CN101754654A - Heat transfer substrate and heat dissipation device provided with same - Google Patents
Heat transfer substrate and heat dissipation device provided with same Download PDFInfo
- Publication number
- CN101754654A CN101754654A CN 200810306050 CN200810306050A CN101754654A CN 101754654 A CN101754654 A CN 101754654A CN 200810306050 CN200810306050 CN 200810306050 CN 200810306050 A CN200810306050 A CN 200810306050A CN 101754654 A CN101754654 A CN 101754654A
- Authority
- CN
- China
- Prior art keywords
- hole
- plate body
- transfer substrate
- heat transfer
- heat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
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Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/467—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing gases, e.g. air
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/02—Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F3/00—Plate-like or laminated elements; Assemblies of plate-like or laminated elements
- F28F3/12—Elements constructed in the shape of a hollow panel, e.g. with channels
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Abstract
The invention relates to a heat dissipation device, comprising a heat transfer substrate and a radiator connected with the heat transfer substrate. The radiator comprises a plurality of heat dissipation fins, and the heat transfer substrate comprises a plate and at least one end cover, wherein the plate is internally provided with a plurality of through holes, and the at least one end cover is positioned at the side of the plate and used for sealing the through holes. Capillary structures are respectively arranged on the internal surface of the through hole, and the work fluid with low boiling point is filled in the through hole. The sealed through hole filled with the work fluid is directly formed inside the plate; a bigger contact area exists between the plate and the capillary structure in the through hole; the heat generated by the electronic heating element is transferred to the plate, and then can be absorbed directly by the work fluid, transferred in a manner of phase change and uniformly distributed in the whole plate. Therefore, the invention realizes the function of reducing heat resistance and effectively solves the heat dissipation problem of the electronic element with high heat productivity.
Description
Technical field
The present invention relates to a kind of heat transfer substrate, be meant a kind of heat abstractor that is suitable for the heat transfer substrate of electronic element radiating and has this heat transfer substrate especially.
Background technology
Along with the constantly development of electronic information industry, each electronic component, as computer cpu, the contour power electronic element of light-emitting diode towards trend development more compact and multi-functional, quicker operation, its heat that unit are is produced when operation is also more and more many thereupon, if these heats can not be left timely and effectively, to directly cause temperature sharply to rise, and badly influence the normal operation of heat-generating electronic elements.For this reason, need heat abstractor to come these electronic components are dispelled the heat.
Most typical heat abstractor comprises a heat transfer substrate that contacts with this electronic component and is positioned at the radiator of this heat transfer substrate top.For answering removing of higher heat flux (heat flux), between electronic component and radiator, be typically provided with a heat pipe with good heat conductivity.This heat transfer substrate area than electronic component usually is big, therefore the heat of electronic component generation concentrates on the central authorities that this heat transfer substrate contacts with electronic component easily, the effect of this heat pipe is that the heat that will concentrate on these heat transfer substrate central authorities is passed to this heat transfer substrate in time away from the periphery of this electronic component and be positioned at the radiator of this periphery top, to give full play to the usefulness of radiator.Yet, because the area that is in contact with one another between this heat pipe and the heat transfer substrate is less, the bigger thermal resistance of existence between the surface that mutually combines when being connected by welding or heat-conducting glue between heat pipe and the heat transfer substrate, make the Heat Transfer of Heat Pipe on Heat Pipe function be subjected to bigger restriction, so that the integral heat sink efficient of heat abstractor is not satisfactory.
Summary of the invention
In view of this, thus be necessary to provide less heat transfer substrate that heat can be transmitted and distributes in time, effectively of a kind of thermal resistance and heat abstractor with this heat transfer substrate.
A kind of heat abstractor, comprise a heat transfer substrate and a radiator that is connected with heat transfer substrate, this radiator comprises some radiating fins, this heat transfer substrate comprises that an inside is provided with the plate body of some through holes and at least onely is positioned at the end cap that this plate body side is used to seal described through hole, be respectively equipped with capillary structure on the inner surface of described through hole, and be filled with lower boiling working fluid in the through hole.
A kind of heat abstractor, comprise a heat transfer substrate and a radiator that is connected with heat transfer substrate, this radiator comprises some radiating fins, this heat transfer substrate comprises that an inside is provided with the plate body of some through holes and two and lays respectively at the end cap that the relative both sides of this plate body are used to seal described through hole, described through hole runs through the both sides of this plate body, the inner surface of through hole is provided with capillary structure, and is filled with lower boiling working fluid in the through hole.
