CN216253724U - Liquid cooling heat dissipation device for circuit board and electronic equipment - Google Patents
Liquid cooling heat dissipation device for circuit board and electronic equipment Download PDFInfo
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- CN216253724U CN216253724U CN202122923051.XU CN202122923051U CN216253724U CN 216253724 U CN216253724 U CN 216253724U CN 202122923051 U CN202122923051 U CN 202122923051U CN 216253724 U CN216253724 U CN 216253724U
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Abstract
The application relates to electronic equipment technical field, especially relates to a circuit board liquid cooling heat abstractor and electronic equipment, and circuit board liquid cooling heat abstractor includes: the heat dissipation device comprises a heat dissipation main body, a heat pipe and a heat pipe, wherein a flow channel pipeline is formed inside the heat dissipation main body; cooling liquid circularly flows in the flow channel pipeline; the circuit board is arranged on the heat dissipation main body, and heat released by the circuit board is transferred to the flow channel pipeline through the heat dissipation main body; the circuit board is provided with a heat consumption concentration area and a heat consumption dispersion area; the runner is including concentrating the radiating part and sparse radiating part, concentrates the radiating part to correspond heat consumption concentrated district setting, and sparse radiating part corresponds heat consumption dispersed district setting. The application provides a circuit board liquid cooling heat abstractor can dispel the heat with the mode of subregion according to the distribution condition of heat loss on the circuit board pertinence, ensures that electronic equipment can normal operating, is favorable to prolonging electronic equipment's life-span moreover.
Description
Technical Field
The application relates to the technical field of electronic equipment, in particular to a liquid cooling heat dissipation device for a circuit board and electronic equipment.
Background
At present, a circuit board in electronic equipment is generally provided with electronic components of a plurality of chips, in the working process of the electronic equipment, various types of electronic components can generate heat to different degrees, the distribution of all the electronic components on the circuit board is not necessarily distributed according to rules, the conditions that the electronic components at local positions are densely distributed and the electronic components at local positions are sparsely distributed exist, the heat distribution of the whole circuit is not uniform, a heat dissipation device of the electronic equipment is difficult to dissipate heat in a targeted manner according to the distribution condition of the electronic components, the whole circuit board is difficult to be efficiently dissipated, the condition that the temperature of the local or individual electronic components is high can exist, the working efficiency of the electronic equipment is influenced, and even the service life of the electronic equipment is influenced.
SUMMERY OF THE UTILITY MODEL
The application aims to provide a circuit board liquid cooling heat dissipation device and electronic equipment, so as to solve the technical problems that the heat dissipation device of the electronic equipment in the prior art is difficult to perform heat dissipation pertinently to the distribution situation of electronic components, so that the whole circuit board is difficult to perform efficient heat dissipation fully, and the local or individual electronic components are easy to have high temperature.
The application provides a circuit board liquid cooling heat abstractor includes:
the heat dissipation device comprises a heat dissipation main body, a heat pipe and a heat pipe, wherein a flow channel pipeline is formed inside the heat dissipation main body; cooling liquid circularly flows in the runner pipeline;
the circuit board is arranged on the heat dissipation main body, and heat released by the circuit board is transferred to the flow channel pipeline through the heat dissipation main body;
the circuit board is provided with a heat consumption concentration area and a heat consumption dispersion area; the runner pipeline comprises a concentrated heat dissipation part and an evacuated heat dissipation part, the concentrated heat dissipation part is arranged corresponding to the heat consumption concentrated area, and the evacuated heat dissipation part is arranged corresponding to the heat consumption dispersed area.
In the above technical solution, further, the circuit board includes a main circuit board and an auxiliary circuit board;
the main circuit board is provided with a plurality of first heat consuming members; the sub circuit board is provided with a plurality of second heat consuming members.
In any one of the above technical solutions, further, the heat dissipating main body includes:
the main circuit board is arranged on the first board surface; the first plate surface is provided with a first fixing groove, and the shape of the main circuit board is matched with that of the first fixing groove;
the second board surface is arranged away from the first board surface, and the sub circuit board is arranged on the second board surface; and a second fixing groove is formed on the second plate surface, and the shape of the sub-circuit board is matched with that of the second fixing groove.
In any one of the above technical solutions, further, a plurality of limiting grooves are formed in the first fixing groove, and the plurality of first heat dissipation members are respectively disposed in the plurality of limiting grooves;
and a plurality of fixing columns are formed in the second fixing groove and are used for connecting the second heat consumption component.
