CN211150541U

CN211150541U - Power device packaging structure and module power supply

Info

Publication number: CN211150541U
Application number: CN201921726029.2U
Authority: CN
Inventors: 唐博汶
Original assignee: Individual
Current assignee: Individual
Priority date: 2019-10-15
Filing date: 2019-10-15
Publication date: 2020-07-31
Anticipated expiration: 2029-10-15

Abstract

The utility model provides a power device packaging structure and module power, relate to the electronic product structure field, the power device packaging structure and module power that this disclosure provided, including current conducting plate and heat-conducting piece, the current conducting plate is used for being connected with the power device of module power, the heat-conducting piece is installed in one side that the power device is connected to the current conducting plate, so that the heat that the power device during operation of connecting in the current conducting plate produced passes through current conducting plate transmission to heat-conducting piece, carry out the heat conduction to the external world by heat-conducting piece, the power device packaging structure that this disclosure provides, through setting up heat-conducting piece and current conducting plate, the power device heat-sinking capability has been improved, the device around it is influenced to the heat that the.

Description

Power device packaging structure and module power supply

Technical Field

The disclosure relates to the field of electronic product structures, in particular to a power device packaging structure and a module power supply.

Background

Reliability and long life are important factors for measuring the performance of electronic products, wherein the heat dissipation capability of the device is one of the decisive factors for the life and reliability of the device, for example, in the process of using a module power supply product for a long time, the power device can not avoid generating heat due to self loss. At present, a plurality of heat dissipation modes are adopted for a module power supply, for example, an air cooling mode and a water cooling mode are adopted, and a heat conduction filling material is added, but most of the heat dissipation modes at present still cannot well improve the heat dissipation capability of a power device in the module power supply.

SUMMERY OF THE UTILITY MODEL

Based on the research, the present disclosure provides a power device package structure and a module power supply.

The present disclosure provides a power device package structure applied to a module power supply including a power device, the power device package structure including a conductive plate and a heat conducting member.

The heat conducting piece is arranged on one side of the power device connected with the current conducting plate, so that heat generated when the power device connected with the current conducting plate works is transferred to the heat conducting piece through the current conducting plate, and the heat conducting piece conducts heat.

Furthermore, the module power supply further comprises a radiator, and the radiator is attached to the heat conducting piece, so that heat generated by the power device during working is transferred to the heat conducting piece through the conducting plate, and is radiated through the radiator.

Further, the module power supply further comprises a PCB main board, the conductive plate is disposed on the PCB main board, and the heat sink is disposed on one side of the heat-conducting member away from the PCB main board and opposite to the PCB main board.

Furthermore, the module power supply further comprises a filling medium, the filling medium is arranged between the PCB main board and the radiator and is in contact with the heat conducting piece, so that when the power device works, heat generated by the power device is transferred to the heat conducting piece through the conducting plate, the heat generated by the power device is transferred to the filling medium through the heat conducting piece, and the filling medium is transferred to the radiator for heat dissipation.

Further, the conductive plate is a PCB circuit board or a high thermal conductivity ceramic circuit board.

Further, the conductive plate is a high-conductivity conductive plate material.

Further, the heat conducting member is made of a metal material or a heat conducting non-metal material.

Further, the sum of the areas of the outer sides of the heat conducting member and the conductive plate is larger than the area of the outer side of the power device.

Further, the heat conducting member and the conductive plate are fixedly connected or detachably connected.

The invention provides a module power supply, which comprises a plurality of current-conducting plates, a plurality of heat-conducting pieces and a plurality of power devices, wherein each power device is arranged on each current-conducting plate and connected with each current-conducting plate, and each heat-conducting piece is arranged on one side of each current-conducting plate, which is connected with each power device, so that when each power device works, heat generated by each power device is transferred to the corresponding heat-conducting piece through each current-conducting plate to conduct heat.

