CN211878562U

CN211878562U - Liquid cooling system and virtual currency digger with same

Info

Publication number: CN211878562U
Application number: CN202020774035.1U
Authority: CN
Inventors: 陈前; 刘方宇; 宁洪燕; 高阳; 巫跃凤
Original assignee: Shenzhen MicroBT Electronics Technology Co Ltd
Current assignee: Shenzhen MicroBT Electronics Technology Co Ltd
Priority date: 2020-05-12
Filing date: 2020-05-12
Publication date: 2020-11-06
Anticipated expiration: 2030-05-12

Abstract

The application discloses a liquid cooling heat dissipation system and a virtual currency mining machine with the same, wherein the liquid cooling heat dissipation system comprises a liquid distribution device and a liquid cooling plate, the liquid cooling plate comprises a liquid cooling plate body, a cooling liquid flow path is arranged inside the liquid cooling plate body, the cooling liquid flow path is provided with an inlet and an outlet on a first side wall, the liquid distribution device comprises a liquid distribution body formed by integrating a liquid distributor and a liquid collector, a first accommodating cavity and a second accommodating cavity of the liquid distribution body are arranged side by side, and through holes connected with the liquid cooling plate and cooling liquid are formed in the same second installation surface of the first accommodating cavity and the second accommodating cavity; wherein, this branch liquid collection body can be installed at the first lateral wall of a plurality of liquid cooling boards, is located the region between the entry and the export of coolant liquid flow path to, branch liquid collection device locates same one side with the pipeline of coolant liquid and liquid cooling board UNICOM respectively, and like this, branch liquid collection body and pipeline all do not exceed a plurality of liquid cooling boards size, liquid cooling system's compact structure in upper and lower left and right directions.

Description

Liquid cooling system and virtual currency digger with same

Technical Field

The utility model relates to a liquid cooling heat dissipation technical field especially relates to a liquid cooling system and have liquid cooling system's virtual currency digs ore deposit machine.

Background

In the operation process of electronic equipment, especially a virtual currency mining machine, a chip of the electronic equipment can generate a large amount of heat, if the heat is not discharged in time, the normal operation of the equipment can be affected and even damaged, and therefore, along with the improvement of the power consumption and the density of the chip and the like, the heat dissipation of the mining machine is more and more important.

Among the prior art, the majority still adopts traditional air-cooled radiating mode, set up the fan in electronic equipment promptly, cool down through the fan dispels the heat, some equipment adopts the liquid cooling radiating mode who installs the liquid cooling board additional, be equipped with the runner of coolant liquid in the liquid cooling board, the lower coolant liquid of outside temperature (for example water, freon etc.) gets into the liquid cooling board and absorbs the heat, then flow out, after the outside release heat, get into the liquid cooling board again, in order to dispel the heat to electronic equipment circulation, and, when using a plurality of liquid cooling boards, a plurality of liquid cooling boards use with the cooperation of diversity liquid device usually.

However, in the above solution, the liquid distributor and the liquid collector of the liquid collecting and distributing device are usually separately disposed on the liquid cooling plate, and the installation structure of the liquid collecting and distributing device and the liquid cooling plate is not compact, resulting in a large occupied space.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a liquid cooling heat dissipation system and a virtual currency mining machine with the same, wherein the liquid cooling heat dissipation system comprises a liquid distribution device and a liquid cooling plate, the liquid cooling plate comprises a liquid cooling plate body, a cooling liquid flow path is arranged inside the liquid cooling plate body, the cooling liquid flow path is provided with an inlet and an outlet on a first side wall, the liquid distribution device comprises a liquid distribution body formed by integrating a liquid distributor and a liquid collector, a first accommodating cavity and a second accommodating cavity of the liquid distribution body are arranged side by side, and through holes connected with the liquid cooling plate and cooling liquid are formed in the same second installation surface of the first accommodating cavity and the second accommodating cavity; wherein, this branch liquid collection body can be installed at the first lateral wall of a plurality of liquid cold plates, be located the region between the entry and the export of coolant liquid flow path, and, branch liquid collection device locates same one side with the pipeline of coolant liquid and liquid cold plate UNICOM respectively, like this, branch liquid collection body and pipeline all do not exceed a plurality of liquid cold plate sizes in upper and lower left and right direction, liquid cooling system's compact structure, thereby solved knockout and knockout separately locate on the liquid cold plate, mounting structure is not compact, the great technical problem of occupation space that leads to.

The embodiment of the application provides a liquid cooling heat dissipation system, which comprises a liquid distribution and collection device and at least two liquid cooling plates provided with the liquid distribution and collection device, wherein,

the liquid cooling plate includes:

the liquid cooling plate comprises a liquid cooling plate body, a first cooling plate and a second cooling plate, wherein the liquid cooling plate body is provided with a first side wall and a second side wall which are arranged oppositely;

a coolant flow path provided inside the liquid-cooled plate body on the first side wall, the coolant flow path having an inlet and an outlet;

the liquid distribution and collection device comprises:

a diversity liquid body having a first mounting surface and a second mounting surface opposite to the first mounting surface;

the first accommodating cavity is arranged between the first mounting surface and the second mounting surface; the first accommodating cavity is provided with a first external through hole and a plurality of first switching through holes on the second mounting surface respectively;

the second accommodating cavity is arranged between the first mounting surface and the second mounting surface and is arranged in parallel with the first accommodating cavity; the second accommodating cavity is provided with a second external through hole and a plurality of second switching through holes on the second mounting surface respectively;

the number of the first through holes is the same as that of the second through holes; the number of the first through holes is the same as that of the liquid cooling plates; or the number of the first transfer through holes is reduced by one compared with the number of the liquid cooling plates;

the first side wall of the liquid cooling plate is arranged in the same direction, the first mounting surface is arranged on the first side wall, the first external through hole and the second external through hole are used for communicating a cooling liquid external circulation heat dissipation system, and an inlet and an outlet of the cooling liquid flow path are respectively connected with the first switching through hole and the second switching through hole;

the coolant liquid is followed first external through-hole flows in first holding chamber, and the warp first switching through-hole flows in the liquid cooling board, then, the coolant liquid is followed the liquid cooling board warp second switching through-hole flows in second holding chamber, and the warp the external through-hole of second flows, so that locate the electronic equipment liquid cooling heat dissipation between the liquid cooling board.

In the embodiment of the disclosure, a first butt pipe extends outwards from the inlet of the cooling liquid flow path, and a second butt pipe extends outwards from the outlet of the cooling liquid flow path;

the first butt joint pipe is connected with the first switching through hole through a first switching pipe, and the second butt joint pipe is connected with the second switching through hole through a second switching pipe;

the first external through hole extends outwards to form a first external connecting pipe, the second external through hole extends outwards to form a second external connecting pipe, and the first external connecting pipe and the second external connecting pipe are used for being communicated with a cooling liquid external circulation heat dissipation system.

In an embodiment of the present disclosure, the first external connection pipe and the second external connection pipe are provided with a first stop valve.

