CN1979080A - Heat pipe radiator and mfg. method - Google Patents
Heat pipe radiator and mfg. method Download PDFInfo
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- CN1979080A CN1979080A CN 200510134532 CN200510134532A CN1979080A CN 1979080 A CN1979080 A CN 1979080A CN 200510134532 CN200510134532 CN 200510134532 CN 200510134532 A CN200510134532 A CN 200510134532A CN 1979080 A CN1979080 A CN 1979080A
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- heat
- pipe
- loam cake
- heat pipe
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Abstract
The invention relates to a manufacture method for jointing heat pipe and radiator that needs not third party medium. It is formed by embedding U shaped heat pipe in heat conductive block. The block is formed by rectangular plate and a upper cover. Containing flutes corresponding to heat absorbing end of heat pipe is set on base, and through holes corresponding to condensing end of heat pipe are set on upper cover. The heat absorbing end and the bottom of heat conductive block would be processed to plane.
Description
Technical field
The present invention relates to a kind of Radiator and its preparation method, relate in particular to heat-pipe radiator and manufacture method thereof that a kind of heat pipe can directly contact with thermal source.
Background technology
During electric or electronic product such as the CPU of use such as personal computer, laser luminous diode or power transistor, all can produce heat energy.The heat energy that produces of electronic component grows with each passing day in recent years, heat dissipation technology thereby become the key technology of electric or electronic industry.The cool-down method of typical electronic or electric product has two kinds, and one is for directly installing cooling body on electronic heating component, and it is two for reducing the temperature of the housing that is mounted with electronic building brick with fan.
Be installed in cooling body on the electronic building brick and be generally heat pipe of dull and stereotyped pedestal, flat heat pipe or pipe shape that material (as copper or aluminium) with high thermal conductivity coefficient makes etc.Heat pipe is a kind of evacuated hollow container, and its inside properly is sealed with working fluid.Because container is evacuated, so working fluid evaporates easily.
The operation principle of heat pipe is summarized as follows.Heat pipe has heat absorbing end and condensation end usually, in use, with heat absorbing end contact thermal source, and the heat that thermal source is produced is passed to working fluid via heat pipe, make working fluid evaporate and move to the condensation end of heat pipe, aqueous at this end release heat again to be condensed into, flow back into heat absorbing end again, thereby form a thermal cycle.The flow circuit of working fluid in pipe is power-actuated by gravity or capillarity.The former needs heat absorbing end is placed under the condensation end; The latter then is that structures such as the storage tank with container inner wall, metal net shaped core or porous tissue produce.Therefore, in heat pipe, a large amount of heats is subjected to the phase change of the working fluid in the airtight container to change with moving and distribute.
In addition, also can use radiator as the cooling body that is installed on the object that will dispel the heat.Radiator is made of heat-conducting block and fin.Known radiating fin comprises one group of lamellar body that outwards extends, and it is connected to radiator via brazing or the mode of extrusion modling with heat-conducting block.The fin of radiator and heat-conducting block are required to be the material with high thermal conductivity coefficient.
High hundreds of times of the thermal conductivity ratio copper of heat pipe, but price is also very expensive.If attach heat pipe in a row on the body surface that will dispel the heat, then its high cost certainly will become the main resistance of this commodity marketization.On the other hand, because the electronic product development of technology, its heating power and order all increase, and the radiator of forming with heat-conducting block and fin can not satisfy the demands merely.Therefore, need a kind of compromise heat-pipe radiator, constitute, the condensation end of heat pipe is worn in the perforation of each fin by engaging heat-conducting block, fin and heat pipe, and make and be arranged with a plurality of conduits that are parallel to each other on the heat-conducting block, and weld by these conduits and the heat absorbing end of heat pipe.Therefore, thermal source closely contacts with the heat-conducting block surface, by heat-conducting block electronic building brick surface heat is everywhere derived in real time, and is uploaded to heat pipe and fin.
Yet known heat-pipe radiator must be by weld layer as connecting the medium of heat pipe with heat-conducting block, thereby make the material cost increase.In addition, the welding of heat pipe and heat-conducting block need be through the hot melt of heating, and makes copper heat pipe surface oxidation and forms cupric oxide, therefore, needs to increase the manufacture process that make its color reduction, thereby has increased manufacturing cost and time cost.In addition, to reduce also be the problem that can not despise to the thermal conductivity that thermal resistance caused that causes of scolder.At last, because the thermal conductivity factor of heat pipe is much larger than heat-conducting block, but heat pipe directly is not attached on the object that will dispel the heat, and therefore, operating efficiency is limited, makes that the lifting of heat transfer efficiency is limited.
