CN210199680U - Silicone grease cooling device - Google Patents
Silicone grease cooling device Download PDFInfo
- Publication number
- CN210199680U CN210199680U CN201921466791.1U CN201921466791U CN210199680U CN 210199680 U CN210199680 U CN 210199680U CN 201921466791 U CN201921466791 U CN 201921466791U CN 210199680 U CN210199680 U CN 210199680U
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- shell
- heat dissipation
- silicone grease
- dissipation plate
- face
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Abstract
A silicone grease cooling device comprises a shell, a first heat dissipation plate and a second heat dissipation plate; the hollow bin with the hollow bin extending from the shell is provided with a first opening and a second opening on the shell respectively; the first heat dissipation plate is positioned at the end face of the shell provided with the first opening; the end face, far away from the shell, of the first heat dissipation plate is uniformly provided with mounting grooves; a silicone grease block is arranged in the notch of the mounting groove; the silicone grease block and the mounting groove respectively form a mounting bin, and a silicone grease layer is coated on the end face of the silicone grease block, which is flush with the first heat dissipation plate, and the end face of the first heat dissipation plate; a semiconductor refrigerating sheet is arranged in the mounting bin, the hot end of the semiconductor refrigerating sheet is tightly pressed on the bottom surface of the mounting bin, and the cold end of the semiconductor refrigerating sheet is tightly pressed on the silicone grease block; the second heating panel is located the shell and is equipped with second open-ended terminal surface department, and second heating panel, first heating panel and shell constitute the stock solution storehouse that is used for saving and establishes the coolant liquid. The utility model provides a cooling device can effectively carry out the radiating action to quick-witted incasement easy heating part.
Description
Technical Field
The utility model relates to a heat dissipation technical field especially relates to a silicone grease cooling device.
Background
The host computer is a main body part of the computer except input and output equipment, and is also a control box body used for placing a mainboard and other main components, and generally comprises a CPU, an internal memory, a mainboard, an optical drive, a power supply, other input and output controllers and interfaces; located inside the main chassis, commonly referred to as a build-in, and located outside the main chassis, commonly referred to as a peripheral; the mainframe box is as partly in the computer accessories, its main function that plays is to place and fix each computer accessories, play a bearing and guard action, the mainframe box capacity is limited, often need install numerous parts that generate heat easily, when the computer uses, the heat dissipation of the easy heat generation part in the mainframe box only relies on radiator fan to dispel the heat, heat-sinking capability is limited, often can not effectually dispel the heat to parts such as CPU, greatly reduced computer's performance, for this reason, propose a silicone grease cooling device in this application in order to carry out effectual heat dissipation to easy heat dissipation part in the mainframe box.
SUMMERY OF THE UTILITY MODEL
Objects of the invention
For solving the technical problem who exists among the background art, the utility model provides a silicone grease cooling device, the utility model provides a cooling device structure is little and convenient to be installed in the computer mainframe box, can effectively dispel the heat to it on cooling device with the setting of the easy heating element of mainframe box to improve the performance of computer.
(II) technical scheme
The utility model provides a silicone grease cooling device, which comprises a shell, a first heating panel, a second heating panel and a plurality of semiconductor refrigerating sheets;
the shell extends inwards along the central axis thereof and is provided with a hollow bin; the hollow bin is provided with a first opening and a second opening on two end faces of the shell which are parallel to each other;
the first heat dissipation plate is positioned at the end face of the shell provided with the first opening, and the end face of the shell is pressed by the first heat dissipation plate towards the end face of the shell; the end face, far away from the shell, of the first heat dissipation plate is uniformly provided with mounting grooves; the mounting grooves are distributed at equal intervals, and silicone grease blocks are respectively arranged in the notches of the mounting grooves; the end faces of the plurality of silicone grease blocks are flush with the end face of the first heat dissipation plate, the plurality of silicone grease blocks and the plurality of mounting grooves form a plurality of mounting bins respectively, and a silicone grease layer is coated on the end face of the plurality of silicone grease blocks, which is flush with the first heat dissipation plate, and the end face of the first heat dissipation plate;
the semiconductor refrigeration pieces are respectively arranged in the mounting bin, wherein the hot ends of the semiconductor refrigeration pieces are tightly pressed on the bottom surface of the mounting bin, and the cold ends of the semiconductor refrigeration pieces are tightly pressed on the silicone grease blocks; sealant is filled in the space between the semiconductor refrigerating sheet and the mounting bin;
the second heating panel is located the shell and is equipped with second open-ended terminal surface department, and the terminal surface that the second heating panel compressed tightly the shell towards the shell, and wherein, second heating panel, first heating panel and shell constitute the stock solution storehouse that is used for depositing the coolant liquid.
