CN105870084A - Heat radiator base plate, inserting-piece type heat radiator and preparation method thereof - Google Patents

Heat radiator base plate, inserting-piece type heat radiator and preparation method thereof Download PDF

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Publication number
CN105870084A
CN105870084A CN201610403268.9A CN201610403268A CN105870084A CN 105870084 A CN105870084 A CN 105870084A CN 201610403268 A CN201610403268 A CN 201610403268A CN 105870084 A CN105870084 A CN 105870084A
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CN
China
Prior art keywords
described
heat transfer
phase transformation
base plate
transfer plate
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Application number
CN201610403268.9A
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Chinese (zh)
Inventor
卢忠亮
李居强
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浙江嘉熙科技有限公司
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Priority to CN201610403268.9A priority Critical patent/CN105870084A/en
Publication of CN105870084A publication Critical patent/CN105870084A/en

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Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/367Cooling facilitated by shape of device
    • H01L23/3672Foil-like cooling fins or heat sinks
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/36Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
    • H01L23/373Cooling facilitated by selection of materials for the device or materials for thermal expansion adaptation, e.g. carbon
    • H01L23/3737Organic materials with or without a thermoconductive filler
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/46Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids

Abstract

The invention provides a heat radiator base plate, an inserting-piece type heat radiator and a preparation method thereof. A lug boss is formed on the surface of the heat radiator base plate; a groove is formed in the lug boss; the groove comprises a first part and a second part which is located under the first part and is connected with the first part; the width of the first part of the groove is greater than that of the second part of the groove. The lug boss is arranged on the surface of the heat radiator base plate and the groove with different widths is formed in the lug boss; after a phase-change inhibition heat transferring plate is inserted into the groove, a non-pipeline part is located at a part, with a narrower width, of the groove; a heat superconducting pipeline is located at a part, with a wider width, of the groove; space between the phase-change inhibition heat transferring plate and the heat radiator base plate is filled with heat conducting glue, so that heat resistance between the phase-change inhibition heat transferring plate and the heat radiator base plate is greatly reduced, and the heat dissipation performance of the inserting-piece type heat radiator is improved.

Description

Radiator base plate, fin-inserted radiator and preparation method thereof

Technical field

Conduction of heat technical field of the present invention, particularly relates to a kind of radiator base plate, fin-inserted radiator and preparation method thereof.

Background technology

Due to developing rapidly of Power Electronic Technique, the integrated level of high performance components is more and more higher, and power density is the most increasing, The heat produced during work is the most increasing.Normal work for guaranteed output device, it is necessary to timely and effectively by disperses heat. If because can not quickly the heat that power device produces be removed in time, the chip temperature in power device being caused to raise, the most then makes Become usefulness to reduce, reduction of service life, heavy then can cause the inefficacy of power device and chip burn bombing.Therefore big merit is solved Rate device heat dissipation problem always one of puzzlement high power device encapsulation manufacturer and the key problem using manufacturer.

The heat radiation of high power device the most on sale is all based on traditional heat transfer mechanism and corresponding heat transfer technology. The effort of the various improvement heat transfer technologies on its whole heat-transfer paths (includes using heat pipe, fin, employing heat conductivility excellent Chip base material etc.) remain difficult to break through chip cooling bottleneck, heat dissipation problem is the most prominent.

Summary of the invention

The shortcoming of prior art in view of the above, it is an object of the invention to provide a kind of radiator base plate, fin-inserted radiator And preparation method thereof, for solving, the radiating efficiency that in prior art, traditional heat-dissipating device exists is low, can not meet radiating requirements Problem.

For achieving the above object and other relevant purposes, the present invention provides a kind of radiator base plate, described radiator base plate surface shape Becoming to have boss, be provided with groove in described boss, described groove includes Part I and is positioned at below described Part I and with described The Part II that Part I is connected, the width of described groove Part I is more than the width of described groove Part II.

Length as a kind of preferred version of the radiator base plate of the present invention, the length direction of described boss and described radiator base plate Degree direction is consistent, and the length of described boss is less than or equal to the length of described radiator base plate.

Length direction as a kind of preferred version of the radiator base plate of the present invention, the length direction of described groove and described boss Unanimously, and the length of described groove is equal to the length of described boss.

As a kind of preferred version of the radiator base plate of the present invention, the surface phase of the sidewall of described groove and described radiator base plate Vertically.

As a kind of preferred version of the radiator base plate of the present invention, described boss is integrated with described radiator base plate.

As a kind of preferred version of the radiator base plate of the present invention, described groove Part II extends in described radiator base plate Portion.

As a kind of preferred version of the radiator base plate of the present invention, the quantity of described boss is multiple, and multiple described boss are in institute State and be distributed in parallel interval on radiator base plate or be distributed radially.

The present invention also provides for a kind of fin-inserted radiator, and described fin-inserted radiator includes:

Radiator base plate as described in above-mentioned either a program;

Phase transformation suppression heat transfer plate, described phase transformation suppression heat transfer plate is to insert limit, and described phase transformation suppression heat transfer plate is by described Insert limit to be inserted in described groove;It is formed with the Super-conductive conduit road with given shape in described phase transformation suppression heat transfer plate, described Super-conductive conduit road is closing pipe line, is filled with heat-transfer working medium in described Super-conductive conduit road;

The degree of depth of described groove is inserted between limit to the described Super-conductive conduit road the most adjacent with it more than described phase transformation suppression heat transfer plate Distance.

