CN201064074Y - Heat pipe radiator - Google Patents
Heat pipe radiator Download PDFInfo
- Publication number
- CN201064074Y CN201064074Y CNU2007201188742U CN200720118874U CN201064074Y CN 201064074 Y CN201064074 Y CN 201064074Y CN U2007201188742 U CNU2007201188742 U CN U2007201188742U CN 200720118874 U CN200720118874 U CN 200720118874U CN 201064074 Y CN201064074 Y CN 201064074Y
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- China
- Prior art keywords
- heat
- pipe
- radiator
- heat pipe
- substrate
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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Abstract
The utility model relates to a heat pipe radiator, comprising a basal plate and a heat pipe embedded into the basal plate, wherein, the basal plate comprises a heat-absorbing surface and a heat radiating surface; the heat radiating surface is provided with a groove; the heat pipe is embedded into the groove arranged on the heat radiating surface. The utility model is embedded into the heat radiating surface of the basal plate of the radiator, which flattens the surface that the heat-absorbing surface contacts the heat source, thereby reducing the thermal resistance.
Description
Technical field
The utility model relates to the electronic element radiating field, particularly a kind of heat-pipe radiator.
Background technology
Along with the continuous development of electronic technology, the integrated degree of semiconductor device circuit is more and more higher.Existing assembly more powerful and volume is littler, density of heat flow rate just strengthens thereupon, and high heat flux requires that electronic devices and components are had better heat management control.Therefore the heat dissipation problem that solves high heat flux has become the key of industries such as present communication, power supply, photoelectricity.
When the device density of heat flow rate constantly increases, to heat dissipation design, the demands for higher performance of radiator especially.Traditional monophasic fluid heat convection method and air blast cooling method generally can only solve density of heat flow rate and be not more than 10W/CM
2The device heat dissipation problem.
Because heat pipe has high thermal conductivity, good isothermal, the good characteristics such as reversible denaturation of direction of heat flow, can satisfy electronic equipment to the radiator compactness, reliable, high-effect, requirement such as do not need repairing.Therefore hot pipe technique generally adopts in industries such as communication, power electronics, semiconductor device.
As shown in Figure 1, existing heat-pipe radiator with heat pipe 12 by welding, mode potting such as bonding in the substrate 11 of radiator so that the heat of thermal source more is evenly distributed on the radiator, thereby the efficient of entire radiator is greatly improved.General this on radiator base plate 11 radiator of potting heat pipe 12 be called the heat pipe cold plate radiator.
As shown in Figure 2, the heat pipe potting mode that generally adopts in the existing heat pipe cold plate radiator is: heat pipe 12 is welded on radiator and the one side that heater 13 contacts.Yet this welding manner is difficult on same plane the bottom surface of heat pipe 12 and radiator base plate 12, thereby has strengthened contact heat resistance, and then greatly reduces radiating efficiency.If the heat-absorbent surface and the heat pipe 12 of radiator base plate 11 is machined to same plane, then is very easy to the damage heat pipe wall and causes heat pipe failure with mechanical method for milling.
The utility model content
The purpose of this utility model is, a kind of heat-pipe radiator is provided, and is big to solve above-mentioned heat-pipe radiator contact heat resistance, the problem that causes heat pipe to leak in the course of processing easily.
The technical solution of the utility model is, a kind of heat-pipe radiator is provided, and comprises substrate, embeds the heat pipe of described substrate, and described substrate comprises heat-absorbent surface and radiating surface, and described radiating surface is provided with groove, and described heat pipe embeds the groove on the described radiating surface.
In heat-pipe radiator described in the utility model, be filled with high heat conduction packing material in the substrate in the described groove and the gap of heat pipe.
In heat-pipe radiator described in the utility model, the radiating surface of described substrate extends upward a plurality of radiating fins.
In heat-pipe radiator described in the utility model, described heat pipe top is provided with a plurality of radiating fins that are connected with heat pipe.
In heat-pipe radiator described in the utility model, be flat surface with the thermal source contact portion on the described substrate heat-absorbent surface.
Heat-pipe radiator of the present utility model by heat pipe being embedded the radiating surface of radiator base plate, makes on the substrate heat-absorbent surface and the surfacing of thermal source contact portion, thereby has reduced thermal resistance.And the utility model has reduced the complexity of the production technology of heat-pipe radiator, has reduced product cost.
Description of drawings
Fig. 1 is the structural representation of existing heat pipe cold plate radiator;
Fig. 2 is the partial enlarged drawing of A portion among Fig. 1;
Fig. 3 is the structural representation of a kind of heat-pipe radiator first embodiment of the utility model;
Fig. 4 is the structural representation of a kind of heat-pipe radiator second embodiment of the utility model.
Embodiment
As shown in Figure 3, be the structural representation of a kind of heat-pipe radiator first embodiment of the utility model.In the present embodiment, heat-pipe radiator comprises substrate 31 and heat pipe 32.