In the embodiment of the disclosure, the first accommodating cavity is further provided with an air inlet through hole on the second mounting surface, and an air inlet pipe extends outwards from the air inlet through hole; and the second accommodating cavity is also provided with a liquid drainage through hole on the second mounting surface, and a liquid drainage pipe extends outwards from the liquid drainage through hole.

In the embodiment of the disclosure, the air inlet pipe and the liquid discharge pipe are provided with second stop valves.

In the embodiment of the present disclosure, the first side walls of the plurality of liquid-cooling plates are fixedly connected through a first side sealing plate, and the first mounting surface is installed on the first side sealing plate.

In the embodiment of the present disclosure, the second side walls of the plurality of liquid-cooling plates are fixedly connected through a second side sealing plate.

In the embodiment of the present disclosure, an adapter plate is disposed between the first side sealing plate and the liquid cooling plate, and/or the adapter plate is disposed between the second side sealing plate and the liquid cooling plate.

In the embodiment of the disclosure, the liquid cooling plate body is further provided with an installation outer edge, a second installation hole is formed in the installation outer edge, and a screw rod is inserted into the second installation hole.

The embodiment of the application further discloses a virtual currency digs ore machine with liquid cooling system, virtual currency digs ore machine is including calculating power board and power, calculate power board with the power is respectively through the heat dissipation of liquid cooling system, wherein, liquid cooling system is foretell liquid cooling system.

One or more technical solutions provided in the embodiments of the present application have at least the following technical effects or advantages:

in the embodiment of the application, the liquid cooling heat dissipation system comprises a liquid cooling plate body and a liquid cooling plate, wherein the liquid cooling plate body comprises a liquid cooling plate body, an inlet and an outlet of a cooling liquid flow path are formed in a first side wall of the liquid cooling plate body, the liquid cooling plate body comprises a liquid distributor and a liquid collecting body which are integrated into a whole, a first accommodating cavity and a second accommodating cavity of the liquid collecting body are arranged side by side, and through holes connected with the liquid cooling plate and the cooling liquid are formed in the same second installation surface of the first accommodating cavity and the second accommodating cavity; wherein, this branch liquid collection body can be installed in the first side wall department of a plurality of liquid cooling boards that set up side by side, is located the region between the entry and the export of coolant liquid flow path to, branch liquid collection device locates same one side with the pipeline of coolant liquid and liquid cooling board UNICOM respectively, and like this, branch liquid collection body and pipeline all do not exceed a plurality of liquid cooling boards in the upper and lower left and right direction size, liquid cooling system's compact structure, occupation space is less.

Drawings

Fig. 1 is a schematic structural diagram of the liquid cooling heat dissipation system in the embodiment of the present application.

Fig. 2 is a schematic view illustrating a usage state of the liquid cooling heat dissipation system in the embodiment of the present application.

Fig. 3 is a schematic view illustrating a usage state of the liquid cooling heat dissipation system in the embodiment of the present application.

Fig. 4 is a schematic structural diagram of the liquid cooling plate in the embodiment of the present application.

Fig. 5 is a schematic view illustrating an installation structure of the first sealing plate, the second sealing plate and the heat dissipation body in the embodiment of the present application.

Fig. 6 is a schematic structural diagram of the heat dissipation flow channel in the embodiment of the present application, wherein an arrow direction in the drawing indicates a flow direction of the cooling liquid along the cooling liquid flow path.

Fig. 7 is a schematic view of an installation structure of the first heat dissipation surface and the second electronic device in the embodiment of the present application.

Fig. 8 is a schematic view of an installation structure of the liquid cooling plate and the second electronic device in the embodiment of the present application.

Fig. 9 is a schematic view of an installation structure of the liquid cooling plate and the first electronic device in the embodiment of the present application.

Fig. 10 is a schematic view of an installation structure of a plurality of liquid cooling plates to a plurality of second electronic devices in the embodiment of the present application.

Fig. 11 is a schematic structural diagram of the heat dissipation channels connected in parallel in the embodiment of the present application.

FIG. 12 is a schematic structural view of a liquid distribution and collection device in an embodiment of the present application.

FIG. 13 is a schematic structural view of the liquid distribution and collection body in the embodiment of the present application.

FIG. 14 is a schematic structural view of a counterbore in an embodiment of the present application.

Fig. 15 is a schematic structural view of the pipe joint according to the embodiment of the present application.

FIG. 16 is a schematic view of the installation structure of the liquid separation and collection device and the liquid cooling plate in the embodiment of the present application.

Reference numerals

31-a first external connecting pipe, 32-a second external connecting pipe, 33-a first adapter pipe, 34-a second adapter pipe, 35-an air inlet pipe, 36-a liquid discharge pipe, 37-a first stop valve, 38-a second stop valve, 39-a first side sealing plate, 40-a second side sealing plate, 41-an adapter plate, 42-a screw rod,

10-a liquid-cooled plate, wherein,

11-a first sealing plate, 111-a first through hole, 112-a second through hole,

12-a second closure plate, the second closure plate,

13-a heat-dissipating main body,

131-first heat dissipating surface, 1311-first mounting hole, 1312 mounting rim, 1313-second mounting hole,

132-a second heat dissipating surface, 1321-a heat dissipating boss, 1322-an abutment boss,

133-heat dissipation flow channel, 1331-corrugated protrusion,

134-the support wall or walls-are,

135-a notch is formed in the upper surface of the body,

136-a hollow cavity therein, the hollow cavity,

14-butt joint pipe, 141-first butt joint pipe, 142-second butt joint pipe,

15-the first electronic device is connected to the first electronic device,

16-second electronic device, 161-substrate unit, 162-heat-generating unit,

17-the screw is used for fixing the screw,

20-liquid separation and collection device

21-the first cover-closing means,

22-a second cover, the second cover,

23-the main body of the diversity liquid,

231-first mounting face, 2311-fixing outer edge, 2312-fixing hole

232-the second mounting surface of the second mounting surface,

233-a first channel, 2331-a first external through hole, 2332-a first transit through hole, 2333-an air intake through hole,

234-a second channel, 2341-a second external through hole, 2342-a second transfer through hole, 2343-a drain through hole,

235-an insulating passage for the passage of heat,

24-quick-plug type pipe joint, 241-external thread, 242-sealing ring and 243-locking ring.

Detailed Description

In order to better understand the technical solution, the technical solution will be described in detail with reference to the drawings and the specific embodiments.