A kind of heat transfer substrate, comprise that an inside is provided with the plate body of some through holes and two and lays respectively at the end cap that the relative both sides of this plate body are used to seal described through hole, described through hole runs through the both sides of this plate body, and the inner surface of through hole is provided with capillary structure, and is filled with lower boiling working fluid in the through hole.
Compared with prior art, the inside of this plate body directly forms the through hole that is loaded with working fluid of sealing in the above-mentioned heat abstractor, be located between interior capillary structure of described through hole and the plate body and have bigger contact area, the heat transferred that heat-generating electronic elements produces is to plate body, can directly be absorbed and be distributed in the whole plate body by the phase change transmission by working fluid, thereby can reach the effect that reduces thermal resistance, effectively solve the heat dissipation problem of golf calorific value electronic component.
Description of drawings
Fig. 1 is the three-dimensional assembly diagram of heat abstractor in the first embodiment of the invention.
Fig. 2 is the three-dimensional exploded view of Fig. 1.
Fig. 3 is the cut-away view of Fig. 1 along the III-III line.
Fig. 4 is the three-dimensional exploded view of heat transfer substrate in the second embodiment of the invention.
Fig. 5 is the cut-away view of heat abstractor in the third embodiment of the invention.
Embodiment
Following with reference to accompanying drawing, be described further.
As shown in Figures 1 and 2, this heat abstractor 10 comprises that a heat transfer substrate 20 and is located at the radiator 30 of these heat transfer substrate 20 tops.
This heat transfer substrate 20 comprises a roughly rectangular plate body 21 and is located at first, second end cap 23 of these plate body 21 relative both sides respectively.This plate body 21 have one with the lower surface and a relative upper surface of heat-generating electronic elements 40 contact.This plate body 21 is respectively equipped with first, second accepting groove 24 with these first, second end cap 23 corresponding both sides.Each accepting groove 24 is rectangular, and forms to the inner recess of plate body 21 from the two sides of the correspondence of plate body 21 respectively.Be provided with some through holes 25 that along continuous straight runs respectively runs through this plate body 21 in this plate body 21.Described through hole 25 is parallel to each other and is arranged at the central authorities of this plate body 21 spaced reciprocally.Described through hole 25 is cylindric respectively, and its inner surface is provided with the capillary structure 26 of annular.Each through hole 25 comprises that one is positioned at the evaporation part of these plate body 21 central authorities and lays respectively at two condensation parts at these two ends, evaporation part.Described condensation part is the both sides of close this plate body 21 respectively, and are connected with first, second accepting groove 24 respectively.The aperture of described through hole 25 is less than the height of this accepting groove 24, and the width of described through hole 25 distribution in this plate body 21 is less than the length of this accepting groove 24.In the present embodiment, described accepting groove 24 is located at the forward and backward both sides of this plate body 21 respectively, and described through hole 25 runs through plate body 21 before and after the along continuous straight runs respectively.
Described first, second end cap 23 comprises the sealing 231 of a rectangle and the some connecting portions 233 that extend from a side direction plate body 21 place directions of sealing portion 231 respectively.The shape of sealing portion 231, size respectively with the shape of this first, second accepting groove 24, measure-alike, thereby can be contained in just in this first, second accepting groove 24.Described connecting portion 233 is cylindrical shape respectively, and along continuous straight runs is arranged on the relative side of this first, second sealing 231 and plate body 21 spaced reciprocally.The quantity of described connecting portion 233 is corresponding with the quantity of described through hole 25, and the slightly larger in diameter of each connecting portion 233 is in the aperture of this through hole 25, and therefore described end cap 23 and plate body 21 can be connected by interference fit between described connecting portion 233 and the described through hole 25.During concrete enforcement, the diameter of described connecting portion 233 also can equal or be slightly less than the aperture of this through hole 25, thereby can by the mode of welding described first, second end cap 23 be individually fixed in the forward and backward both sides of this plate body 21 again by between the inner surface of the outer surface of this connecting portion 233 or through hole 25, being coated with tin cream.
