WO2023045259A1

WO2023045259A1 - Processor module and server

Info

Publication number: WO2023045259A1
Application number: PCT/CN2022/078684
Authority: WO
Inventors: 郑建武; 宁宏超; 谭显光; 何永占
Original assignee: 北京百度网讯科技有限公司
Priority date: 2021-09-24
Filing date: 2022-03-01
Publication date: 2023-03-30
Also published as: CN113835488B; CN113835488A

Abstract

A processor module and a server, which belong to the technical field of servers. A processor module (10) comprises a bearing plate (11), a heat dissipation plate (13) and a plurality of processors (12), wherein the bearing plate has a first end portion (111), and a bearing surface (112) perpendicular to the thickness direction of the bearing plate; the processors (12) are arranged on the bearing surface (112) of the bearing plate (11) and are electrically connected to the bearing plate (11); the heat dissipation plate (13) is stacked on the bearing surface (112) of the bearing plate (11) and is attached to the processors (12) on the bearing surface (112); and the first end portion (111) of the bearing plate (11) extends out of the heat dissipation plate (13). The processor module (10) may be detachably connected to an exchange board (20) by means of the first end portion (111) of the bearing plate (11), thereby achieving operation and maintenance, heat dissipation and management of the processors (12) by using a single processor module (10) as a unit. When a fault occurs in a certain processor (12), the processor module (10) where the processor (12) is located can be detached for maintenance, without requiring the entire server to be shut down, thus ensuring that the server can continue working.

Description

Processor modules and servers

technical field

The present disclosure relates to the technical field of servers, in particular to a processor module and a server.

Background technique

In existing servers, the processor is directly installed on the switch board. Once a certain processor on the switch board fails, the entire server needs to be shut down before the faulty processor can be maintained, which will increase the overall failure of the server. The high rate affects the normal work of the server.

Contents of the invention

The disclosure provides a processor module and a server.

According to a first aspect of the present disclosure, a processor module is provided, including:

a bearing plate, the bearing plate has a first end and a bearing surface perpendicular to its thickness direction;

a plurality of processors, the processors are arranged on the bearing surface of the bearing board and are electrically connected with the bearing board;

a heat dissipation plate, the heat dissipation plate is stacked on the bearing surface of the bearing plate, and is bonded to the processor on the bearing surface;

The first end of the bearing plate protrudes from the heat dissipation plate.

In the embodiment of the present disclosure, the cooling plate is provided with a receiving slot; the processor is located in the receiving slot and adheres to the bottom surface of the receiving slot.

In an embodiment of the present disclosure, a plurality of bar-shaped slots are provided on a side of the cooling plate away from the processor.

In an embodiment of the present disclosure, a plurality of first connectors are arranged on the bearing surface of the bearing board;

Each processor is detachably connected to the corresponding first connector, and is electrically connected to the carrier board through the first connector.

In the embodiment of the present disclosure, a plurality of first connectors are arranged at intervals along the length direction of the carrying board on the carrying surface.

In the embodiment of the present disclosure, the first end is an end in the length direction of the bearing plate.

In the embodiment of the present disclosure, the bearing plate and the heat dissipation plate are connected by bolts.

In an embodiment of the present disclosure, the processor module further includes a handle, and the handle is connected to the carrying board.

In an embodiment of the present disclosure, the carrying board has two carrying surfaces perpendicular to its thickness direction, each carrying surface is provided with a processor;

The processor module includes two cooling plates, and each cooling plate is stacked on a corresponding carrying surface of the carrying plate, and bonded to the processor on the corresponding carrying surface.

According to a second aspect of the present disclosure, a server is provided, including:

switch board;

In at least one processor module provided in the first aspect of the present disclosure, the first end of the carrier board in the processor module is detachably connected to the switch board.

In an embodiment of the present disclosure, at least one second connector is disposed on the switch board;

The first end of the carrier board in the processor module is detachably connected to the corresponding second connector.

In an embodiment of the present disclosure, the server further includes a power module;

The power module is arranged on the switch board and is electrically connected with the switch board, and is used for providing electric energy to the processor on the load board through the switch board.

In the embodiment of the present disclosure, the server further includes a fan; the fan is disposed on the switch board and is electrically connected to the switch board to dissipate heat for the processor module.

