TWI426859B - Heat dissipation module, flat heat column thereof and manufacturing method for flat heat column - Google Patents
Heat dissipation module, flat heat column thereof and manufacturing method for flat heat column Download PDFInfo
- Publication number
- TWI426859B TWI426859B TW097132974A TW97132974A TWI426859B TW I426859 B TWI426859 B TW I426859B TW 097132974 A TW097132974 A TW 097132974A TW 97132974 A TW97132974 A TW 97132974A TW I426859 B TWI426859 B TW I426859B
- Authority
- TW
- Taiwan
- Prior art keywords
- capillary structure
- temperature equalizing
- flat hollow
- equalizing element
- hollow tube
- Prior art date
Links
Classifications
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F1/00—Tubular elements; Assemblies of tubular elements
- F28F1/02—Tubular elements of cross-section which is non-circular
- F28F1/022—Tubular elements of cross-section which is non-circular with multiple channels
-
- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2225/00—Reinforcing means
- F28F2225/04—Reinforcing means for conduits
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
- Y10T—TECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
- Y10T29/00—Metal working
- Y10T29/49—Method of mechanical manufacture
- Y10T29/4935—Heat exchanger or boiler making
- Y10T29/49353—Heat pipe device making
Description
本發明係關於一種散熱模組,特別是一種具有毛細結構的導流元件設置於中空腔體內部之散熱模組。The invention relates to a heat dissipation module, in particular to a heat dissipation module with a capillary structure and a flow guiding element disposed inside the hollow body.
隨著科技發達,電子元件單位面積上的電晶體數量越來越多,造成其使用時發熱量的增加。而由於熱管(heat pipe)是一種簡單卻極有效的散熱裝置,因此已被廣泛地應用於各種電子散熱產品的需要上。其工作原理是藉由工作流體氣、液兩相間相變化的潛熱來傳遞能量,在蒸發段(vaporization section),工作流體藉蒸發潛熱自熱源帶走大量熱能並在冷凝段(condensation section)凝結成液體並釋放熱能,而工作流體靠毛細結構(wick)提供的毛細力流回至蒸發段再進行相變化的循環,持續地將熱能從熱源傳輸至遠處散出。With the development of technology, the number of transistors per unit area of electronic components is increasing, causing an increase in the amount of heat generated during use. Since the heat pipe is a simple but extremely effective heat sink, it has been widely used in various electronic heat sink products. The working principle is to transfer energy by the latent heat of the phase change between the working fluid gas and the liquid phase. In the evaporation section, the working fluid takes a large amount of heat energy from the heat source by the latent heat of evaporation and condenses in the condensation section. The liquid releases heat, and the working fluid flows back to the evaporation section by the capillary force provided by the wick to perform a phase change cycle, continuously transferring the heat energy from the heat source to the distant place.
均溫板屬於熱管的一種,由於傳統上的均溫板主要是利用上下兩平板焊接在一起,不僅焊接路徑長且焊接可靠度低,更導致上下板的毛細結構無法連續,只能靠接觸的方式加以連通,造成工作流體通過時毛細力下降使回流速度受到阻礙而影響導熱效率。The temperature equalizing plate is a kind of heat pipe. Since the traditional temperature equalizing plate is mainly welded by the upper and lower plates, not only the welding path is long, but the welding reliability is low, and the capillary structure of the upper and lower plates cannot be continuous, and the contact can only be achieved. The way to connect, causing the capillary force to drop when the working fluid passes, hinders the reflow speed and affects the heat transfer efficiency.
此外,傳統上將上下平板加以焊接的方法,亦因零件多及模治具技術程度高,使得成本相對較為高昂,並因其幾何形狀限制,需個別燒結該上下板的毛細結構,而無法以單一步驟同時完成。再者,隨著不同長度均溫 板的需求,亦需相對應使用不同的成形模具與相關治工具,造成設備成本大幅增加。In addition, the traditional method of welding the upper and lower plates is also costly due to the high number of parts and the high degree of mold fixture technology. Due to the limitation of geometry, the capillary structure of the upper and lower plates needs to be individually sintered. A single step is done at the same time. Furthermore, with different lengths of uniform temperature The demand for the board also requires the use of different forming dies and related tools, resulting in a significant increase in equipment costs.
有鑑於上述課題,本發明之目的係提出一種可靠度增加,成本低廉且熱傳效率佳的均溫元件及其製造方法。In view of the above problems, an object of the present invention is to provide a temperature equalizing element which is improved in reliability, low in cost, and excellent in heat transfer efficiency, and a method of manufacturing the same.
