CN104571398A - Server and heat-radiating component thereof - Google Patents
Server and heat-radiating component thereof Download PDFInfo
- Publication number
- CN104571398A CN104571398A CN201310482970.5A CN201310482970A CN104571398A CN 104571398 A CN104571398 A CN 104571398A CN 201310482970 A CN201310482970 A CN 201310482970A CN 104571398 A CN104571398 A CN 104571398A
- Authority
- CN
- China
- Prior art keywords
- extension board
- radiating
- radiating module
- composition surface
- base plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 230000000694 effects Effects 0.000 claims description 7
- 230000004308 accommodation Effects 0.000 claims description 6
- 238000001816 cooling Methods 0.000 claims description 5
- 239000002360 explosive Substances 0.000 description 2
- 238000010030 laminating Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Classifications
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
- G06F1/16—Constructional details or arrangements
- G06F1/20—Cooling means
-
- G—PHYSICS
- G06—COMPUTING; CALCULATING OR COUNTING
- G06F—ELECTRIC DIGITAL DATA PROCESSING
- G06F2200/00—Indexing scheme relating to G06F1/04 - G06F1/32
- G06F2200/20—Indexing scheme relating to G06F1/20
- G06F2200/203—Heat conductive hinge
Abstract
The invention relates to a server and a heat-radiating component thereof. The server comprises a motherboard, two central processing units and the heat-radiating component, wherein the two central processing units are arranged on the motherboard; the heat-radiating component comprises two heat-radiating modules; the two heat-radiating modules are respectively fit with two heat sources; each of the two heat-radiating modules comprises a joint part; the joint part is provided with a first extending plate and a second extending plate, the first extending plate of one of the two heat-radiating modules is fit with the second extending plate of the other heat-radiating module, and the second extending plate of the one of the two heat-radiating modules is fit with the first extending plate of the other heat-radiating module.
Description
Technical field
The present invention relates to a kind of servomechanism, particularly a kind of servomechanism with two radiating modules that can engage each other.
Background technology
Along with the development of electronics technology, servomechanism has become the information handling system that industry widely uses.Servomechanism, as hardware, typically refers to those and has higher computational power, can be supplied to the computing machine that multiple user uses.Motherboard, central processing unit (Central ProcessingUnit, CPU), power supply unit, hard disc etc. have been generally included in servomechanism.
In the servomechanism with multiple central processing unit, due to the difference of system configuration, the position residing for different central processing unit may have influence on its operational temperature, and the program load of different central processing unit also has difference.Therefore, the temperature being easy to an appearance central processing unit in this servomechanism is very high, and the temperature of another one central processing unit is very low, and then cooling system corresponding to the central processing unit making temperature higher must the energy of at substantial dispel the heat to it.For example, the rotating speed of the fan corresponding to central processing unit higher for temperature must be improved the heat being just enough to it to produce and shed by system, therefore causes serious noise and energy resource consumption.There is mirror therewith, how to design a kind of cooling system, can dispel the heat with the central processing unit of the mode of full blast to different temperatures, the important topic solved needed for current industry.
Summary of the invention
In view of above problem, the object of the present invention is to provide a kind of servomechanism and radiating subassembly thereof, using improvement at present cannot efficiently to the problem that the central processing unit of different temperatures dispels the heat.
The servomechanism of one embodiment of the invention, comprises a motherboard, two central processing units and a radiating subassembly.Two central processing units are arranged on motherboard.Radiating subassembly comprises two radiating modules.Two radiating modules are fitted two thermals source respectively.Two radiating modules comprise a junction surface respectively.Junction surface has one first extension board and one second extension board respectively, and first extension board of one of two radiating modules and the second extension board of another radiating module are fitted, and the first extension board of second extension board of one of two radiating modules and another radiating module is fitted.
The present invention separately provides a kind of radiating subassembly, comprise two radiating modules, two radiating modules are fitted two thermals source respectively, two radiating modules comprise a junction surface respectively, junction surface has one first extension board and one second extension board respectively, first extension board of one of two radiating modules and the second extension board of another radiating module are fitted, and the first extension board of second extension board of one of two radiating modules and another radiating module is fitted.
Servomechanism of the present invention and radiating subassembly thereof, because two radiating modules can combine by two junction surface thermal contact with one another, reach the effect of samming by this, to avoid system to consume the energy (such as improving rotation speed of the fan) in a large number in the temperature reducing the higher central processing unit of temperature, and then save the energy and reduce noise.
Describe the present invention below in conjunction with the drawings and specific embodiments, but not as a limitation of the invention.
Accompanying drawing explanation
Fig. 1 is the structural perspective of servomechanism according to an embodiment of the invention;
Fig. 2 is the explosive view of Fig. 1;
Fig. 3 is the structural perspective of radiating module according to an embodiment of the invention;
Fig. 4 is the cut-open view of radiating subassembly according to an embodiment of the invention.