It should be understood that what is described in this section is not intended to identify key or important features of the embodiments of the present disclosure, nor is it intended to limit the scope of the present disclosure. Other features of the present disclosure will be readily understood through the following description.

The beneficial effects brought by the technical solution provided by the disclosure are:

In the technical solution of the present disclosure, a plurality of processors are integrated into a processor module, and the processor module can be detachably connected through the first end of the carrier board to switch boards, realizing a single processor module as the The unit performs processor operation and maintenance, cooling and management. When a processor fails, the processor module where the processor is located can be removed for maintenance without requiring the entire server to shut down, ensuring that the server can continue to work and improving the convenience of service operation and maintenance.

Description of drawings

The accompanying drawings are used to better understand the present solution, and do not constitute a limitation to the present disclosure. in:

FIG. 1 shows a schematic diagram of a disassembled structure of a processor module provided by an embodiment of the present disclosure;

Fig. 2 shows a schematic structural diagram of a server including a processor module according to an embodiment of the present disclosure.

The description of the reference numbers is as follows:

10-processor module;

11-loading plate; 111-first end; 112-bearing surface;

12-processor; 13-radiating plate; 131-accommodating slot; 132-bar slot;

14-first connector; 15-handle;

20-exchange board; 30-second connector;

40-power module; 50-fan; 60-chassis.

Detailed ways

Exemplary embodiments of the present disclosure are described below in conjunction with the accompanying drawings, which include various details of the embodiments of the present disclosure to facilitate understanding, and they should be regarded as exemplary only. Accordingly, those of ordinary skill in the art will recognize that various changes and modifications of the embodiments described herein can be made without departing from the scope and spirit of the disclosure. Also, descriptions of well-known functions and constructions are omitted in the following description for clarity and conciseness.

The processor module and the server provided by the embodiments of the present disclosure aim to solve at least one of the above technical problems in the prior art.

An embodiment of the present disclosure provides a processor module. FIG. 1 shows a schematic diagram of a disassembled structure of a processor module provided by an embodiment of the present disclosure. FIG. 2 shows a processor module including an embodiment of the present disclosure. Schematic diagram of the structure of a group of servers. As shown in FIGS. 1 and 2 , the processor module 10 includes a carrier board 11 , a plurality of processors 12 , and a heat sink 13 .

The bearing plate 11 has a first end portion 111 and a bearing surface 112 perpendicular to its thickness direction. The carrying board 11 in the embodiment of the present disclosure is a circuit board with a certain thickness, which can transmit electrical signals, and the carrying surface 112 is the bottom surface of the carrying board 11 .

The processor 12 is disposed on the carrying surface 112 of the carrying board 11 and is electrically connected to the carrying board 11 . The processor 12 in the embodiment of the present disclosure may be any type of processor 12, and the processor 12 is electrically connected to the carrier board 11 to receive external electrical signals or send external electrical signals.

The cooling plate 13 is stacked on the carrying surface 112 of the carrying plate 11 and attached to the processor 12 on the carrying surface 112 . The cooling plate 13 can be made of a material with good thermal conductivity (such as aluminum), and the heat generated by the processor 12 can be conducted to the cooling plate 13 to dissipate the heat through the cooling plate 13 .

The first end 111 of the carrier board 11 is used to detachably connect to components other than the processor module 10 (such as the switch board 20 ), and is used to receive external electrical signals or send external electrical signals generated by the processor 12 . Therefore, the first end 111 of the carrier board 11 needs to protrude out of the heat sink 13 , so as to facilitate connection with components other than the processor module 10 .

In the disclosed embodiment, a plurality of processors 12 are integrated into a processor module 10, and the processor module 10 can be detachably connected to the exchange board 20 through the first end 111 of the carrier board 11, realizing a single processor module. The group 10 is used as a unit to perform operation and maintenance, heat dissipation and management of the processor 12 . When a processor 12 fails, the processor module 10 where the processor 12 is located can be removed for maintenance without requiring the entire server to shut down, ensuring that the server can continue to work and improving the convenience of service operation and maintenance .

