CN220693617U

CN220693617U - Heat dissipation device

Info

Publication number: CN220693617U
Application number: CN202322333208.2U
Authority: CN
Inventors: 舒伟; 胡扬; 董汉; 陈超; 李哲峰; 李忠桥; 周宝琳; 刘雨
Original assignee: Suzhou Tsing Standard Automobile Technology Co ltd
Current assignee: Suzhou Tsing Standard Automobile Technology Co ltd
Priority date: 2023-08-29
Filing date: 2023-08-29
Publication date: 2024-03-29
Anticipated expiration: 2033-08-29

Abstract

The present disclosure relates to the field of electronic device heat dissipation technologies, and in particular, to a heat dissipation device. The heat dissipation device includes: the heat dissipation plate comprises a heat dissipation surface 14 and a heat exchange surface 15, wherein a plurality of heat dissipation channels are arranged on the heat dissipation surface 14, and the heat exchange surface 15 is used for being in contact with the circuit module so as to transfer heat generated by the circuit module to the heat dissipation plate; a fan for generating a heat radiation air flow; the air duct transfer box is used for enabling the heat dissipation airflow to flow into the heat dissipation channel so as to dissipate heat generated by the circuit module. According to the embodiment of the specification, the fan and the air duct transfer box can enable the heat dissipation air flow to flow into the heat dissipation channel. The circuit module can be radiated through the radiating air flow in the radiating channel, so that the radiating effect is improved.

Description

Heat dissipation device

Technical Field

The present disclosure relates to the field of electronic device heat dissipation technologies, and in particular, to a heat dissipation device.

Background

In the electronic equipment industry, as the integration level of circuit modules is continuously improved, the volume of the circuit modules is continuously reduced, and the heat flux density is continuously increased. The circuit module often has the phenomena of abnormal operation state, damage and the like caused by difficult discharge of heating loss. In order to ensure the normal operation of the circuit module, a heat dissipation device is generally used for heat dissipation of the circuit module.

However, the heat dissipation effect of the existing heat dissipation device is often poor, and the heat dissipation requirement of the circuit module cannot be met.

Disclosure of Invention

The embodiment of the specification provides a heat dissipation device for improving heat dissipation effect.

The embodiment of the specification provides a heat dissipation device, including:

the heat dissipation plate comprises a heat dissipation surface and a heat exchange surface, wherein a plurality of heat dissipation channels are arranged on the heat dissipation surface, and the heat exchange surface is used for being in contact with the circuit module so as to transfer heat generated by the circuit module to the heat dissipation plate;

a fan for generating a heat radiation air flow;

the air duct transfer box is used for enabling the heat dissipation airflow to flow into the heat dissipation channel so as to dissipate heat generated by the circuit module.

The heat dissipating device of the embodiment of the specification comprises a heat dissipating plate, an air duct adapter box and a fan. The heat dissipation plate can comprise a heat dissipation surface and a heat exchange surface, wherein a plurality of heat dissipation channels are arranged on the heat dissipation surface, and the heat exchange surface is used for being in contact with the circuit module so as to transfer heat generated by the circuit module to the heat dissipation plate. The air duct transfer box is used for enabling the heat dissipation airflow to flow into the heat dissipation channel so as to dissipate heat generated by the circuit module. The fan is used for generating heat dissipation airflow. The fan and the air passage switching box can enable the heat dissipation airflow to flow into the heat dissipation channel. The circuit module can be radiated through the radiating air flow in the radiating channel, so that the radiating effect is improved.

Drawings

In order to more clearly illustrate the embodiments of the present description or the solutions in the prior art, the drawings that are required for the embodiments or the description of the prior art will be briefly described, the drawings in the following description are only some embodiments described in the present description, and other drawings may be obtained according to these drawings without inventive effort for a person skilled in the art.

Fig. 1 is a schematic structural diagram of a heat dissipating device according to an embodiment of the present disclosure;

FIG. 2 is a schematic diagram of a heat exchange surface on a heat dissipation plate according to an embodiment of the present disclosure;

FIG. 3 is a schematic view of one end of the heat dissipating plate for flowing out a heat dissipating airflow according to the embodiment of the present disclosure;

FIG. 4 is a schematic view of an inclined heat sink fin in an embodiment of the present disclosure;

FIG. 5 is a schematic view of a first airflow aperture in a sidewall of a first side of a duct adapter according to an embodiment of the present disclosure;

FIG. 6 is a schematic illustration of a second airflow aperture in a sidewall of a second side of a duct adapter in an embodiment of the present disclosure.