The embodiment of the application provides a liquid cooling heat dissipation system, which comprises a liquid collecting device 20 and at least two liquid cooling plates 10 arranged on the liquid collecting device 20, wherein each liquid cooling plate comprises a liquid cooling plate body, and the liquid cooling plate bodies are provided with a first side wall and a second side wall which are arranged oppositely; the cooling liquid flow path is arranged in the liquid cooling plate body; on the first sidewall, the coolant flow path has an inlet and an outlet; the liquid distributing and collecting device comprises a liquid distributing and collecting body, wherein the liquid distributing and collecting body is provided with a first mounting surface and a second mounting surface opposite to the first mounting surface; the first accommodating cavity is arranged between the first mounting surface and the second mounting surface; the first accommodating cavity is provided with a first external through hole and a plurality of first switching through holes on the second mounting surface respectively; the second accommodating cavity is arranged between the first mounting surface and the second mounting surface and is arranged in parallel with the first accommodating cavity; the second accommodating cavity is provided with a second external through hole and a plurality of second switching through holes on a second mounting surface respectively;

the number of the first through holes is the same as that of the second through holes; the number of the first through holes is the same as that of the liquid cooling plates; or the number of the first switching through holes is reduced by one compared with the number of the liquid cooling plates; the first side wall of the liquid cooling plate is arranged in the same direction, the first mounting surface is arranged on the first side wall, the first external through hole and the second external through hole are used for communicating a cooling liquid external circulation heat dissipation system, and an inlet and an outlet of a cooling liquid flow path are respectively connected with the first switching through hole and the second switching through hole; the cooling liquid flows into the first accommodating cavity from the first external through hole and flows into the liquid cooling plate through the first switching through hole, and then flows into the second accommodating cavity from the liquid cooling plate through the second switching through hole and flows out through the second external through hole, so that the liquid cooling of the electronic equipment arranged between the liquid cooling plates is cooled and dissipated.

Wherein the cooling liquid can be water, insulating oil, fluoride, etc.

In one possible embodiment, a first butt pipe extends outwards from the inlet of the cooling liquid flow path, and a second butt pipe extends outwards from the outlet of the cooling liquid flow path; the first butt joint pipe is connected with the first switching through hole through the first switching pipe, and the second butt joint pipe is connected with the second switching through hole through the second switching pipe; the first external through hole extends outwards to form a first external connecting pipe, the second external connecting hole extends outwards to form a second external connecting pipe, and the first external connecting pipe and the second external connecting pipe are used for being communicated with a cooling liquid external circulation heat dissipation system.

In one possible embodiment, the first external connection pipe and the second external connection pipe are provided with a first stop valve to control the opening and closing of the external cooling liquid.

In one possible implementation mode, the first accommodating cavity is further provided with an air inlet through hole on the second mounting surface, and an air inlet pipe extends outwards from the air inlet through hole; the second accommodating cavity is also provided with a liquid discharge through hole on the second mounting surface, and a liquid discharge pipe extends outwards from the liquid discharge through hole; the air inlet pipe and the liquid discharge pipe are provided with a second stop valve; wherein, when need not flowing back, this second stop valve is closed, and when needs flowing back, this second stop valve is opened.

The aforesaid setting through first stop valve and second stop valve can make the whole dismantlement from outside coolant liquid system of liquid cooling system, easy to assemble to can realize the nimble increase and decrease of ore deposit machine.

In one possible embodiment, the first side walls of the plurality of liquid cooling plates are fixedly connected through a first side sealing plate, and the first mounting surface of the liquid collecting and distributing device is arranged on the first side sealing plate; second side walls of the liquid cooling plates are fixedly connected through second side sealing plates; an adapter plate is arranged between the first side sealing plate and the liquid cooling plate, and/or an adapter plate is arranged between the second side sealing plate and the liquid cooling plate.

In a possible embodiment, the liquid cooling plate body further has a mounting outer edge, a second mounting hole is formed in the mounting outer edge, and a screw rod is inserted into the second mounting hole, so that the plurality of liquid cooling plates are fixedly mounted together through the screw rod, and the screw rod applies the tightening force to the whole panel of the liquid cooling plate through the adapter plate, and the stress is uniform.

The embodiment of the application further discloses a virtual currency digger with the liquid cooling heat dissipation system, the virtual currency digger comprises a computing force plate and a power supply, the computing force plate and the power supply are respectively used for heat dissipation through the liquid cooling heat dissipation system, and the liquid cooling heat dissipation system is the liquid cooling heat dissipation system.

Above introduced liquid cooling system and virtual currency digs the ore deposit machine as a whole, the application of this liquid cooling system, the fan has been got rid of completely to the messenger digs the ore deposit machine, no longer need big wind volume to carry, the appearance volume diminishes, both greatly reduced the ore deposit machine noise of operation, the ore deposit machine trouble that dust impurity that has avoided the forced air cooling to bring again, increase of service life, the maintenance cost is saved, the high-efficient heat dissipation of liquid cooling system simultaneously, the power density that chip work allowed has not only been improved, the controllable scope of chip temperature also widens, and the operating temperature difference between each chip also reduces on the same power plate, the working property of power plate has greatly been promoted.

The following is described separately for the liquid cooled plate and the liquid diversity device.

Liquid cooling plate

The liquid cooling plate 10 includes a liquid cooling plate body, wherein the liquid cooling plate body has a first heat dissipation surface 131 and a second heat dissipation surface 132 which are arranged in parallel, the first heat dissipation surface 131 is a plane, and the second heat dissipation surface 132 is provided with a plurality of heat dissipation bosses 1321; a plurality of heat dissipation channels 133 extending along the heat dissipation bosses are arranged inside the liquid cooling plate body and correspond to the positions of the heat dissipation bosses 1321 respectively between the first heat dissipation surface 131 and the second heat dissipation surface 132, and the plurality of heat dissipation channels 133 are communicated to form a cooling liquid flow path; the cooling liquid flow path is provided with an inlet and an outlet, and the inlet and the outlet of the cooling liquid flow path are communicated with the cooling liquid external circulation heat dissipation system;

the first heat dissipation surface 131 is configured to be abutted against a surface of the first electronic device 15, the surface of the first electronic device 15 is a plane, and the cooling liquid flows in from the inlet of the cooling liquid flow path and flows out from the outlet, so that the first electronic device 15 is cooled and dissipated; alternatively, the first heat dissipation surface 131 is configured to abut against a first surface of the second electronic device 16, the first surface of the second electronic device 16 is a plane, the second heat dissipation surface 132 is configured to abut against a second surface of the second electronic device 16, the second surface of the second electronic device is disposed with the heat generating unit 162, and the heat dissipation boss 1321 is configured to abut against the heat generating unit 162, and the cooling liquid flows in from the inlet of the cooling liquid flow path and flows out from the outlet, so that the second electronic device liquid-cools and dissipates heat.

Specifically, as shown in fig. 4, 5, and 8, the liquid-cooled plate body is, for example, a flat plate, the first heat dissipation surface and the second heat dissipation surface of the liquid-cooled plate body are arranged in parallel, the second heat dissipation surface is provided with a plurality of heat dissipation bosses, the first heat dissipation surface is a flat surface, a coolant flow path formed by communicating a plurality of heat dissipation flow paths is arranged inside the liquid-cooled plate body, the coolant flow path has an inlet and an outlet, and the inlet and the outlet of the coolant flow path are communicated with the coolant external circulation heat dissipation system, so that the coolant enters from the inlet and flows through the coolant flow path inside the liquid-cooled plate body and then flows out from the outlet, that is, both the two heat dissipation surfaces of the liquid-cooled plate body can have a heat dissipation effect.