The utility model provides a power device packaging structure and module power, including current conducting plate and heat conduction piece, the current conducting plate is used for being connected with the power device of module power, heat conduction piece installs in one side that power device is connected to the current conducting plate, so that the heat that the power device during operation that connects in the current conducting plate produced transmits to heat conduction piece through the current conducting plate, carry out the heat conduction to the external world by heat conduction piece, through setting up heat conduction piece and current conducting plate, the heat influence its surrounding device of power device production has been avoided, the heat-sinking capability of power device has been improved simultaneously.

In order to make the aforementioned objects, features and advantages of the present disclosure more comprehensible, preferred embodiments accompanied with figures are described in detail below.

Drawings

To more clearly illustrate the technical solutions of the present disclosure, the drawings needed for the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present disclosure, and therefore should not be considered as limiting the scope, and those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.

Fig. 1 is a schematic diagram of a conventional heat dissipation structure.

Fig. 2 is a schematic diagram of a heat dissipation principle of a power device in the prior art.

Fig. 3 is a schematic structural diagram of a power device package structure provided in the present disclosure.

Fig. 4 is another structural schematic diagram of a power device package structure provided by the present disclosure.

Fig. 5 is a schematic diagram illustrating a heat dissipation principle of the power device package structure provided in the present disclosure.

Fig. 6 is a schematic diagram illustrating another heat dissipation principle of the power device package structure provided in the present disclosure.

Fig. 7 is a schematic structural diagram of another angle of the power device package structure provided in the present disclosure.

Icon: 10-power device package structure; 11-a thermally conductive member; 12-a conductive plate; 20-a power device; 30-a heat sink; 40-a PCB main board; 50-filling medium.

Detailed Description

The technical solutions in the present disclosure will be described clearly and completely with reference to the accompanying drawings in the present disclosure, and it is to be understood that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. The components of the present disclosure, as generally described and illustrated in the figures herein, may be arranged and designed in a wide variety of different configurations. Thus, the following detailed description of the embodiments of the present disclosure, presented in the figures, is not intended to limit the scope of the claimed disclosure, but is merely representative of selected embodiments of the disclosure. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the disclosure without making creative efforts, shall fall within the protection scope of the disclosure.

In the description of the present disclosure, it should be noted that the terms "middle", "upper", "lower", "left and right", "inner", "outer", and the like indicate orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships conventionally laid out when the present disclosure is used, and are only for convenience of describing and simplifying the description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present disclosure. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.

In the description of the present disclosure, it is to be noted that the terms "disposed," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected unless otherwise explicitly stated or limited. Either mechanically or electrically. They may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present disclosure can be understood in specific instances by those of ordinary skill in the art.

Reliability and long lifetime are important factors for measuring the performance of electronic products, wherein the heat dissipation capability of the device is one of the decisive factors for influencing the lifetime and reliability of the device. For example, in a module power supply product, heat cannot be generated by a power device due to self-loss during long-term use. The good heat dissipation capability ensures the excellent working performance, otherwise, the power supply of the module must be used for reducing the power, or the external environment cooling must be enhanced.

At present, the commonly used external cooling mode is a wind cooling mode and a water cooling mode. The heat generated by devices on electronic products such as a module power supply and the like can be effectively taken away by improving the rotating speed of the fan and enhancing the speed of water flow. However, this method has the following problems: a) the wind direction (water flow) is regional (shown in fig. 1), and all positions on the module power supply cannot be considered, so that the heat dissipation of a certain area is good (area a), and the heat dissipation of a certain area is poor or even cannot be performed (area B); b) the wind direction (water flow) has a single property (A-B direction), resulting in a region close to the wind source, the module has good heat dissipation, and a position far away from the wind source is heated, so that the reliability and the service life of the device are further shortened. Thereby affecting the reliability and life of the entire module itself.