Reference numerals illustrate:

1. a heat dissipation plate; 11. a heat dissipation channel; 12. a heat radiation fin; 13. a circuit module; 14. a heat radiating surface; 15. a heat exchange surface; 16. a back plate; 17. the air duct transfer box faces the surface of the radiating fin; 18. one side of the heat exchange surface, which is perpendicular to the surface of the air duct transfer box, which faces the radiating fins; 19. the other side of the heat exchange surface is vertical to the surface of the air duct transfer box, which faces the radiating fins; 2. an air duct transfer box; 21. a first airflow aperture; 22. a second airflow aperture; 3. a fan.

Detailed Description

The technical solutions of the embodiments of the present specification will be clearly and completely described below with reference to the drawings in the embodiments of the present specification, and it is apparent that the described embodiments are only some embodiments of the present specification, not all embodiments. The specific embodiments described herein are to be considered in an illustrative rather than a restrictive sense. All other embodiments derived by a person of ordinary skill in the art based on the described embodiments of the present disclosure fall within the scope of the present disclosure. In addition, relational terms such as "first" and "second", and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions.

Please refer to fig. 1, 2 and 3. The embodiment of the specification provides a heat dissipation device.

The heat dissipation device may include a heat dissipation plate 1, an air duct adapter box 2 and a fan 3.

In some embodiments, the heat dissipating plate 1 may include a heat dissipating surface 14 and a heat exchanging surface 15. The heat dissipating surface 14 and the heat exchanging surface 15 may be opposite surfaces of the heat dissipating plate 1. For example, one surface of the heat dissipating plate 1 may be used as the heat dissipating surface 14, and the other surface may be used as the heat exchanging surface 15. The heat dissipation surface 14 may be provided with a plurality of heat dissipation channels 11. The heat dissipation channel 11 may be a rectangular channel. The number of embodiments may be one or more. The inlet of the heat dissipation channel 11 may be one end of the heat dissipation plate 1, and the outlet of the heat dissipation channel 11 may be the other end opposite to the heat dissipation plate 1. The heat dissipation channel 11 may be used as an air channel through which the heat dissipation air flows. Specifically, the heat radiation air flow may flow in from one end of the heat radiation plate 1 and flow out from the other end opposite to the heat radiation plate 1. So that convection is formed at both ends of the heat dissipation plate 1.

In practical applications, the heat dissipating surface 14 may be provided with a plurality of heat dissipating fins 12. The heat dissipation fin 12 may have a rectangular shape. The heat radiating fins 12 have long sides and short sides. One long side of the radiating fin 12 is provided on the radiating surface 14. The heat sink may also include a back plate 16. The back plate 16 may be parallel to the heat dissipating surface 14. The back plate 16 is disposed above the plurality of heat radiating fins 12. Specifically, the back plate 16 may be disposed above the other long side of the heat radiating fin 12. The heat dissipating surface 14, the plurality of heat dissipating fins 12, and the back plate may form one or more cavities, which may serve as the heat dissipating channels 11. The plurality of heat dissipation fins 12 may be disposed at equal intervals, so that the plurality of heat dissipation channels 11 may be disposed at equal intervals. The plurality of heat dissipation channels 11 may be parallel to each other, thereby forming a grid channel.

The heat exchanging surface 15 is adapted to be in contact with the circuit module 13. In this way, the heat generated by the circuit module 13 during operation can be transferred to the heat dissipation plate 1, the heat dissipation plate 1 can further transfer the heat to the heat dissipation fins 12, and the heat dissipation fins 12 can exchange heat with air, so that the heat generated by the circuit module 13 is transferred to the air in the heat dissipation channel 11. The heat in the air can be carried out by the heat dissipation airflow flowing in the heat dissipation device 11, so that the heat dissipation of the circuit module 13 is realized.

By providing the circuit module 13 on one face of the heat dissipation plate 1, the heat dissipation path 11 is provided on the other face. On the one hand, the circuit module 13 and the heat dissipation channel 11 can be relatively independent and are not mutually interfered, and on the other hand, the heat dissipation effect can be improved.

Fig. 2 shows a plurality of heat radiating fins 12 on the heat exchanging surface 15. The plurality of heat radiating fins 12 form a plurality of heat radiating passages 11.