Wherein, Reference numeral 10 servomechanism
12 motherboards
14 central processing units
15 radiating subassemblies
16 radiating modules
17 junction surfaces
171 first extension boards
1710 upper surfaces
1711 first composition surfaces
172 second extension boards
1720 lower surfaces
1722 second composition surfaces
18 base plates
181 end faces
182 bottom surfaces
187 lateral margins
30 heat pipes
40 flutings
50 radiating fin groups
Embodiment
Below in conjunction with accompanying drawing, structural principle of the present invention and principle of work are described in detail:
Please refer to Fig. 1, Fig. 2, Fig. 3 and Fig. 4.Fig. 1 is the structural perspective of servomechanism according to an embodiment of the invention.Fig. 2 is the explosive view of Fig. 1.Fig. 3 is the structural perspective of the radiating subassembly according to one embodiment of the invention.Fig. 4 is the cut-open view of radiating subassembly according to an embodiment of the invention.
Servomechanism 10 comprises motherboard 12, two central processing unit 14 and a radiating subassembly 15.Two central processing units 14 are arranged on motherboard 12.Two central processing units 14 are spaced a distance.
Radiating subassembly 15 comprises two radiating modules 16.In the present embodiment, the structure of two radiating modules 16 is identical.Two radiating modules 16 are thermo-contact two central processing unit 14 respectively.Two radiating modules 16 do not comprise base plate 18, junction surface 17, heat pipe 30 and a radiating fin group 50.
Base plate 18 has relative end face 181 and a bottom surface 182.Two 17, junction surfaces do not comprise one first extension board 171 and one second extension board 172.First extension board 171 and the second extension board 172 are extended by a lateral margin 187 of base plate 18 and formed.First extension board 171 has upper surface 1710 and one first composition surface 1711.The bottom surface 182 of the first composition surface 171 and base plate 18 forms one first accommodation space (anticipate and namely leave space between the first composition surface 171 and bottom surface 182), and the first composition surface 171 is towards same direction with bottom surface 182.Second extension board 172 has a lower surface 1720 and one second composition surface 1722.Lower surface 1720 and bottom surface 182 copline of the present embodiment.Second composition surface 1722 and end face 181 form one second accommodation space (anticipate and namely leave space between the second composition surface 1722 and end face 181), and the normal direction on the normal direction on the first composition surface 1711 and the second composition surface 1722 is directions towards the opposite.Second composition surface 1722 is towards same direction with end face 181, and the first composition surface 1722 and the second composition surface 182 are copline.
In the present embodiment, first composition surface 1711 of the first extension board 171 has one first distance with end face 181, and the second composition surface 1722 of the second extension board 172 has a second distance with bottom surface 182, and the first distance equals the thickness of base plate 18 with the sum of second distance.In addition, in this enforcement, the thickness D3 of base plate 18 is the sum totals for the thickness D1 of the first extension board 171 and thickness D2 of the second extension board 172, but not as limit.In the present embodiment, the thickness D3 of base plate 18 is 4.5 millimeters, and the thickness D1 of the first extension board 171 is 2.8 millimeters, and the thickness D2 of the second extension board is 1.7 millimeters, but all not as limit.
Heat pipe 30 is embedded in base plate 18.A part for heat pipe 30 extends to the first extension board 171 by the lateral margin 187 of base plate 18.Specifically, in the present embodiment, base plate 18 and the first extension board 171 have a fluting 40, and heat pipe 30 is embedded in fluting 40.And slot 40 in the direction of the first extension board 171 perpendicular to the radiating fin group 50 on upper surface 1710.Radiating fin group 50 is arranged on end face 181 and upper surface 1710.The heat pipe 30 of the present embodiment is extended to the part of the first extension board 171 length by the lateral margin 187 of base plate 18 equals the distance that two central processing units 14 are spaced.The radiating fin 50 of upper surface 1710 is parallel with the radiating fin 50 of the upper surface 1710 of another radiating module 10, and each radiating fin 50 that wherein each radiating fin 50 of the upper surface 1710 of a radiating module 10 is corresponding with the upper surface 1710 of another radiating module 10 is respectively adjacent.
Two radiating modules 16 of the present invention can combine mutually each other.Specifically, fitting in first composition surface 1711 of one of two radiating modules 16 and another the second composition surface 1722 of two radiating modules 16, and fits in another the first composition surface 1711 of second composition surface 1722 of one of two radiating modules 16 and two radiating modules 16.The side of the heat pipe 30 of the present embodiment is the second composition surface 1722 of the second extension board 172 being directly contacted with another corresponding radiating module 16, to reach good laminating effect.The surface that the heat pipe 30 of the present embodiment carries out fitting is the surperficial copline with the first extension board 171, but not as limit.In other embodiments, heat pipe 30 can protrude the surface of the first extension board 171, and the surface that the second composition surface 1722 can be designed to cave in is to arrange in pairs or groups heat pipe 30, that is, heat pipe 30 and the second composition surface 1722 can change its structural design of arranging in pairs or groups mutually on demand.