Preferably, a first flange plate; wherein, the end surface of the shell provided with the first opening is provided with a first positioning groove connected with the head;
the first flange plate is arranged on the first heat dissipation plate, and the first flange plate is matched and inserted into the first positioning groove in a sliding mode; the first flange plates are arranged in a head-to-head connection mode, and the end faces, facing the bottom face of the first positioning groove, of the first flange plates press the bottom face of the first positioning groove tightly.
Preferably, the first flange plate is provided with a first gasket on an end surface pressing the first positioning groove.
Preferably, the first flange plate and the first heat dissipation plate are of an integrated structure, and the first flange plate is uniformly provided with first mounting holes; wherein, the first mounting holes are respectively provided with a first fastening piece; a first positioning blind hole is formed in the first positioning groove;
the first fastening pieces are screwed into the first positioning blind holes respectively, wherein the first fastening pieces correspond to the first positioning blind holes one to one.
Preferably, a second flange plate; wherein, the end surface of the shell provided with the second opening is provided with a second positioning groove connected with the head;
the second flange plate is arranged on the second heat dissipation plate and is matched and slidably inserted into the second positioning groove; the second flange plates are arranged in a head-to-head connection mode, and the end faces, facing the bottom face of the second positioning groove, of the second flange plates press the bottom face of the second positioning groove tightly.
Preferably, the end face of the second flange plate pressing against the second positioning groove is provided with a second sealing gasket.
Preferably, the second flange plate and the second heat dissipation plate are of an integrated structure, and the second flange plate is uniformly provided with second mounting holes; wherein, the second mounting holes are respectively provided with a second fastening piece; a second positioning blind hole is formed in the second positioning groove;
and the second fastening pieces are screwed into the second positioning blind holes respectively, wherein the second fastening pieces correspond to the second positioning blind holes one to one.
Preferably, a plurality of heat radiating fins are included; a plurality of fin equidistant side by side sets up on first heating panel, and a plurality of fin all are located the coolant liquid.
Preferably, a plurality of baffles are included; the baffle plates are arranged in the mounting bin, the length of each baffle plate is smaller than the width of the mounting bin, the baffle plates are distributed in parallel at equal intervals along the length direction of the mounting bin, and two adjacent baffle plates are distributed in a staggered mode to form a liquid channel in the mounting bin; the liquid channel is respectively provided with a liquid inlet hole connected with the transfusion end of the external cooling liquid conveying device and a liquid outlet hole connected with the liquid inlet of the external cooling liquid storage box at the two ends of the shell.
The above technical scheme of the utility model has following profitable technological effect:
in the utility model, when in use, the cooling device is arranged in the computer case; connecting the shell with the inner wall of the computer mainframe box, mounting parts which are easy to heat, such as a CPU (central processing unit) in the computer mainframe box, on the first heat dissipation plate, and transferring heat energy generated by the parts such as the CPU to the surface of the first heat dissipation plate through the silicone grease layer; the semiconductor refrigerating sheet is electrified to operate, and the cold end of the semiconductor refrigerating sheet cools the silicone grease block, so that the high temperature transmitted from the first heat dissipation plate is quickly cooled; the hot end of the semiconductor refrigeration piece transfers the generated heat to a first heat dissipation plate which is in contact with the cooling liquid, and the hot end of the semiconductor refrigeration piece is transferred to the first heat dissipation plate through the cooling liquid to be cooled at high temperature; the second heat dissipation plate is connected with the mainframe box and is arranged at the blowing end of the heat dissipation fan in the mainframe box, and the high temperature transmitted to the second heat dissipation plate by the cooling liquid is dissipated by the wind blown by the heat dissipation fan; the cooling device can effectively and efficiently dissipate heat of parts easy to dissipate heat in the computer case, and avoids the influence of poor heat dissipation effect on normal use of the computer caused by the parts easy to heat, such as a CPU (central processing unit) in the case;
in addition, a liquid channel is arranged in the mounting bin; the cooling liquid is conveyed into the liquid channel through a cooling liquid conveying device; the cooling liquid flows back to the cooling liquid storage tank, and the cooling liquid circulates in the liquid channel, so that the heat dissipation efficiency of the device is improved.