In order to solve the problems, three schemes are generally proposed, 1) the power supply design of the module is optimized, and the self loss is reduced; 2) comparing devices of different manufacturers, selecting a power device or a magnetic device with higher efficiency, and reducing power loss; 3) the mechanical structure design is improved, and the heat conduction silica gel and the like are added, so that the power device is easy to dissipate heat.

Although the reliability and the service life of the module power supply are improved to a certain extent by the method, the heat dissipation capacity of the power device cannot be improved well due to the factors and the difference of the power device, and the overall consistency of the power module cannot be ensured.

For example, as shown in fig. 2, most module power supplies directly solder the pins of the power device 20 on the PCB main board 40, so that the power device 20 directly contacts with the PCB main board 40, and the contact area is the heat conducting area. When the module power supply operates, part of heat generated by the work of the power device 20 is directly transferred to the PCB main board 40, the PCB main board 40 transfers the heat to the outside of the heat radiator 30 for heat dissipation, or a heat conduction material is added, the heat conduction material is in contact with the power device 20, and the heat generated by the heat conduction material is transferred to the outside of the heat radiator 30 for heat dissipation.

However, the contact resistance between the power device 20 and the PCB main board 40 and the contact resistance between the power device 20 and the heat conductive material are both relatively large, for example, when the power device 20 is in direct contact with the PCB main board 40, the pins of the power device 20 have thermal resistance (about 1 ℃/w), and the PCB main board 40 also has thermal resistance (the thermal conductivity of the circuit board with the common insulating layer made of glass fiber material: about 1w/MK in the longitudinal direction and about 100w/MK in the transverse direction); when the power device 20 is in direct contact with the heat conducting materials, thermal resistance exists between the heat conducting materials (different thermal resistances of different heat conducting materials, generally, the thicker the thickness the greater the thermal resistance), and thermal resistance also exists in the plastic package of the power device 20 (about 50 ℃/w). Therefore, such a heat dissipation method still cannot satisfy the heat dissipation requirement of the power device 20, and even affects the working efficiency of the surrounding devices.

Based on the above research, the present disclosure provides a power device package structure 10.

Referring to fig. 3, the power device package structure 10 provided in the present disclosure is applied to a module power supply including a power device 20, and the power device package structure 10 includes a conductive plate 12 and a heat conducting element 11.

The conductive plate 12 is used to connect with a power device 20 of the module power supply, and the heat conducting member 11 is installed at one side of the conductive plate 12 connected with the power device 20, so that heat generated when the power device 20 connected with the conductive plate 12 operates is transferred to the heat conducting member 11 through the conductive plate 12, and is conducted by the heat conducting member 11.

Optionally, in the present disclosure, the conductive plate 12 and the power device 20 are connected by welding, and the heat conducting member 11 is mounted on one side of the conductive plate 12 connected to the power device 20 by welding.

Compared with the structure shown in fig. 2, the power device package structure 10 provided by the present disclosure obviously concentrates the heat dissipation direction, so that heat is transferred to the heat conducting member 11 through the conductive plate 12, and the heat conducting member 11 conducts heat to the outside, thereby preventing the heat generated by the power device 20 from affecting devices around the power device 20, reducing the thermal resistance, and greatly improving the heat dissipation capability of the power device 20.

Optionally, in the power device package structure 10 provided by the present disclosure, the shape of the heat conducting member 11 is not limited, and the cross section of the heat conducting member 11 may be a triangle, a rectangle, a square, a regular polygon or an irregular polygon, as shown in fig. 4, where fig. 4 is a schematic structural diagram of another implementation of the heat conducting member 11 provided by the present disclosure. The heat conducting member 11 provided by the present disclosure only needs to be installed on one side of the conductive plate 12 connected to the power device 20, so that heat generated when the power device 20 connected to the conductive plate 12 operates is transferred to the heat conducting member 11 through the conductive plate 12, and the heat conducting member 11 conducts heat to the outside.

