CN207369500U - A kind of element radiating structure - Google Patents
A kind of element radiating structure Download PDFInfo
- Publication number
- CN207369500U CN207369500U CN201721213749.XU CN201721213749U CN207369500U CN 207369500 U CN207369500 U CN 207369500U CN 201721213749 U CN201721213749 U CN 201721213749U CN 207369500 U CN207369500 U CN 207369500U
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- China
- Prior art keywords
- pcb board
- radiating fin
- radiating
- radiating structure
- metal cap
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- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
It the utility model is related to radiator structure technical field, a kind of more particularly to element radiating structure, including radiating fin, element and pcb board, the radiating fin, pcb board and element are bonded setting successively, and the element is right against the position that the radiating fin is bonded with pcb board；Metal cap is covered with the member outboard.The goal of the invention of the utility model is to provide a kind of element radiating structure, and the technical problem of current element pedion fitting heat radiation fin structure heat dissipation effect difference can be solved using technical solution provided by the utility model.
Description
Technical field
It the utility model is related to radiator structure technical field, more particularly to a kind of element radiating structure.
Background technology
Increasing with integrated circuit function now, its caloric value is also increasing, and radiating requirements are also essential.
Mainly there is both direction for the sinking path of an element, one is radiated towards the top surface direction of element, that is, passes through case faces
Heat dissipation, another kind are the bottom surface direction heat dissipations towards element, i.e., are radiated by board faces.
As shown in Figure 1, the common radiating mode for this high heat element is to apply to dissipate in the case faces of element 1 at present
Thermal medium 2, the boss of radiating fin 3 is contacted with heat eliminating medium 2 when assembling, the heat of element 1 is passed through this path
To external environment condition.The heat sink conception is only applicable to pcb board towards the element of radiating fin one side, and positioned at pcb board another side
Element can not radiate with this solution；And pcb board is not contacted with radiating fin, the heat that element is transmitted by board faces
Amount is stored within pcb board, causes the temperature of PCB very high, and then hinder the ability that element radiates to board faces.
Utility model content
The goal of the invention of the utility model is to provide a kind of element radiating structure, using technology provided by the utility model
Scheme can solve the technical problem of current element pedion fitting heat radiation fin structure heat dissipation effect difference.
In order to solve the above-mentioned technical problem, the utility model uses following technical scheme：A kind of element radiating structure, including
Radiating fin, element and pcb board, the radiating fin, pcb board and element are bonded setting successively, and the element is right against institute
State the position that radiating fin is bonded with pcb board；Metal cap is covered with the member outboard.
Preferably, heat dissipation is equipped between the radiating fin and pcb board and between the element and metal cap
Medium.
Preferably, in the metal cap edge formed with the flanging being bonded with the pcb board.
Preferably, it is equipped with heat eliminating medium between the flanging and pcb board.
Preferably, the metal cap is contacted and fixed with the Lu Tong areas of pcb board by tin cream.
Preferably, formed with several ground holes in the Lu Tong areas contacted on the pcb board with the element and flanging.
Preferably, the part windowing processing contacted on the pcb board with the radiating fin；The PCB plates and heat dissipation
Heat eliminating medium between fin is placed in the pcb board windowing processing Hou Lutong areas.
Pcb board is held between element and radiating fin by the utility model, and a high thermal conductivity is covered on element
Metal cap, the one side which can be by the heat transfer in element case faces to pcb board backwards to radiating fin, and element
The heat that board faces distribute equally can also be pooled to the face, and the element solved backwards to radiating fin one side can not pass through heat dissipation
The problem of fin radiates, solving the problems, such as and optimize element can efficiently radiate towards case faces and board faces both direction.
Brief description of the drawings
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to this practicality
Attached drawing is briefly described needed in the description of new embodiment or the prior art.It should be evident that description below
In attached drawing be only the utility model part of the embodiment, for those of ordinary skill in the art, do not paying wound
On the premise of the property made is laborious, other attached drawings can also be obtained according to these attached drawings.
Fig. 1 is existing element radiating structure diagram；
Fig. 2 is the utility model embodiment element radiating structure diagram.
Embodiment
The following is a combination of the drawings in the embodiments of the present utility model, and the technical scheme in the embodiment of the utility model is carried out
Clearly and completely describe.Obviously, the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiment in the utility model, those of ordinary skill in the art are without creative efforts
All other embodiments obtained, shall fall within the protection scope of the present invention.
The common radiating mode for this high heat element is in the case faces of element and the boss of radiating fin at present
Contact, which is only applicable to pcb board towards the element of radiating fin one side, and positioned at pcb board another side element without
Method radiates with this solution；And pcb board is not contacted with radiating fin, the heat that element is transmitted by board faces all stores up
There are in pcb board, causing, the temperature of PCB is very high, and then hinders the ability that element radiates to board faces.