Drawings
Fig. 1 is a schematic structural diagram of a silicone grease cooling device according to the present invention.
Fig. 2 is a schematic structural diagram of a part a of a silicone grease cooling device according to the present invention.
Fig. 3 is a schematic perspective view of a housing of a silicone grease cooling device according to the present invention.
Fig. 4 is a cross-sectional view of a silicone grease cooling device according to the present invention.
Fig. 5 is a schematic perspective view of a first heat dissipation plate in a silicone grease cooling device according to the present invention.
Reference numerals: 1. a housing; 2. a first heat dissipation plate; 3. a first fastening member; 4. a silicone layer; 5. a heat sink; 6. a second heat dissipation plate; 7. a baffle plate; 8. a second fastening member; 9. a second flange plate; 10. silicone grease block; 11. mounting grooves; 12. a semiconductor refrigeration sheet; 13. a hollow bin; 14. a first positioning groove; 15. a liquid inlet hole; 16. a liquid outlet hole; 17. a second positioning groove; 18. a second positioning blind hole; 19. a liquid channel; 20. a first mounting hole; 21. a first flange plate; 22. a liquid storage bin.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings. It should be understood that the description is intended to be illustrative only and is not intended to limit the scope of the present invention. Moreover, in the following description, descriptions of well-known structures and techniques are omitted so as to not unnecessarily obscure the concepts of the present invention.
As shown in fig. 1-5, the present invention provides a silicone grease cooling device, which comprises a housing 1, a first heat dissipation plate 2, a second heat dissipation plate 6 and a plurality of semiconductor cooling fins 12;
the shell 1 is internally provided with a hollow bin 13 along the central axis thereof; the hollow bin 13 is provided with a first opening and a second opening on two parallel end faces of the shell 1 respectively;
the first heat dissipation plate 2 is positioned at the end face of the shell 1 provided with the first opening, and the end face of the shell 1 is pressed by the first heat dissipation plate 2 towards the end face of the shell 1; the end face, far away from the shell 1, of the first heat dissipation plate 2 is uniformly provided with mounting grooves 11; wherein, a plurality of mounting grooves 11 are distributed at equal intervals, and silicone grease blocks 10 are respectively arranged in the notches of the mounting grooves 11; the end faces of the plurality of silicone grease blocks 10 are flush with the end face of the first heat dissipation plate 2, the plurality of silicone grease blocks 10 and the plurality of mounting grooves 11 form a plurality of mounting bins respectively, and the end faces of the plurality of silicone grease blocks 10 flush with the first heat dissipation plate 2 and the end face of the first heat dissipation plate 2 are coated with a silicone grease layer 4;
the semiconductor refrigeration pieces 12 are respectively arranged in the installation bin, wherein the hot ends of the semiconductor refrigeration pieces 12 tightly press the bottom surface of the installation bin, and the cold ends of the semiconductor refrigeration pieces 12 tightly press the silicone grease blocks 10; sealant is filled in the space between the semiconductor refrigeration piece 12 and the mounting bin to form a heat insulation layer to separate the cold end of the semiconductor refrigeration piece 12 from the hot end of the semiconductor refrigeration piece 12 so as to improve the refrigeration effect of the semiconductor refrigeration piece;
the second heat dissipation plate 6 is positioned at the end face of the shell 1 provided with the second opening, the end face of the shell 1 is pressed by the second heat dissipation plate 6 towards the end face of the shell 1, wherein the second heat dissipation plate 6, the first heat dissipation plate 2 and the shell 1 form a liquid storage bin 22 for storing cooling liquid;
the first heat dissipation plate 2 and the second heat dissipation plate 6 are identical in shape, and when the projection of the shell 1 is in a shape of a Chinese character 'hui', the projections of the first heat dissipation plate 2 and the second heat dissipation plate 6 are square;
when the projection of the housing 1 is annular, the projections of the first heat dissipation plate 2 and the second heat dissipation plate 6 are square.
