CN211349203U - Case with high heat dissipation performance - Google Patents
Case with high heat dissipation performance Download PDFInfo
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- CN211349203U CN211349203U CN201922404491.7U CN201922404491U CN211349203U CN 211349203 U CN211349203 U CN 211349203U CN 201922404491 U CN201922404491 U CN 201922404491U CN 211349203 U CN211349203 U CN 211349203U
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- liquid cooling
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Abstract
The utility model discloses a case with high heat dissipation performance, which comprises a front side plate, a rear side plate, a left side plate, a right side plate, an upper side plate and a lower side plate; the front side plate, the rear side plate, the left side plate, the right side plate, the upper side plate and the lower side plate are spliced to form an accommodating cavity, and a main plate and an expansion card connected with the main plate are arranged in the accommodating cavity; the front side of the mainboard is provided with a heat dissipation module for dissipating heat of the mainboard; a first hollow part is arranged on the upper side of the left side plate, and a first radiating fan is arranged on the inner side of the left side plate corresponding to the first hollow part; a second hollow part is arranged at the middle lower side of the right side plate, and a second cooling fan is arranged at the inner side of the right side plate corresponding to the second hollow part; the upper side plate is provided with a third hollow part, and a third cooling fan is arranged on the inner side of the upper side plate corresponding to the third hollow part; a liquid cooling module is arranged at the lower side of the third cooling fan; therefore, the heat dissipation structure has higher heat dissipation performance, can dissipate the heat inside the case in time, and ensures the normal operation.
Description
Technical Field
The utility model relates to a quick-witted case field technique especially indicates a quick-witted case with high heat dissipating ability.
Background
The chassis typically includes a housing, brackets, various switches on the panel, indicator lights, etc. The case is used as one part of computer accessories, the shell of the case is made of steel plates and plastics in a combined mode, the hardness is high, the case plays a main role in placing and fixing the computer accessories and plays a role in supporting and protecting. In addition, the computer case has an important role in shielding electromagnetic radiation.
The chassis has a plurality of types, and the AT, ATX, Micro ATX and the latest BTX-AT chassis which are commonly sold in the market are called BaBy AT, and are mainly applied to early machines which can only support the installation of AT mainboards. The ATX chassis is currently the most common chassis, supporting most types of motherboards today. However, the case in the prior art has poor heat dissipation performance, which causes difficulty in timely dissipation of heat generated during operation inside the case, and thus the case is prone to have a phenomenon that normal operation is affected due to overhigh temperature.
Therefore, a new technical solution needs to be developed to solve the above problems.
SUMMERY OF THE UTILITY MODEL
In view of this, the utility model discloses to the disappearance that prior art exists, its main objective provides a quick-witted case with high heat dispersion, and it has higher heat dispersion, can in time give off the heat of quick-witted incasement portion, has guaranteed the operation of normal work.
In order to achieve the above purpose, the utility model adopts the following technical scheme:
a chassis with high heat dissipation performance comprises a front side plate, a rear side plate, a left side plate, a right side plate, an upper side plate and a lower side plate;
the front side plate, the rear side plate, the left side plate, the right side plate, the upper side plate and the lower side plate are spliced to form an accommodating cavity, and a main plate and an expansion card connected with the main plate are arranged in the accommodating cavity; the main board is vertically arranged on the front side of the rear side board, the expansion cards are arranged on the front side of the main board, and the number of the expansion cards is multiple; the expansion cards are sequentially and transversely arranged at uniform intervals to form an expansion card module; each expansion card extends vertically; the front side of the mainboard is provided with a heat dissipation module for dissipating heat of the mainboard, the heat dissipation module is fixedly locked on the mainboard through screws, and the heat dissipation module is positioned above the expansion card module;
a first hollow part is arranged on the upper side of the left side plate, and a first radiating fan is arranged on the inner side of the left side plate corresponding to the first hollow part; a second hollow part is arranged at the middle lower side of the right side plate, and a second cooling fan is arranged at the inner side of the right side plate corresponding to the second hollow part; the upper side plate is provided with a third hollow part, and a third cooling fan is arranged on the inner side of the upper side plate corresponding to the third hollow part; the liquid cooling module is arranged on the lower side of the third radiating fan, the left side and the right side of the liquid cooling module are respectively connected to the left side plate and the right side plate, and the liquid cooling module comprises a liquid cooling main body, and a liquid cooling inlet and a liquid cooling outlet which are connected to the liquid cooling main body.