In any of the above technical solutions, further, a plurality of first fixing blocks are disposed on an inner wall of the first fixing groove;
a plurality of second fixing blocks are arranged inside the second fixing grooves;
the first fixing block and the second fixing block are provided with through holes.
In any one of the above technical solutions, further, the heat dissipation main body is provided with a liquid inlet interface and a liquid outlet interface, the liquid inlet interface is connected with one end of the flow channel pipeline, and the liquid outlet interface is connected with the other end of the flow channel pipeline.
In any of the above technical solutions, further, the heat consumption concentration region includes a plurality of the first heat consumption components or a plurality of the second heat consumption components;
the runner pipeline is provided with a plurality of bending parts on the concentrated heat dissipation part;
the front and the back of the concentrated heat dissipation part are provided with the evacuated heat dissipation part along the flowing direction of the fluid in the flow channel pipeline.
In any one of the above technical solutions, further, the circuit board liquid cooling heat dissipation device further includes:
the first sealing plate is arranged at the opening of the first fixing groove;
and the second sealing plate is arranged at the opening of the second fixing groove.
In any of the above technical solutions, further, the heat dissipation body is made of an aluminum alloy.
The application also provides an electronic device, including any of the above technical schemes of the casing circuit board liquid cooling heat abstractor, circuit board liquid cooling heat abstractor set up in the casing. The application provides an electronic equipment has this circuit board liquid cooling heat abstractor's whole beneficial technological effect, here, no longer gives unnecessary details.
Compared with the prior art, the beneficial effect of this application is:
the application provides a circuit board liquid cooling heat abstractor includes: the heat dissipation device comprises a heat dissipation main body, a heat pipe and a heat pipe, wherein a flow channel pipeline is formed inside the heat dissipation main body; cooling liquid circularly flows in the flow channel pipeline; the circuit board is arranged on the heat dissipation main body, and heat released by the circuit board is transferred to the flow channel pipeline through the heat dissipation main body; the circuit board is provided with a heat consumption concentration area and a heat consumption dispersion area; the runner is including concentrating the radiating part and sparse radiating part, concentrates the radiating part to correspond heat consumption concentrated district setting, and sparse radiating part corresponds heat consumption dispersed district setting.
The application provides a circuit board liquid cooling heat abstractor can dispel the heat with the mode of subregion with the distribution condition pertinence ground of heat loss on the circuit board, can absorb the heat of each part of circuit board fully, carries out high-efficient heat dissipation to the circuit board, avoids appearing the condition that local heat is concentrated, ensures that each electronic components can normal operating on the circuit board to ensure that electronic equipment can normal operating, be favorable to prolonging electronic equipment's life-span moreover.
The application provides an electronic equipment, including the aforesaid circuit board liquid cooling heat abstractor, therefore, can specifically generate heat the condition to the circuit board through this circuit board liquid cooling heat abstractor and carry out the subregion heat dissipation pertinence to dispel the heat to the circuit board comprehensively, carefully, high-efficiently, and then can ensure electronic equipment's work efficiency, still help prolonging electronic equipment's life-span.
Drawings
In order to more clearly illustrate the detailed description of the present application or the technical solutions in the prior art, the drawings needed to be used in the detailed description of the present application or the prior art description will be briefly introduced below, and it is obvious that the drawings in the following description are some embodiments of the present application, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic structural diagram of a liquid-cooled heat dissipation apparatus for a circuit board according to an embodiment of the present application;
fig. 2 is a schematic structural diagram of a liquid-cooled heat dissipation apparatus for a circuit board according to an embodiment of the present disclosure;
fig. 3 is an enlarged schematic structural view of the liquid-cooled heat dissipating device of the circuit board shown in fig. 2 at a position B;
fig. 4 is another perspective view of the liquid-cooled heat dissipation device of the circuit board according to the embodiment of the present disclosure;
fig. 5 is a cross-sectional view a-a of the circuit board liquid-cooled heat sink provided in fig. 4.
Reference numerals: 1-heat dissipation main body, 101-first fixing groove, 1011-limiting groove, 1012-protrusion, 1013-first fixing block, 1014-through hole, 102-second fixing groove, 1021-fixing column, 103-liquid inlet interface, 104-liquid outlet interface, 105-installation part, 2-flow channel pipeline, 201-starting end, 202-first heat dissipation partition, 203-concentrated heat dissipation partition, 204-second heat dissipation partition, 205-third heat dissipation partition, and 206-tail end.