It can be understood that the bearing plate 11 has two bottom surfaces, both of which can be used as bearing surfaces 112, that is to say, the bearing plate 11 can have two bearing surfaces 112 perpendicular to its thickness direction, and each bearing surface 112 can be Processor 12 is set. The processor module 10 may include two heat sinks 13 , and each heat sink 13 is stacked on a corresponding carrying surface 112 of the carrying board 11 and attached to the processor 12 on the corresponding carrying surface 112 .

The number of processors 12 disposed on each carrying surface 112 may be determined according to actual needs, as shown in FIG. 1 , four processors 12 may be disposed on the carrying surface 112 . As shown in Figure 1, in a processor module 10, two cooling plates 13 are respectively located on both sides of the carrying plate 11, each cooling plate 13 is directly opposite to a bearing surface 112 in the carrying plate 11, and each cooling plate 13 The board 13 is attached to the processor 12 on the bearing surface 112 facing it. It can be understood that in the assembled processor module 10, the carrier board 11 and the two heat sinks 13 are stacked, the carrier board 11 is located between the two heat sinks 13, and the carrier board 11 and the heat sink 13 are provided with Processor 12.

In the embodiment of the present disclosure, the connection manner of the carrying plate 11 and the heat dissipation plate 13 may be determined according to actual design requirements. For example, the bearing plate 11 and the heat dissipation plate 13 are connected by bolts, or by bonding, which is not limited in the present disclosure.

In the embodiment of the present disclosure, the cooling plate 13 is provided with a receiving groove 131 , and the processor 12 is located in the receiving groove 131 , which can ensure the safety of the processor 12 . The processor 12 can be attached to the bottom surface of the receiving groove 131 of the heat sink 13 , so that the heat generated by the processor 12 can be conducted to the heat sink 13 and dissipated through the heat sink 13 . Optionally, the processor 12 may be bonded to the bottom surface of the receiving groove 131 of the heat dissipation plate 13 with thermally conductive glue. The thermally conductive adhesive can be made of organic silica gel as the main body, adding polymer materials such as fillers and thermally conductive materials, and kneading the silica gel, which has good thermal conductivity and electrical insulation properties.

In the embodiment of the present disclosure, a plurality of bar-shaped slots 132 are disposed on a side of the heat sink 13 away from the processor 12 . The strip grooves 132 provided on the heat dissipation plate 13 can increase the surface area of the heat dissipation plate 13, thereby improving the heat dissipation efficiency. The number and arrangement of the strip grooves 132 can be determined according to actual design requirements. As shown in FIG. 1 , the strip grooves 132 can extend along the length direction of the heat sink 13 .

In the embodiment of the present disclosure, a plurality of first connectors 14 are disposed on the bearing surface 112 of the bearing board 11 . Each processor 12 is detachably connected to a corresponding first connector 14 , and is electrically connected to the carrier board 11 through the first connector 14 . It can be understood that the first connector 14 has the function of transmitting signals, and the first connector 14 can be designed as a plug-in structure compatible with the processor 12, so as to facilitate the electrically detachable connection between the first connector 14 and the carrier board 11. The connection facilitates the replacement and maintenance of the processor 12.

In the embodiment of the present disclosure, the carrying board 11 may be a strip-shaped board, and a plurality of first connectors 14 may be arranged at intervals along the length direction of the carrying board 11 on the carrying surface 112 . It can be understood that the sizes of processors of different types are different, and the first connectors 14 are arranged at intervals, which can reserve installation space for processors with larger sizes, so as to facilitate replacement of processors of different types.

In the embodiment of the present disclosure, the bearing plate 11 may be a strip-shaped plate, and the first end portion 111 may be an end portion of the bearing plate 11 in the length direction. The processor module 10 may further include a handle 15 connected to the carrier board 11 , and a worker may hold the handle 15 to install and disassemble the processor module 10 . Here, the handle 15 may be disposed at the other end of the carrying plate 11 opposite to the first end 111 in the length direction.

Based on the same inventive concept, an embodiment of the present disclosure also provides a server. As shown in FIG. The first end 111 of 11 is detachably connected to the exchange board 20 .