As a preferred scheme, the liquid cooling main part includes front locating plate, back locating plate, left locating plate, right locating plate, front locating plate, back locating plate, left locating plate, right locating plate concatenation enclose to form a chamber of stepping down, the intracavity of stepping down is provided with a plurality of staves, and a plurality of staves all extend along controlling the direction, and both ends are equallyd divide and do not connect in left locating plate, right locating plate about every stave, and a plurality of staves are along the even interval arrangement in proper order of fore-and-aft direction, are provided with the fin between two adjacent staves, liquid cooling entry, liquid cooling export all set up on right locating plate.
As a preferred scheme, the right positioning plate is provided with a first flow passage, and the liquid cooling inlet and the liquid cooling outlet are both communicated with the first flow passage; every stave all is provided with the second runner that extends along left right direction, and the right side of every second runner all is provided with the connector, and every connector all communicates in first runner.
As a preferred scheme, the downside of expansion card module is provided with the space bar, the space bar includes vertical board portion and the horizontal board portion that extends from the upper end of vertical board portion to the back an organic whole, the lower extreme of vertical board portion is connected in the lower plate, the rear end of horizontal board portion is connected in the inboard of posterior lateral plate, space bar, lower plate, posterior lateral plate three enclose to form an installation cavity that is used for installing the power, the downside of left side board is provided with the installing port, the installing port communicates in the installation cavity.
As an optimal scheme, the left side of lower plate is provided with fourth fretwork portion, fourth fretwork portion communicates in the installation cavity, the outside of fourth fretwork portion is provided with the backstop board, the lower plate all is provided with the location lug around front side, rear side, the right side of fourth fretwork portion, and every location lug is established from the outside of lower plate to the evagination, and all location lugs enclose to form a location space, and every location lug all has the draw-in groove, and every draw-in groove all communicates in the location space, in the backstop board inserted the location space from left to right, preceding lateral wall, back wall, the right side wall of backstop board block respectively in the corresponding draw-in groove.
As a preferable scheme, the left side of the stop plate is further provided with a pulling part convenient to pull, the pulling part is integrally arranged outwards from the left side of the stop plate in a protruding mode, and the pulling part is provided with a pulling groove penetrating through the upper side and the lower side of the pulling part.
Compared with the prior art, the utility model obvious advantage and beneficial effect have, particularly, can know by above-mentioned technical scheme, it mainly is the design that combines liquid cooling module through thermal module, first radiator fan, second radiator fan, third radiator fan, makes its whole possess higher heat dispersion, can in time give off the heat of quick-witted incasement portion, has guaranteed the operation of normal work.
To more clearly illustrate the structural features and technical means of the present invention and the specific objects and functions achieved thereby, the present invention will be described in further detail with reference to the accompanying drawings and specific embodiments.
Drawings
FIG. 1 is a perspective view of the overall structure of the embodiment of the present invention;
fig. 2 is a perspective view of another angle overall structure of the embodiment of the present invention;
FIG. 3 is a schematic structural view of the embodiment of the present invention with the front side plate removed;
FIG. 4 is an exploded view of an embodiment of the present invention;
fig. 5 is a schematic diagram of an assembly structure of a liquid cooling module according to an embodiment of the present invention;
fig. 6 is a top view of a liquid cooling module according to an embodiment of the present invention;
fig. 7 is an exploded view of a liquid cooling module according to an embodiment of the present invention;
fig. 8 is another exploded view of a liquid cooling module according to an embodiment of the present invention;
FIG. 9 is a schematic diagram of a portion of an embodiment of the present invention;
fig. 10 is a partial structural schematic diagram of an embodiment of the present invention.