The heat dissipation plate 1 may be made of aluminum, copper, iron, or the like. The material may have a relatively high thermal conductivity. For example, the thermal conductivity of the material may be greater than or equal to a set threshold. This can facilitate the heat transfer from the circuit module 13 to the heat dissipation plate 1, and the heat dissipation plate 1 further transfers the heat generated by the circuit module 13 to the heat dissipation fins 12, thereby improving the heat dissipation efficiency.

One or more mounting holes may be provided on the heat dissipation plate 1. The mounting holes are used for fixedly connecting the circuit module 13 with the heat dissipation plate 1. For example, the circuit module 13 and the heat dissipation plate 1 can be fixedly connected by bolts by means of mounting holes.

Further, a heat-conducting silica gel may be coated on the heat exchanging surface 15. So that the heat exchanging surface 15 can be in contact with the circuit module 13 via a thermally conductive silicone. By means of the thermally conductive silicone, the circuit module 13 can conveniently transfer heat to the heat dissipation plate 1 with high efficiency.

The circuit module 13 may comprise a semiconductor power module, such as a DC power module. The semiconductor power module may include a driving circuit board and a circuit component. The circuit components may include IGBTs (insulated gate bipolar transistors) and the like. The circuit components may be mounted on a driving circuit board. The driving circuit board may be mounted on the heat dissipation plate 1.

In some embodiments, the duct adapter box 2 is used to enable the heat dissipation airflow generated by the fan 3 to flow into the heat dissipation channel 11. So that the heat of the heat radiating fins 12 can be taken out by the heat radiating air flow flowing in the heat radiating passage 11, thereby realizing the heat radiation of the heat generated by the circuit module 13. In addition, through the duct adapter box 2, the heat dissipation airflow can be further split into the plurality of heat dissipation channels 11. In this way, the heat dissipation air flow in each heat dissipation channel 11 can be uniform as much as possible, and larger difference of the heat dissipation air flows in different heat dissipation channels 11 is avoided. So that the heat dissipation plate 1 can be uniformly dissipated. The air duct transfer box 2 may be rectangular or the like.

In some embodiments, the fan 3 is used to generate a heat dissipating airflow. In addition, the fan 3 can promote the heat dissipation airflow to flow in the heat dissipation channel 11 to form convection, so as to improve the heat dissipation effect on the circuit module 13.

The number of fans 3 may be one or more. For example, the number of fans 3 may be 3 or 4, etc.

The direction of the heat dissipation air flow generated by the fan 3 may be parallel to the direction of the heat dissipation channel 11. So that the direction of the heat radiation air flow does not need to be changed during the flow in the heat radiation passage 11. The heat radiation air flow flows through the heat radiation passage 11, and the heat in the heat radiation passage 11 can be taken out. Of course, the direction of the heat dissipation airflow generated by the fan 3 may also have a set angle with the direction of the heat dissipation channel 11. The set angle may be an acute angle. For example, the set angle may be 5 °. Such that the flow of the heat radiation air needs to change direction during the flow in the heat radiation passage 11. The heat dissipation air flow can be in close contact with the heat dissipation fins 12 in the flowing process, so that sufficient heat exchange between the heat dissipation air flow and the heat dissipation fins 12 is facilitated, and the heat dissipation effect can be improved.

In some embodiments, the fan 3 may be disposed on the duct adapter box 2, and the duct adapter box 2 may be disposed at one end of the heat dissipation plate 1. In practical application, the fan 3 may be fixedly connected to the air duct adapter box 2 through a bolt, and the air duct adapter box 2 may be fixedly connected to one end of the heat dissipation plate 1 through a bolt. So that the duct adapter box 2 can be located between the end of the radiator plate 1 and the fan 3. The heat radiation air flow generated by the fan 3 can enter the air duct transfer box 2 through the inlet of the air duct transfer box 2, and can be split into each heat radiation channel 11 through the outlet of the air duct transfer box 2. The heat radiation air flow in each heat radiation passage 11 may flow out at the other end of the heat radiation plate 1. Convection can be formed at both ends of the heat dissipation plate 1, thereby improving the heat dissipation effect on the circuit module 13.

Fig. 3 shows one end of the heat dissipation plate 1 for the outflow of the heat dissipation air flow.

The number of the fans 3 may be plural, and the plural fans 3 may be disposed on the duct adapter box 2 in an aligned manner.