為達到上述的目的,本發明提出一種均溫元件之製造方法,包括以下步驟:提供一平板式中空管體,其內壁表面佈滿有連續之一第一毛細結構;提供至少一導流元件,置於該平板式中空管體內且該導流元件表面具有一第二毛細結構;連接該第一毛細結構及該第二毛細結構而形成一連續式毛細結構;以及充填一工作流體並將該平板式中空管體之二端部密封。In order to achieve the above object, the present invention provides a method for manufacturing a temperature equalizing element, comprising the steps of: providing a flat hollow tube body having an inner wall surface covered with a continuous first capillary structure; providing at least one flow guiding An element disposed in the flat hollow tube body and having a second capillary structure on the surface of the flow guiding element; connecting the first capillary structure and the second capillary structure to form a continuous capillary structure; and filling a working fluid and The two ends of the flat hollow tube are sealed.
為達到上述的目的,本發明提出一種均溫元件,其包括一平板式中空管體,其管體為一體成形,且於內壁表面佈滿有一連續之第一毛細結構;至少一導流元件,設置於該平板式中空管體內且該導流元件表面具有一第二毛細結構;以及一工作流體,設置於密封後之該平板式中空管體內部;其中,該第一毛細結構與該第二毛細結構係形成一連續式毛細結構。In order to achieve the above object, the present invention provides a temperature equalizing element comprising a flat hollow tube body, the tube body being integrally formed, and having a continuous first capillary structure on the inner wall surface; at least one diversion flow An element disposed in the flat hollow tube body and having a second capillary structure on the surface of the flow guiding element; and a working fluid disposed inside the sealed flat hollow tube body; wherein the first capillary structure Forming a continuous capillary structure with the second capillary structure.
為達到上述的目的,本發明提出一種散熱模組In order to achieve the above object, the present invention provides a heat dissipation module
依本發明之均溫元件之製造方法,可以一體成型方式取代傳統之上下板方式,不僅焊道路徑較少導致可靠度增加,且可在任意位置設置導流元件並可與冷凝端及蒸發端的毛細結構形成連續式的毛細結構,幫助工作流體 自冷凝端藉由此導流元件回流至蒸發端過程中的毛細力不會間斷,因而加快工作流體的循環流動,進而達到有效增加散熱效率,相較習知具有一毛細結構不連續區的均溫板,依本發明之均溫元件之結構與製造方法,可提供一更佳之毛細結構使工作流體能快速循環而增加熱傳效率。According to the manufacturing method of the temperature equalizing element of the present invention, the conventional upper and lower plate method can be replaced by the integral molding method, and not only the bead path is less, the reliability is increased, and the flow guiding element can be disposed at any position and can be combined with the condensation end and the evaporation end. The capillary structure forms a continuous capillary structure that helps the working fluid The capillary force from the condensation end to the evaporation end by the flow guiding element is not interrupted, thereby accelerating the circulating flow of the working fluid, thereby effectively increasing the heat dissipation efficiency, compared with the conventionally having a discontinuous area of capillary structure. The warm plate, according to the structure and manufacturing method of the temperature equalizing element of the invention, can provide a better capillary structure to enable the working fluid to circulate rapidly and increase the heat transfer efficiency.
並且,本發明之均溫元件之製造方法,係利用管材沖壓形成均溫板的外壁,不需複雜成形或成本昂貴的材料,並可依不同使用者之個別需求,調整該均溫元件之長度,且模具便宜又可共用,可達到簡化製程步驟之優點,整體而言,本發明之均溫元件之製造方法,具有幾何形狀變化容易,且成本便宜等優點。Moreover, the method for manufacturing the temperature equalizing element of the present invention is to form the outer wall of the temperature equalizing plate by pipe stamping, without complicated forming or expensive materials, and can adjust the length of the temperature equalizing element according to individual needs of different users. Moreover, the mold is cheap and can be shared, and the advantages of the process steps can be simplified. Overall, the method for manufacturing the temperature-sensing element of the present invention has the advantages of easy geometric change and low cost.
為讓本發明之上述和其他目的、特徵、和優點能更明顯易懂,下文特舉一較佳實施例,並配合所附圖式,作詳細說明如下:The above and other objects, features, and advantages of the present invention will become more apparent and understood.