The attached drawings indicate the following:
10. front side plate 20, rear side plate
30. Left side plate 31, first fretwork portion
40. Right side plate 41 and second hollow part
50. Upper side plate 51 and third hollow part
60. Lower plate 61, fourth hollowed-out part
62. Positioning projection 63 and clamping groove
70. Mainboard 80 and expansion card
90. Heat dissipation module 101 and first heat dissipation fan
102. Second radiator fan 103 and third radiator fan
104. Liquid cooling module 1041, front positioning plate
1042. Rear positioning plate 1043 and left positioning plate
1044. Right positioning plate 1045, liquid cooling inlet
1046. Liquid cooling outlet 1047 and cooling wall
1048. Abdication cavity 1049, heat sink
105. Partition plate 106 and installation cavity
107. Stopper 1071, pulling part
1072. Pull slot 108, mounting port.
Detailed Description
Fig. 1 to 10 are schematic diagrams showing specific structures of embodiments of the present invention.
A chassis with high heat dissipation performance comprises a front side plate 10, a rear side plate 20, a left side plate 30, a right side plate 40, an upper side plate 50 and a lower side plate 60; wherein:
the front side plate 10, the rear side plate 20, the left side plate 30, the right side plate 40, the upper side plate 50 and the lower side plate 60 are spliced to form an accommodating cavity, and a main plate 70 and an expansion card 80 connected with the main plate 70 are arranged in the accommodating cavity; the main board 70 is vertically arranged at the front side of the rear side board 20, the expansion cards 80 are arranged at the front side of the main board 70, and the number of the expansion cards 80 is several; the expansion cards 80 are sequentially and transversely arranged at uniform intervals to form an expansion card module; each expansion card 80 extends vertically; a heat dissipation module 90 for dissipating heat from the motherboard 70 is disposed on the front side of the motherboard 70; the heat dissipation module 90 is fixed on the main board 70 by screws, so that the heat dissipation module 90 can be conveniently disassembled and assembled; the heat dissipation module 90 is located above the expansion card module; here, the setting of a plurality of expansion cards 80 can improve the holistic performance of quick-witted case, makes the holistic performance of quick-witted case stronger, more is favorable to satisfying more work demands.
A first hollow portion 31 is disposed on the upper side of the left side plate 30, and a first heat dissipation fan 101 is disposed on the inner side of the left side plate 30 corresponding to the first hollow portion 31; a second hollow portion 41 is disposed at a middle lower side of the right side plate 40, and a second heat dissipation fan 102 is disposed at an inner side of the right side plate 40 corresponding to the second hollow portion 41; the upper plate 50 is provided with a third hollow part 51, and a third heat dissipation fan 103 is arranged on the inner side of the upper plate 50 corresponding to the third hollow part 51; a liquid cooling module 104 is disposed on the lower side of the third heat dissipation fan 103, the left and right sides of the liquid cooling module 104 are connected to the left side plate 30 and the right side plate 40, respectively, and the liquid cooling module 104 includes a liquid cooling main body, and a liquid cooling inlet 1045 and a liquid cooling outlet 1046 connected to the liquid cooling main body. Thus, the first cooling fan 101, the second cooling fan 102 and the third cooling fan 103 are combined with the liquid cooling module 104, so that the cooling performance of the chassis is improved, and the normal operation is ensured.
The liquid cooling main body comprises a front positioning plate 1041, a rear positioning plate 1042, a left positioning plate 1043 and a right positioning plate 1044, the front positioning plate 1041, the rear positioning plate 1042, the left positioning plate 1043 and the right positioning plate 1044 are spliced to form an abdicating cavity 1048 in a surrounding manner, a plurality of cooling walls 1047 are arranged in the abdicating cavity 1048, the plurality of cooling walls 1047 extend in the left-right direction, the left end and the right end of each cooling wall 1047 are respectively connected to the left positioning plate 1043 and the right positioning plate 1044, the plurality of cooling walls 1047 are sequentially arranged at uniform intervals in the front-back direction, cooling fins 1049 are arranged between every two adjacent cooling walls 1047, and the liquid cooling inlets 1045 and the liquid cooling outlets 1046 are arranged on the; the right positioning plate 1044 is provided with a first flow channel, and the liquid cooling inlet 1045 and the liquid cooling outlet 1046 are both communicated with the first flow channel; each cooling wall 1047 is provided with a second flow channel extending in the left-right direction, the right side of each second flow channel is provided with a connector, and each connector is communicated with the first flow channel. In this embodiment, the left side plate 30 is provided with an abdication port on the rear side of the first hollow portion 31, so that the liquid cooling inlet 1045 and the liquid cooling outlet 1046 are conveniently communicated with the outside through a connecting pipeline through the abdication port, and thus the cooling liquid is conveniently injected or removed; here, the cooling liquid may be water or other liquid suitable for cooling; further, the right side of the liquid cooling main body is located inside the left side plate 30, so that the liquid cooling inlet 1045 and the liquid cooling outlet 1046 are close to the relief port.