In the utility model, when in use, the cooling device is arranged in the computer case; connecting the shell 1 with the inner wall of the computer mainframe box, mounting the parts which are easy to generate heat, such as a CPU (central processing unit) in the computer mainframe box, on the first heat dissipation plate 2, and transmitting the heat energy generated by the parts such as the CPU to the surface of the first heat dissipation plate 2 by the silicone grease layer 4; the semiconductor refrigerating sheet 12 is electrified to operate, and the cold end of the semiconductor refrigerating sheet 12 cools the silicone grease block 12, so that the high temperature transmitted from the first heat dissipation plate 2 is quickly cooled; the hot end of the semiconductor refrigeration piece 12 transfers the generated heat to the first heat dissipation plate 2 which is contacted with the cooling liquid, and the hot end of the semiconductor refrigeration piece 12 is transferred to the first heat dissipation plate 2 through the cooling liquid to be cooled at high temperature; the second heat dissipation plate 6 is connected with the mainframe box, the second heat dissipation plate 6 is arranged at the blowing end of a heat dissipation fan in the mainframe box, and the high temperature transmitted to the second heat dissipation plate 6 by the cooling liquid is dissipated through the wind blown by the heat dissipation fan; the cooling device can effectively and efficiently dissipate heat of the parts easy to dissipate heat in the computer case, and avoids the influence of the parts easy to heat such as a CPU (central processing unit) in the case on the normal use of the computer due to poor heat dissipation effect.
In an alternative embodiment, a first flange plate 21; wherein, the end surface of the shell 1 provided with the first opening is provided with a first positioning groove 14 connected with the head;
the first flange plate 21 is arranged on the first heat dissipation plate 2, and the first flange plate 21 is inserted into the first positioning groove 14 in a matching and sliding manner; wherein, the first flange plate 21 is arranged in a head-to-head connection, and the end surface of the first flange plate 21 facing the bottom surface of the first positioning groove 14 presses the bottom surface of the first positioning groove 14;
the first heat sink 2 is easily and quickly mounted on the housing 1 by the first flange plate 21.
In an alternative embodiment, the first flange plate 21 is provided with a first gasket on the end face pressed against the first positioning groove 14; the first gasket is provided to improve the sealing performance between the first flange plate 21 and the housing 1 and prevent the coolant from flowing out through the gap therebetween.
In an alternative embodiment, the first flange plate 21 and the first heat dissipation plate 2 are an integral structure, and the first flange plate 21 is uniformly provided with first mounting holes 20; wherein, the first fastening pieces 3 are respectively arranged in the plurality of first mounting holes 20; a first positioning blind hole is arranged in the first positioning groove 14;
the first fastening pieces 3 are screwed into the first positioning blind holes respectively in a threaded manner, wherein the first fastening pieces 3 correspond to the first positioning blind holes one by one; the first heat dissipation plate 2 and the housing 1 are conveniently disassembled and assembled through the first fastening piece 3.
In an alternative embodiment, a second flange plate 9 is included; wherein, the end surface of the shell 1 provided with the second opening is provided with a second positioning groove 17 connected with the head;
the second flange plate 9 is arranged on the second heat dissipation plate 6, and the second flange plate 9 is matched and inserted into the second positioning groove 17 in a sliding mode; wherein, the second flange plate 9 is connected at the head, the end surface of the second flange plate 9 facing to the bottom surface of the second positioning slot 17 presses the bottom surface of the second positioning slot 17; the second heat sink 6 is easily and quickly mounted on the housing 1 by the provision of the second flange plate 9.
In an alternative embodiment, the second flange plate 9 is provided with a second gasket on its end face which is pressed against the second positioning slot 17; the second gasket is provided to improve the sealing between the second flange plate 9 and the housing 1 and to prevent the coolant from flowing out through the gap between the two.