Summary of the invention
Because the thermal conductivity factor of heat pipe is much larger than the copper heat-conducting block, therefore, heat pipe directly is attached on the thermal source will improves heat transfer efficiency effectively.Therefore, need a kind of heat pipe heat absorbing end of utilizing directly to wear heat-conducting block, make heat-conducting block and heat pipe be attached at the heat-pipe radiator of electronic heating component simultaneously, as shown in Figure 2.Therefore, main purpose of the present invention is to provide a kind of heat pipe can fit in the manufacture method of the heat-pipe radiator on electronic heating component surface with heat-conducting block synchronously.
Another object of the present invention is to, provide a kind of the 3rd medium that do not need just can make the method that heat pipe engages with heat-conducting block.Heat pipe and the many modes of engaging of heat-conducting block with welding, but the thermal conductivity factor of scolder is lower, and heat heat transfer efficiency by material interface the time is inconsistent, therefore, will form thermal resistance in solder interface.Relatively reasonable manner is, utilizes socket join structure to connect heat pipe and radiator, falls the thermal resistance that is caused thereby reduce the composition surface suddenly because of material difference thermal conductivity factor gradient.
The present invention is pressed on the heat pipe contraposition on the heat-conducting block apace by the mode that loam cake presses down, and therefore, its manufacture process is quick, and has reduced the step of welding and copper reduction, so can effectively reduce the manufacturing time and the material cost of heat-pipe radiator.Therefore, another object of the present invention is to, provide a kind of and can produce fast and cost-effective manufacture method.
In sum, the invention provides a kind of the 3rd medium that do not need and just can make that heat pipe engages manufacture method with radiator, this radiator constitutes by the storage tank that heat pipe is embedded in heat-conducting block inside.Wherein, heat-conducting block is formed in the one side positioning combination by the rectangular slab base and the loam cake of correspondence setting, and a plurality of storage tanks are arranged on this base, and its internal diameter equates with the heat absorbing end of U type heat pipe just with shape.
In addition, on be stamped a plurality of perforation corresponding with the heat pipe condensation end, then there is the inboard corresponding arcuation lug boss of a plurality of and heat pipe heat absorbing end the bottom surface, loam cake and base have the location division of mutual fastening, thereby make the condensation end of heat pipe wear in the loam cake, and make loam cake press down, make heat absorbing end arrive in the storage tank of base, by lug boss with heat pipe and the tight pressing of base.At last, heat absorbing end and heat-conducting block underrun processing are carried out smooth, are embedded in the radiator that heat-conducting block inside, heat pipe and heat-conducting block can be attached at thermal source simultaneously fully thereby form heat pipe.
Description of drawings
Fig. 1 is a stereogram of the present invention;
Fig. 2 is the stereogram of another angle of the present invention;
Fig. 3 is a three-dimensional exploded view of the present invention;
Fig. 4 is the present invention's first manufacturing step side view;
Fig. 5 is the present invention's second manufacturing step side view;
Fig. 6 is the present invention's the 3rd manufacturing step side view;
Fig. 7 is the present invention's the 4th manufacturing step side view;
Fig. 8 is the side view of another embodiment of the present invention.
In the accompanying drawing, the list of parts of each label representative is as follows:
1-heat-conducting block 2-fin
3-heat pipe 11-loam cake
12-storage tank 13-base
The 14-first location division 15-second location division
17-through hole 19-lug boss
21-perforation 31-condensation end
33-heat absorbing end 15A reference column
The 14A-locating hole
The specific embodiment
In order to make those skilled in the art further understand feature of the present invention and technology contents, see also following about detailed description of the present invention and accompanying drawing, accompanying drawing only provide with reference to and usefulness is described, be not to be used for limiting the present invention.
The invention provides a kind of manufacture method of heat-pipe radiator, wherein the stereogram of this radiator as shown in Figure 1.See also this figure, radiator is stacked at interval on the heat-conducting block 1 by a plurality of fins 2 and forms, and wherein, heat-conducting block 1 is made with the material of aluminium, copper or other high thermal conductivity coefficient with fin 2.Simultaneously, offer the corresponding perforation 21 of a plurality of and heat pipe 3 on the fin 2.
