CN208141275U - Sealed computer cabinet - Google Patents
Sealed computer cabinet Download PDFInfo
- Publication number
- CN208141275U CN208141275U CN201820287402.8U CN201820287402U CN208141275U CN 208141275 U CN208141275 U CN 208141275U CN 201820287402 U CN201820287402 U CN 201820287402U CN 208141275 U CN208141275 U CN 208141275U
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- mounting plate
- heat pipe
- heat
- core
- cabinet
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Abstract
The utility model relates to field of computer technology, disclose a kind of sealed computer cabinet, including：Cabinet and it is located in the box body CPU core core, further includes：Core radiator, intermediate heat sink and preceding radiator；Core radiator includes：First mounting plate, the first heat pipe and thermally conductive sheet, the first heat pipe are arranged in the holding tank on the first mounting plate, and thermally conductive sheet is mounted on the first mounting plate, and the first heat pipe contact, and connect CPU core core；Intermediate heat sink includes：Second mounting plate and the second heat pipe, the second heat pipe are arranged in the holding tank on the second mounting plate, and preceding radiator includes：Third mounting plate and third heat pipe, third heat pipe is arranged in the holding tank on third mounting plate, first mounting plate, the second mounting plate are parallel with third mounting plate to overlap, heat-conducting medium is filled in first heat pipe, the second heat pipe and third heat pipe, third mounting plate is one of side wall of cabinet.The sealed computer cabinet of the utility model can rapidly radiate.
Description
Technical field
The utility model relates to field of computer technology, in particular to a kind of sealed computer cabinet.
Background technique
Currently, cpu chip calorific value is also increasing at an amazing speed with the raising of Computing processing capacity.
In the cabinet of open type ventilation, air-cooled radiating mode is mainly added using cooling fin, all designs have reasonable air duct to carry out empty
The heat dissipation of gas switch type.And in some hermetically sealed computer equipments, the equipment of especially big power consumption is constantly improved in performance
Afterwards, core cpu mainboard heat ink radiates as the first order in cooling system, faces very big challenge, and traditional air cooling way
It is not able to satisfy the demand that heat exchanges inside and outside sealing space.How the heat Quick diffusing inside sealing space to outside,
It is an important and urgent demand, if radiator heat-dissipation scarce capacity or cannot will quickly to concentrate heat be transmitted to outer
Portion, will lead to equipment when using for a long time or under hot environment can due to overheat cisco unity malfunction, to internal electricity
Sub- component damages or accelerates high-temperature oxydation, in turn results in the failure of equipment or shortens service life of equipment.
Utility model content
The utility model proposes a kind of sealed computer cabinets, solve the prior art for hermetically sealed computer equipment
Can not rapid cooling the problem of.
A kind of sealed computer cabinet of the utility model, including：Cabinet and it is located in the box body CPU core core, also
Including：Core radiator, intermediate heat sink and preceding radiator, the intermediate heat sink be located at core radiator and preceding radiator it
Between；The core radiator includes：First mounting plate, the first heat pipe and thermally conductive sheet, the first heat pipe setting is in the first installation
In holding tank on plate, thermally conductive sheet is mounted on the first mounting plate, and the first heat pipe contact, and connects the CPU core core；Institute
Stating intermediate heat sink includes：The holding tank on the second mounting plate is arranged in second mounting plate and the second heat pipe, second heat pipe
In, the preceding radiator includes：The receiving on third mounting plate is arranged in third mounting plate and third heat pipe, the third heat pipe
In slot, first mounting plate, the second mounting plate are parallel with third mounting plate to overlap, first heat pipe, the second heat
Heat-conducting medium is filled in pipe and third heat pipe, the third mounting plate is one of side wall of the cabinet.
Wherein, between first mounting plate and the second mounting plate and between the second mounting plate and third mounting plate
Equipped with heat conductive phase change material layer.
Wherein, the heat conductive phase change material layer is with a thickness of 0.1mm~0.3mm.
Wherein, each side wall of the cabinet is equipped with fin structure.
Wherein, the thermally conductive sheet is made of copper plate.
Wherein, first mounting plate is connect with the CPU core core, and the second mounting plate is fixed on cabinet.