A partition plate 105 is arranged on the lower side of the expansion card module, the partition plate 105 comprises a vertical plate portion and a transverse plate portion integrally extending backwards from the upper end of the vertical plate portion, the lower end of the vertical plate portion is connected to the lower side plate 60, the rear end of the transverse plate portion is connected to the inner side of the rear side plate 20, an installation cavity 106 for installing a power supply is formed by the partition plate 105, the lower side plate 60 and the rear side plate 20 in a surrounding manner, an installation opening 108 is arranged on the lower side of the left side plate 30, and the installation opening 108 is communicated with the installation cavity 106; in this way, the installation opening 108 and the installation cavity 106 are arranged, so that the power module can be conveniently and integrally installed in the subsequent process.
A fourth hollow portion 61 is arranged on the left side of the lower side plate 60, the fourth hollow portion 61 is communicated with the installation cavity 106, a stop plate 107 is arranged on the outer side of the fourth hollow portion 61, positioning protrusions 62 are arranged on the front side, the rear side and the right side of the lower side plate 60 surrounding the fourth hollow portion 61, each positioning protrusion 62 protrudes outwards from the outer side of the lower side plate 60, a positioning space is formed by surrounding of all the positioning protrusions 62, each positioning protrusion 62 is provided with a clamping groove 63, each clamping groove 63 is communicated with the positioning space, the stop plate 107 is inserted into the positioning space from left to right, and the front side wall, the rear side wall and the right side wall of the stop plate 107 are respectively clamped into the corresponding clamping grooves 63; the left side of backstop board 107 still is provided with the pulling portion 1071 of being convenient for the pulling, pulling portion 1071 is protruding outward from the left side of backstop board 107 an organic whole, pulling portion 1071 has the pulling groove 1072 who link up the upper and lower both sides of pulling portion 1071.
In addition, in the present embodiment, the inner sidewalls of the front side plate 10, the rear side plate 20, the left side plate 30, the right side plate 40, the upper side plate 50, and the lower side plate 60 are all provided with an anti-static plate (not shown), and the anti-static plate includes a base layer, a first anti-static coating, a second anti-static coating, and an anti-static ring disposed on the outer surface of the first anti-static coating, wherein the first anti-static coating and the second anti-static coating are respectively coated on two sides of the base layer; the anti-static ring comprises an anti-static rubber pad, the anti-static rubber pad comprises a static dissipation layer and a conductive layer, and the conductive layer is positioned on one side of the first anti-static coating; the conducting layer is a metal foil which is attached to one side of the first anti-static coating. Here, the base layer is a multilayer structure including a thermoplastic polymer resin layer and a thermoplastic elastomer layer; one end of the metal foil is connected with the ground wire, and the metal foil is preferably made of copper or aluminum. Therefore, by the arrangement of the anti-static plate, the electrostatic reaction and the electrostatic dust accumulation in the case can be effectively inhibited.
To sum up, the utility model discloses a design focus lies in, and it mainly is through the design of heat radiation module, first radiator fan, second radiator fan, third radiator fan combination liquid cooling module, makes its whole possess higher heat dispersion, can in time give off the heat of quick-witted incasement portion, has guaranteed the operation of normal work.
The above description is only a preferred embodiment of the present invention, and is not intended to limit the technical scope of the present invention, so that any slight modifications, equivalent changes and modifications made by the technical spirit of the present invention to the above embodiments are all within the scope of the technical solution of the present invention.