As shown in Figure 1, heat pipe 3 is the hollow tube of U-shaped, still, it should be appreciated by those skilled in the art that heat pipe 3 also can be other shape, and does not depart from the scope of the present invention.Inside heat pipe has the working fluid of appropriate sealing, and two ends of its U-shaped section are condensation end 31, and the centre then is a heat absorbing end 33.Condensation end 31 is provided with away from heat-conducting block 1, in order to the perforation 21 that wears fin 2, with serial connection fin 2.
Fig. 2 is the stereogram of another angle of the present invention.As shown in the figure, the bottom of the heat absorbing end 33 of heat pipe of the present invention by processing shape is and parallel plane, radiating block 1 bottom surface, and can attaches mutually with the electronic heating component surface by this plane.Cooperation is with reference to figure 3, and it is a three-dimensional exploded view of the present invention, and wherein, heat-conducting block 1 is that the loam cake 11 of rectangular slab is formed with base 13 corresponding sockets by essence.Wherein, offer a plurality of storage tanks 12 on the base 13, its shape and big or small substantial equivalence are in the heat absorbing end 33 of the heat pipe 3 of U type.
With reference to figure 3, offer a plurality of through holes 17 on the loam cake 11 again, itself and the condensation end 31 corresponding settings of heat pipe 3, and internal diameter essence equals the external diameter of condensation end 31.In addition, a plurality of block-shaped protrusion portion 19 is arranged on the loam cake 11, the radian of its side is corresponding with the heat absorbing end 33 of heat pipe 3 just.Therefore, condensation end 31 can be arranged in loam cake 11 via through hole 17, and can fit and suppress the heat absorbing end 33 that is positioned at storage tank 12 by lug boss 19, make heat absorbing end 33 and storage tank 12 fit tightly, thus heat pipe 3 is fixing and be positioned the inside of radiating block 1.
Therefore, the manufacture method of this heat-pipe radiator such as Fig. 4 are to shown in Figure 7.The steps include:
(1) by shown in Figure 4, on the plate body base 13 that can attach and cover electronic heating component fully, wear more than one storage tank 12, its shape essence equals the heat absorbing end 33 of heat pipe 3;
(2) make the front of base 13 scatter a plurality of second location divisions 15;
(3) heat absorbing end 33 with heat pipe 3 places in the storage tank 12;
(4) as shown in Figure 4, can with the loam cake 11 of base 13 fluid-tight engagement on, offer a plurality of through holes 17, its position is corresponding with the condensation end 31 of heat pipe 3, and aperture essence equals the external diameter of condensation end 31;
(5) scatter a plurality of first location divisions 14 in the bottom surface of loam cake 11, its position is corresponding with the shape and second location division 15;
(6) make loam cake 11 floor lift block-shaped protrusion portions 19, its shape just can with the inboard corresponding pressing of the heat absorbing end 33 of heat pipe 3;
(7) as shown in Figure 6, make the through hole 17 of loam cake 11 aim at, and heat pipe 3 is pressed to base 13, make location division 14,15 chimeric mutually, thereby make loam cake and base form heat-conducting block with condensation end 31;
(8) loam cake 11 and base 13 are fitted tightly, and fitting projection portion 19 compacting heat absorbing end 33, make heat pipe 3 be positioned in the heat-conducting block 1;
(9) as shown in Figure 7, on a plurality of fins 2, offer the perforation 21 of symmetry, and make the condensation end 31 of heat pipe 3 wear serial connection, make its formation comprise the heat-pipe radiator of heat-conducting block 1, heat pipe 3 and fin 2;
(10) in Fig. 7, the part that protrudes in heat-conducting block 1 bottom surface with the heat absorbing end 33 of processing mode opposite heat tube 3 of leveling is handled, and makes heat absorbing end 33 and base 13 be configured as the plane.
For making base 13 of the present invention closely connect into heat-conducting block 1 with loam cake 11, lug boss 19, through hole 17 need accurately be aimed at and engage with the condensation end 31 of storage tank 12, heat pipe, therefore, corresponding first location division 14 and second location division 15 of being provided with on loam cake 11 and base 13.Correspondence by the location division fastens, and makes loam cake 11 accurately aim on base 13, forms the heat-conducting block body thereby engage.