For example, referring to fig. 9, the liquid-cooled plate may be applied to a first electronic device 15, the surface of which is a plane, such as a power box of a mining machine, and then, a liquid-cooled plate is disposed on a side wall of the power box, and a first heat dissipation surface 131 of the liquid-cooled plate is mounted on the side wall of the power box; when a plurality of liquid cooling plates are installed, the cooling liquid flow paths of the liquid cooling plates can be arranged in parallel, so that the liquid cooling plates can carry out liquid cooling heat dissipation on the first electronic equipment, and the heat dissipation is uniform; it will be appreciated that the fluid-cooled plate may be mounted on multiple planes of the first electronic device, as desired.

For example, with reference to fig. 7, 8 and 10, the liquid cooling plate can be applied to a second electronic device 16, such as a force computing plate, where the force computing plate includes a substrate unit 161, a first surface of the substrate unit is a plane, a second surface of the substrate unit is provided with a heat generating unit 162, such as an array of chips, and then the two liquid cooling plates sandwich the second electronic device, and the first heat dissipation surface is abutted with the first surface of the substrate unit, the second heat dissipation surface is abutted with the second surface of the substrate unit, and the heat dissipation boss is abutted with the heat generating unit, so that the liquid cooling plate can dissipate heat of the second electronic device from both surfaces, and can completely meet the heat dissipation requirement of the second electronic device, does not need to use a fan, and dissipates heat uniformly;

in addition, it can be understood that the computation force plate is usually a plurality of stacked arrangements, at this time, in combination with fig. 10, a plurality of liquid cooling plates can be stacked with a plurality of computation force plates in a sandwich arrangement, and cooling liquid flow paths of a plurality of liquid cooling plates can be arranged in parallel, that is, one liquid cooling plate can perform liquid cooling heat dissipation on two computation force plates on two sides simultaneously, or one computation force plate can perform liquid cooling heat dissipation through two liquid cooling plates on two sides, so that the heat dissipation efficiency is improved, all heat loads of the computation force plate can be borne, and a fan is not needed.

That is to say, the liquid cooling plate of this application embodiment can be applicable to the liquid cooling heat dissipation of two kinds of devices of power and calculation board to can bear the heat dissipation demand of above-mentioned two kinds of electronic equipment, needn't install the fan.

In the embodiment of the application, the liquid cooling plate comprises a liquid cooling plate body, the liquid cooling plate body is provided with a first radiating surface and a second radiating surface, the first radiating surface is provided with a plurality of radiating bosses, radiating channels corresponding to the radiating bosses are arranged between the first radiating surface and the second radiating surface, the radiating channels extend along the radiating bosses, the radiating channels are communicated to form a cooling liquid flow path, and the cooling liquid flow path is provided with an inlet and an outlet, so that cooling liquid flows into the cooling liquid flow path from the inlet and flows out from the outlet to radiate heat of the liquid cooling of the electronic equipment;

when the electronic equipment is first electronic equipment such as a power box, the first heat dissipation surface of the liquid cooling plate is used for butting the plane of the power box so as to realize heat dissipation; when the electronic equipment is for example when digging the power board of ore deposit, a plurality of liquid cooling boards pile up to the second cooling surface orientation is the same, then be equipped with the power board of calculating between adjacent liquid cooling board, the power board of calculating is equipped with the one side and the butt joint of second cooling surface of the unit that generates heat, and like this, through the range upon range of sandwich setting of liquid cooling board and power board of calculating, this liquid cooling board can realize the complete liquid cooling heat dissipation to the power board of calculating, needn't use the fan, and the radiating effect is good, can bear the heat dissipation load of above-mentioned two kinds of electronic equipment completely, and convenient to use and simple to operate.

It can be understood that the area of the first heat dissipation surface or the second heat dissipation surface in the liquid cooling plate can be determined according to actual needs; and the thickness of the liquid cooling plate, namely the thickness between the two radiating surfaces can be determined according to the caliber of the radiating flow channel required in practice.

It can be understood that the heat dissipation flow channel is determined according to the number and the position of the heat dissipation bosses, for example, a plurality of heat dissipation bosses are arranged on the second heat dissipation surface in parallel, the number of the heat dissipation flow channel is the same as that of the heat dissipation bosses, and the position of the heat dissipation flow channel vertically corresponds to that of the heat dissipation bosses between the first heat dissipation surface and the second heat dissipation surface; in addition, the plurality of heat dissipation flow channels are communicated with each other to form a cooling fluid flow path, and it can be understood that the cooling fluid flow path should have two ports, i.e., an inlet and an outlet, for the cooling fluid to flow circularly.

It can be understood that, in the above embodiments, the intervals of the heat dissipation bosses should be determined according to the array arrangement of the heat generating units on the second electronic device, and the intervals of the heat dissipation flow channels should be consistent with the intervals of the heat dissipation bosses; the width of the heat dissipation boss is ensured to cover the heating unit, for example, the width of the heat dissipation boss is slightly larger than the width of the heating unit; in addition, if the width of the heat generating unit is small, one heat dissipating boss may correspond to the width of a plurality of heat generating units for the convenience of processing.

It can be understood that the heat dissipation bosses correspond to the positions of the heating units and avoid other electronic elements through the gaps between adjacent heat dissipation bosses; the central position of the heat dissipation flow channel corresponds to the central position of the heating unit so as to ensure that the heat of the heating unit can be discharged in time.

In one possible embodiment, a plurality of heat dissipation flow passages are connected in series to form a cooling fluid flow path.

Specifically, as shown in fig. 6, for example, a plurality of heat dissipation channels are connected in series to form an S-shaped coolant flow path, so that the coolant flow path can be ensured to be connected in series with each heat dissipation channel, thereby ensuring uniform heat dissipation.

In one possible embodiment, the liquid cooling plate body further has a first side wall and a second side wall which are oppositely arranged between the first heat dissipation surface and the second heat dissipation surface; wherein, the inlet and the outlet of the cooling liquid flow path are arranged on the first side wall.

Specifically, referring to fig. 5, in the present embodiment, the inlet and the outlet of the cooling fluid flow path are both disposed on the same side wall, i.e., the first side wall, and the first side wall is located between the first heat dissipation surface and the second heat dissipation surface; therefore, when the inlet and the outlet are externally connected with pipelines, the external pipelines of the cooling liquid can be ensured to be positioned on the same side of the liquid cooling plate, and then interfaces such as a power supply or a signal wire can be arranged on the other side (the second side wall), namely, liquid and electricity separation is realized, so that the use convenience and the safety and reliability are improved.

In one possible embodiment, the liquid cooling plate body comprises a heat dissipating main body 13 and a first closing plate 11 and a second closing plate 12 mounted to the heat dissipating main body 13; the heat dissipating body 13 has the first heat dissipating surface 131 and the second heat dissipating surface 132, a heat dissipating channel 133 is disposed inside the heat dissipating body 13, and the heat dissipating channel 133 penetrates through two ends of the heat dissipating body 13; the first sealing plate 11 and the second sealing plate 12 are respectively installed at two ends of the heat dissipating main body 13, so that the first sealing plate 11 and the second sealing plate 12 seal the heat dissipating flow channel 133, and the first sealing plate 11 and the second sealing plate 12 respectively form a first side wall and a second side wall; the first sealing plate 11 is provided with a first through hole 111 and a second through hole 112, which constitute an inlet and an outlet of the coolant, respectively.