Two radiating modules 16 of the present invention can be fitted each other by two junction surfaces 17 and be combined into a radiating subassembly 15.By this, when temperature higher than another central processing unit 14 of the temperature of one of them central processing unit 14, the heat energy that central processing unit 14 higher for temperature can produce by the structural design of radiating subassembly 15 conducts to the radiating module 16 corresponding to the lower central processing unit of temperature 14 via heat pipe 30, first extension board 171, second extension board 172 and base plate 18, and the radiating module 16 on the central processing unit 14 utilizing temperature lower helps heat radiation.By this, radiating subassembly 15 can reach the effect of samming, to avoid system to consume the energy (such as improving the rotation speed of the fan of the higher central processing unit of temperature) in a large number in the temperature reducing the higher central processing unit 14 of temperature, and then save the energy and reduce noise.After tested, under the state that fan is all in identical maximum speed, general separate type radiating subassembly only can make the temperature difference of two central processing units 14 be 9.4 degree Celsius, and radiating subassembly of the present invention 15 can make the temperature difference of two central processing units 14 be down to is about 1 degree Celsius.
In the present embodiment and other embodiments of part, more be provided with a cooling pad (drafting) between first composition surface 1711 of radiating module 16 and the second composition surface 1712 of another radiating module 16, make the first composition surface 1711 of radiating module 16 have better thermo-contact effect to each other with the second composition surface 1712 of another radiating module 16.
According to servomechanism and the radiating subassembly thereof of above-described embodiment, can fit each other by two junction surfaces due to two radiating modules and combine, reach the effect of samming by this, consume the temperature (such as improving the rotation speed of the fan of the higher central processing unit of temperature) that can come from and reduce the higher central processing unit of temperature to avoid system in a large number, and then save the energy and can also noise be reduced.
Certainly; the present invention also can have other various embodiments; when not deviating from the present invention's spirit and essence thereof; those of ordinary skill in the art are when making various corresponding change and distortion according to the present invention, but these change accordingly and are out of shape the protection domain that all should belong to the claim appended by the present invention.
Claims (10)
1. a servomechanism, is characterized in that, comprises:
One motherboard;
Two thermals source, are arranged on this motherboard; And
One radiating subassembly, comprise two radiating modules, this two radiating module is this two thermal source of thermo-contact respectively, this two radiating module comprises a junction surface respectively, this junction surface has one first extension board and one second extension board respectively, this the first extension board of one of this two radiating module and this second extension board of another this radiating module are fitted, and this first extension board of this second extension board of one of this two radiating module and another this radiating module is fitted.
2. servomechanism according to claim 1, it is characterized in that, this two radiating module comprises a base plate respectively, this base plate has a relative end face and a bottom surface, this first extension board and this second extension board are extended by a lateral margin of this base plate and formed, this first extension board has a upper surface and one first composition surface, this bottom surface of this first composition surface and this base plate forms one first accommodation space, this second extension board has one second composition surface, this second composition surface and this end face form one second accommodation space, the normal direction on this first composition surface and the normal direction on this second composition surface are directions towards the opposite, this end face and this upper surface has a radiating fin group.
3. servomechanism according to claim 2, it is characterized in that, this second extension board has a lower surface, this end face copline of this upper surface and this base plate, this bottom surface copline of this lower surface and this base plate, and this first composition surface and this second composition surface copline.
4. servomechanism according to claim 2, it is characterized in that, this two radiating module comprises a heat pipe more respectively, this heat pipe extends to this first extension board by this lateral margin of this base plate, wherein one of this two radiating module is positioned at this second composition surface that this heat pipe of this first extension board is this second extension board being directly contacted with another corresponding this radiating module, to reach good thermal conduction effect.
5. servomechanism according to claim 4, is characterized in that, this base plate and this first extension board have a fluting, and this heat pipe is embedded in this fluting, and this direction being recessed at this first extension board is perpendicular to this radiating fin group on this upper surface.
6. servomechanism according to claim 2, it is characterized in that, this radiating fin group of this upper surface of one of this two radiating module is parallel with this radiating fin group of this upper surface of another this radiating module, and corresponding with this upper surface of another this radiating module respectively this radiating fin group of this radiating fin group of this upper surface of one of this two radiating module is adjacent.