Please refer to Fig. 3, it is the preferred embodiments of the present invention, and wherein, first location division 14 is the locating hole of depression, and second reference column of location division 15 for protruding.Utilize the chimeric of locating hole and reference column, make loam cake and base correctly aim at and engage.But, it should be appreciated by those skilled in the art that and also can use any structure of locating and engaging, and do not depart from the scope of the present invention.
Please refer to Fig. 8 in addition, it is another embodiment of location division of the present invention.Wherein, first location division 14 is perforation 14A, and second location division is the double-screw bolt 15A that end-rings is established screw thread.The shape essence of double-screw bolt 15A equates that with perforation 14A therefore, double-screw bolt 15A can be arranged in perforation 14A and expose to heat-conducting block 1, and is with nut that double-screw bolt 15A is sealed more at last, with fixed cover 11 and base 13.
Known heat absorbing end only has a side to contact with heat-conducting block, and heat absorbing end of the present invention 33 is embedded in heat-conducting block 1 inside, and its heat pipe and heat-conducting block contact area heighten, and therefore, the heat conduction is more efficient.In addition, it is intermediate that heat-conducting block is still arranged between heat pipe in the past and thermal source, and the thermal conductivity factor of heat-conducting block and radiating rate be far below heat pipe, therefore, its heat conduction and heat dissipation with directly heat pipe is fitted in compare on the object that will dispel the heat relatively poor.
According to the manufacture method of above-mentioned heat-pipe radiator, heat pipe 3 need be fixedly arranged on earlier in the storage tank 12 of heat-conducting block 1, again fin is taken shape in heat pipe.In addition, storage tank 12 runs through the base 13 of heat-conducting block 1, therefore, the heat absorbing end 33 of heat pipe 3 is contacted with the body surface that will dispel the heat.
Simultaneously, heat pipe 3 is arranged at the inside of heat-conducting block 1, and therefore bigger with the contact area of heat-conducting block 1, heat-conducting block can more effectively conduct to heat heat pipe and distribute.Therefore compared with prior art, the present invention can promptly directly derive heat and make it and distribute.
Thereby known joint method, therefore to need through the copper reduction process because hot weld makes copper heat pipe oxidation deterioration via the brazier hot melt welding of heating to need heat pipe and heat-conducting block, its make consume numerous time-consuming.But the present invention makes heat pipe 3 locate fast by loam cake 11 and base 13, and is socketed in the heat-conducting block 1, therefore can significantly shorten manufacturing time and reduce step, effectively reduces time and material cost.Further, because the present invention does not need the 3rd medium such as scolder to wait and makes heat-conducting block engage with heat pipe, the situation that does not therefore have the 3rd medium interface to produce thermal resistance takes place.
The above only is the preferred embodiments of the present invention, be not so promptly limit claim of the present invention, the equivalent structure transformation that every utilization specification of the present invention and accompanying drawing content are done, or directly or indirectly be used in other relevant technical field, all in like manner be included in the claim of the present invention.
Claims (10)
1. the manufacture method of a heat-pipe radiator comprises the steps:
On in order to the base that is attached at electronic heating component fully, wear more than one storage tank;
Offer more than one through hole last covering, the bottom surface of described loam cake can with described base fluid-tight engagement, and the position of described through hole is corresponding with the condensation end of described heat pipe with shape;
Described heat pipe correspondence is placed between described loam cake and the described base, the described condensation end of described heat pipe is extended from described through hole, and corresponding described loam cake and the described base of connecting;
Processing mode by leveling is handled the part that protrudes in described base of the described heat absorbing end of described heat pipe, makes described heat absorbing end and described base be configured as a plane.
2. the manufacture method of heat-pipe radiator as claimed in claim 1, wherein, described loam cake is connected with locating hole with the reference column of described base by corresponding setting.
3. the manufacture method of heat-pipe radiator as claimed in claim 1, wherein, the floor lift lug boss of described loam cake, the shape of described lug boss is corresponding with the described heat absorbing end of described heat pipe.
4. the manufacture method of heat-pipe radiator as claimed in claim 3, wherein, described loam cake and described base fit tightly, and suppress described heat absorbing end by described lug boss, make described heat pipe fit with described loam cake and described base fully.