This radiator 30 comprises some parallel radiating fins 31.Described radiating fin 31 all extends along the direction identical with through hole 25, promptly extend along the front and rear direction of plate body 21, wherein, the radiating fin 31 that is positioned at described through hole 25 tops is along the length of its bearing of trend length greater than the radiating fin 31 that is positioned at these plate body 21 and arranged on left and right sides.As shown in Figure 3, each radiating fin 31 comprises a flat rectangular body 311 and the flanging 312 that extends to a lateral buckling from the bottom of body 311.In the two adjacent arbitrarily radiating fins, be positioned at the right side radiating fin 31 flanging 312 end be positioned at the left side adjacent radiating fin 31 body 311 mutually against, thereby form a smooth joint face in the bottom of this radiator 30, be welded to each other with upper surface and be connected with this heat transfer substrate 20.
During assembling, this radiator 30 is located on the upper surface of this plate body 21, and this electronic component 40 is attached at the middle body with the lower surface of this plate body 21.Connecting portion 233 on this first, second end cap 23 is aimed at described through hole 25 respectively, and inserts the end of the condensation part at through hole 25 two ends accordingly, and described sealing 231 is contained in respectively in the accepting groove 25 of this plate body 21 accordingly.Described end cap 23 is respectively with the both sides sealing of this plate body 21, i.e. sealed at both ends with described through hole 25 respectively, thus form some airtight chambers in this plate body 21 is inner.Be equipped with capillary structure 26 in the described chamber, and be pumped down to certain vacuum state, and be filled with lower boiling working fluid,, thereby utilize the phase change of this working fluid to reach the purpose of flash heat transfer and soaking as water, alcohol etc.
During work, the heat that electronic component 40 produces at first directly is passed to the middle body that is positioned at the plate body 21 directly over it, promptly directly is passed to the wall portion of the evaporation part of described through hole 25.Because the working fluid in the described through hole 25 is selected lower boiling liquid for use, its heat absorption back rapid evaporation produces steam, the steam that produces is full of whole through hole 25 rapidly, and be positioned at this plate body 21 both sides when running into, when being the wall portion of condensation part of described through hole 25, being cooled to liquid and being back to the evaporation part of these plate body 21 central authorities and entering circulation next time along capillary structure 26.As everyone knows, heat when undergoing phase transition of fluid passes normally tens of times even hundreds of times during undergoing phase transition not of coefficient, therefore the phase change by working fluid in these plate body 21 interior bone 25 can significantly promote the transmission efficiency and the diffuser efficiency of heat and the heat that electronic component 40 is produced can be distributed in whole heat transfer substrate 20 rapidly, is passed to the radiating fin 31 that is positioned at these heat transfer substrate 20 tops then equably and externally distributes.Because this plate body 21 directly forms the wall portion of seal operation fluid in the described through hole 25, and the capillary structure 26 in each through hole 25 has bigger contact area along its circumferencial direction and plate body 21, heat transferred is to the plate body 21 close central authorities of this electronic component 40, can be absorbed and be passed to the periphery of this plate body 21 rapidly away from electronic component 40 by the working fluid of plate body 21 inside, the thermal resistance of this heat in transmittance process is less, thereby can give full play to the heat transmission function of working fluid in the plate body 21.
Be illustrated in figure 4 as second embodiment that heat abstractor of the present invention adopts plate body 20a, the difference of itself and above-mentioned first embodiment is: the rear side of this plate body 20a is a sealing surface, the rear end of described through hole 25a is respectively blind end, and this plate body 20a only comprises an end cap 23 in order to seal described through hole 25a of being located at the front side.
Be illustrated in figure 5 as the 3rd embodiment of heat abstractor 10b of the present invention, the difference of itself and above-mentioned first embodiment is: described radiating fin 31b and plate body 21b are formed in one, and each radiating fin 31b comprises a upper surface from the plate body 21b vertically extending body 311 that makes progress.In the present embodiment, because radiating fin 31b and plate body 21b are one-body molded, thereby can reduce the thermal resistance that combines between radiating fin 31b and the plate body 21b, can be passed to the radiating fin 31b of plate body 21b top rapidly after making heat be distributed in this plate body 21b, thereby further promote the radiating efficiency of this heat abstractor.
Claims (11)
1. heat abstractor, comprise a heat transfer substrate and a radiator that is connected with heat transfer substrate, this radiator comprises some radiating fins, it is characterized in that: this heat transfer substrate comprises that an inside is provided with the plate body of some through holes and at least onely is positioned at the end cap that this plate body side is used to seal described through hole, the inner surface of described through hole is provided with capillary structure, and is filled with lower boiling working fluid in the through hole.
