CN208141314U - Combined radiating device - Google Patents
Combined radiating device Download PDFInfo
- Publication number
- CN208141314U CN208141314U CN201820287495.4U CN201820287495U CN208141314U CN 208141314 U CN208141314 U CN 208141314U CN 201820287495 U CN201820287495 U CN 201820287495U CN 208141314 U CN208141314 U CN 208141314U
- Authority
- CN
- China
- Prior art keywords
- mounting plate
- heat pipe
- heat
- radiator
- radiating device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 239000012782 phase change material Substances 0.000 claims description 5
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 238000005516 engineering process Methods 0.000 abstract description 3
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 238000007789 sealing Methods 0.000 description 4
- 238000012546 transfer Methods 0.000 description 4
- 238000000034 method Methods 0.000 description 3
- 238000009835 boiling Methods 0.000 description 2
- 230000029052 metamorphosis Effects 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 230000005855 radiation Effects 0.000 description 2
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 2
- 229910000838 Al alloy Inorganic materials 0.000 description 1
- 238000005219 brazing Methods 0.000 description 1
- 239000012141 concentrate Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000005611 electricity Effects 0.000 description 1
- 238000002309 gasification Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 239000007788 liquid Substances 0.000 description 1
- 238000003754 machining Methods 0.000 description 1
- 230000007257 malfunction Effects 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000007254 oxidation reaction Methods 0.000 description 1
- 238000010992 reflux Methods 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000009423 ventilation Methods 0.000 description 1
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to field of computer technology, disclose a kind of combined radiating device, including：Core radiator, intermediate heat sink and preceding radiator, intermediate heat sink is between core radiator and preceding radiator；The core radiator includes：First mounting plate, the first heat pipe and thermally conductive sheet, the first heat pipe are arranged in the holding tank on the first mounting plate, and thermally conductive sheet is mounted on the first mounting plate, and with the first heat pipe contact；Intermediate heat sink includes：Second mounting plate and the second heat pipe, second heat pipe are arranged in the holding tank on the second mounting plate, and preceding radiator includes：Third mounting plate and third heat pipe, third heat pipe is arranged in the holding tank on third mounting plate, first mounting plate, the second mounting plate are parallel with third mounting plate to overlap, and high thermal conductivity medium is filled in the first heat pipe, the second heat pipe and third heat pipe.The combined radiating device of the utility model can be rapidly by the heat derives in hermetically sealed computer equipment.
Description
Technical field
The utility model relates to field of computer technology, in particular to a kind of combined radiating device.
Background technique
Currently, cpu chip calorific value is also increasing at an amazing speed with the raising of Computing processing capacity.
In the cabinet of open type ventilation, air-cooled radiating mode is mainly added using cooling fin, all designs have reasonable air duct to carry out empty
The heat dissipation of gas switch type.And in some hermetically sealed computer equipments, the equipment of especially big power consumption is constantly improved in performance
Afterwards, core cpu mainboard heat ink radiates as the first order in cooling system, faces very big challenge, and traditional air cooling way
It is not able to satisfy the demand that heat exchanges inside and outside sealing space.How the heat Quick diffusing inside sealing space to outside,
It is an important and urgent demand, if radiator heat-dissipation scarce capacity or cannot will quickly to concentrate heat be transmitted to outer
Portion, will lead to equipment when using for a long time or under hot environment can due to overheat cisco unity malfunction, to internal electricity
Sub- component damages or accelerates high-temperature oxydation, in turn results in the failure of equipment or shortens service life of equipment.
Utility model content
The utility model proposes a kind of combined radiating device, solve the prior art for hermetically sealed computer equipment without
The problem of method rapid cooling.
A kind of combined radiating device of the utility model, including：Core radiator, intermediate heat sink and preceding radiator,
The intermediate heat sink is between core radiator and preceding radiator；The core radiator includes：First mounting plate, first
Heat pipe and thermally conductive sheet, first heat pipe are arranged in the holding tank on the first mounting plate, and thermally conductive sheet is mounted on the first mounting plate
On, and with the first heat pipe contact；The intermediate heat sink includes：Second mounting plate and the second heat pipe, the second heat pipe setting
In the holding tank on the second mounting plate, the preceding radiator includes：Third mounting plate and third heat pipe, the third heat pipe are set
It sets in the holding tank on third mounting plate, first mounting plate, the second mounting plate are parallel with third mounting plate to overlap one
It rises, heat-conducting medium is filled in first heat pipe, the second heat pipe and third heat pipe.