As a kind of preferred version of the fin-inserted radiator of the present invention, described phase transformation suppression heat transfer plate is composite board type structure, institute Stating phase transformation suppression heat transfer plate is one side bulging state, two-sided bulging state or two-sided flat form.

As a kind of preferred version of the fin-inserted radiator of the present invention, described Super-conductive conduit road be shaped as hexagonal honeycomb shape, More than multiple U-shapeds, rhombus, triangle, annular or any of which of crisscross netted, head and the tail series connection any Combination.

As a kind of preferred version of the fin-inserted radiator of the present invention, the edge of described phase transformation suppression heat transfer plate is non-pipeline portions, Described non-pipeline portions is inserted in described groove Part II;Near described in the part inserting limit of described phase transformation suppression heat transfer plate Super-conductive conduit road is positioned at described groove Part I, and the described Super-conductive conduit road being positioned at described groove Part I includes first The sub-pipeline of straight flange and the sub-pipeline of the second straight flange, described first straight flange length of pipe direction suppresses the insertion of heat transfer plate with described phase transformation The length direction on limit is consistent, and the described second sub-pipeline of straight flange is vertical with the described first sub-pipeline of straight flange to be connected.

As a kind of preferred version of the fin-inserted radiator of the present invention, fill between described phase transformation suppression heat transfer plate and described boss There is heat-conducting glue.

As a kind of preferred version of the fin-inserted radiator of the present invention, described radiator base plate leads to described phase transformation suppression heat transfer plate Cross process for pressing, heat-conducting glue bonding process, Friction stir welding, Welding technique, pressing and heat-conducting glue adhesive bond work Skill, pressing are fixed together with Welding combined process with agitating friction weldering combined process or pressing.

As a kind of preferred version of the fin-inserted radiator of the present invention, described radiator base plate is along described phase transformation suppression heat transfer plate Insert the length inserting limit being smaller in size than or suppressing equal to described phase transformation heat transfer plate in edge lengths direction.

As a kind of preferred version of the fin-inserted radiator of the present invention, on described phase transformation suppression heat transfer plate between Super-conductive conduit road Region is provided with air vent.

The present invention also provides for the preparation method of a kind of fin-inserted radiator, and described preparation method includes:

There is provided just like the radiator base plate described in any of the above-described scheme, and in described groove, fill heat-conducting glue;

Use blowing-up technology to prepare phase transformation suppression heat transfer plate, be formed in described phase transformation suppression heat transfer plate and there is given shape and mutually The Super-conductive conduit road of connection, described Super-conductive conduit road is closing pipe line, is filled with heat-transfer working medium in described Super-conductive conduit road;

By described phase transformation suppression heat transfer plate while inserting in described groove, and by process for pressing, heat-conducting glue bonding process, stir Mix friction welding technological, Welding technique, pressing and heat-conducting glue adhesive bond technique, pressing and agitating friction weldering combined process or Pressing is connected fixing with described radiator base plate for described phase transformation suppression heat transfer plate with Welding combined process.

As a kind of preferred version of preparation method of the fin-inserted radiator of the present invention, use blowing-up technology to prepare described phase transformation and press down Heat transfer plate processed method particularly includes:

There is provided the first sheet material and the second sheet material two boards material altogether, by described first sheet material and described one hacking of second sheet material and dry up Only;

Graphite print process is used to form the effigurate graphite line of the tool being interconnected on the hacking face of sheet material described at least one Road, described graphite circuit defines the shape on described Super-conductive conduit road;

Is fitted in the hacking face of described first sheet material and described second sheet material and the alignment of three limits, edgewise riveted;

Heat is carried out after described first sheet material riveted together and described second sheet material are heated to uniform temperature and maintain a period of time Roll processing to form composite board;

Described composite board is carried out soft annealing, is cooled to after room temperature at described first sheet material and described second sheet material correspondence stone Fabrication hole is bored to graphite linings in the position on line of ink marker road;

In described composite board, it is filled with high-pressure fluid through described fabrication hole to expand to described composite board, in described composite board While portion forms described Super-conductive conduit road, formed corresponding with described Super-conductive conduit road at least one surface of described composite board Described bulge-structure;

In described Super-conductive conduit road, inject heat-transfer working medium through described fabrication hole, and seal described fabrication hole.

As a kind of preferred version of preparation method of the fin-inserted radiator of the present invention, described Super-conductive conduit road be shaped as six limits Netted, multiple U-shapeds, rhombus, triangle, annular or any of which of head and the tail series connection that shape is cellular, crisscross Above combination in any.

