CN204576375U - A kind of main frame - Google Patents
A kind of main frame Download PDFInfo
- Publication number
- CN204576375U CN204576375U CN201520017913.4U CN201520017913U CN204576375U CN 204576375 U CN204576375 U CN 204576375U CN 201520017913 U CN201520017913 U CN 201520017913U CN 204576375 U CN204576375 U CN 204576375U
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- CN
- China
- Prior art keywords
- main frame
- cabinet
- casing
- heater element
- fins
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- Expired - Fee Related
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a kind of main frame, comprise cabinet and be placed in the heater element in described cabinet, described cabinet is provided with groups of fins, and described groups of fins is connected with described heater element heat conduction.The main frame that the utility model provides, by design one can secondary computer heater element heat radiation cabinet, heat computer heating element sent takes to and can the cabinet of auxiliary heat dissipation dissipate, thus accomplish the Inner heat sink eliminating band fan, the volume of computer mainframe box can be reduced greatly, the noise sent when reducing main frame work, and because mainframe box is inner without fan part, cabinet does not need to accomplish open by design, stop the problem that dust enters cabinet, make computing machine long-time running also without the need to carrying out dust cleaning to inside, increase the serviceable life of main frame.
Description
Technical field
The utility model relates to field of computer technology, particularly a kind of main frame.
Background technology
Active computer mainframe box inside (comprises mainboard except installing the most basic main frame accessory, CPU (central processing unit), internal memory, video card (optional), hard disk, built-in power (optional)) outward, also need the heating radiator installing a band fan to the chip that thermal value is large, generally to CPU (central processing unit), chipset chip (being also north bridge chips) installs such heating radiator, this heating radiator can take a large amount of computer cabinet inner spaces, make the space that computer cabinet has to when designing consider that heating radiator needs take, cannot accomplish that the miniaturization of main frame is microminiaturized, and because the existence of radiator fan, make the main frame noise that operationally existence is more or less certain, also need when accessory is installed to consider air intake, air-out problem, installation is made to become complicated, also cabinet inside is made to gather a large amount of dusts along with passage of time, reduce computing machine serviceable life.
Existing computer mainframe box also exists: volume is large, noise is high, installation is complicated, easy most distinct issues of dust stratification these 4.Market there is at present the computer without fan mainframe box that part use low power processor is worked it out, its structure and existing computer host box substantially similar, heat radiator volume just by strengthening CPU reaches fan-free muting function, cannot accomplish that small size inner sealing does not enter dust.
In view of this, how to reduce the volume of computer host box, reducing noise, avoid dust to enter computer host box, is the current technical issues that need to address of those skilled in the art.
Utility model content
The purpose of this utility model aims to provide a kind of main frame, and little, the basic noiselessness of this main frame volume, this main frame can avoid dust to enter in its casing in addition.
The main frame that the utility model provides, comprise cabinet and be placed in the heater element in described cabinet, described cabinet is provided with groups of fins, and described groups of fins is connected with described heater element heat conduction.
Preferably, heat conducting module is provided with between described groups of fins and described heater element.
Preferably, described heater element comprises at least one in central processing unit, chipset chip and internal memory three.
Preferably, described cabinet comprises the first casing and coordinates with described first casing the first case lid installed, described groups of fins is arranged at the outside surface of described first case lid, and described heater element to be placed in described first casing and to be connected with the inside surface heat conduction of described first case lid.
Preferably, described groups of fins comprises at least two heat radiator be set parallel to each other, the elongated shape of described heat radiator, and each described heat radiator is equidistant arrangement and all perpendicular to the outside surface of described first case lid.
Preferably, silicone grease is scribbled between the inside surface of described heater element and described first case lid.
Preferably, described first casing is provided with draw-in groove, described first case lid is provided with projection, described first case lid is placed in described draw-in groove by described projection and coordinates with described first casing and install.
Preferably, described cabinet comprises the second casing and coordinates with described second casing the second case lid installed, described groups of fins is arranged at the outside surface of described second casing, and described heater element to be placed in described second casing and to be connected with the inside surface heat conduction of described second casing.
Preferably, the rated power of described main frame is 60 watts, and described cabinet is rectangular shape, and the thickness of described cabinet is 47 millimeters, and length and width are 182 millimeters.
Preferably, the rated power of described main frame is 30 watts, and described cabinet is rectangular shape, and the thickness of described cabinet is 45 millimeters, and length and width are 115 millimeters.
The main frame that watt watt the utility model provides, by design one can secondary computer heater element heat radiation cabinet, heat computer heating element sent takes to and can the cabinet of auxiliary heat dissipation dissipate, thus accomplish the Inner heat sink eliminating band fan, the volume of computer mainframe box can be reduced greatly, the noise sent when reducing main frame work, and because mainframe box is inner without fan part, cabinet does not need to accomplish open by design, stop the problem that dust enters cabinet, make computing machine long-time running also without the need to carrying out dust cleaning to inside, increase the serviceable life of main frame.