5. the manufacture method of heat-pipe radiator as claimed in claim 1 further comprises the step that is connected in series a plurality of fins, wherein, has the perforation of symmetry on the described fin, makes the described condensation end of described heat pipe pass described perforation and is connected in series with described fin.
6. the manufacture method of heat-pipe radiator as claimed in claim 1, wherein, the described through hole of described loam cake is aimed at described condensation end, and described loam cake is pressed to described base, makes described loam cake and described base form heat-conducting block.
7. the manufacture method of heat-pipe radiator as claimed in claim 1, wherein, the bottom shape essence of described base equates with heat-dissipating thing.
8. the manufacture method of heat-pipe radiator as claimed in claim 1, wherein, described loam cake, described base and described fin are made up of the material of high thermal conductivity coefficient.
9. the manufacture method of heat-pipe radiator as claimed in claim 1, wherein, the shape essence of described storage tank equates with the heat absorbing end of described heat pipe.
10. a heat-pipe radiator includes heat pipe and heat-conducting block, wherein:
Described heat-conducting block is formed by correspondence chimeric loam cake and the mutual buckle of base, and described base offers more than one storage tank, is stamped more than one lug boss on described;
Described storage tank is corresponding with the heat absorbing end of described heat pipe with described lug boss;
Described heat pipe merges the inside of being fixed in described heat-conducting block by described loam cake and described base corresponding clip;
The processing mode of the underrun of described base leveling and being flattened.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101345325A CN100427871C (en) | 2005-12-08 | 2005-12-08 | Heat pipe radiator and mfg. method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CNB2005101345325A CN100427871C (en) | 2005-12-08 | 2005-12-08 | Heat pipe radiator and mfg. method |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN2008100093903A Division CN101240984B (en) | 2005-12-08 | 2005-12-08 | Heat pipe radiator |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN1979080A true CN1979080A (en) | 2007-06-13 |
| CN100427871C CN100427871C (en) | 2008-10-22 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CNB2005101345325A Expired - Fee Related CN100427871C (en) | 2005-12-08 | 2005-12-08 | Heat pipe radiator and mfg. method |
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| Country | Link |
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| CN (1) | CN100427871C (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101553103B (en) * | 2008-04-03 | 2010-12-08 | 鈤新科技股份有限公司 | Heat radiator with heat pipes and leveling manufacture method of heated parts thereof |
| CN102133608A (en) * | 2010-01-22 | 2011-07-27 | 陈世明 | Manufacturing method and system of flat heat pipe |
| CN101384153B (en) * | 2007-09-07 | 2011-09-21 | 鈤新科技股份有限公司 | Heat-pipe radiator and preparation thereof |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH11351769A (en) * | 1998-06-12 | 1999-12-24 | Furukawa Electric Co Ltd:The | Heat sink |
| US6394175B1 (en) * | 2000-01-13 | 2002-05-28 | Lucent Technologies Inc. | Top mounted cooling device using heat pipes |
| US20040035558A1 (en) * | 2002-06-14 | 2004-02-26 | Todd John J. | Heat dissipation tower for circuit devices |
| CN2622650Y (en) * | 2003-05-08 | 2004-06-30 | 于秉恒 | Thermotube radiator |
| TWM244561U (en) * | 2003-09-12 | 2004-09-21 | Hon Hai Prec Ind Co Ltd | A heat pipe radiator |
| US6779595B1 (en) * | 2003-09-16 | 2004-08-24 | Cpumate Inc. | Integrated heat dissipation apparatus |
-
2005
- 2005-12-08 CN CNB2005101345325A patent/CN100427871C/en not_active Expired - Fee Related
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101384153B (en) * | 2007-09-07 | 2011-09-21 | 鈤新科技股份有限公司 | Heat-pipe radiator and preparation thereof |
| CN101553103B (en) * | 2008-04-03 | 2010-12-08 | 鈤新科技股份有限公司 | Heat radiator with heat pipes and leveling manufacture method of heated parts thereof |
| CN102133608A (en) * | 2010-01-22 | 2011-07-27 | 陈世明 | Manufacturing method and system of flat heat pipe |
| CN102133608B (en) * | 2010-01-22 | 2015-09-09 | 陈世明 | The manufacture method of flat heat pipe and manufacturing system |
Also Published As
| Publication number | Publication date |
|---|---|
| CN100427871C (en) | 2008-10-22 |
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