Specifically, referring to fig. 5, the liquid cooling plate body includes a heat dissipating main body, a first sealing plate and a second sealing plate, the heat dissipating main body has the first heat dissipating surface and the second heat dissipating surface, a plurality of heat dissipating flow channels are disposed inside the heat dissipating main body, the heat dissipating flow channels penetrate through the heat dissipating main body, and then the first sealing plate and the second sealing plate are respectively disposed at two ends of the heat dissipating main body, so as to seal the heat dissipating flow channels, such that the first sealing plate forms the first side wall, the second sealing plate forms the second side wall, and the first through hole and the second through hole are respectively disposed on the first sealing plate, and thus the first through hole and the second through hole respectively form an inlet and an outlet of the cooling liquid flow channel.

In this embodiment, this liquid cooling plate is this body to constitute by three installed part installation concatenation, and first shrouding and second shrouding can adopt the mode fixed mounting that welding or bonding in the heat dissipation main part, and this heat dissipation main part is equipped with the heat dissipation runner that runs through, and processing is convenient, easily realizes.

With regard to the configuration of the coolant flow path, in one possible embodiment, the adjacent heat dissipation flow channels 133 are separated by a support wall 134, and the support wall 134 is provided with a notch 135; the notches 135 of the adjacent support walls 134 are respectively adjacent to the first sealing plate 11 and the second sealing plate 12, so that the plurality of heat dissipation flow channels 133 are connected in series to constitute a coolant flow path.

With reference to fig. 5 and 6, a supporting wall is disposed between the first heat dissipating surface and the second heat dissipating surface, a heat dissipating flow channel is formed between adjacent supporting walls, and a gap is disposed at one end of the supporting wall, through which the cooling liquid can pass; the gaps of the adjacent supporting walls are respectively close to the first sealing plate and the second sealing plate, namely, for example, the gap of the first supporting wall is positioned at one side of the first sealing plate, the gap of the second supporting wall adjacent to the first supporting wall is positioned at one side of the second sealing plate, and so on, so that a plurality of radiating flow channels can be communicated in series to form a cooling liquid flow path; then, the heat dissipation flow channels on the two sides penetrate through the first sealing plate to form a first through hole and a second through hole respectively.

In the embodiment, the plurality of heat dissipation runners are connected in series and communicated through simple notch design, and the notch is convenient to process on the heat dissipation main body and easy to realize; in addition, the size of the gap is determined according to the actually required cooling liquid flow and flow rate.

In one possible embodiment, the first heat dissipating surface 131 is provided with a plurality of first mounting holes 1311, and the first mounting holes 1311 avoid the heat dissipating runner 133; the first heat dissipating surface 131 is protruded with a mounting rim 1312, and the mounting rim 1312 is provided with a second mounting hole 1313.

Referring to fig. 4 and 7, in order to make the liquid cooling plate and the first electronic device or the second electronic device tightly fit for heat dissipation, a plurality of first mounting holes are formed in the first heat dissipation surface, and screws 17 penetrate through the side wall of the first electronic device or the substrate unit of the second electronic device and then are fixed in the first mounting holes to achieve fixed mounting; it can be appreciated that the first mounting hole should avoid the position of the liquid cooling plate heat dissipation channel.

In addition, the first heat dissipation surface is further protruded with an installation outer edge, the installation outer edge is provided with a second installation hole, and with reference to fig. 4, 9 and 10, a screw (not shown in the figure) can be used to penetrate through the second installation hole so as to realize the stacking installation of a plurality of liquid cooling plates or to fixedly install the liquid cooling plates on two side walls of the power box.

It can be understood that, for example, when two liquid cooling plates are installed on two side walls of the power box, the two liquid cooling plates can first pass through the second installation holes through the screws so as to clamp the power box, and then the two liquid cooling plates can be positioned and installed in the first installation holes from the inside of the power box by using the screws according to actual needs.

In one possible embodiment, the second heat dissipating surface is further provided with an abutting projection 1322, the abutting projection 1322 is higher than the heat dissipating projection 1321, so that the abutting projection 1322 abuts against the second surface of the second electronic device 16, and the heat dissipating projection 1321 abuts against the heat generating unit 162; the abutting bosses 1322 are disposed at both ends of the second heat dissipating surface 132, and/or the abutting bosses 1322 are disposed between the adjacent heat dissipating bosses 1321.

Referring to fig. 5, the second heat dissipating surface is further provided with an abutting boss, and the abutting boss is used for abutting against the substrate unit of the second electronic device, it can be understood that, since the substrate unit is provided with the heating unit with a certain height, the heat dissipating boss is used for abutting against the heating unit, and then the abutting boss is used for abutting against the substrate unit, the height of the abutting boss should be greater than that of the heat dissipating boss, and specifically should be determined according to the height of the heating unit; that is to say, the difference in height of butt boss and heat dissipation boss should be the height of the unit that generates heat, and at this moment, when butt boss butt base plate unit, the heat dissipation boss just in time butt the unit that generates heat to guarantee heat dissipation boss and the unit that generates heat full contact, do benefit to the heat dissipation, the unit that generates heat is unlikely to again to be damaged by the heat dissipation boss extrusion simultaneously.

It can be understood that, referring to fig. 5, the abutment bosses may be provided at both ends of the second heat radiating surface; alternatively, the abutting bosses may be provided at the middle position of the second heat dissipating surface, i.e., between the adjacent heat dissipating bosses.

In one possible embodiment, the first heat dissipation surface is coated with heat conductive silicone grease, and the heat dissipation boss surface is provided with a heat conductive silicone pad.

The heat conduction silicone grease is beneficial to heat conduction from the side wall of the first electronic device or the substrate unit of the second electronic device to the first heat dissipation surface, similarly, the heat conduction silicone pad is beneficial to heat conduction from the heating unit to the heat dissipation boss on one hand, and the heat conduction silicone pad plays a role in buffering and prevents the heat dissipation boss from extruding and damaging the heating unit on the other hand; the heat-conducting silicone grease and the heat-conducting silicone pad are beneficial to improving the heat-radiating efficiency and the heat-radiating uniformity.

In one possible embodiment, the liquid cooling plate body is further provided with hollow cavities 136 inside, and the hollow cavities 136 are located between adjacent heat dissipation channels 133.

Referring to fig. 5, one or more hollow cavities 136 may be further disposed inside the liquid cooling plate body, and the hollow cavities 136 are located between adjacent heat dissipation channels 133, so that the hollow cavities can reduce the weight of the liquid cooling plate and save the cost.

In one possible embodiment, the inner wall of the heat dissipation flow channel is provided with a turbulent flow structure; the turbulating structure includes corrugated protrusions 1331 or tooth-like protrusions extending along the heat dissipation channel, and/or the turbulating structure includes spiral protrusions extending along the heat dissipation channel.

