the insertion direction opposite to the opening with respect to the heat-dissipating target part,
The shielding wall is arranged on the primary side in the insertion direction of the heat-dissipating target portion and in the vicinity of the end portion on the secondary side in the blowing direction,
5. The electronic device according to claim 4, wherein said heat sink has pin fins. 3. The electronic device according to claim 2, wherein one surface of said heat transfer sheet is in contact with the substrate-side surface of said heat sink and the other surface is in contact with said heat sink.