As a kind of preferred version of preparation method of the fin-inserted radiator of the present invention, the edge of described phase transformation suppression heat transfer plate is Non-pipeline portions, described non-pipeline portions is inserted in described groove Part II;Insertion near described phase transformation suppression heat transfer plate The part described Super-conductive conduit road on limit is positioned at described groove Part I, is positioned at the described hot superconduction of described groove Part I Pipeline includes that the first sub-pipeline of straight flange and the sub-pipeline of the second straight flange, described first straight flange length of pipe direction suppress with described phase transformation The length direction inserting limit of heat transfer plate is consistent, and the described second sub-pipeline of straight flange is vertical with the described first sub-pipeline of straight flange to be connected.

As it has been described above, the radiator base plate of the present invention, fin-inserted radiator and preparation method thereof, have the advantages that

1. passing through at radiator base plate surface configuration boss, and arrange the groove with different in width in boss, phase transformation suppression passes After hot plate inserts in described groove, non-pipeline portions is positioned at the part that groove width is narrower, and Super-conductive conduit road is positioned at groove width relatively Wide part, and fill heat-conducting glue between phase transformation suppression heat transfer plate and radiator base plate, substantially reduce phase transformation suppression heat transfer plate And the thermal resistance between radiator base plate, improves the heat dispersion of fin-inserted radiator;

2. use phase transformation suppression heat transfer plate to replace conventional heat sink of the prior art so that the fin-inserted radiator heat conduction of the present invention Hurry up, fin efficiency high (up to more than 90%), fin efficiency change little with the height of phase transformation suppression heat transfer plate, phase transformation presses down The height of heat transfer plate processed is unrestricted;

3. the fin-inserted radiator of the present invention is easily manufactured flexibly, low cost, and heat-sinking capability is big, lightweight, volume is little, can replace For heat-pipe radiator and part water-filled radiator, it is especially suitable for the dissipation from electronic devices demand of high-power high heat flux, has wide Wealthy market prospect and huge economic worth.

Accompanying drawing explanation

Fig. 1 is shown as in the embodiment of the present invention one the cross section structure schematic diagram of the radiator base plate provided.

Fig. 2 is shown as in the embodiment of the present invention two the cross section structure schematic diagram of the fin-inserted radiator provided.

The pipeline portions local of the phase transformation suppression heat transfer plate that Fig. 3 is shown as in the embodiment of the present invention two in the fin-inserted radiator provided Enlarged section.

Fig. 4 be shown as in the embodiment of the present invention two provide fin-inserted radiator in Super-conductive conduit road, inside be shaped as hexagon The structural representation of cellular phase transformation suppression heat transfer plate.

Fig. 5 is shown as in the embodiment of the present invention three flow chart of the preparation method of the fin-inserted radiator provided.

Element numbers explanation

1 radiator base plate

11 boss

12 grooves

121 groove Part I

122 groove Part II

2 phase transformation suppression heat transfer plates

21 first sheet materials

22 second sheet materials

23 Super-conductive conduit roads

The 231 first sub-pipelines of straight flange

The 232 second sub-pipelines of straight flange

24 non-pipeline portions

25 technique mouths

26 bulge-structures

27 heat-transfer working mediums

The insertion limit of 28 phase transformation suppression heat transfer plates

3 heat-conducting glues

Detailed description of the invention

Below by way of specific instantiation, embodiments of the present invention being described, those skilled in the art can be by disclosed by this specification Content understand other advantages and effect of the present invention easily.The present invention can also be added by the most different detailed description of the invention To implement or application, the every details in this specification can also be based on different viewpoints and application, in the essence without departing from the present invention Various modification or change is carried out under god.

Refer to Fig. 1 to Fig. 5 it should be noted that the diagram provided in the present embodiment illustrates the present invention's the most in a schematic way Basic conception, though component count when only display with relevant assembly in the present invention rather than is implemented according to reality in Tu Shi, shape and Size is drawn, and during its actual enforcement, the kenel of each assembly, quantity and ratio can be a kind of random change, and its assembly layout type State is likely to increasingly complex.

Embodiment one

Referring to Fig. 1, the present invention provides a kind of radiator base plate 1, and described radiator base plate 1 surface is formed with boss 11, institute Being provided with groove 12 in stating boss 11, described groove 12 includes Part I and is positioned at below described Part I and with described first The Part II that part is connected, the width of described groove Part I 121 is more than the width of described groove Part II 122.

As example, the length direction of described boss 11 is consistent with the length direction of described radiator base plate 1, and described boss The length of 11 is less than or equal to the length of described radiator base plate 1.

As example, the length direction of described groove 12 is consistent with the length direction of described boss 11, and the length of described groove 12 Degree is equal to the length of described boss 11.

Perpendicular as example, the sidewall of described groove 12 and described radiator base plate 1.

As example, described boss 11 is integrated with described radiator base plate 1.

It is respectively positioned in described boss 11 at an example, described groove Part I 121 and described groove Part II 122, such as figure Shown in 1;In another example, described groove Part II 122 extends to the inside of described radiator base plate 1.

As example, the material of described radiator base plate 1 should be the material that heat conductivity is good;Preferably, in the present embodiment, institute The material stating radiator base plate 1 can be copper, copper alloy, aluminum or aluminum alloy or the combination in any more than any one.

As example, the quantity of described boss 11 is multiple, multiple described boss 11 on described radiator base plate 1 in parallel Spaced apart.It should be noted that the length direction of multiple described boss 11 can with the sides aligned parallel of described radiator base plate 1, Can also be with the edge oblique of described radiator base plate 1.