Accompanying drawing explanation
The structure cross-sectional schematic of a kind of embodiment of main frame that Fig. 1 provides for the utility model;
The structure schematic side view of cabinet in a kind of embodiment of the main frame that Fig. 2 provides for the utility model;
In a kind of embodiment of the main frame that Fig. 3 provides for the utility model, cabinet is in the perspective view of disassembled state;
The external structure schematic diagram of cabinet in a kind of embodiment of the main frame that Fig. 4 provides for the utility model;
The external structure schematic diagram of cabinet in the another kind of embodiment of the main frame that Fig. 5 provides for the utility model.
It is as follows that the utility model Reference numeral refers to relation:
1-cabinet, 11-groups of fins, 12-first casing, 13-first case lid, 14-power switch and power light, 2-heater element, 3-heat conducting module.
Embodiment
Core of the present utility model is for providing a kind of main frame, and little, the basic noiselessness of this main frame volume, this main frame can avoid dust to enter in its cabinet in addition.
In order to make those skilled in the art understand the technical solution of the utility model better, below in conjunction with the drawings and specific embodiments, the utility model is described in further detail.
Please refer to Fig. 1, the structure cross-sectional schematic of a kind of embodiment of main frame that Fig. 1 provides for the utility model.
The main frame that the utility model provides, the heater element 2 comprising cabinet 1 and be placed in cabinet 1, cabinet 1 is provided with groups of fins 11, and groups of fins 11 is connected with heater element 2 heat conduction.
Cabinet 1 is provided with groups of fins 11, can auxiliary heat dissipation, the selection of cabinet 1 material and profile design are that the heat be easy to computer mainframe internal chip produces is dispersed into external environment condition, wherein the metal being easy to heat conduction can be selected in material aspect, such as aluminium, copper etc., also can select the nonmetallic materials that the coefficient of heat conductivity such as pottery are high.
Heater element 2 can comprise at least one in central processing unit, chipset chip and internal memory three.In a kind of specific embodiment, heater element 2 comprises central processing unit; In a kind of specific embodiment, heater element 2 can also comprise chipset.In a kind of specific embodiment, heater element 2 can also comprise internal memory.In a kind of specific embodiment, between groups of fins 11 and heater element 2, heat conducting module 3 can be provided with.
The main frame that the utility model provides, by design one can secondary computer heater element 2 dispel the heat cabinet 1, the heat that computer heating element 2 sends is taken to and can the cabinet 1 of auxiliary heat dissipation dissipate, thus accomplish the Inner heat sink eliminating band fan, the volume of computer mainframe box 1 can be reduced greatly, the noise sent when reducing main frame work, and because mainframe box 1 inside is without fan part, cabinet 1 does not need to accomplish open by design, stop the problem that dust enters cabinet 1, make computing machine long-time running also without the need to carrying out dust cleaning to inside, increase the serviceable life of main frame.
As shown in Figure 2, the side-looking structural representation of cabinet 1 in a kind of embodiment of main frame of providing for utility model of Fig. 2.Groups of fins 11 can be one with the casing of cabinet 1, but in order to the processing that simplifies each parts and making, can make separation, be fixed between two parts by buckle or screw.
In a kind of specific embodiment, cabinet 1 comprises the first casing 12 and coordinates the first case lid 13 installed with the first casing 12, groups of fins 11 comprises at least two heat radiator be set parallel to each other, each heat radiator is arranged at the outside surface of the first case lid 13, and heater element 2 to be placed in the first casing 12 and to be connected with the inside surface heat conduction of the first case lid 13.Further, the elongated shape of heat radiator, each heat radiator is equidistant arrangement and all perpendicular to the outside surface of the first case lid 13.Cabinet 1 shape of such setting is the heating radiator with zigzag heat radiator in conjunction with casing.In a kind of specific embodiment, the first casing 12 is provided with draw-in groove, the first case lid 13 is provided with projection, the first case lid 13 is placed in draw-in groove by projection and coordinates with the first casing 12 and install.
In another kind of specific embodiment, cabinet 1 comprises the second casing and coordinates the second case lid installed with the second casing, groups of fins 11 comprises at least two heat radiator be set parallel to each other, each heat radiator is arranged at the outside surface of the second casing, and heater element 2 is placed in the second casing and with the inside surface heat conduction of the second casing and is connected.
Further as shown in Figure 3, in a kind of embodiment of the main frame that Fig. 3 provides for utility model, cabinet 1 is in the perspective view of disassembled state, groups of fins 11 on cabinet 1 case lid is after same cabinet 1 casing installs, and heater element 2 is fit together with groups of fins 11.Adopting in the design being separated groups of fins 11 and cabinet 1 casing, groups of fins 11 must fit tightly with heater element 2 or heat conducting module 3, and between the strong medium of the heat conduction such as silicone grease can be used to be bonded together, silicone grease is used to fill needs trickle gap between two of heat conduction parts.Power switch and power light 14 can be arranged at one jiao of cabinet 1 case lid.
The heat radiation scale needed due to the main frame of different size, different performance is different, can design and produce the cabinet 1 with auxiliary heat dissipation according to heating size, the large main frame that generates heat uses larger cooling cabinet 1, and the main frame generating heat little uses the cooling cabinet 1 of small scale.