The heat that CPU is generated in the sealed computer cabinet of the utility model is transmitted to the first heat pipe via thermally conductive sheet
On, it is then sequentially delivered on the second heat pipe and third heat pipe, by the metamorphosis of medium in heat pipe, quickly heat is conducted
Onto external preceding radiator, it is finally reached the mediate contact of internal heat resource and outside air, makes to be rapidly achieved one inside and outside equipment
A thermal equilibrium state takes away heat finally by the radiation of preceding radiator and the air circulation of outside.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, before not making the creative labor property
It puts, is also possible to obtain other drawings based on these drawings.
Fig. 1 is a kind of sealed computer case structure schematic diagram of the utility model.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without creative efforts
Every other embodiment obtained, fall within the protection scope of the utility model.
The sealed computer cabinet of the present embodiment is as shown in Figure 1, include：Cabinet 1 and it is located in the box body CPU core core
2, further include：Core radiator, intermediate heat sink and preceding radiator, intermediate heat sink be located at core radiator and preceding radiator it
Between.Core radiator includes：First mounting plate 3, the first heat pipe 4 and thermally conductive sheet, first heat pipe 4 are arranged in the first mounting plate
In holding tank on 3, thermally conductive sheet is mounted on the first mounting plate 3, is contacted with the first heat pipe 4, and connects CPU core core 2, this reality
It applies in example, thermally conductive sheet includes：Core cpu thermally conductive sheet 5 and bridge chip thermally conductive sheet 6, core cpu thermally conductive sheet 5 are close to cpu chip,
Bridge chip thermally conductive sheet 6 is close to bridge chip.Intermediate heat sink includes：Second mounting plate 7 and the second heat pipe 8, the setting of the second heat pipe 8
In the holding tank on the second mounting plate 7.Preceding radiator includes：Third mounting plate 9 and third heat pipe 10, third heat pipe 10 are arranged
In the holding tank on third mounting plate 3.First mounting plate 3, the second mounting plate 7 is parallel with third mounting plate 9 overlaps,
Heat-conducting medium is filled in first heat pipe 4, the second heat pipe 8 and third heat pipe 10, third mounting plate 3 is wherein the one of cabinet 1
A side wall can reduce the thickness of cabinet 1, improve heat transfer efficiency.
It is welded and fixed with brazing mode integral between the corresponding mounting plate of each heat pipe, thermally conductive sheet is also by soldering
Mode is mounted on the first mounting plate 3, and each mounting plate can be machining by aluminium alloy 6061, can pass through spiral shell between each mounting plate
It tethers and connects, the shape and quantity of each heat pipe are set according to the actual conditions in cabinet.
The heat-conducting medium of the present embodiment is in near-thermal source (part contacted with thermally conductive sheet) medium high-temperature gasification, remote heat source side
The reflux of (from the farther away part of thermally conductive sheet) heat-conducting medium low-temperature liquefaction, i.e., heat is conducted from remote hot end, to realize heat
Quick conduction.Heat-conducting medium can be boiling point lower than 60 DEG C or less (preferably shorter than 40 DEG C) liquid, such as：It pours water in heat pipe
And vacuumize, make the boiling point of water at 40 DEG C or so, in this way the temperature of CPU core core be greater than 40 DEG C when, heat pipe start to work into
Row heat transfer.
In the sealed computer cabinet of the present embodiment, core radiator is close to CPU core core 9 close to CPU, and sealing calculates
At work, CPU core core generates amount of heat to machine equipment, is transmitted on the first heat pipe 4 via thermally conductive sheet, then successively transmits
Onto the second heat pipe 8 and third heat pipe 10, by the metamorphosis of medium in heat pipe, dissipated before heat is quickly transmitted to outside
On hot device, it is finally reached the mediate contact of internal heat resource and outside air, makes to be rapidly achieved a thermal equilibrium state inside and outside equipment,
Heat is taken away finally by the radiation of preceding radiator and the air circulation of outside.
The surface of first mounting plate 3, the second mounting plate 7 and third mounting plate 9 can not accomplish substantially flat, therefore be overlapped
When together, between have compared with Multiple level, heat can rest in gap, reduce heat conduction velocity.Therefore, the present embodiment
In, thermally conductive phase is equipped between the first mounting plate 3 and the second mounting plate 7 and between the second mounting plate 7 and third mounting plate 9
Change material layer (not shown), so that heat faster transmits.