In some examples, the duct adapter box 2 may be rectangular parallelepiped or the like. The air duct transfer box 2 can be of a cavity structure. A fan 3 is mounted on the side wall of the first side of the air duct adapter box 2. The cooling air flow generated by the fan 3 may enter the cavity through the side wall of the first side. The side wall of the second side of the air duct transfer box 2 is contacted with one end of the heat dissipation plate 1. The heat dissipation air flow in the cavity may enter the heat dissipation channel 11 through the side wall of the second side. The first side and the second side may be opposite sides of the duct adapter box 2. In particular, the sidewall of the first side may be provided with one or more first airflow holes 21. One fan 3 for each first airflow hole 21. The heat radiation air flow generated by each fan 3 may enter the cavity through the first air flow hole 21 corresponding to the fan 3. The sidewall of the second side may be provided with a plurality of second airflow apertures 22. Each of the second airflow holes 22 corresponds to one of the heat dissipation passages 11. The heat radiation air flow in the cavity may enter the heat radiation passage 11 corresponding to the second air flow hole 22 through the second air flow hole 22. Please refer to fig. 5. Fig. 5 shows a side wall of the first side of the air duct adapter box 2 and the first airflow aperture 21 thereon. Please refer to fig. 6. Fig. 6 shows a side wall of the second side of the air duct adapter box 2 and the second airflow aperture 22 therein.

In other examples, the duct adapter box 2 may be rectangular parallelepiped or the like. The air duct transfer box 2 can be of a cavity structure. A fan 3 may be mounted on the side wall of the first side of the duct adapter box 2. The cooling air flow generated by the fan 3 may enter the cavity through the side wall of the first side. In particular, the sidewall of the first side may be provided with one or more first airflow holes 21. One fan 3 for each first airflow hole 21. The heat radiation air flow generated by each fan 3 may enter the cavity through the first air flow hole 21 corresponding to the fan 3. The second side of the duct adapter box 2 has no side walls. The second side of the duct adapter box 2 is in contact with one end of the heat dissipation plate 1. The heat radiation air flow in the cavity can directly enter each heat radiation passage 11. The first side and the second side may be opposite sides of the duct adapter box 2.

In some embodiments, the shape of the heat dissipation plate 1 may be rectangular.

Please refer to fig. 2. The heat radiating fins 12 may be perpendicular to the heat radiating surface 14. The heat dissipation fins 12 may be parallel to a specific side of the heat dissipation plate 1. The specific edge may be perpendicular to a face of the air duct adapter box facing the heat radiating fins. Specifically, the heat dissipation plate 1 may include a heat dissipation surface 14. The radiating surface 14 may have 2 sides perpendicular to the surface of the air duct adapter facing the radiating fins, and the specific side may be any one of the 2 sides. Of course, the heat dissipation plate 1 may include the heat exchange surface 15. The heat exchange surface 15 may have 2 sides perpendicular to the surface of the air duct adapter box facing the heat dissipation fins, and the specific side may be any one of the 2 sides. For example, please refer to fig. 1. In fig. 1, 17 shows the face of the duct adapter box facing the heat radiating fins 12. 18 and 19 show 2 sides of the heat exchange surface 15 perpendicular to the face of the air duct adapter box facing the heat sink fins 12. The particular edge may be either of 18 and 19. So that the direction of the heat radiation air flow generated by the fan 3 can be parallel to the direction of the heat radiation passage 11. The heat radiation air flow does not need to change direction during the process of flowing in the heat radiation passage 11. The heat radiation air flow flows through the heat radiation passage 11, and the heat in the heat radiation passage 11 can be taken out.

The surface of the duct adapter box 2 facing the heat radiating fins 12 may be parallel to the distribution surface of the fan 3. In the arrangement of the heat dissipating device shown in fig. 1, the surface of the air duct adapter box 2 facing the heat dissipating fins and the distribution surface of the fan 3 are parallel to the horizontal plane. The specific edge is perpendicular to the surface of the air duct transfer box facing the radiating fins, and can be further understood as: the specific edge is perpendicular to the horizontal plane.

Alternatively, refer to FIG. 4. The heat radiating fins 12 may be perpendicular to the heat radiating surface 14. The heat dissipation fin 12 may rotate by a first angle (for example, α°) with respect to the first position by using a short side of the heat dissipation fin, which is close to the air duct adapter box, as a rotation axis. In the first position, the heat dissipation fins 12 are parallel to adjacent edges of the end of the air duct adapter box 2 on the heat dissipation plate 1. The heat radiating fins 12 are thus inclined with respect to the sides of the rectangle, and the respective heat radiating passages 11 are also inclined with respect to the sides of the rectangle. The direction of the heat dissipation air flow generated by the fan 3 has a set angle with the direction of the heat dissipation channel 11. The set angle may be an acute angle. For example, the set angle may be 5 °. In this way, the length of the heat dissipation channel 11 is increased, and the heat dissipation area of the heat dissipation fins 12 is also increased, so that sufficient heat exchange can be performed between the heat dissipation airflow and the heat dissipation fins 12, and the heat dissipation effect is further improved.