In an alternative embodiment, the second flange plate 9 and the second heat dissipation plate 6 are an integral structure, and the second flange plate 9 is uniformly provided with second mounting holes; wherein, the second fastening pieces 8 are respectively arranged in the second mounting holes; a second positioning blind hole 18 is arranged in the second positioning groove 17;
the plurality of second fastening pieces 8 are screwed into the second positioning blind holes 18 respectively, wherein the second fastening pieces 8 correspond to the second positioning blind holes 18 one by one; the second heat dissipation plate 6 and the housing 1 are conveniently disassembled and assembled through the second fastening piece 8.
In an alternative embodiment, a plurality of fins 5 are included; the plurality of radiating fins 5 are arranged on the first radiating plate 2 side by side at equal intervals, and the plurality of radiating fins 5 are all positioned in the cooling liquid; the cooling speed of the cooling liquid to the hot end contact end face of the first heat dissipation plate 2 and the semiconductor refrigeration piece 12 is improved through the arranged cooling fins 5.
In an alternative embodiment, a plurality of baffles 7 are included; the baffles 7 are arranged in the mounting bin, the length of each baffle 7 is smaller than the width of the mounting bin, the baffles 7 are distributed in parallel at equal intervals along the length direction of the mounting bin, and the adjacent baffles 7 are distributed in a staggered mode to form a liquid channel 19 in the mounting bin; the liquid channel 19 is respectively provided with a liquid inlet hole 15 connected with the transfusion end of the external cooling liquid conveying device and a liquid outlet hole 16 connected with the liquid inlet of the external cooling liquid storage tank at the two ends of the shell 1;
the cooling liquid is conveyed into the liquid channel 19 through a cooling liquid conveying device; the cooling liquid flows back to the cooling liquid storage tank, and the cooling liquid is circulated in the liquid channel 19, so that the heat dissipation efficiency of the device is improved.
It is to be understood that the above-described embodiments of the present invention are merely illustrative of or explaining the principles of the invention and are not to be construed as limiting the invention. Therefore, any modification, equivalent replacement, improvement and the like made without departing from the spirit and scope of the present invention should be included in the protection scope of the present invention. Further, it is intended that the appended claims cover all such variations and modifications as fall within the scope and boundaries of the appended claims or the equivalents of such scope and boundaries.
Claims (9)
1. The silicone grease cooling device is characterized by comprising a shell (1), a first heat dissipation plate (2), a second heat dissipation plate (6) and a plurality of semiconductor refrigeration pieces (12);
the shell (1) is internally provided with a hollow bin (13) along the central axis; the hollow bin (13) is provided with a first opening and a second opening on two parallel end faces of the shell (1) respectively;
the first heat dissipation plate (2) is positioned at the end face of the shell (1) provided with the first opening, and the end face of the shell (1) is pressed by the first heat dissipation plate (2) towards the end face of the shell (1); the end face, far away from the shell (1), of the first heat dissipation plate (2) is uniformly provided with mounting grooves (11); wherein the mounting grooves (11) are distributed at equal intervals, and silicone grease blocks (10) are respectively arranged in the notches of the mounting grooves (11); the end faces of the silicone grease blocks (10) are flush with the end face of the first heat dissipation plate (2), a plurality of mounting bins are formed by the silicone grease blocks (10) and the mounting slots (11), and a silicone grease layer (4) is coated on the end face of the silicone grease blocks (10) which are flush with the first heat dissipation plate (2) and the end face of the first heat dissipation plate (2);
the semiconductor refrigerating pieces (12) are respectively arranged in the mounting bin, wherein the hot ends of the semiconductor refrigerating pieces (12) are tightly pressed on the bottom surface of the mounting bin, the cold ends of the semiconductor refrigerating pieces (12) are tightly pressed on the silicone block (10), and a space between the semiconductor refrigerating pieces (12) and the mounting bin is filled with sealant;
the second heating panel (6) is located shell (1) and is equipped with second open-ended terminal surface department, and second heating panel (6) compress tightly the terminal surface of shell (1) towards the terminal surface of shell (1), and wherein, second heating panel (6), first heating panel (2) and shell (1) constitute stock solution storehouse (22) that are used for depositing the coolant liquid.