7. servomechanism according to claim 2, it is characterized in that, this first composition surface of this first extension board and this end face have one first distance, this second composition surface of this second extension board and this bottom surface have a second distance, and this first distance equals the thickness of this base plate with this second distance sum.
8. servomechanism according to claim 2, is characterized in that, this first composition surface of one of this two radiating module and this second composition surface of another this radiating module are provided with a cooling pad, and this cooling pad is in order to promote the effect of thermo-contact.
9. a radiating subassembly, it is characterized in that, comprise two radiating modules, this two radiating module comprises a junction surface respectively, this junction surface has one first extension board and one second extension board respectively, this the first extension board of one of this two radiating module and this second extension board of another this radiating module are fitted, and this first extension board of this second extension board of one of this two radiating module and another this radiating module is fitted.
10. radiating subassembly according to claim 9, it is characterized in that, this two radiating module comprises a base plate respectively, this base plate has a relative end face and a bottom surface, this two junction surface comprises this first extension board and this second extension board respectively, this first extension board and this second extension board are extended by a lateral margin of this base plate and are formed, this first extension board has a upper surface and this first composition surface, this first composition surface and this bottom surface form one first accommodation space, this second extension board has this second composition surface, this second composition surface and this end face form one second accommodation space, the normal direction on this first composition surface and the normal direction on this second composition surface are directions towards the opposite, this end face and this upper surface has a radiating fin group.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310482970.5A CN104571398B (en) | 2013-10-15 | 2013-10-15 | Servomechanism and its radiating subassembly |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201310482970.5A CN104571398B (en) | 2013-10-15 | 2013-10-15 | Servomechanism and its radiating subassembly |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN104571398A true CN104571398A (en) | 2015-04-29 |
| CN104571398B CN104571398B (en) | 2018-04-13 |
Family
ID=53087688
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201310482970.5A Expired - Fee Related CN104571398B (en) | 2013-10-15 | 2013-10-15 | Servomechanism and its radiating subassembly |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN104571398B (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107305311A (en) * | 2016-04-18 | 2017-10-31 | 松下知识产权经营株式会社 | Cooling device and projection type video display apparatus |
| US10551881B2 (en) | 2017-03-17 | 2020-02-04 | Microsoft Technology Licensing, Llc | Thermal management hinge |
| CN113835488A (en) * | 2021-09-24 | 2021-12-24 | 北京百度网讯科技有限公司 | Processor module and server |
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| CN101203122A (en) * | 2006-12-14 | 2008-06-18 | 英业达股份有限公司 | Dual heat source radiating module |
| CN201601889U (en) * | 2009-10-21 | 2010-10-06 | 鸿富锦精密工业（深圳）有限公司 | Circuit board combination |
| EP2388851A1 (en) * | 2010-05-18 | 2011-11-23 | Behr GmbH & Co. KG | Cooling device and method for producing same |
| CN102316698A (en) * | 2010-07-06 | 2012-01-11 | 鸿富锦精密工业（深圳）有限公司 | Heat radiation device |
| CN103096688A (en) * | 2011-11-08 | 2013-05-08 | 富准精密工业(深圳)有限公司 | Heat dissipation device |
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2013
- 2013-10-15 CN CN201310482970.5A patent/CN104571398B/en not_active Expired - Fee Related
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101203122A (en) * | 2006-12-14 | 2008-06-18 | 英业达股份有限公司 | Dual heat source radiating module |
| CN201601889U (en) * | 2009-10-21 | 2010-10-06 | 鸿富锦精密工业（深圳）有限公司 | Circuit board combination |
| EP2388851A1 (en) * | 2010-05-18 | 2011-11-23 | Behr GmbH & Co. KG | Cooling device and method for producing same |
| CN102316698A (en) * | 2010-07-06 | 2012-01-11 | 鸿富锦精密工业（深圳）有限公司 | Heat radiation device |
| CN103096688A (en) * | 2011-11-08 | 2013-05-08 | 富准精密工业(深圳)有限公司 | Heat dissipation device |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107305311A (en) * | 2016-04-18 | 2017-10-31 | 松下知识产权经营株式会社 | Cooling device and projection type video display apparatus |
| US10551881B2 (en) | 2017-03-17 | 2020-02-04 | Microsoft Technology Licensing, Llc | Thermal management hinge |
| CN113835488A (en) * | 2021-09-24 | 2021-12-24 | 北京百度网讯科技有限公司 | Processor module and server |
| WO2023045259A1 (en) * | 2021-09-24 | 2023-03-30 | 北京百度网讯科技有限公司 | Processor module and server |
| CN113835488B (en) * | 2021-09-24 | 2024-03-26 | 北京百度网讯科技有限公司 | Processor module and server |
Also Published As
| Publication number | Publication date |
|---|---|
| CN104571398B (en) | 2018-04-13 |
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