In the embodiment, the turbulent flow structure can be arranged in the heat dissipation flow channel, and the turbulent flow structure can play a role in enhancing heat transfer by convection on the cooling liquid, namely, the flow velocity is improved, and the turbulent flow strength is enhanced, so that the temperature difference between the cooling liquid and the heating unit is reduced, and a good heat exchange effect is ensured under a small cooling liquid circulation flow;

referring to fig. 5, the turbulent flow structure can adopt a corrugated convex design with a simpler processing technology, so that the heat exchange area is increased, and meanwhile, the flow interface is reduced under the requirement of a certain flow channel width; or the flow disturbing structure can adopt a spiral bulge extending along the heat dissipation flow channel; alternatively, in other embodiments, the flow disturbing structure may be implemented by designing a flow disturbing column or filling a flow disturbing structural member, such as a coil spring, inside the heat dissipation flow channel.

In one possible embodiment, referring to fig. 4 and 5, the first through hole 111 and the second through hole 112 extend outward to form a butt joint pipe 14, and the butt joint pipe 14 is used for connecting the cooling liquid.

In one possible embodiment, the heat dissipation channels 133 are connected in parallel to form a cooling fluid flow path.

In this embodiment, referring to fig. 11, it can be understood that the plurality of heat dissipation flow channels may also be connected in parallel to form a cooling fluid flow path; at this time, it is preferable that the heat dissipation channel 133 should be disposed perpendicular to the first sidewall and the second sidewall.

It can be understood that when the plurality of heat dissipation channels are communicated in series, the cooling liquid flows through each heat dissipation channel in sequence, namely, for the following heat dissipation channel, the cooling liquid enters after absorbing certain heat, which is unfavorable for heat dissipation, and at the moment, the circulation flow of the cooling liquid can be reduced, and the flow rate of the cooling liquid can be increased; namely, the heat dissipation runners are communicated in series and are suitable for the condition of small cooling liquid circulation flow;

in a similar way, when the plurality of heat dissipation flow channels are connected in parallel and communicated, the cooling liquid flows through each heat dissipation flow channel simultaneously, and the unfavorable condition of heat dissipation does not exist, so that the heat dissipation flow channels are connected in parallel and communicated to be suitable for the condition of larger cooling liquid circulation flow.

Liquid collecting and separating device

The liquid collecting and distributing device is connected with the liquid cooling plate 10 and comprises a liquid collecting and distributing body, wherein the liquid collecting and distributing body is provided with a first mounting surface 231 and a second mounting surface 232 opposite to the first mounting surface 231; the first accommodating cavity is arranged between the first mounting surface 231 and the second mounting surface 232; the second accommodating cavity is arranged between the first mounting surface 231 and the second mounting surface 232, and the second accommodating cavity and the first accommodating cavity are arranged side by side;

then, a first external connection through hole 2331, a second external connection through hole 2341, a first transfer through hole 2332 and a second transfer through hole 2342 are respectively arranged on the second mounting surface 232; the first external through hole 2331 penetrates through the first accommodating cavity, the second external through hole 2341 penetrates through the second accommodating cavity, the first transfer through hole 2332 penetrates through the first accommodating cavity, and the second transfer through hole 2342 penetrates through the second accommodating cavity; thus, the first external connection hole 2331 and the second external connection hole 2341 are used for communicating with the external circulation cooling system of the cooling liquid, and the first transfer hole 2332 and the second transfer hole 2342 are used for communicating with the liquid cooling plate 10;

the cooling liquid flows into the first accommodating cavity from the first external through hole and flows into the liquid cooling plate through the first switching through hole, then flows into the second accommodating cavity from the liquid cooling plate through the second switching through hole and flows out through the second external through hole, so that the first accommodating cavity is used as a liquid distribution cavity, and the second accommodating cavity is used as a liquid collection cavity.

Specifically, as shown in fig. 12 and 13, the liquid collecting and distributing body is, for example, a flat plate shape, and has a first mounting surface and a second mounting surface which are opposite to each other, and a first accommodating cavity and a second accommodating cavity (not shown) are respectively arranged inside the liquid collecting and distributing body side by side between the first mounting surface and the second mounting surface, that is, the first accommodating cavity and the second accommodating cavity share the first mounting surface and the second mounting surface, and the first accommodating cavity and the second accommodating cavity are sealed independently; wherein, the first mounting surface is used for being mounted on the liquid cooling plate; the second mounting surface is respectively provided with a first external through hole, a second external through hole, a first switching through hole and a second switching through hole; the first external through hole and the first transfer through hole respectively and independently penetrate through the first accommodating cavity, and similarly, the second external through hole and the second transfer through hole respectively and independently penetrate through the second accommodating cavity.

That is to say, the first accommodating cavity and the second accommodating cavity are respectively provided with two types of through holes, wherein one type of through holes of the first accommodating cavity is used for connecting a cooling liquid external circulation heat dissipation system, the other type of through holes is used for connecting a liquid cooling plate, similarly, one type of through holes of the second accommodating cavity is used for connecting the cooling liquid external circulation heat dissipation system, and the other type of through holes is used for connecting the liquid cooling plate; like this, the coolant liquid is at first got into first holding chamber from the outside, then, gets into the liquid cooling board from first holding chamber, after the liquid cooling board absorbs the heat, gets into second holding chamber from the liquid cooling board again, flows from the second holding chamber at last, after the heat is released to outside cold source, circulates once more.

In the embodiment of the application, the liquid collecting and distributing device is connected with the liquid cooling plates for use, for example, connected with a plurality of liquid cooling plates for use; the diversity liquid device comprises a diversity liquid body, wherein the diversity liquid body is provided with a first mounting surface and a second mounting surface which are oppositely arranged, the diversity liquid body is provided with a first accommodating cavity and a second accommodating cavity which are arranged side by side between the first mounting surface and the second mounting surface, then the first mounting surface is used for being mounted on a liquid cooling plate, and the second mounting surface is respectively provided with a first external through hole, a second external through hole, a first switching through hole and a second switching through hole, wherein the first external through hole and the first switching through hole respectively penetrate through the first accommodating cavity, and the second external through hole and the second switching through hole respectively penetrate through the second accommodating cavity; in this way, the cooling liquid flows in from the first external through hole, sequentially flows through the first accommodating cavity, the liquid cooling plate and the second accommodating cavity, and flows out from the second external through hole, namely, the first accommodating cavity is used as a liquid distribution cavity, and the second accommodating cavity is used as a liquid collection cavity; that is to say, the branch liquid collecting device of this application embodiment will divide liquid chamber and liquid collecting chamber to set up side by side to, locate same face with the through-hole of coolant liquid and liquid cooling board UNICOM, like this, when using with the cooperation of liquid cooling board, this branch liquid collecting device can locate the middle zone of liquid cooling board business turn over liquid mouth, and the second installation face outwards, this second installation face is all located to the pipeline, thereby has space utilization height, the technological effect of easy to assemble use.

It can be understood that the liquid collecting and distributing device can be respectively communicated with the cooling liquid external circulation heat dissipation system and the liquid cooling plate through pipelines, and the aperture of the first external through hole, the aperture of the second external through hole, the aperture of the first switching through hole and the aperture of the second switching through hole are respectively determined according to the cooling liquid flow channel and the liquid cooling plate flow channel.