2. heat abstractor as claimed in claim 1, it is characterized in that: described through hole along continuous straight runs runs through this plate body, the quantity of described end cap is two, and each end cap comprises some connecting portions, and described connecting portion is contained in the two ends of described through hole accordingly to seal described through hole.
3. heat abstractor as claimed in claim 2 is characterized in that: the external diameter of described connecting portion is slightly larger than the diameter of described through hole, is connected with the through hole interference fit by described connecting portion between described end cap and the plate body.
4. heat abstractor as claimed in claim 2 is characterized in that: the external diameter of described connecting portion equals or is slightly less than the diameter of described through hole, is welded to connect between the inner surface by described connecting portion and through hole between described end cap and the plate body.
5. heat abstractor as claimed in claim 2, it is characterized in that: each end cap comprises the sealing of a rectangle, described connecting portion extends towards a side direction plate body place direction of plate body from the sealing of correspondence respectively, the relative both sides of this plate body are respectively equipped with an accepting groove that is used to accommodate described sealing, and the two ends of each through hole are communicated with described accepting groove respectively.
6. heat abstractor as claimed in claim 1 is characterized in that: a described through hole only end is communicated with the side of plate body, and the quantity of this end cap is one, and this end cap comprises some connecting portions, and described connecting portion is contained in the described through hole accordingly to seal described through hole.
7. as any described heat abstractor in the claim 1 to 6, it is characterized in that: each radiating fin comprises a body and extends flanging from the bottom of body from a lateral buckling, and described flanging is common to form a smooth joint face to be connected with the upper surface of this heat transfer substrate.
8. as any described heat abstractor in the claim 1 to 6, it is characterized in that: described radiating fin extends from the upper surface of this heat transfer substrate one that makes progress.
9. heat abstractor, comprise a heat transfer substrate and a radiator that is connected with heat transfer substrate, this radiator comprises some radiating fins, it is characterized in that: this heat transfer substrate comprises that an inside is provided with the plate body of some through holes and two and lays respectively at the end cap that the relative both sides of this plate body are used to seal described through hole, described through hole runs through the both sides of this plate body, the inner surface of through hole is provided with capillary structure, and is filled with lower boiling working fluid in the through hole.
10. heat abstractor as claimed in claim 9, it is characterized in that: each end cap comprises a sealing and the some connecting portions that extend from sealing portion, the relative both sides of this plate body are respectively equipped with an accepting groove that is used to accommodate described sealing, the two ends of each through hole are communicated with described accepting groove respectively, and described connecting portion is contained in the end of described through hole accordingly to seal described through hole.
11. heat transfer substrate, it is characterized in that: comprise that an inside is provided with the plate body of some through holes and two and lays respectively at the end cap that the relative both sides of this plate body are used to seal described through hole, described through hole runs through the both sides of this plate body, the inner surface of through hole is provided with capillary structure, and is filled with lower boiling working fluid in the through hole.
Priority Applications (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810306050 CN101754654A (en) | 2008-12-08 | 2008-12-08 | Heat transfer substrate and heat dissipation device provided with same |
| US12/465,648 US20100139888A1 (en) | 2008-12-08 | 2009-05-14 | Heat spreader and heat dissipation device using same |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200810306050 CN101754654A (en) | 2008-12-08 | 2008-12-08 | Heat transfer substrate and heat dissipation device provided with same |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN101754654A true CN101754654A (en) | 2010-06-23 |