As example, the quantity of described boss 11 is multiple, multiple described boss 11 on described radiator base plate 1 in radiation Shape is distributed.It should be noted that the distribution radially on described radiator base plate 1 of multiple described boss 11 refers to multiple described Boss 11 is positioned at the surface of described radiator base plate 1, and from the position near described radiator base plate 1 center to described radiator The edge of substrate 1 extends.Need it is further noted that multiple described boss 11 is uniform in the circumference of described radiator base plate 1 Distribution.

It should be noted that Fig. 1 only forms a described boss 11 using the surface of described radiator base plate 1 as example, institute State the surface of radiator base plate 1 formed the accompanying drawing of multiple described boss 11 not with displaying.

Need it is further noted that the length direction of described radiator base plate 1 is the side consistent with the length of described boss 11 To, the direction that i.e. parallel in the surface with described boss 11, the width of described radiator base plate 1 is and described boss 11 The consistent direction of width, i.e. cross-wise direction shown in Fig. 1, that is the direction of the perpendicular with described boss 11.

Embodiment two

Referring to Fig. 2 to Fig. 4, the present invention provides a kind of fin-inserted radiator, and described fin-inserted radiator includes: such as embodiment Radiator base plate 1 described in one;Phase transformation suppression heat transfer plate 2, described phase transformation suppression heat transfer plate 2 is to insert limit, described Phase transformation suppression heat transfer plate 2 is inserted in described groove 12 by described insertion limit;It is formed with tool in described phase transformation suppression heat transfer plate 2 Having the Super-conductive conduit road 23 of given shape, described Super-conductive conduit road 23 is closing pipe line, is filled with in described Super-conductive conduit road 23 Heat-transfer working medium 27;The degree of depth of described groove 12 more than the insertion limit 28 of described phase transformation suppression heat transfer plate 2 to described insertion limit The adjacent distance between described Super-conductive conduit road 23.The degree of depth of described groove 12 is inserted more than described phase transformation suppression heat transfer plate 2 Enter the distance between limit 28 to the described Super-conductive conduit road 23 the most adjacent with described insertion limit, it can be ensured that suppress in described phase transformation After heat transfer plate 2 inserts in described groove 12, the part that described Super-conductive conduit road 23 is distributed can be with described radiator base plate 1 directly contacts, and to reduce the thermal resistance between described phase transformation suppression heat transfer plate 2 and radiator base plate 1, improves blade inserting heat radiation The heat dispersion of device;Owing to the thickness of the part on described Super-conductive conduit road 23 being distributed in described phase transformation suppression heat transfer plate 2 more than non- The thickness of pipeline portions, is set to described groove 12 include Part I and be positioned at below described Part I and with described first The Part II that part is connected, the width of described groove Part I 121 is more than the width of described groove Part II 122, After may insure that described phase transformation suppression heat transfer plate 2 inserts described groove 12, the Super-conductive conduit road of described phase transformation suppression heat transfer plate 2 Part and non-pipeline portions realize good contact away from described radiator base plate 1, thus reduce described phase transformation suppression heat transfer further Thermal resistance between plate 2 and radiator base plate 1, improves the heat dispersion of fin-inserted radiator.

As example, the degree of depth of described groove Part II 122 equal to described phase transformation suppression heat transfer plate 2 insertion limit 28 to institute State the distance inserted between the described Super-conductive conduit road 23 that limit is the most adjacent.

As example, described phase transformation suppression heat transfer plate 2 is composite board type structure, and the surface of described phase transformation suppression heat transfer plate 2 is permissible For two-sided bulging state as shown in Figure 3, described phase transformation suppression heat transfer plate 2 includes the first sheet material 21 and the second sheet material 22, described First sheet material 21 is combined with each other by rolling process with described second sheet material 22;Blowing-up technology is passed through on described Super-conductive conduit road 23 Formed, while forming described Super-conductive conduit road 23, formed on the surface of described first sheet material 21 and described second sheet material 22 The bulge-structure 26 corresponding with described Super-conductive conduit road 23.

It should be noted that except the structure shown in Fig. 2, described phase transformation suppression heat transfer plate 2 includes described first sheet material 21 and institute When stating the second sheet material 22, it is also possible to by blowing-up technology while forming described Super-conductive conduit road 23, at described first sheet material The surface of 21 or the surface of described second sheet material 22 form the described bulge-structure 26 corresponding with described Super-conductive conduit road 23, i.e. The surface of described phase transformation suppression heat transfer plate 2 is one side bulging state.

Need it is further noted that the surface of described phase transformation suppression heat transfer plate 2 can also be two-sided flat form, the most described phase The concrete structure becoming suppression heat transfer plate 2 can two-sided flat with described in the patent application document of Application No. 201511029540.3 The structure of phase transformation suppression heat transfer plate structure is identical, specifically refers to this patent application document, is not repeated herein.