It can be understood that the liquid collecting and distributing device is connected with the liquid cooling plate, wherein the connection comprises that the liquid collecting and distributing body is fixedly arranged on the liquid cooling plate, namely, the first mounting surface of the liquid collecting and distributing body is fixedly arranged on the liquid cooling plate, and is particularly arranged in the middle area of a liquid inlet and a liquid outlet of the liquid cooling plate; and the liquid collecting and distributing body is connected with the liquid cooling plate through a pipeline so that the cooling liquid flows between the liquid collecting and distributing body and the liquid cooling plate.

It can be understood that when the cooling liquid of the external circulation heat dissipation system flows into the liquid distribution and collection device from the second external through hole, the second accommodating cavity serves as a liquid distribution cavity, then the cooling liquid flows into the liquid cooling plate from the second through hole, after the liquid cooling plate absorbs heat, the cooling liquid flows from the liquid cooling plate to the first accommodating cavity through the first through hole and flows back to the external circulation heat dissipation system through the first external through hole, and at the moment, the first accommodating cavity serves as a liquid collection cavity; that is, first external through-hole and second external through-hole, first holding chamber and second holding chamber, first switching through-hole and second switching through-hole are only as distinguishing, can use according to actual interchange.

In one possible embodiment, the liquid collecting and distributing device further comprises an air inlet through hole 2333 and a liquid discharge through hole 2343, wherein the air inlet through hole 2333 and the liquid discharge through hole 2343 are arranged on the second mounting surface 232; the air inlet through hole 2333 penetrates through the first accommodating cavity, and the liquid outlet through hole 2343 penetrates through the second accommodating cavity; or, the air inlet hole 2333 penetrates through the second accommodating cavity, and the liquid outlet hole 2343 penetrates through the first accommodating cavity; valves are connected to the air inlet 2333 and liquid outlet 2343.

Specifically, as shown in fig. 13, an air inlet through hole and a liquid discharge through hole are further formed in the second mounting surface, the air inlet through hole penetrates through the first accommodating cavity, the liquid discharge through hole penetrates through the second accommodating cavity, a valve is externally connected to the air inlet through hole and the liquid discharge through hole, when the air inlet through hole and the liquid discharge through hole are not used, the valve is closed, when liquid discharge is needed, the valve is opened, the air inlet through hole and the liquid discharge through hole are respectively communicated with an external liquid discharge device (such as an air compressor and the like), and when the first external through hole and the second external through hole are closed, air enters from the air inlet through hole, extrudes cooling liquid in the liquid collection device and the liquid cooling plate, and is discharged from the liquid discharge through.

That is, in this application embodiment, through setting up inlet opening and flowing back through-hole, can make the coolant liquid discharge in branch liquid device and the liquid cold plate when needs, then with the whole follow outside cooling liquid pipeline dismantlement of branch liquid device and liquid cold plate can, convenient to use.

Can understand, foretell air inlet through hole and flowing back through hole also can exchange the position, promptly, air inlet through hole runs through to second holding chamber, and the flowing back through hole runs through to first holding chamber, and like this, the outside compressed air of second holding chamber UNICOM does not influence the flowing back effect.

In one possible embodiment, the liquid-cooling plate assembly is connected to a plurality of liquid-cooling plates 10, and includes a plurality of first transfer holes 2332 and a plurality of second transfer holes 2342, the number of the first transfer holes 2332 and the number of the second transfer holes 2342 are the same; the number of the first transfer holes 2332 is the same as the number of the liquid-cooled plates 10; alternatively, the number of the first transfer-through holes 2332 is reduced by one compared to the number of the liquid-cooled plates 10.

Specifically, as shown in fig. 16, in use, one of the liquid collecting and distributing devices may be connected to a plurality of liquid cooling plates, the plurality of liquid cooling plates are stacked, an electronic device is disposed between adjacent liquid cooling plates, and the first mounting surface of the liquid collecting and distributing device is fixedly mounted on one side of the plurality of liquid cooling plates, for example, in an area between the liquid inlet and the liquid outlet; then, the second installation surface of the liquid collecting and distributing device is provided with the first through holes and the second through holes which are the same in number, so that the side edge of the liquid collecting and distributing device can not exceed the size of liquid cooling mining machine equipment with a plurality of liquid cooling plates, the space utilization rate is high, and the size of the liquid cooling mining machine is fully reduced.

For example, as shown in fig. 16, one liquid distribution and collection device is connected to four liquid cooling plates, and the first receiving chamber and the second receiving chamber are respectively provided with four first through holes and four second through holes, so that each first through hole is respectively connected to one liquid inlet and outlet hole of one liquid cooling plate, and similarly, each second through hole is respectively connected to the other liquid inlet and outlet hole of one liquid cooling plate; that is to say, relative diversity liquid device, four liquid cooling boards are the parallel relation, and the coolant liquid can get into these four liquid cooling boards simultaneously from first holding chamber, then flows back to the second holding chamber simultaneously again, like this, is favorable to improving the heat dissipation homogeneity of locating a plurality of electronic equipment between the liquid cooling board.

Referring to fig. 16 again, among the four stacked liquid-cooled plates, the two outermost liquid-cooled plates on the two sides only use one heat dissipation surface to dissipate heat for the electronic device, and on the premise of ensuring the heat dissipation effect, the two outermost liquid-cooled plates can also be used in series, and at this time, it can be understood that the first accommodating cavity and the second accommodating cavity are respectively provided with three first through holes and three second through holes.

In one possible embodiment, the diversity liquid body comprises a diversity liquid main body 23 and a first cover 21 and a second cover 22 which are arranged on the diversity liquid main body 23; the diversity liquid main body 23 has a first mounting surface 231 and a second mounting surface 232, and between the first mounting surface 231 and the second mounting surface 232, the diversity liquid main body 23 has a first channel 233 and a second channel 234, and the first channel 233 and the second channel 234 respectively penetrate through both ends of the diversity liquid main body 23; the first covers 21 are installed at two ends of the first channel 233, so that the first channel 233 forms a first accommodating cavity; the second cover 22 is disposed at two ends of the second channel 234, so that the second channel 234 forms a second receiving cavity.

Specifically, as shown in fig. 13, the diversity liquid main body is, for example, a plate-shaped, and has a first mounting surface and a second mounting surface, and between the first mounting surface and the second mounting surface, the diversity liquid main body further has a first channel and a second channel penetrating therethrough, and then, the two first sealing caps are respectively sealed at two ends of the first channel, so that the first channel forms a first receiving cavity, and the two second sealing caps are respectively sealed at two ends of the second channel, so that the second channel forms a second receiving cavity.

In this embodiment, two channels of the main body of the diversity liquid can be realized by stamping, and then the sealing cover is installed, and the sealing cover and the main body of the diversity liquid are welded, for example, so that the structure is compact and simple, and the realization is easy.

It will be understood that the cross-section of the first and second channels may be determined according to the actual situation, such as square or other shapes, without limitation.

In this embodiment, the first channel and the second channel are separately closed at two sides of the main body of the diversity liquid, which is beneficial to opening the first accommodating cavity and the second accommodating cavity respectively; it will be appreciated that the first and second covers may also be of unitary construction.