Wherein, the third mounting plate is equipped with air duct slot.
Wherein, between first mounting plate and the second mounting plate and between the second mounting plate and third mounting plate
Equipped with heat conductive phase change material layer.
Wherein, the heat conductive phase change material layer is with a thickness of 0.1mm~0.3mm.
Wherein, the thermally conductive sheet is made of copper plate.
The CPU heat generated is transmitted to first via thermally conductive sheet by the way of three-stage combination heat dissipation by the utility model
It on heat pipe, is then sequentially delivered on the second heat pipe and third heat pipe, by the metamorphosis of medium in heat pipe, quickly heat
It is transmitted on external preceding radiator, is finally reached the mediate contact of internal heat resource and outside air, makes quickly to reach inside and outside equipment
To a thermal equilibrium state, heat is taken away finally by the radiation of preceding radiator and the air circulation of outside.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, before not making the creative labor property
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is a kind of combined radiating device structural schematic diagram of the utility model.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without creative efforts
Every other embodiment obtained, fall within the protection scope of the utility model.
The combined radiating device of the present embodiment is as shown in Figure 1, include：Core radiator, intermediate heat sink and preceding heat dissipation
Device, intermediate heat sink is between core radiator and preceding radiator.Core radiator includes：First mounting plate 1, the first heat pipe
2 and thermally conductive sheet 3, the first heat pipe 2 be arranged in the holding tank on the first mounting plate 1, thermally conductive sheet 3 is mounted on the first mounting plate 3,
And contacted with the first heat pipe 2, to transfer heat to the first heat pipe 2.Intermediate heat sink includes：Second mounting plate 4 and second
Heat pipe 5, the second heat pipe 5 are arranged in the holding tank on the second mounting plate 4.Preceding radiator includes：Third mounting plate 6 and third heat
Pipe 7, third heat pipe 7 are arranged in the holding tank on third mounting plate 6.First mounting plate 1, the second mounting plate 4 and third installation
Plate 6 overlaps in parallel, and heat-conducting medium is filled in the first heat pipe 2, the second heat pipe 5 and third heat pipe 7.The present embodiment
For heat-conducting medium in near-thermal source (part contacted with thermally conductive sheet 3) medium high-temperature gasification, remote heat source side is (farther away from thermally conductive sheet 3
Part) reflux of heat-conducting medium low-temperature liquefaction, i.e., heat is conducted from remote hot end, to realize the quick conduction of heat.It is thermally conductive
Medium can be boiling point lower than 60 DEG C or less (preferably shorter than 40 DEG C) liquid, such as：It pours water and vacuumizes in heat pipe, make water
Boiling point is at 40 DEG C or so, and in this way when the temperature of CPU core core is greater than 40 DEG C, heat pipe, which is started to work, carries out heat transfer.
It is welded and fixed with brazing mode integral between the corresponding mounting plate of each heat pipe, thermally conductive sheet 3 is also by soldering
Mode be mounted on the first mounting plate 1, in Fig. 1 include two pieces of thermally conductive sheets 3, be that core cpu thermally conductive sheet and bridge chip are led respectively
Backing.Each mounting plate can be machining by aluminium alloy 6061, can be bolted between each mounting plate, the shape of each heat pipe
It is set with quantity according to the actual conditions in cabinet.
The combined radiating device of the present embodiment is mounted in sealing computer equipment, and core radiator is close to close to CPU
CPU core core 9, at work, CPU core core generates amount of heat to sealing computer equipment, is transmitted to first via thermally conductive sheet 3
On heat pipe 2, then it is sequentially delivered on the second heat pipe 5 and third heat pipe 7, by the metamorphosis of medium in heat pipe, quick handle
Heat is transmitted on external preceding radiator, is finally reached the mediate contact of internal heat resource and outside air, is made extra income in equipment
Speed reaches a thermal equilibrium state, and heat is taken away finally by the radiation of preceding radiator and the air circulation of outside.