Alternatively, the heat dissipation fins 12 may be parallel to the adjacent edge of the end of the heat dissipation plate 1 where the air duct adapter box 2 is located. The heat dissipation fin 12 may be rotated by a second angle with respect to the second position about a long side thereof adjacent to the heat dissipation surface. In the second position, the heat radiating fins 12 are perpendicular to the heat radiating surface 14. Such that the individual heat dissipation channels 11 are parallel with respect to the sides of the rectangle. The direction of the heat radiation air flow generated by the fan 3 may be parallel to the direction of the heat radiation passage 11. The heat radiating fins 12 are inclined with respect to the heat radiating surface 14. The length of the short side of the radiating fin 12 is increased, and the radiating area of the radiating fin 12 is increased, so that sufficient heat exchange can be performed between the radiating airflow and the radiating fin 12, and the radiating effect is improved.

Those skilled in the art will appreciate that the descriptions of various embodiments are provided herein with respect to each of the embodiments, and that reference may be made to the relevant descriptions of other embodiments for parts of one embodiment that are not described in detail. In addition, it will be appreciated that those skilled in the art, upon reading the present specification, may conceive of any combination of some or all of the embodiments set forth herein without any inventive effort, and that such combination is within the scope of the disclosure and protection of the present specification.

Although the present specification is depicted by way of example, it will be appreciated by those skilled in the art that the above examples are merely intended to aid in understanding the core ideas of the present specification. Those skilled in the art will appreciate numerous modifications and variations therefrom. It is intended that the appended claims cover such modifications and variations as fall within the true spirit of this present description.

Claims

1. A heat sink, comprising:

a fan for generating a heat radiation air flow;

2. The heat dissipating device of claim 1, wherein the heat dissipating plate is provided with mounting holes for fixedly connecting the circuit module to the heat dissipating plate, and the heat exchanging surface is in contact with the circuit module through thermally conductive silicone.

3. The heat sink of claim 1, wherein the circuit module comprises a semiconductor power module.

4. The heat dissipating device of claim 1, wherein a plurality of heat dissipating channels are provided on the heat dissipating surface, the plurality of heat dissipating channels being equally spaced apart and the plurality of heat dissipating channels being parallel to each other;

the air duct transfer box is used for dividing the heat dissipation airflow into the plurality of heat dissipation channels.

5. The heat dissipating device of claim 1, wherein a plurality of heat dissipating fins are disposed on the heat dissipating surface in parallel with each other, and a back plate is disposed on the plurality of heat dissipating fins, the back plate being parallel to the heat dissipating surface;

the radiating surface, the radiating fins and the backboard form a plurality of radiating channels.

6. The heat dissipating device of claim 5, wherein the fan is disposed on an air duct adapter box disposed at one end of the heat dissipating plate for allowing the flow of heat dissipating air to flow out through the heat dissipating channel at the opposite end of the heat dissipating plate.

7. The heat sink of claim 6, wherein the heat dissipating plate is rectangular in shape, and the heat dissipating fins are perpendicular to the heat dissipating surface; and the radiating fins are parallel to specific sides on the radiating plate, and the specific sides are perpendicular to the surface of the air duct transfer box, which faces the radiating fins.

8. The heat sink of claim 6, wherein the heat dissipating plate is rectangular in shape, and the heat dissipating fins are perpendicular to the heat dissipating surface; the radiating fins rotate by a first angle relative to the first position by taking the short side of the radiating fins, which is close to the air duct transfer box, as an axis; in the first position, the radiating fins are parallel to specific sides on the radiating plate, and the specific sides are perpendicular to the surface of the air duct transfer box, which faces the radiating fins.

9. The heat dissipating device of claim 6, wherein the heat dissipating plate is rectangular in shape, the heat dissipating fins are parallel to specific sides on the heat dissipating plate, and the specific sides are perpendicular to a face of the air duct adapter box facing the heat dissipating fins; the radiating fins rotate by a second angle relative to the second position by taking the long side of each radiating fin, which is close to the radiating surface, as an axis; in the second position, the radiating fins are perpendicular to the radiating surface.

10. The heat dissipating device of claim 1, wherein the heat dissipating plate is aluminum.