In one possible embodiment, the liquid collecting and distributing body 23 is further provided with an insulating channel 235, the insulating channel 235 penetrates through the liquid collecting and distributing body 23, and the insulating channel 235 is located between the first channel 233 and the second channel 234.

That is, as shown in fig. 13, a penetrating heat insulation channel is further provided between the first channel and the second channel, the heat insulation channel can circulate air, the air thermal conductivity coefficient is low, and further, the first accommodating chamber and the second accommodating chamber are heat insulated, so that the coolant with higher temperature recovered by the liquid collection chamber (the second accommodating chamber) is prevented from affecting the coolant with lower temperature in the liquid distribution chamber (the first accommodating chamber), and the heat dissipation effect is reduced; namely, in this embodiment, the first accommodating chamber and the second accommodating chamber are physically separated by the heat insulation chamber, and the heat insulation effect is good.

In one possible embodiment, the first mounting surface 231 is protruded with a fixing rim 2311, the fixing rim 2311 is provided with fixing holes 2312, and the fixing holes 2312 are used for mounting the diversity liquid body on the liquid cooling plate 10.

It will be appreciated that the retaining rim may be convex in a direction perpendicular to the first passageway, as shown in figures 13 and 16, or alternatively, convex in the direction of the first passageway.

In one possible embodiment, the first external through hole, the second external through hole, the first adapting through hole and the second adapting through hole are externally connected with pipe joints, and the pipe joints are used for connecting the through holes with the cooling liquid external circulation heat dissipation system and the liquid cooling plate respectively; wherein, the pipe joint and the through hole can be in threaded connection or welded; the pipe joint can be a quick-plugging pipe joint 24, a pagoda type pipe joint or a movable joint and the like.

Specifically, as shown in fig. 14, the first external through hole, the second external through hole, the first through hole and the second through hole are counter bores, the counter bores are provided with internal threads, then the pipe joint is provided with external threads spirally mounted with the internal threads, the pipe joint is a quick-insertion type pipe joint 24, the quick-insertion type pipe joint 24 can be externally connected with a quick-insertion hose, the hose and the quick-insertion type pipe joint are locked and limited by a joint locking ring 243 and sealed by an internal O-ring, the external threads 241 on the quick-insertion type pipe joint are matched with the internal threads of the counter bores to extrude a sealing ring 242 to perform end face sealing, or the external threads and the internal threads are directly matched to.

It can be understood that, in another embodiment, the pipe joint can also be a pagoda joint, the pagoda joint can be externally connected with a hose and locked by a hose clamp, the pagoda joint and the through hole can be in threaded connection or welding connection, and the pagoda joint and the through hole are sealed by thread sealant or welding; in another embodiment, the pipe joint is also a loose joint, the loose joint and the externally connected hose can be sealed by a flat gasket or an O-shaped sealing ring, and the loose joint and the through hole can be welded and sealed.

It can be understood that, in the above embodiment, as shown in fig. 2, the first external through hole and the second external through hole are diagonally arranged with respect to the liquid collecting and distributing device, and the air inlet through hole and the liquid outlet through hole are diagonally arranged with respect to the liquid collecting and distributing device, so as to facilitate the connection and installation of the pipelines.

The foregoing describes the general principles of the present application in conjunction with specific embodiments, however, it is noted that the advantages, effects, etc. mentioned in the present application are merely examples and are not limiting, and they should not be considered essential to the various embodiments of the present application. Furthermore, the foregoing disclosure of specific details is for the purpose of illustration and description and is not intended to be limiting, since the foregoing disclosure is not intended to be exhaustive or to limit the disclosure to the precise details disclosed.

The block diagrams of devices, apparatuses, systems referred to in this application are only given as illustrative examples and are not intended to require or imply that the connections, arrangements, configurations, etc. must be made in the manner shown in the block diagrams. These devices, apparatuses, devices, systems may be connected, arranged, configured in any manner, as will be appreciated by those skilled in the art. Words such as "including," "comprising," "having," and the like are open-ended words that mean "including, but not limited to," and are used interchangeably therewith. The words "or" and "as used herein mean, and are used interchangeably with, the word" and/or, "unless the context clearly dictates otherwise. The word "such as" is used herein to mean, and is used interchangeably with, the phrase "such as but not limited to".

It should also be noted that in the devices, apparatuses, and methods of the present application, the components or steps may be decomposed and/or recombined. These decompositions and/or recombinations are to be considered as equivalents of the present application.

The previous description of the disclosed aspects is provided to enable any person skilled in the art to make or use the present application. Various modifications to these aspects will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other aspects without departing from the scope of the application. Thus, the present application is not intended to be limited to the aspects shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

The foregoing description has been presented for purposes of illustration and description. Furthermore, the description is not intended to limit embodiments of the application to the form disclosed herein. While a number of exemplary aspects and embodiments have been discussed above, those of skill in the art will recognize that certain variations, modifications, alterations, additions and sub-combinations thereof are encompassed within the scope of the invention.

Claims

1. A liquid cooling heat dissipation system is characterized in that the liquid cooling heat dissipation system comprises a liquid distribution and collection device and at least two liquid cooling plates provided with the liquid distribution and collection device, wherein,

the liquid cooling plate includes:

the liquid distribution and collection device comprises:

2. The liquid-cooled heat removal system of claim 1,

a first connecting pipe extends outwards from the inlet of the cooling liquid flow path, and a second connecting pipe extends outwards from the outlet of the cooling liquid flow path;

3. The liquid-cooled heat dissipation system of claim 2, wherein the first extension tube and the second extension tube have a first shut-off valve disposed thereon.

4. The liquid-cooled heat dissipation system of claim 1, wherein the first receiving cavity further has an air inlet through hole on the second mounting surface, and the air inlet through hole extends outward to form an air inlet pipe; and the second accommodating cavity is also provided with a liquid drainage through hole on the second mounting surface, and a liquid drainage pipe extends outwards from the liquid drainage through hole.

5. The liquid-cooled heat removal system of claim 4, wherein a second shut-off valve is provided on the inlet pipe and the drain pipe.

6. The liquid-cooled heat dissipation system of claim 1, wherein said first sidewalls of said plurality of liquid-cooled plates are fixedly connected via a first side sealing plate, and said first mounting surface is mounted on said first side sealing plate.

7. The liquid-cooled heat removal system of claim 6, wherein the second sidewalls of the plurality of liquid-cooled plates are fixedly attached by a second side sealing plate.

8. The liquid-cooled heat dissipation system of claim 7, wherein an interposer is disposed between the first side sealing plate and the liquid-cooled plate, and/or an interposer is disposed between the second side sealing plate and the liquid-cooled plate.

9. The liquid-cooled heat dissipation system of claim 1, wherein the liquid-cooled plate body further comprises a mounting rim, the mounting rim is provided with a second mounting hole, and a screw is inserted into the second mounting hole.

10. A virtual currency digger with a liquid cooling heat dissipation system is characterized by comprising a computing board and a power supply, wherein the computing board and the power supply are respectively used for dissipating heat through the liquid cooling heat dissipation system, and the liquid cooling heat dissipation system is the liquid cooling heat dissipation system as claimed in any one of claims 1 to 9.