Detailed Description
The technical solutions of the present application will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are only some embodiments of the present application, but not all embodiments.
The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application.
All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
In the description of the present application, it should be noted that the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and "third" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
A circuit board liquid-cooled heat sink and an electronic apparatus according to an embodiment of the present application are described below with reference to fig. 1 to 5.
Referring to fig. 1 to 5, an embodiment of the present application provides a circuit board liquid-cooled heat dissipation device, including: the heat dissipation device comprises a heat dissipation body 1 and a circuit board (not shown in the figure) arranged on the surface of the heat dissipation body 1, wherein a flow channel pipeline 2 is arranged inside the heat dissipation body 1, cooling liquid flows in the flow channel pipeline 2, heat released by the circuit board is conducted to the heat dissipation body 1, the temperature of the cooling liquid is low, and the heat of the heat dissipation body 1 is absorbed, so that the circuit board is cooled.
Specifically, the heat dissipation body 1 is in a flat plate shape, and in a state shown in fig. 1, a lower plate surface of the heat dissipation body 1 is a first plate surface, a first fixing groove 101 is formed on the first plate surface, and the first fixing groove 101 is used for mounting a main circuit board described below; the upper plate surface of the heat dissipating body 1 is a second plate surface, and a second fixing groove 102 is formed on the second plate surface, and the second fixing groove 102 is used for accommodating a sub circuit board described below.
The position that a side of heat dissipation main part 1 is close to both ends has feed liquor interface 103 and play liquid interface 104 respectively, feed liquor interface 103 communicates with a tip of runner pipeline 2, let in the coolant liquid in to runner pipeline 2 through feed liquor interface 103, runner pipeline 2 is arranged at the inside buckle of heat dissipation main part 1, enlarge the length of runner pipeline 2 and the space that runner pipeline 2 occupied in heat dissipation main part 1 as far as possible, in order to ensure the radiating effect, go out liquid interface 104 and runner pipeline 2's other end interface intercommunication, be used for the coolant liquid that discharges, with this circulation, first face and the second face to heat dissipation main part 1 all can effectively absorb heat, and then effectively dispel the heat to the circuit board.
Furthermore, the circuit board comprises a main circuit board and a sub circuit board, wherein a plurality of first heat consumption components with different functions, shapes and sizes are arranged on the main circuit board, a plurality of second heat consumption components are arranged on the sub circuit board, and the first heat consumption components and the second heat consumption components are chips or electronic components in other forms. Four apex angles of the first fixing groove 101 protrude towards the inside of the first fixing groove 101 to form a protrusion 1012, four apex angles of the main circuit board are provided with notches, and the notches are matched with the protrusion 1012, so that the main circuit board can be installed in the first fixing groove 101 in a clamping or embedding manner, the main circuit board is prevented from shaking in the first fixing groove 101, the second fixing groove 102 is similar to the sub-circuit board, and the technical personnel in the field can completely understand the main circuit board and are not described again.
Further, a plurality of limiting grooves 1011 are formed in the bottom wall surface or the first plate surface of the first fixing groove 101, preferably, the plurality of limiting grooves 1011 are distributed on the first plate surface in various sizes and different shapes, the plurality of limiting grooves 1011 are respectively arranged corresponding to the plurality of first heat dissipation members, the plurality of first heat dissipation members are arranged on one side of the main circuit board facing the first plate surface, and after the main circuit board is arranged in the first fixing groove 101, the plurality of first heat dissipation members are respectively embedded into the plurality of limiting grooves 1011.
Further, a plurality of fixing columns 1021 are arranged in the second fixing groove 102, and each second heat consuming component is formed with a connecting hole, which is matched with the fixing column 1021, so that the second heat consuming component can be fixed on the bottom wall surface or the second plate surface of the second fixing groove 102 through the matched fixing column 1021 and connecting hole.
Furthermore, part of the first heat consumption components in the plurality of first heat consumption components are distributed on the main circuit board more densely, the heat generated by the part of the first heat consumption components forms a first heat consumption concentrated area on the main circuit board, the other part of the first heat consumption components are distributed on the main circuit board more sparsely, and the part of the first heat consumption components forms a first heat consumption dispersing area on the main circuit board.
And part of the second heat consumption components in the plurality of second heat consumption components are distributed more densely on the sub circuit board, the heat generated by the part of the second heat consumption components forms second heat consumption concentration, the other part of the second heat consumption components are distributed more sparsely on the sub circuit board, and the heat generated by the part of the second heat consumption components forms a second heat consumption dispersion area.