As shown in Figure 4, the external structure schematic diagram of cabinet 1 in a kind of embodiment of the main frame that Fig. 4 provides for the utility model, in this embodiment, main frame is the main frame (complete machine maximum power dissipation is 60 watts and left and right) generating heat larger, and the size of cooling cabinet 1 reaches 182mm*182mm*47mm.
As shown in Figure 5, the external structure schematic diagram of cabinet 1 in the another kind of embodiment of the main frame that Fig. 5 provides for the utility model, in this embodiment, main frame is the mini main frame (complete machine maximum power dissipation is 30 watts and left and right) generating heat less, and the size of cooling cabinet 1 has narrowed down to 115mm*115mm*45mm (mm represents millimeter).
Apply specific case herein to set forth principle of the present utility model and embodiment, the explanation of above embodiment just understands method of the present utility model and core concept thereof for helping.Should be understood that; for those skilled in the art; under the prerequisite not departing from the utility model principle, can also carry out some improvement and modification to the utility model, these improve and modify and also fall in the protection domain of the utility model claim.
Claims (10)
1. a main frame, comprise cabinet and be placed in the heater element in described cabinet, it is characterized in that, described cabinet is provided with groups of fins, and described groups of fins is connected with described heater element heat conduction.
2. main frame according to claim 1, is characterized in that, is provided with heat conducting module between described groups of fins and described heater element.
3. main frame according to claim 1, is characterized in that, described heater element comprises at least one in central processing unit, chipset chip and internal memory three.
4. main frame according to claim 1, it is characterized in that, described cabinet comprises the first casing and coordinates with described first casing the first case lid installed, described groups of fins is arranged at the outside surface of described first case lid, and described heater element to be placed in described first casing and to be connected with the inside surface heat conduction of described first case lid.
5. main frame according to claim 4, it is characterized in that, described groups of fins comprises at least two heat radiator be set parallel to each other, the elongated shape of described heat radiator, and each described heat radiator is equidistant arrangement and all perpendicular to the outside surface of described first case lid.
6. main frame according to claim 4, is characterized in that, scribbles silicone grease between the inside surface of described heater element and described first case lid.
7. main frame according to claim 4, is characterized in that, described first casing is provided with draw-in groove, and described first case lid is provided with projection, and described first case lid is placed in described draw-in groove by described projection and coordinates with described first casing and install.
8. main frame according to claim 1, it is characterized in that, described cabinet comprises the second casing and coordinates with described second casing the second case lid installed, described groups of fins is arranged at the outside surface of described second casing, and described heater element to be placed in described second casing and to be connected with the inside surface heat conduction of described second casing.
9. main frame according to claim 1, is characterized in that, the rated power of described main frame is 60 watts, and described cabinet is rectangular shape, and the thickness of described cabinet is 47 millimeters, and length and width are 182 millimeters.
10. main frame according to claim 1, is characterized in that, the rated power of described main frame is 30 watts, and described cabinet is rectangular shape, and the thickness of described cabinet is 45 millimeters, and length and width are 115 millimeters.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520017913.4U CN204576375U (en) | 2015-01-12 | 2015-01-12 | A kind of main frame |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201520017913.4U CN204576375U (en) | 2015-01-12 | 2015-01-12 | A kind of main frame |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN204576375U true CN204576375U (en) | 2015-08-19 |
Family
ID=53868985
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201520017913.4U Expired - Fee Related CN204576375U (en) | 2015-01-12 | 2015-01-12 | A kind of main frame |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN204576375U (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN106249829A (en) * | 2016-09-12 | 2016-12-21 | 芜湖能盟信息技术有限公司 | Computer cabinet radiator |
| WO2017041672A1 (en) * | 2015-09-12 | 2017-03-16 | Qingyuan Li | Electronic device having quiet cooling |
| CN107562161A (en) * | 2017-10-25 | 2018-01-09 | 四川云玦科技有限公司 | A kind of main frame radiator |
| CN110568914A (en) * | 2019-09-16 | 2019-12-13 | 深圳市巨烽显示科技有限公司 | mute type all-in-one machine |
-
2015
- 2015-01-12 CN CN201520017913.4U patent/CN204576375U/en not_active Expired - Fee Related
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2017041672A1 (en) * | 2015-09-12 | 2017-03-16 | Qingyuan Li | Electronic device having quiet cooling |
| GB2542273B (en) * | 2015-09-12 | 2018-02-28 | Li Qingyuan | Silent computers having external heat sinks and portable RAID docks |
| CN106249829A (en) * | 2016-09-12 | 2016-12-21 | 芜湖能盟信息技术有限公司 | Computer cabinet radiator |
| CN107562161A (en) * | 2017-10-25 | 2018-01-09 | 四川云玦科技有限公司 | A kind of main frame radiator |
| CN110568914A (en) * | 2019-09-16 | 2019-12-13 | 深圳市巨烽显示科技有限公司 | mute type all-in-one machine |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20150819 Termination date: 20180112 |
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| CF01 | Termination of patent right due to non-payment of annual fee |