In the disclosed embodiment, at least one second connector 30 is disposed on the switch board 20 , and the first end 111 of the carrier board 11 in the processor module 10 is detachably connected to the corresponding second connector 30 . The number and positions of the second connectors 30 may be determined according to actual design requirements. It can be understood that the second connector 30 has the function of transmitting signals, and the second connector 30 can be designed as a plug-in structure compatible with the first end 111 of the carrier board 11, so as to facilitate the connection between the second connector 30 and the carrier. The board 11 is electrically detachably connected to facilitate the replacement and maintenance of the processor module 10 .

In the embodiment of the present disclosure, the server further includes a power supply module 40 (Power Supply Unit, PSU). The power module 40 is disposed on the switch board 20 and is electrically connected to the switch board 20 . The number and positions of the power supply modules 40 may be determined according to actual design requirements. It can be understood that the power module 40 can provide power to the processor 12 on the carrier board 11 through the switch board 20 .

In the embodiment of the present disclosure, the server further includes a fan 50 . The fans 50 are arranged on the switch board 20 and are electrically connected to the switch board 20. The number and position of the fans 50 can be determined according to actual design requirements. The fan 50 can accelerate the air flow, can dissipate heat for the processor module 10, and improve heat dissipation efficiency. It can be understood that the power module 40 can provide power to the processor 12 on the fan 50 through the switch board 20 .

Optionally, the server may further include a chassis 60, and components such as the processor module 10 and the switch board 20 may be disposed in the chassis 60 to ensure that these components are not damaged.

The above description is only a preferred embodiment of the present disclosure and an illustration of the applied technical principles. Those skilled in the art should understand that the scope of the utility model involved in this disclosure is not limited to the technical solution formed by the specific combination of the above-mentioned technical features, and should also cover the above-mentioned utility model without departing from the concept of the utility model. Other technical solutions formed by any combination of technical features or equivalent features. For example, a technical solution formed by replacing the above-mentioned features with (but not limited to) technical features with similar functions disclosed in this disclosure.

Claims

A processor module, comprising:

a bearing plate, the bearing plate has a first end, and a bearing surface perpendicular to its thickness direction;

a plurality of processors, the processors are arranged on the bearing surface of the bearing board and are electrically connected with the bearing board;

a heat dissipation plate, the heat dissipation plate is stacked on the carrying surface of the carrying plate, and is bonded to the processor on the carrying surface;

The first end of the bearing plate protrudes from the heat dissipation plate.
The processor module according to claim 1, wherein the heat dissipation plate is provided with a receiving groove; the processor is located in the receiving groove and adheres to the bottom surface of the receiving groove.
The processor module according to claim 1, wherein a plurality of bar-shaped slots are arranged on a side of the heat dissipation plate away from the processor.
The processor module according to claim 1, wherein a plurality of first connectors are arranged on the bearing surface of the bearing board;

Each of the processors is detachably connected to the corresponding first connector, and is electrically connected to the carrier board through the first connector.
The processor module according to claim 4, wherein the plurality of first connectors are arranged at intervals along the length direction of the carrying board on the carrying surface.
The processor module according to claim 4, wherein the first end is an end in the length direction of the carrier board.
The processor module according to claim 1, wherein the carrying plate and the heat dissipation plate are connected by bolts.
The processor module according to any one of claims 1-7, further comprising a handle connected to the bearing plate.
The processor module according to any one of claims 1-7, wherein the bearing board has two bearing surfaces perpendicular to its thickness direction, and each of the bearing surfaces is provided with the processor;

The processor module includes two heat dissipation plates, each of the heat dissipation plates is stacked on a corresponding carrying surface of the carrying plate, and is bonded to the processor on the corresponding carrying surface.
A server comprising:

switch board;

At least one processor module according to any one of claims 1-9, wherein the first end of the carrier board in the processor module is detachably connected to the switch board.
The server according to claim 10, wherein at least one second connector is provided on the switching board;

The first end of the carrying board in the processor module is detachably connected to the corresponding second connector.
The server according to claim 10, further comprising a power module;

The power supply module is arranged on the switch board and is electrically connected to the switch board, and is used for providing electric energy to the processor on the carrier board through the switch board.
The server according to claim 10, further comprising a fan;

The fan is arranged on the switch board and is electrically connected to the switch board for cooling the processor module.