Further, the flow path line 2 has an end connected to the liquid inlet port 103 as a start end 201, an end connected to the liquid outlet port 104 as a tail end 206, and the flow path line 2 sequentially includes: the heat dissipation device comprises a starting end 201, a first heat dissipation partition 202, a concentrated heat dissipation partition 203, a second heat dissipation partition 204, a third heat dissipation partition 205 and a tail end 206, wherein the concentrated heat dissipation partition 203 corresponds to a concentrated heat dissipation part, and the first heat dissipation partition 202, the second heat dissipation partition 204 and the third heat dissipation partition 205 correspond to an evacuated heat dissipation part. Wherein the first heat dissipation partition 202 is formed with a corner for changing the extending direction of the runner pipe 2; the concentrated heat dissipation subarea 203 is arranged corresponding to the first heat consumption concentrated area and the second heat consumption concentrated area, and the concentrated heat dissipation subarea 203 forms a plurality of bending parts, so that the concentrated heat dissipation subarea 203 has a continuous S-shaped structure to improve the occupied area of the part and the length of a flow path of cooling liquid in the part of pipeline, and the first heat consumption concentrated area and the second heat consumption concentrated area are subjected to targeted efficient heat dissipation; the second and third heat radiating partitions 204 and 205 are also formed with corners for changing the extending direction of the runner duct 2 again.
It should be noted that the first heat dissipation sub-area 202, the second heat dissipation sub-area 204, and the third heat dissipation sub-area 205 are disposed corresponding to the first heat dissipation distribution area and the second heat dissipation distribution area, and the first heat dissipation sub-area 202, the second heat dissipation sub-area 204, and the third heat dissipation sub-area 205 bear all heat dissipation requirements of the heat dissipation main body 1 except the concentrated heat dissipation sub-area 203.
In addition, in order to reduce the flow resistance of the coolant in the flow channel 2, the number of corners or bends in the first, second, and third heat dissipation sub-sections 202, 204, and 205, particularly in the first and second heat dissipation sub-sections 202 and 204, should be reduced as much as possible.
Further, an opening of the first fixing groove 101 is provided with a first sealing plate (not shown in the drawings) to enclose the main circuit board in the first fixing groove 101; the opening of the second fixing groove 102 is provided with a second sealing plate (not shown) to enclose the daughter circuit board within the second fixing groove 102.
Further, a plurality of first fixing blocks 1013 protruding from the inner wall surface of the first fixing groove 101 are formed at four corners of the inner wall surface of the first fixing groove 101 and on the side wall of the first fixing groove, a through hole 1014 is formed in the first fixing block 1013, a through hole is formed in a position of the first sealing plate facing the through hole 1014, and the first sealing plate is connected to the first fixing groove 101 by sequentially passing through the through hole and the through hole 1014 using a screw or other type of fastener. The second fixing block is also disposed in the second fixing groove 102, and the connection manner between the second fixing groove 102 and the second sealing plate is the same as that described above, which can be fully understood by those skilled in the art and will not be described again.
To sum up, the circuit board liquid cooling heat abstractor that this application provided can dispel the heat with the mode of subregion according to the distribution condition pertinence ground of heat loss on the circuit board, can absorb the heat of each part of circuit board fully, carries out high-efficient heat dissipation to the circuit board, avoids appearing the condition that local heat is concentrated, ensures that each electronic components can normal operating on the circuit board to ensure that electronic equipment can normal operating, be favorable to prolonging electronic equipment's life-span moreover.
In addition, it should be noted that the liquid-cooled heat dissipation device for a circuit board provided in the embodiments of the present application is mainly applicable to a VPX chassis common in the prior art, where VPX is a new generation of high-speed serial bus standard that is proposed by vta (VME International Trade Association ) organization on the basis of VME bus in 2007.
The VPX case is provided with a clamping groove, a heat dissipation main body of the circuit board liquid cooling heat dissipation device is connected with the clamping groove, the connection mode can be but is not limited to clamping, and the circuit board liquid cooling heat dissipation device dissipates heat of a circuit board, a module and the like of the VPX case.
The embodiment of the application also provides an electronic device, which comprises a shell and the circuit board liquid cooling heat dissipation device in any embodiment, so that all beneficial technical effects of the circuit board liquid cooling heat dissipation device are achieved, and the description is omitted.