As example, the shape on described Super-conductive conduit road 23 can be hexagonal honeycomb shape, crisscross netted, head and the tail series connection Multiple U-shapeds, rhombus, triangle, annular or any of which more than combination in any.Fig. 4 is with described Super-conductive conduit Road 23 be shaped as hexagonal honeycomb shape as example.As shown in Figure 4, in Fig. 4, hexagonal part and marginal area are non- Pipeline portions 24, around hexagon each described and the structure that is interconnected is described Super-conductive conduit road 23.Need explanation , owing to described Super-conductive conduit road 23 is prepared from by blowing-up technology, so in the mistake forming described Super-conductive conduit road 23 It is formed with technique mouth 25 on Cheng Zhong, described first sheet material 21 or described second sheet material 22, i.e. fills working medium mouth.Described technique mouth 25 After the shape on described Super-conductive conduit road 23 preliminarily forms, described technique mouth 25 is sealed by welding manner, described to realize Super-conductive conduit road 23 does not turns on the external world.

As example, please continue to refer to Fig. 4, described non-pipeline portions 24 is inserted in described groove Part II 122;Close The part described Super-conductive conduit road 23 inserting limit 23 of described phase transformation suppression heat transfer plate is positioned at described groove Part I 121, The described Super-conductive conduit road 23 being positioned at described groove Part I 121 includes the first sub-pipeline of straight flange 231 and the second straight flange pipe Road 232, described first straight flange pipeline 231 length direction and described phase transformation suppress the length direction one inserting limit 28 of heat transfer plate Causing, the described second sub-pipeline of straight flange 232 is vertical with the described first sub-pipeline of straight flange 231 to be connected.Will be located in described groove first The described Super-conductive conduit road 23 in 121 is divided to be set to include the first sub-pipeline of straight flange 231 and the structure of the sub-pipeline of the second straight flange 232, That is the described Super-conductive conduit road 23 that will be located in described groove Part I 121 is set to straightsided shape, such design makes institute Stating phase transformation suppression heat transfer plate 2 to coordinate with described radiator base plate 1 and facilitate, technique easily realizes so that described groove 12 and Described bulge-structure 26 is combined closely, pressing the latter two associativity, heat conductivity relatively good, and mechanical strength is higher.

As example, described heat-transfer working medium 27 is fluid, it is preferable that described heat-transfer working medium 27 be gas, liquid or gas with The mixture of liquid, it is further preferable that in the present embodiment, described heat-transfer working medium 27 is the mixture of liquid and gas.

As example, the material of described phase transformation suppression heat transfer plate 2 should be the material that heat conductivity is good;Preferably, in the present embodiment, The material of described phase transformation suppression heat transfer plate 2 can be copper, copper alloy, aluminum or aluminum alloy or the combination in any more than any one.Institute The material of the material and described radiator base plate 1 of stating phase transformation suppression heat transfer plate 2 can be identical, it is also possible to different;Preferably, originally In embodiment, the material of described phase transformation suppression heat transfer plate 2 is identical with the material of described radiator base plate 1.

As example, between described phase transformation suppression heat transfer plate 2 and described boss 11, it is filled with heat-conducting glue 3.

As example, described radiator base plate 1 and described phase transformation suppression heat transfer plate 2 by process for pressing, heat-conducting glue bonding process, Friction stir welding, Welding technique, pressing weld combined process with heat-conducting glue adhesive bond technique, pressing with agitating friction Or pressing is fixed together with Welding combined process.

As example, described radiator base plate 1 inserts being smaller in size than of limit 28 length direction along described phase transformation suppression heat transfer plate 2 Or the length inserting limit 28 equal to described phase transformation suppression heat transfer plate 2.

As example, on described phase transformation suppression heat transfer plate 2, the region between Super-conductive conduit road 23 is provided with air vent (not shown), To strengthen heat radiation.

It should be noted that only with one described boss 11 of surface formation of described radiator base plate 1, described radiator in Fig. 2 The described boss 11 of substrate 1 is inserted into a described phase transformation suppression heat transfer plate 2 as example, the surface of described radiator base plate 1 When forming multiple described boss 11, the quantity of described phase transformation suppression heat transfer plate 2 is identical with the quantity of described boss 11, the most each All it is inserted with described phase transformation suppression heat transfer plate 2 in described boss 11, described radiator base plate 1 surface is not formed by accompanying drawing Multiple described boss 11, the scheme being all inserted with described phase transformation suppression heat transfer plate 2 in multiple described boss 11 is shown.

In the present embodiment, by boss 11 described in described radiator base plate 1 surface configuration, and arrange in described boss 11 Having the groove 12 of different in width, after described phase transformation suppression heat transfer plate 2 inserts in described groove 12, non-pipeline portions 24 is positioned at The part of groove 12 narrower width, described Super-conductive conduit road 23 is positioned at the part that groove width is wider, and suppresses in described phase transformation Fill described heat-conducting glue 3 between heat transfer plate 2 and described radiator base plate 1, substantially reduce described phase transformation suppression heat transfer plate 2 with Thermal resistance between described radiator base plate 1, improves the heat dispersion of fin-inserted radiator;Phase transformation suppression heat transfer plate is used to replace Conventional heat sink of the prior art so that the fin-inserted radiator heat conduction of the present invention is fast, fin efficiency is high (up to more than 90%), Fin efficiency changes little with the height of phase transformation suppression heat transfer plate, the height of phase transformation suppression heat transfer plate is unrestricted;The present invention Fin-inserted radiator easily manufactured flexibly, low cost, heat-sinking capability is big, lightweight, volume is little, alternative heat-pipe radiator With part water-filled radiator, it is especially suitable for the dissipation from electronic devices demand of high-power high heat flux, there is wide market prospect With huge economic worth.