The radiating surface of substrate 31 is provided with groove, and heat pipe 32 embeds this groove.Thereby heat pipe 32 can absorb the heat on the radiator base plate 31, and the heat of thermal source more is evenly distributed on the radiator, thereby the efficient of entire radiator is greatly improved.
As shown in Figure 4, be the structural representation of a kind of heat-pipe radiator second embodiment of the utility model.In the present embodiment, heat-pipe radiator comprises substrate 41 and heat pipe 42, and heat pipe 42 embeds the radiating surface of substrate 41.
Because the contact-making surface and the out-of-flatness of heat pipe 42 and substrate 341 fovea superior cell walls, thereby may cause the thermal resistance of 42 of substrate 41 and heat pipes bigger.In order to reduce the thermal resistance of 42 of substrate 41 and heat pipes, can in the gap between the contact-making surface of groove walls on the substrate 41 and heat pipe 32, fill high heat conduction packing material, increase the heat conduction of 41 of heat pipe 42 and substrates, thereby the heat in the substrate 41 can more efficiently must be absorbed by heat pipe, further increase sink-efficiency.
In addition, in order to increase area of dissipation, the radiating surface of substrate 41 extends upward a plurality of radiating fins.Equally, above heat pipe 42, also be provided with the radiating fin that links to each other with heat pipe 42.
Certainly, said structure of the present utility model also can be applicable in other dissimilar radiator.
Above-mentioned heat-pipe radiator embeds the radiating surface of radiator base plate with heat pipe, makes on the substrate heat-absorbent surface and the surfacing of thermal source contact portion, thereby has reduced thermal resistance, and reduced the complex manufacturing degree of heat-pipe radiator, has reduced product cost.
Claims (5)
1. heat-pipe radiator comprises substrate, embeds the heat pipe of described substrate, it is characterized in that described substrate comprises heat-absorbent surface and radiating surface, and described radiating surface is provided with groove, and described heat pipe embeds the groove on the described radiating surface.
2. heat-pipe radiator according to claim 1 is characterized in that, is filled with high heat conduction packing material in the substrate in the described groove and the gap of heat pipe.
3. heat-pipe radiator according to claim 1 and 2 is characterized in that the radiating surface of described substrate extends upward a plurality of radiating fins.
4. heat-pipe radiator according to claim 3 is characterized in that, described heat pipe top is provided with a plurality of radiating fins that are connected with heat pipe.
5. heat-pipe radiator according to claim 4 is characterized in that, is flat surface with the thermal source contact portion on the described substrate heat-absorbent surface.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201188742U CN201064074Y (en) | 2007-03-09 | 2007-03-09 | Heat pipe radiator |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNU2007201188742U CN201064074Y (en) | 2007-03-09 | 2007-03-09 | Heat pipe radiator |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN201064074Y true CN201064074Y (en) | 2008-05-21 |
Family
ID=39452463
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNU2007201188742U Expired - Lifetime CN201064074Y (en) | 2007-03-09 | 2007-03-09 | Heat pipe radiator |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN201064074Y (en) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103796491A (en) * | 2014-01-24 | 2014-05-14 | 东莞汉旭五金塑胶科技有限公司 | Heat dissipation device for portable type electronic device |
| CN109845424A (en) * | 2016-10-17 | 2019-06-04 | Zf 腓德烈斯哈芬股份公司 | For exporting the equipment and its manufacturing method of heat |
| CN111465268A (en) * | 2020-04-14 | 2020-07-28 | 华为技术有限公司 | Radiator and manufacturing method thereof and electronic equipment |
| CN111653531A (en) * | 2020-06-12 | 2020-09-11 | 青岛恒芯半导体有限公司 | Novel double-current IGBT packaging structure and method thereof |
-
2007
- 2007-03-09 CN CNU2007201188742U patent/CN201064074Y/en not_active Expired - Lifetime
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103796491A (en) * | 2014-01-24 | 2014-05-14 | 东莞汉旭五金塑胶科技有限公司 | Heat dissipation device for portable type electronic device |
| CN109845424A (en) * | 2016-10-17 | 2019-06-04 | Zf 腓德烈斯哈芬股份公司 | For exporting the equipment and its manufacturing method of heat |
| CN109845424B (en) * | 2016-10-17 | 2021-11-09 | Zf 腓德烈斯哈芬股份公司 | Device for dissipating heat and method for producing the same |
| CN111465268A (en) * | 2020-04-14 | 2020-07-28 | 华为技术有限公司 | Radiator and manufacturing method thereof and electronic equipment |
| CN111465268B (en) * | 2020-04-14 | 2022-05-17 | 华为数字能源技术有限公司 | Radiator and manufacturing method thereof and electronic equipment |
| CN111653531A (en) * | 2020-06-12 | 2020-09-11 | 青岛恒芯半导体有限公司 | Novel double-current IGBT packaging structure and method thereof |
| CN111653531B (en) * | 2020-06-12 | 2021-11-30 | 青岛佳恩半导体科技有限公司 | Double-current IGBT packaging structure and method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CX01 | Expiry of patent term | ||
| CX01 | Expiry of patent term |
Granted publication date: 20080521 |