Family
ID=42229771
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200810306050 Pending CN101754654A (en) | 2008-12-08 | 2008-12-08 | Heat transfer substrate and heat dissipation device provided with same |
Country Status (2)
| Country | Link |
|---|---|
| US (1) | US20100139888A1 (en) |
| CN (1) | CN101754654A (en) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103412626A (en) * | 2013-07-26 | 2013-11-27 | 昆山维金五金制品有限公司 | CPU radiating fin |
| CN104932648A (en) * | 2015-07-17 | 2015-09-23 | 中国移动通信集团广东有限公司 | Water-cooled type heat pipe radiator and manufacturing method thereof |
| CN106659090A (en) * | 2017-01-16 | 2017-05-10 | 深圳市迈安热控科技有限公司 | Heat pipe conduction heat sink |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114812234A (en) * | 2021-01-28 | 2022-07-29 | 华为技术有限公司 | Heat dissipation device, preparation method of heat dissipation device and wireless communication base station |
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| US5253702A (en) * | 1992-01-14 | 1993-10-19 | Sun Microsystems, Inc. | Integral heat pipe, heat exchanger, and clamping plate |
| JP3268734B2 (en) * | 1996-11-15 | 2002-03-25 | 古河電気工業株式会社 | Method of manufacturing electronic device heat radiation unit using heat pipe |
| JP3501918B2 (en) * | 1997-03-19 | 2004-03-02 | 株式会社アドバンテスト | Heating element cooling device |
| US20020023733A1 (en) * | 1999-12-13 | 2002-02-28 | Hall David R. | High-pressure high-temperature polycrystalline diamond heat spreader |
| US6191946B1 (en) * | 2000-01-03 | 2001-02-20 | Thermal Corp. | Heat spreader with excess solder basin |
| US6407924B1 (en) * | 2001-01-09 | 2002-06-18 | International Business Machines Corporation | Enhanced thermal path mechanical tolerance system |
| JP2003193114A (en) * | 2001-08-28 | 2003-07-09 | Advanced Materials Technologies Pte Ltd | Heat pipe and its manufacturing method |
| US20030136550A1 (en) * | 2002-01-24 | 2003-07-24 | Global Win Technology | Heat sink adapted for dissipating heat from a semiconductor device |
| US7424907B2 (en) * | 2002-10-01 | 2008-09-16 | Enertron, Inc. | Methods and apparatus for an integrated fan pump cooling module |
| US7090001B2 (en) * | 2003-01-31 | 2006-08-15 | Cooligy, Inc. | Optimized multiple heat pipe blocks for electronics cooling |
| US20050067143A1 (en) * | 2003-09-08 | 2005-03-31 | Glacialtech, Inc. | Heat conductive seat with liquid |
| US20050121172A1 (en) * | 2003-12-03 | 2005-06-09 | Rotys Inc. | Composite heatsink for cooling of heat-generating element |
| WO2005117917A2 (en) * | 2004-04-07 | 2005-12-15 | Thermonix Llc | Thermal management system and computer arrangement |
| US6966359B1 (en) * | 2004-04-30 | 2005-11-22 | I-Ming Liu | Radiator plate rapid cooling apparatus |
| JP4549759B2 (en) * | 2004-07-08 | 2010-09-22 | 富士通株式会社 | Cooling module |
| CN2727958Y (en) * | 2004-08-10 | 2005-09-21 | 鸿富锦精密工业（深圳）有限公司 | Radiator |
| US7583502B2 (en) * | 2006-06-13 | 2009-09-01 | Taiwan Semiconductor Manufacturing Co., Ltd. | Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC) |
| US20080035313A1 (en) * | 2006-08-09 | 2008-02-14 | Hul-Chun Hsu | Heat-Conducting Base and Isothermal Plate having the same |
| US20080264611A1 (en) * | 2007-04-30 | 2008-10-30 | Kun-Jung Chang | Heat plate |
| CN101562960B (en) * | 2008-04-18 | 2011-12-28 | 富准精密工业(深圳)有限公司 | Heat dissipating device combination and fastener thereof |
| US7646606B2 (en) * | 2008-05-13 | 2010-01-12 | Honeywell International Inc. | IGBT packaging and cooling using PCM and liquid |
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2008
- 2008-12-08 CN CN 200810306050 patent/CN101754654A/en active Pending
-
2009
- 2009-05-14 US US12/465,648 patent/US20100139888A1/en not_active Abandoned
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103412626A (en) * | 2013-07-26 | 2013-11-27 | 昆山维金五金制品有限公司 | CPU radiating fin |
| CN104932648A (en) * | 2015-07-17 | 2015-09-23 | 中国移动通信集团广东有限公司 | Water-cooled type heat pipe radiator and manufacturing method thereof |
| CN104932648B (en) * | 2015-07-17 | 2019-02-26 | 中国移动通信集团广东有限公司 | A kind of water-cooled heat-pipe radiator and its manufacturing method |
| CN106659090A (en) * | 2017-01-16 | 2017-05-10 | 深圳市迈安热控科技有限公司 | Heat pipe conduction heat sink |
Also Published As
| Publication number | Publication date |
|---|---|
| US20100139888A1 (en) | 2010-06-10 |
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Application publication date: 20100623 |