Embodiment three

Referring to Fig. 5, the present invention also provides for the preparation method of a kind of fin-inserted radiator, and described preparation method includes:

S1: provide just like the radiator base plate described in embodiment one, and in described groove, fill heat-conducting glue;

S2: use blowing-up technology prepare phase transformation suppression heat transfer plate, described phase transformation suppression heat transfer plate in be formed have given shape and The Super-conductive conduit road being interconnected, described Super-conductive conduit road is closing pipe line, is filled with heat-transfer working medium in described Super-conductive conduit road;

S3: by inserting in described groove of described phase transformation suppression heat transfer plate, and by process for pressing, heat-conducting glue bonding process, Friction stir welding, Welding technique, pressing weld combined process with heat-conducting glue adhesive bond technique, pressing with agitating friction Or pressing is connected fixing with described radiator base plate for described phase transformation suppression heat transfer plate with Welding combined process.

Perform step S1, refer to the S1 step in Fig. 5, it is provided that just like the radiator base plate described in embodiment one, and Heat-conducting glue is filled in described groove.

As example, the concrete structure of described radiator base plate refers to embodiment one, is not repeated herein.

Perform step S2: refer to the S2 step in Fig. 5, use blowing-up technology to prepare phase transformation suppression heat transfer plate, described phase transformation Being formed with, in suppression heat transfer plate, the Super-conductive conduit road having given shape and being interconnected, described Super-conductive conduit road is closing pipe line, It is filled with heat-transfer working medium in described Super-conductive conduit road.

As example, blowing-up technology is used to prepare described phase transformation suppression heat transfer plate method particularly includes:

S21: the first sheet material and the second sheet material two boards material altogether is provided, by described first sheet material and described one hacking of second sheet material also Blow clean;

S22: use graphite print process to form the effigurate graphite of the tool being interconnected on the hacking face of sheet material described at least one Circuit, described graphite circuit defines the shape on described Super-conductive conduit road;

S23: is fitted in the hacking face of described first sheet material and described second sheet material and the alignment of three limits, edgewise riveted;

S24: described first sheet material riveted together and described second sheet material are heated to uniform temperature and maintain a period of time laggard Row hot rolling is to form composite board;

S25: described composite board is carried out soft annealing, is cooled to after room temperature at described first sheet material and described second sheet material pair Fabrication hole is bored to graphite linings in the position answering graphite circuit;

S26: be filled with high-pressure fluid in described composite board through described fabrication hole and expand to described composite board, in described composite plate While material is internally formed described Super-conductive conduit road, formed and described Super-conductive conduit road phase at least one surface of described composite board Corresponding described bulge-structure;

S27: inject heat-transfer working medium in described Super-conductive conduit road through described fabrication hole, and seal described fabrication hole.

As example, described Super-conductive conduit road be shaped as hexagonal honeycomb shape, crisscross netted, head and the tail series connection multiple Combination in any more than U-shaped, rhombus, triangle, annular or any of which.

As example, the edge of described phase transformation suppression heat transfer plate is non-pipeline portions, and described non-pipeline portions is inserted into described groove In Part II;It is positioned at described groove first near the part described Super-conductive conduit road inserting limit of described phase transformation suppression heat transfer plate In point, the described Super-conductive conduit road being positioned at described groove Part I includes the first sub-pipeline of straight flange and the sub-pipeline of the second straight flange, The length direction inserting limit of described first straight flange length of pipe direction and described phase transformation suppression heat transfer plate is consistent, described second straight The sub-pipeline in limit is vertical with the described first sub-pipeline of straight flange to be connected.

Perform step S3, refer to the S3 step in Fig. 5, in described phase transformation is suppressed the described groove of insertion of heat transfer plate, And by process for pressing, heat-conducting glue bonding process, Friction stir welding, Welding technique, pressing and heat-conducting glue bonding knot Close technique, described phase transformation is suppressed heat transfer plate and institute with agitating friction weldering combined process or pressing with Welding combined process by pressing State the fixing connection of radiator base plate.

As example, use process for pressing that with described radiator base plate, described phase transformation suppression heat transfer plate is fixed the concrete grammar being connected Position: after in the described groove of insertion of described phase transformation suppression heat transfer plate, apply external force in the both sides of described boss, make described phase Becoming suppression heat transfer plate and described radiator base plate close-fitting, described heat-conducting glue fills up described phase transformation suppression heat transfer plate and described radiator base Space between plate.