2. A silicone grease cooling device according to claim 1 comprising a first flange plate (21); wherein, the end surface of the shell (1) provided with the first opening is provided with a first positioning groove (14) connected with the head;
the first flange plate (21) is arranged on the first heat dissipation plate (2), and the first flange plate (21) is matched and inserted into the first positioning groove (14) in a sliding mode; the first flange plates (21) are arranged in series at the head, and the end faces of the first flange plates (21) facing the bottom face of the first positioning groove (14) press against the bottom face of the first positioning groove (14).
3. A silicone grease cooling device according to claim 2 wherein the first flange plate (21) is provided with a first gasket on the end face pressed against the first positioning groove (14).
4. A silicone grease cooling device according to claim 2, wherein the first flange plate (21) and the first heat sink plate (2) are of an integral structure, and the first flange plate (21) is uniformly provided with the first mounting holes (20); wherein, a first fastening piece (3) is respectively arranged in the first mounting holes (20); a first positioning blind hole is arranged in the first positioning groove (14);
the first fastening parts (3) are screwed into the first positioning blind holes respectively, wherein the first fastening parts (3) correspond to the first positioning blind holes one to one.
5. A silicone grease cooling device according to claim 1, characterised by comprising a second flange plate (9); wherein, the end surface of the shell (1) provided with the second opening is provided with a second positioning groove (17) connected with the head;
the second flange plate (9) is arranged on the second heat dissipation plate (6), and the second flange plate (9) is matched and inserted into the second positioning groove (17) in a sliding mode; the second flange plates (9) are arranged in a head-to-head connection mode, and the end faces, facing the bottom face of the second positioning grooves (17), of the second flange plates (9) press the bottom faces of the second positioning grooves (17) tightly.
6. A silicone grease cooling device according to claim 5, characterised in that the end face of the second flange plate (9) which is pressed against the second positioning groove (17) is provided with a second sealing gasket.
7. A silicone grease cooling device as claimed in claim 5, wherein the second flange plate (9) and the second heat sink plate (6) are of an integral structure, and the second flange plate (9) is uniformly provided with second mounting holes; wherein, a second fastening piece (8) is respectively arranged in the second mounting holes; a second positioning blind hole (18) is arranged in the second positioning groove (17);
the plurality of second fastening pieces (8) are screwed into the second positioning blind holes (18) respectively, wherein the second fastening pieces (8) correspond to the second positioning blind holes (18) one by one.
8. A silicone grease cooling device according to claim 1, characterised by comprising a plurality of heat sinks (5); the radiating fins (5) are arranged on the first radiating plate (2) in parallel at equal intervals, and the radiating fins (5) are all located in the cooling liquid.
9. A silicone grease cooling device according to claim 1, comprising a plurality of baffles (7); the baffles (7) are arranged in the mounting bin, the length of each baffle (7) is smaller than the width of the mounting bin, the baffles (7) are distributed in parallel at equal intervals along the length direction of the mounting bin, and the adjacent baffles (7) are distributed in a staggered mode to form liquid channels (19) in the mounting bin; the two ends of the liquid channel (19) on the shell (1) are respectively provided with a liquid inlet hole (15) used for being connected with the transfusion end of an external cooling liquid conveying device and a liquid outlet hole (16) used for being connected with the liquid inlet of an external cooling liquid storage box.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921466791.1U CN210199680U (en) | 2019-09-03 | 2019-09-03 | Silicone grease cooling device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201921466791.1U CN210199680U (en) | 2019-09-03 | 2019-09-03 | Silicone grease cooling device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210199680U true CN210199680U (en) | 2020-03-27 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201921466791.1U Expired - Fee Related CN210199680U (en) | 2019-09-03 | 2019-09-03 | Silicone grease cooling device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210199680U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111584409A (en) * | 2020-06-02 | 2020-08-25 | 温州空云如电子科技有限公司 | Device for automatically coating silicon grease on chip |
-
2019
- 2019-09-03 CN CN201921466791.1U patent/CN210199680U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111584409A (en) * | 2020-06-02 | 2020-08-25 | 温州空云如电子科技有限公司 | Device for automatically coating silicon grease on chip |
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Granted publication date: 20200327 Termination date: 20210903 |