Further, referring to fig. 5, the module power supply further includes a heat sink 30 and a PCB main board 40, the heat sink 30 is attached to the heat conducting member 11, the conductive plate 12 is disposed on the PCB main board 40, and the heat sink 30 is disposed on a side of the heat conducting member 11 away from the PCB main board 40 and opposite to the PCB main board 40.

Wherein, laminate with heat-conducting piece 11 through radiator 30 to the heat that makes power device 20 during operation produce can transmit to heat-conducting piece 11 through current conducting plate 12, and rethread heat-conducting piece 11 transmits to radiator 30 and dispels the heat, compares in the structure that power device 20 directly contacted with PCB mainboard 40, and this disclosure has avoided on transmitting the PCB mainboard 40 that accepts the heat, and then, has reduced the temperature of PCB mainboard 40, has improved the working property of module power.

Optionally, if the heat conducting member 11 is not attached to the heat sink 30, for better heat dissipation, the present disclosure provides a filling medium 50, as shown in fig. 6, where the filling medium 50 is disposed between the PCB main board 40 and the heat sink 30 and fully contacts with the heat conducting member 11, and further, when the power device 20 works, heat generated by the power device 20 is transferred to the heat conducting member 11 through the conductive plate 12, the heat generated by the power device 20 is transferred to the filling medium 50 through the heat conducting member 11, and the filling medium 50 is transferred to the heat sink 30 for heat dissipation.

The power device package structure 10 provided by the present disclosure not only improves the heat dissipation capability of the power device 20, but also improves the space utilization rate of the PCB main board 40. When the power device 20 is located at the top layer (a layer close to the heat sink 30) or the bottom layer (a layer close to the PCB main board 40), no additional heat conductive copper foil is needed to be added on the bottom layer or the top layer corresponding to the PCB main board 40, thereby further improving the space utilization rate of the PCB main board 40. For example, when the power device 20 is located at the bottom layer, that is, the conductive plate 12 is disposed on the PCB main board 40, it is not necessary to additionally add a heat conductive copper foil on the corresponding top layer (the heat sink 30 layer), and when the power device 20 is located at the top layer, it is not necessary to additionally add a heat conductive copper foil on the corresponding bottom layer (the PCB main board 40 layer).

Further, the conductive plate 12 may be one of a PCB circuit board, a high thermal conductive ceramic circuit board, or a high thermal conductive plate.

Further, the heat conductive member 11 is made of a metal material or a highly heat conductive material.

In the present disclosure, if the heat conducting member 11 is made of a metal material, in order to ensure the safety of the module power supply, the power device 20 located on the conductive plate 12 is not in contact with the heat conducting member 11, and the insulation between the power device 20 and the heat conducting member 11 is ensured, as shown in fig. 7.

If the conductive plate 12 and the heat conducting member 11 are made of high thermal conductivity insulating materials such as ceramic, the insulation and voltage resistance level of the power device 20 itself can be improved, the safety of the module power supply can be enhanced, and the thermal resistance in heat transfer can be reduced. If the heat conducting member 11 is made of a metal material, the thermal resistance in heat transfer is significantly reduced.

Further, the sum of the outer side areas of the heat-conducting member 11 and the conductive plate 12 is larger than the outer side area of the power device 20.

The sum of the outer side areas of the heat conducting member 11 and the conductive plate 12 is larger than the outer side area of the power device 20, so that the contact area of heat conduction is increased, the heat dissipation capability of the power device 20 can be obviously improved, and meanwhile, the area of the heat conducting member 11 is larger than the area of the power device 20, so that when the heat conducting member is fully contacted with the filling medium 50, the heat resistance can also be reduced.

Further, the heat-conducting member 11 and the conductive plate 12 are fixedly attached or detachably attached.

The heat conducting member 11 and the conductive plate 12 may be fixedly connected by welding, or detachably connected by bolts.