Heat conductive phase change material layer is not only able to achieve quick conductive with a thickness of 0.1mm~0.3mm in this way, and can be preferably
In a certain range by device thickness control.
In the present embodiment, each side wall of cabinet 1 is equipped with fin structure 11, increases heat dissipation area, can quickly by
Heat transfer is gone out.Further the top of cabinet 1 is additionally provided with fin structure.
Thermally conductive sheet is made of copper plate, further increases heat-transfer rate.
In the present embodiment, the combination form of core radiator, intermediate heat sink and preceding radiator three-stage can reduce machine
Processing cost and difficulty of processing reduce assembling and setting difficulty, reduce the weight loading of computer motherboard (if computer main board is vertical
Formula installation, then have very high requirement to the weight of radiator itself).First mounting plate 3 is connect with CPU core core 2, the second installation
Plate 7 is fixed on cabinet 1, and third mounting plate 9 is a side wall of cabinet 1 in itself, therefore reduces computer motherboard weight bearing
The risk of excessive deformation damage also reduces the risk for damaging mainboard in computer handling process, improves equipment dependability, safety
Property and service life.
The above is only the preferred embodiment of the present invention, is not intended to limit the utility model, all practical at this
Within novel spirit and principle, any modification, equivalent replacement, improvement and so on should be included in the guarantor of the utility model
Within the scope of shield.
Claims (6)
1. a kind of sealed computer cabinet, including：Cabinet and it is located in the box body CPU core core, which is characterized in that also wrap
It includes：Core radiator, intermediate heat sink and preceding radiator, the intermediate heat sink be located at core radiator and preceding radiator it
Between；The core radiator includes：First mounting plate, the first heat pipe and thermally conductive sheet, the first heat pipe setting is in the first installation
In holding tank on plate, thermally conductive sheet is mounted on the first mounting plate, and the first heat pipe contact, and connects the CPU core core；Institute
Stating intermediate heat sink includes：The holding tank on the second mounting plate is arranged in second mounting plate and the second heat pipe, second heat pipe
In, the preceding radiator includes：The receiving on third mounting plate is arranged in third mounting plate and third heat pipe, the third heat pipe
In slot, first mounting plate, the second mounting plate are parallel with third mounting plate to overlap, first heat pipe, the second heat
Heat-conducting medium is filled in pipe and third heat pipe, the third mounting plate is one of side wall of the cabinet.
2. sealed computer cabinet as described in claim 1, which is characterized in that first mounting plate and the second installation
Heat conductive phase change material layer is equipped between plate and between the second mounting plate and third mounting plate.
3. sealed computer cabinet as claimed in claim 2, which is characterized in that the heat conductive phase change material layer with a thickness of
0.1mm~0.3mm.
4. sealed computer cabinet as described in claim 1, which is characterized in that each side wall of the cabinet is equipped with fin
Structure.
5. sealed computer cabinet as described in claim 1, which is characterized in that the thermally conductive sheet is made of copper plate.
6. such as sealed computer cabinet according to any one of claims 1 to 5, which is characterized in that first mounting plate
It is connect with the CPU core core, the second mounting plate is fixed on cabinet.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820287402.8U CN208141275U (en) | 2018-03-01 | 2018-03-01 | Sealed computer cabinet |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820287402.8U CN208141275U (en) | 2018-03-01 | 2018-03-01 | Sealed computer cabinet |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN208141275U true CN208141275U (en) | 2018-11-23 |
Family
ID=64286522
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201820287402.8U Active CN208141275U (en) | 2018-03-01 | 2018-03-01 | Sealed computer cabinet |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN208141275U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112654206A (en) * | 2020-11-05 | 2021-04-13 | 西安交通大学 | 5G base station lightweight cooling system for mine |
-
2018
- 2018-03-01 CN CN201820287402.8U patent/CN208141275U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN112654206A (en) * | 2020-11-05 | 2021-04-13 | 西安交通大学 | 5G base station lightweight cooling system for mine |
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| GR01 | Patent grant |