Claims (6)
1. The utility model provides a quick-witted case with high heat dissipating ability which characterized in that: comprises a front side plate, a rear side plate, a left side plate, a right side plate, an upper side plate and a lower side plate;
the front side plate, the rear side plate, the left side plate, the right side plate, the upper side plate and the lower side plate are spliced to form an accommodating cavity, and a main plate and an expansion card connected with the main plate are arranged in the accommodating cavity; the main board is vertically arranged on the front side of the rear side board, the expansion cards are arranged on the front side of the main board, and the number of the expansion cards is multiple; the expansion cards are sequentially and transversely arranged at uniform intervals to form an expansion card module; each expansion card extends vertically; the front side of the mainboard is provided with a heat dissipation module for dissipating heat of the mainboard, the heat dissipation module is fixedly locked on the mainboard through screws, and the heat dissipation module is positioned above the expansion card module;
a first hollow part is arranged on the upper side of the left side plate, and a first radiating fan is arranged on the inner side of the left side plate corresponding to the first hollow part; a second hollow part is arranged at the middle lower side of the right side plate, and a second cooling fan is arranged at the inner side of the right side plate corresponding to the second hollow part; the upper side plate is provided with a third hollow part, and a third cooling fan is arranged on the inner side of the upper side plate corresponding to the third hollow part; the liquid cooling module is arranged on the lower side of the third radiating fan, the left side and the right side of the liquid cooling module are respectively connected to the left side plate and the right side plate, and the liquid cooling module comprises a liquid cooling main body, and a liquid cooling inlet and a liquid cooling outlet which are connected to the liquid cooling main body.
2. The chassis with high heat dissipation performance of claim 1, wherein: the liquid cooling main part includes front locating plate, back locating plate, left locating plate, right locating plate, front locating plate, back locating plate, left locating plate, right locating plate concatenation enclose to become one and step down the chamber, the intracavity of stepping down is provided with a plurality of staves, and a plurality of staves all extend along controlling the direction, and both ends are equallyd divide and do not connect in left locating plate, right locating plate about every stave, and a plurality of staves are arranged along the even interval in proper order of fore-and-aft direction, are provided with the fin between two adjacent staves, liquid cooling entry, liquid cooling export all set up on right locating plate.
3. The chassis with high heat dissipation performance according to claim 2, wherein: the right positioning plate is provided with a first flow passage, and the liquid cooling inlet and the liquid cooling outlet are both communicated with the first flow passage; every stave all is provided with the second runner that extends along left right direction, and the right side of every second runner all is provided with the connector, and every connector all communicates in first runner.
4. The chassis with high heat dissipation performance of claim 1, wherein: the downside of expansion card module is provided with the space bar, the space bar includes vertical board and the horizontal board that extends from the upper end of vertical board to the back an organic whole, the lower extreme of vertical board is connected in the lower plate, the rear end of horizontal board is connected in the inboard of posterior lateral plate, space bar, lower plate, posterior lateral plate three enclose to form an installation cavity that is used for installing the power, the downside of left side board is provided with the installing port, the installing port communicates in the installation cavity.
5. The chassis with high heat dissipation performance of claim 4, wherein: the left side of lower plate is provided with fourth fretwork portion, fourth fretwork portion communicates in the installation cavity, the outside of fourth fretwork portion is provided with the backstop board, the lower plate all is provided with the locating convex block around front side, rear side, the right side of fourth fretwork portion, and every locating convex block is outwards protruding from the outside of lower plate and is established, and all locating convex blocks enclose to form a location space, and every locating convex block all has the draw-in groove, and every draw-in groove all communicates in the location space, in the backstop board inserted the location space from left to right, preceding lateral wall, back wall, the right side wall of backstop board block respectively in the corresponding draw-in groove.
6. The chassis with high heat dissipation performance of claim 5, wherein: the left side of backstop board still is provided with the pulling portion of being convenient for the pulling, the pulling portion is protruding outward from the left side of backstop board is integrative, the pulling portion has the pulling groove who link up the upper and lower both sides of pulling portion.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922404491.7U CN211349203U (en) | 2019-12-27 | 2019-12-27 | Case with high heat dissipation performance |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201922404491.7U CN211349203U (en) | 2019-12-27 | 2019-12-27 | Case with high heat dissipation performance |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN211349203U true CN211349203U (en) | 2020-08-25 |
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ID=72101456
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201922404491.7U Active CN211349203U (en) | 2019-12-27 | 2019-12-27 | Case with high heat dissipation performance |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN211349203U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI745123B (en) * | 2020-10-15 | 2021-11-01 | 安鈦克科技股份有限公司 | Computer case |
-
2019
- 2019-12-27 CN CN201922404491.7U patent/CN211349203U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI745123B (en) * | 2020-10-15 | 2021-11-01 | 安鈦克科技股份有限公司 | Computer case |
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