The power device package structure 10 provided by the present disclosure connects the power device 20 to the conductive plate 12, and then installs the heat conducting member 11 at one side of the conductive plate 12 connected to the power device 20, so that the heat generated by the power device 20 during operation is transferred to the heat conducting member 11 through the conductive plate 12, and is dissipated by transferring the heat conducting member 11 to the heat sink 30, thereby avoiding transferring the heat to the received PCB motherboard 40, changing the path of heat transfer, and improving the heat transfer effect.

On the basis, the present disclosure further provides a module power supply, which includes a plurality of conductive plates 12, a plurality of heat conducting members 11, and a plurality of power devices 20, where each power device 20 is respectively disposed on each conductive plate 12 and connected to each conductive plate 12, and each heat conducting member 11 is respectively mounted on one side of each conductive plate 12 connected to each power device 20, so that when each power device 20 operates, heat generated by each power device 20 is transferred to the corresponding heat conducting member 11 through each conductive plate 12 to conduct heat.

It is clear to those skilled in the art that, for convenience and brevity of description, the specific working process of the module power supply described above may refer to the corresponding process in the power device package structure 10, and will not be described in detail herein.

In summary, the power device package structure and the module power supply provided by the present disclosure connect the power device to the conductive plate, and then install the heat conducting member on one side of the conductive plate connected to the power device, so that the heat generated by the power device during operation is transferred to the heat conducting member through the conductive plate, and the heat is conducted by the heat conducting member, thereby concentrating the heat dissipation direction, avoiding the heat generated by the power device from affecting the devices around the power device, reducing the thermal resistance, and greatly providing the heat dissipation capability of the power device.

The above description is only a preferred embodiment of the present disclosure and is not intended to limit the present disclosure, and various modifications and changes may be made to the present disclosure by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present disclosure should be included in the protection scope of the present disclosure. It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present disclosure, and all the changes or substitutions should be covered within the scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims

1. A power device packaging structure is applied to a module power supply comprising a power device, and comprises a conductive plate and a heat conducting piece;

2. The power device package structure of claim 1, wherein the module power supply further comprises a heat sink attached to the heat conducting member, such that heat generated by the power device during operation is transferred to the heat conducting member through the conductive plate, and dissipated through the heat sink.

3. The power device package structure of claim 2, wherein the module power supply further comprises a PCB main board, the conductive plate is disposed on the PCB main board, and the heat sink is disposed on a side of the heat conductive member away from the PCB main board and opposite to the PCB main board.

4. The power device package structure of claim 3, wherein the module power supply further comprises a filling medium, the filling medium is disposed between the PCB main board and the heat sink and is in contact with the heat conducting member, so that when the power device is operated, heat generated by the power device is transferred to the heat conducting member through the conductive plate, the heat conducting member transfers the heat generated by the power device to the filling medium, and the filling medium transfers the heat to the heat sink for heat dissipation.

5. The power device package structure of claim 1, wherein the conductive plate is a PCB circuit board or a high thermal conductivity ceramic circuit board.

6. The power device package structure of claim 1, wherein the conductive plate is a high thermal conductivity conductive plate material.

7. The power device package structure of claim 1, wherein the thermal conductive member is made of a metallic material or a thermally conductive non-metallic material.

8. The power device package structure of claim 1, wherein a sum of an outer area of the heat conducting member and the conductive plate is larger than an outer area of the power device.

9. The power device package structure of claim 1, wherein the thermal conductive member and the conductive plate are fixedly or removably connected.

10. A module power supply is characterized by comprising a plurality of current-conducting plates, a plurality of heat-conducting pieces and a plurality of power devices, wherein each power device is arranged on each current-conducting plate and connected with each current-conducting plate, and each heat-conducting piece is arranged on one side of each current-conducting plate, which is connected with each power device, so that when each power device works, heat generated by each power device is transferred to the corresponding heat-conducting piece through each current-conducting plate to conduct heat.