Furthermore, two sides of the heat dissipation body 1 extending along the length direction are provided with plate-shaped or strip-shaped mounting portions 105, mounting holes are formed in the mounting portions 105, and the mounting portions 105 can be connected with the specified positions of the housing by using fasteners to penetrate through the mounting holes and the specified positions of the housing, so that the circuit board liquid cooling heat dissipation device is fixed to the housing of the electronic device.
Finally, it should be noted that: the above embodiments are only used for illustrating the technical solutions of the present application, and not for limiting the same; although the present application has been described in detail with reference to the foregoing embodiments, it should be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present application.
Claims (10)
1. The utility model provides a circuit board liquid cooling heat abstractor which characterized in that includes:
the heat dissipation device comprises a heat dissipation main body, a heat pipe and a heat pipe, wherein a flow channel pipeline is formed inside the heat dissipation main body; cooling liquid circularly flows in the runner pipeline;
the circuit board is arranged on the heat dissipation main body, and heat released by the circuit board is transferred to the flow channel pipeline through the heat dissipation main body;
the circuit board is provided with a heat consumption concentration area and a heat consumption dispersion area; the runner pipeline comprises a concentrated heat dissipation part and an evacuated heat dissipation part, the concentrated heat dissipation part is arranged corresponding to the heat consumption concentrated area, and the evacuated heat dissipation part is arranged corresponding to the heat consumption dispersed area.
2. The circuit board liquid-cooled heat sink of claim 1, wherein the circuit board comprises a main circuit board and a sub-circuit board;
the main circuit board is provided with a plurality of first heat consuming members; the sub circuit board is provided with a plurality of second heat consuming members.
3. The circuit board liquid-cooled heat sink of claim 2, wherein the heat sink body comprises:
the main circuit board is arranged on the first board surface; the first plate surface is provided with a first fixing groove, and the shape of the main circuit board is matched with that of the first fixing groove;
the second board surface is arranged away from the first board surface, and the sub circuit board is arranged on the second board surface; and a second fixing groove is formed on the second plate surface, and the shape of the sub-circuit board is matched with that of the second fixing groove.
4. The liquid-cooled heat sink for circuit board as claimed in claim 3, wherein a plurality of position-limiting grooves are formed in the first fixing groove, and the plurality of first heat dissipation members are respectively disposed in the plurality of position-limiting grooves;
and a plurality of fixing columns are formed in the second fixing groove and are used for connecting the second heat consumption component.
5. The liquid-cooled heat sink for circuit board as claimed in claim 3, wherein the inner wall of the first fixing groove is provided with a plurality of first fixing blocks;
a plurality of second fixing blocks are arranged inside the second fixing grooves;
the first fixing block and the second fixing block are provided with through holes.
6. The liquid-cooled circuit board heat sink as claimed in claim 1, wherein the heat sink body has a liquid inlet and a liquid outlet, the liquid inlet is connected to one end of the flow pipeline, and the liquid outlet is connected to the other end of the flow pipeline.
7. The circuit board liquid cooled heat sink of claim 2, wherein the heat dissipation concentrating region comprises a plurality of the first heat dissipating components or a plurality of the second heat dissipating components;
the runner pipeline is provided with a plurality of bending parts on the concentrated heat dissipation part;
the front and the back of the concentrated heat dissipation part are provided with the evacuated heat dissipation part along the flowing direction of the fluid in the flow channel pipeline.
8. The circuit board liquid-cooled heat sink of claim 3, further comprising:
the first sealing plate is arranged at the opening of the first fixing groove;
and the second sealing plate is arranged at the opening of the second fixing groove.
9. The liquid-cooled heat sink device for circuit board as claimed in any one of claims 1 to 8, wherein the heat dissipating body is made of aluminum alloy.
10. An electronic device comprising a housing and the circuit board liquid-cooled heat sink of any of claims 1-9, the circuit board liquid-cooled heat sink being disposed within the housing.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122923051.XU CN216253724U (en) | 2021-11-25 | 2021-11-25 | Liquid cooling heat dissipation device for circuit board and electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122923051.XU CN216253724U (en) | 2021-11-25 | 2021-11-25 | Liquid cooling heat dissipation device for circuit board and electronic equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216253724U true CN216253724U (en) | 2022-04-08 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122923051.XU Active CN216253724U (en) | 2021-11-25 | 2021-11-25 | Liquid cooling heat dissipation device for circuit board and electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216253724U (en) |
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2021
- 2021-11-25 CN CN202122923051.XU patent/CN216253724U/en active Active
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