In sum, the present invention provides a kind of radiator base plate, fin-inserted radiator and preparation method thereof, described radiator base plate Surface is formed with boss, is provided with groove in described boss, described groove include Part I and be positioned at below described Part I and The Part II being connected with described Part I, the width of described groove Part I is more than the width of described groove Part II. By at radiator base plate surface configuration boss, and arranging the groove with different in width in boss, phase transformation suppression heat transfer plate is inserted After entering in described groove, non-pipeline portions is positioned at the part that groove width is narrower, and Super-conductive conduit road is positioned at the portion that groove width is wider Point, and fill heat-conducting glue between phase transformation suppression heat transfer plate and radiator base plate, substantially reduce phase transformation suppression heat transfer plate and heat radiation Thermal resistance between device substrate, improves the heat dispersion of fin-inserted radiator;Phase transformation suppression heat transfer plate is used to replace in prior art Conventional heat sink so that the fin-inserted radiator heat conduction of the present invention is fast, fin efficiency is high (up to more than 90%), fin effect Rate changes little with the height of phase transformation suppression heat transfer plate, the height of phase transformation suppression heat transfer plate is unrestricted;The inserted sheet of the present invention Formula radiator is easily manufactured flexibly, low cost, and heat-sinking capability is big, lightweight, volume is little, alternative heat-pipe radiator and part Water-filled radiator, is especially suitable for the dissipation from electronic devices demand of high-power high heat flux, has wide market prospect and huge Economic worth.

The principle of above-described embodiment only illustrative present invention and effect thereof, not for limiting the present invention.Any it is familiar with this skill Above-described embodiment all can be modified under the spirit and the scope of the present invention or change by the personage of art.Therefore, such as All that in art, tool usually intellectual is completed under without departing from disclosed spirit and technological thought etc. Effect is modified or changes, and must be contained by the claim of the present invention.

Claims (19)

1. a radiator base plate, it is characterized in that, described radiator base plate surface is formed with boss, it is provided with groove in described boss, described groove includes Part I and is positioned at the Part II being connected below described Part I and with described Part I, and the width of described groove Part I is more than the width of described groove Part II.
Radiator base plate the most according to claim 1, it is characterised in that: the length direction of described boss is consistent with the length direction of described radiator base plate, and the length of described boss is less than or equal to the length of described radiator base plate.
Radiator base plate the most according to claim 1, it is characterised in that: the length direction of described groove is consistent with the length direction of described boss, and the length of described groove is equal to the length of described boss.
Radiator base plate the most according to claim 1, it is characterised in that: the sidewall of described groove and the perpendicular of described radiator base plate.
Radiator base plate the most according to claim 1, it is characterised in that: described boss is integrated with described radiator base plate.
Radiator base plate the most according to claim 1, it is characterised in that: described groove Part II extends to inside described radiator base plate.
Radiator base plate the most according to claim 1, it is characterised in that: the quantity of described boss is multiple, and multiple described boss are distributed in parallel interval on described radiator base plate or are distributed radially.
8. a fin-inserted radiator, it is characterised in that described fin-inserted radiator includes:
Radiator base plate as according to any one of claim 1 to 7;
Phase transformation suppression heat transfer plate, described phase transformation suppression heat transfer plate is to insert limit, and described phase transformation suppression heat transfer plate is inserted in described groove by described insertion limit;Being formed with the Super-conductive conduit road with given shape in described phase transformation suppression heat transfer plate, described Super-conductive conduit road is closing pipe line, is filled with heat-transfer working medium in described Super-conductive conduit road;
The degree of depth of described groove is more than the distance inserted between limit to the described Super-conductive conduit road the most adjacent with it of described phase transformation suppression heat transfer plate.
Fin-inserted radiator the most according to claim 8, it is characterised in that: described phase transformation suppression heat transfer plate is composite board type structure, and described phase transformation suppression heat transfer plate is one side bulging state, two-sided bulging state or two-sided flat form.
Fin-inserted radiator the most according to claim 8, it is characterised in that: the combination in any being shaped as more than hexagonal honeycomb shape, crisscross multiple U-shapeds, rhombus, triangle, annular or any of which netted, series connection from beginning to end on described Super-conductive conduit road.
11. fin-inserted radiators according to claim 8, it is characterised in that: the edge of described phase transformation suppression heat transfer plate is non-pipeline portions, and described non-pipeline portions is inserted in described groove Part II;It is positioned at described groove Part I near the part described Super-conductive conduit road inserting limit of described phase transformation suppression heat transfer plate, the described Super-conductive conduit road being positioned at described groove Part I includes the first sub-pipeline of straight flange and the sub-pipeline of the second straight flange, described first straight flange length of pipe direction is consistent with the length direction inserting limit of described phase transformation suppression heat transfer plate, and the described second sub-pipeline of straight flange is vertical with the described first sub-pipeline of straight flange to be connected.
12. fin-inserted radiators according to claim 8, it is characterised in that: it is filled with heat-conducting glue between described phase transformation suppression heat transfer plate and described boss.
13. fin-inserted radiators according to claim 8, it is characterised in that: described radiator base plate is fixed together with Welding combined process with agitating friction weldering combined process or pressing with heat-conducting glue adhesive bond technique, pressing by process for pressing, heat-conducting glue bonding process, Friction stir welding, Welding technique, pressing with described phase transformation suppression heat transfer plate.
14. fin-inserted radiators according to claim 8, it is characterised in that: described radiator base plate is along the length inserting limit being smaller in size than or suppressing equal to described phase transformation heat transfer plate in the insertion edge lengths direction of described phase transformation suppression heat transfer plate.
15. fin-inserted radiators according to claim 8, it is characterised in that: on described phase transformation suppression heat transfer plate, the region between Super-conductive conduit road is provided with air vent.
The preparation method of 16. 1 kinds of fin-inserted radiators, it is characterised in that described preparation method includes:
There is provided just like the radiator base plate according to any one of claim 1 to 7, and in described groove, fill heat-conducting glue;
Using blowing-up technology to prepare phase transformation suppression heat transfer plate, be formed with, in described phase transformation suppression heat transfer plate, the Super-conductive conduit road having given shape and being interconnected, described Super-conductive conduit road is closing pipe line, is filled with heat-transfer working medium in described Super-conductive conduit road;
By described phase transformation suppression heat transfer plate while inserting in described groove, and suppress heat transfer plate and described radiator base plate fix described phase transformation with agitating friction weldering combined process or pressing with Welding combined process with heat-conducting glue adhesive bond technique, pressing by process for pressing, heat-conducting glue bonding process, Friction stir welding, Welding technique, pressing to be connected.
The preparation method of 17. fin-inserted radiators according to claim 16, it is characterised in that: use blowing-up technology to prepare described phase transformation suppression heat transfer plate method particularly includes:
There is provided the first sheet material and the second sheet material two boards material altogether, by described first sheet material and described one hacking of second sheet material and blow clean;
Using graphite print process to form the tool being interconnected effigurate graphite circuit on the hacking face of sheet material described at least one, described graphite circuit defines the shape on described Super-conductive conduit road;
Is fitted in the hacking face of described first sheet material and described second sheet material and the alignment of three limits, edgewise riveted;
Hot rolling is carried out to form composite board after described first sheet material riveted together and described second sheet material are heated to uniform temperature and maintain a period of time;
Described composite board is carried out soft annealing, bores fabrication hole after being cooled to room temperature in the position of described first sheet material and described second sheet material correspondence graphite circuit to graphite linings;
In described composite board, it is filled with high-pressure fluid through described fabrication hole to expand to described composite board, while described composite board is internally formed described Super-conductive conduit road, form the described bulge-structure corresponding with described Super-conductive conduit road at least one surface of described composite board;
In described Super-conductive conduit road, inject heat-transfer working medium through described fabrication hole, and seal described fabrication hole.
18. according to the preparation method of the fin-inserted radiator described in claim 16 or 17, it is characterised in that: the combination in any more than multiple U-shapeds, rhombus, triangle, annular or any of which that are shaped as hexagonal honeycomb shape, crisscross netted, head and the tail series connection on described Super-conductive conduit road.
The preparation method of 19. fin-inserted radiators according to claim 16, it is characterised in that: the edge of described phase transformation suppression heat transfer plate is non-pipeline portions, and described non-pipeline portions is inserted in described groove Part II;It is positioned at described groove Part I near the part described Super-conductive conduit road inserting limit of described phase transformation suppression heat transfer plate, the described Super-conductive conduit road being positioned at described groove Part I includes the first sub-pipeline of straight flange and the sub-pipeline of the second straight flange, described first straight flange length of pipe direction is consistent with the length direction inserting limit of described phase transformation suppression heat transfer plate, and the described second sub-pipeline of straight flange is vertical with the described first sub-pipeline of straight flange to be connected.
CN201610403268.9A 2016-06-07 2016-06-07 Heat radiator base plate, inserting-piece type heat radiator and preparation method thereof CN105870084A (en)