Moreover, the combination form of core radiator, intermediate heat sink and preceding radiator three-stage, can reduce and be machined to
Sheet and difficulty of processing reduce assembling and setting difficulty, reduce the weight loading of computer motherboard (if computer main board is vertical peace
Dress, then have very high requirement to the weight of radiator itself), core radiator need to only be connect with the CPU core core on mainboard,
Intermediate heat sink and preceding radiator can be fixed on cabinet, to reduce the wind of computer motherboard weight bearing excessive deformation damage
Danger also reduces the risk for damaging mainboard in computer handling process, improves equipment dependability, safety and service life.
In the present embodiment, third mounting plate be equipped with air duct slot 8, increase heat dissipation area, enable preceding radiator more
It transfers heat away from fastly.
The surface of first mounting plate 1, the second mounting plate 4 and third mounting plate 6 can not accomplish substantially flat, therefore be overlapped
When together, between have compared with Multiple level, heat can rest in gap, reduce heat conduction velocity.Therefore, the present embodiment
In, thermally conductive phase is equipped between the first mounting plate 1 and the second mounting plate 4 and between the second mounting plate 4 and third mounting plate 6
Change material layer (not shown), so that heat faster transmits.
Heat conductive phase change material layer is not only able to achieve quick conductive with a thickness of 0.1mm~0.3mm in this way, and can be preferably
In a certain range by device thickness control.Wherein, third mounting plate 6 can be the wherein one side wall of equipment box.
Thermally conductive sheet 3 is made of copper plate, further increases heat-transfer rate.
The above is only the preferred embodiment of the present invention, is not intended to limit the utility model, all practical at this
Within novel spirit and principle, any modification, equivalent replacement, improvement and so on should be included in the guarantor of the utility model
Within the scope of shield.
Claims (5)
1. a kind of combined radiating device, which is characterized in that including：Core radiator, intermediate heat sink and preceding radiator, it is described
Intermediate heat sink is between core radiator and preceding radiator；The core radiator includes：First mounting plate, the first heat pipe
And thermally conductive sheet, first heat pipe are arranged in the holding tank on the first mounting plate, thermally conductive sheet is mounted on the first mounting plate, and
With the first heat pipe contact；The intermediate heat sink includes：Second mounting plate and the second heat pipe, second heat pipe are arranged second
In holding tank on mounting plate, the preceding radiator includes：Third mounting plate and third heat pipe, third heat pipe setting is the
In holding tank on three mounting plates, first mounting plate, the second mounting plate are parallel with third mounting plate to overlap, described
Heat-conducting medium is filled in first heat pipe, the second heat pipe and third heat pipe.
2. combined radiating device as described in claim 1, which is characterized in that the third mounting plate is equipped with air duct slot.
3. combined radiating device as described in claim 1, which is characterized in that first mounting plate and the second mounting plate
Between and the second mounting plate and third mounting plate between be equipped with heat conductive phase change material layer.
4. combined radiating device as claimed in claim 3, which is characterized in that the heat conductive phase change material layer with a thickness of
0.1mm~0.3mm.
5. combined radiating device as described in any one of claims 1 to 4, which is characterized in that the thermally conductive sheet is red copper
Plate is made.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820287495.4U CN208141314U (en) | 2018-03-01 | 2018-03-01 | Combined radiating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820287495.4U CN208141314U (en) | 2018-03-01 | 2018-03-01 | Combined radiating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208141314U true CN208141314U (en) | 2018-11-23 |
Family
ID=64286520
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820287495.4U Expired - Fee Related CN208141314U (en) | 2018-03-01 | 2018-03-01 | Combined radiating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208141314U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114245676A (en) * | 2021-12-20 | 2022-03-25 | 中汽创智科技有限公司 | Heat dissipation device and force calculation device |
-
2018
- 2018-03-01 CN CN201820287495.4U patent/CN208141314U/en not_active Expired - Fee Related
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114245676A (en) * | 2021-12-20 | 2022-03-25 | 中汽创智科技有限公司 | Heat dissipation device and force calculation device |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20181123 |