Fig. 2 is referred to, the present embodiment provides a kind of element radiating structure, including radiating fin 10, element 20 and pcb board
30.Radiating fin 10, pcb board 30 and element 20 are bonded setting successively, and element 20 is right against radiating fin 10 and pcb board 30
The position of fitting.Metal cap 40 is covered with the outside of element 20, which is made of high thermal conductivity material, and metal cap
40 are contacted and fixed with the Lu Tong areas of pcb board 30 by tin cream.Between radiating fin 10 and pcb board 30 and element 20 with
Heat eliminating medium 50 is equipped between metal cap 40.
Element 20 is placed on the one side backwards to radiating fin 10, and the gold of a high thermal conductivity is covered on the element 20
Belong to cover 40, metal cap 40 is contacted by heat eliminating medium 50 with the case faces of element 20, is connect by the Lu Tong areas of tin cream and pcb board 30
Touch and fix, at this time the metal cap 40 can by the heat transfer in element 20case faces to pcb board 30 backwards to radiating fin 10 one
Face, and the heat that element 20board faces distribute equally can also be pooled to the face, and element is may be such that by one piece of radiating fin 10
20 efficiently radiate towards case faces and board faces both direction at the same time, and heat dissipation effect is notable.
For the further optimization of technical solution, in 40 edge of metal cap formed with the flanging 41 being bonded with pcb board 30,
Heat eliminating medium 50 is equipped between flanging 41 and pcb board 30.The structure can be effectively by the heat transfer in element 20case faces
To the copper sheet area of pcb board 30, and then effectively improve the efficiency that 20 chip of element transmits heat to case faces.
Formed with several ground holes 31 in the Lu Tong areas contacted at the same time also on pcb board 30 with element 20 and flanging 41, make
The heat that the face is collected is delivered to the one side towards radiating fin 10 by the ground hole 31 in Lu Tong areas.
Further, the part windowing processing contacted on pcb board 30 with radiating fin 10, pcb board 30 and radiating fin
Heat eliminating medium 50 between 10 is placed in the windowing processing Hou Lutong of pcb board 30 areas.The structure makes heat be transmitted by the approach
To external environment condition, the element 20 before solving the problems, such as backwards to 10 one side of radiating fin can not be radiated by radiating fin 10.
Pcb board is held between element and radiating fin by element radiating structure provided in this embodiment, and on element
Cover the metal cap of a high thermal conductivity, the metal cap can by the heat transfer in element case faces to pcb board backwards to radiating fin
One side, and the heat that element board faces distribute equally can also be pooled to the face, solve the element backwards to radiating fin one side
The problem of can not being radiated by radiating fin, solving and optimize element can efficiently dissipate towards case faces and board faces both direction
The problem of hot.
Embodiments described above, does not form the restriction to the technical solution protection domain.It is any in above-mentioned implementation
Modifications, equivalent substitutions and improvements made within the spirit and principle of mode etc., should be included in the protection model of the technical solution
Within enclosing.
Claims (7)
1. a kind of element radiating structure, including radiating fin, element and pcb board, it is characterised in that：The radiating fin, pcb board
It is bonded setting successively with element, and the element is right against the position that the radiating fin is bonded with pcb board；Outside the element
Side cover has metal cap.
A kind of 2. element radiating structure according to claim 1, it is characterised in that：The radiating fin and pcb board it
Between and the element and metal cap between be equipped with heat eliminating medium.
A kind of 3. element radiating structure according to claim 2, it is characterised in that：The metal cap edge formed with
The flanging being bonded with the pcb board.
A kind of 4. element radiating structure according to claim 3, it is characterised in that：Spread between the flanging and pcb board
Equipped with heat eliminating medium.
A kind of 5. element radiating structure according to claim 4, it is characterised in that：The metal cap passes through tin cream and PCB
Ban Lutong areas contact and fix.
A kind of 6. element radiating structure according to claim 5, it is characterised in that：On the pcb board with the element
Formed with several ground holes in the Lu Tong areas contacted with flanging.
A kind of 7. element radiating structure according to claim 6, it is characterised in that：On the pcb board with the heat dissipation
The part windowing processing of fin contact；Heat eliminating medium between the pcb board and radiating fin is placed in the pcb board windowing processing
In Hou Lutong areas.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721213749.XU CN207369500U (en) | 2017-09-20 | 2017-09-20 | A kind of element radiating structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721213749.XU CN207369500U (en) | 2017-09-20 | 2017-09-20 | A kind of element radiating structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN207369500U true CN207369500U (en) | 2018-05-15 |
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ID=62348867
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201721213749.XU Active CN207369500U (en) | 2017-09-20 | 2017-09-20 | A kind of element radiating structure |
Country Status (1)
| Country | Link |
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| CN (1) | CN207369500U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113939132A (en) * | 2021-10-11 | 2022-01-14 | 惠州市德赛西威汽车电子股份有限公司 | Laminated vehicle-mounted host structure |
-
2017
- 2017-09-20 CN CN201721213749.XU patent/CN207369500U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113939132A (en) * | 2021-10-11 | 2022-01-14 | 惠州市德赛西威汽车电子股份有限公司 | Laminated vehicle-mounted host structure |
| CN113939132B (en) * | 2021-10-11 | 2024-05-31 | 惠州市德赛西威汽车电子股份有限公司 | Laminated vehicle-mounted host structure |
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