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Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN101425744A (en) * 2008-10-24 2009-05-06 上海新时达电气股份有限公司;上海辛格林纳新时达电机有限公司 Curved surface fin insertion type heat radiator for frequency transformer
US20090145580A1 (en) * 2007-12-10 2009-06-11 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat sink and a method of manufacturing the heat sink
KR20110024121A (en) * 2009-09-01 2011-03-09 김경식 A led module having panel structure of protection against heat
WO2015008326A1 (en) * 2013-07-16 2015-01-22 三協立山株式会社 Heat sink and method for manufacturing heat sink
CN105101751A (en) * 2015-07-03 2015-11-25 浙江嘉熙光电设备制造有限公司 Thermal superconductive gilled radiator and manufacturing method therefor

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20090145580A1 (en) * 2007-12-10 2009-06-11 Hong Fu Jin Precision Industry (Shenzhen) Co., Ltd. Heat sink and a method of manufacturing the heat sink
CN101425744A (en) * 2008-10-24 2009-05-06 上海新时达电气股份有限公司;上海辛格林纳新时达电机有限公司 Curved surface fin insertion type heat radiator for frequency transformer
KR20110024121A (en) * 2009-09-01 2011-03-09 김경식 A led module having panel structure of protection against heat
WO2015008326A1 (en) * 2013-07-16 2015-01-22 三協立山株式会社 Heat sink and method for manufacturing heat sink
CN105101751A (en) * 2015-07-03 2015-11-25 浙江嘉熙光电设备制造有限公司 Thermal superconductive gilled radiator and manufacturing method therefor

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