以下將詳細說明本發明均溫元件之製造方法,請同時參照第1A圖與第1B圖,第1A圖與第1B圖係依據本發明之二種均溫元件之製程圖。首先,提供一平板式中空管體2,例如是以一圓形管材1經由沖壓方式而形成該平板式中空管體2,該平板式中空管體2之截面形狀係為多邊形、長橢圓形或長圓弧形,而該管體之材質例如是鋁、銅、鈦、鉬或其他具高熱傳導係數之金屬。在此,必須注意的是,平板式中空管體2除了是以圓管1 經由沖壓方式而形成之外,亦可利用沖壓方式而直接製成該平板式中空管體2。Hereinafter, the manufacturing method of the temperature equalizing element of the present invention will be described in detail. Please refer to FIG. 1A and FIG. 1B simultaneously. FIGS. 1A and 1B are process diagrams of two kinds of temperature equalizing elements according to the present invention. First, a flat hollow tubular body 2 is provided. For example, the flat hollow tubular body 2 is formed by pressing a circular tubular material 1. The cross-sectional shape of the flat hollow tubular body 2 is polygonal and long. The shape of the tube is, for example, aluminum, copper, titanium, molybdenum or other metal having a high thermal conductivity. Here, it must be noted that the flat hollow body 2 is in addition to the round tube 1 The flat-type hollow tubular body 2 can be directly formed by a press method in addition to being formed by a press method.
該平板式中空管體2內部採用燒結方法,形成連續之一第一毛細結構4佈滿於該平板式中空管體2之內壁,其中該第一毛細結構4係為金屬彈簧狀、溝槽狀、柱狀、網狀或以金屬粉粒成型之多孔質結構。接著,依據實際產品的需求,可於平板式中空管體2之一面以沖壓方式再形成一凸台3(如第1B圖所示),且具有此凸台3之面即為均溫元件的底面,用以與熱源接觸。或者,該平板式中空管體也可不設置該凸台3,而直接與熱源接觸,如第1A圖所示。The inside of the flat hollow tubular body 2 is sintered, and one continuous first capillary structure 4 is formed on the inner wall of the flat hollow tubular body 2, wherein the first capillary structure 4 is a metal spring shape. A grooved, columnar, mesh or porous structure formed of metal powder. Then, according to the requirements of the actual product, a boss 3 can be formed on one side of the flat hollow tube body 2 by stamping (as shown in FIG. 1B), and the surface of the boss 3 is a temperature equalizing element. The bottom surface is used to contact the heat source. Alternatively, the flat hollow body may be provided without contacting the boss 3 as shown in FIG. 1A.
接著,提供至少一導流元件5,利用燒結方法於其表面形成有一第二毛細結構6,再將燒結好之導流元件5置於該平板式中空管體2內,進行第二次燒結使第一毛細結構4與導流元件5上的第二毛細結構6連結而形成一連續式毛細結構;之後,於平板式管體側壁插入注水管7,再將平板式中空管體2之兩端及注水管7與平板式中空管體2接合處予以密封,該密封之方法係以焊接、熔接或類似機械加工方式密封。密封後並自注水管7充填一工作流體於平板式中空管體2內,工作流體例如是無機化合物、水、烷類、醇類、液態金屬、酮類、冷煤或有機化合物。最後,自注水管7將平板式中空管體7抽真空以去除非凝結性氣體(NCG),並加以密封注水管7,如此即可完成本發明均溫元件11A、11B之製作。Next, at least one flow guiding member 5 is provided, a second capillary structure 6 is formed on the surface thereof by a sintering method, and the sintered flow guiding member 5 is placed in the flat hollow tubular body 2 for the second sintering. The first capillary structure 4 is coupled with the second capillary structure 6 on the flow guiding element 5 to form a continuous capillary structure; after that, the water injection pipe 7 is inserted into the side wall of the flat pipe body, and then the flat hollow pipe body 2 is The ends and the water injection pipe 7 are sealed at the joint of the flat hollow pipe body 2, and the sealing method is sealed by welding, welding or the like. After sealing, a working fluid is filled in the flat hollow tubular body 2 from the water injection pipe 7, and the working fluid is, for example, an inorganic compound, water, an alkane, an alcohol, a liquid metal, a ketone, a cold coal or an organic compound. Finally, the flat-type hollow pipe body 7 is evacuated from the water injection pipe 7 to remove non-condensable gas (NCG), and the water injection pipe 7 is sealed, so that the production of the temperature equalizing elements 11A, 11B of the present invention can be completed.
第2圖係第1A圖中將均溫元件倒置後之A-A’剖面 示意圖。各實施例中相同或相當之元件係標示同一符號。請同時參照第1A圖與第2圖,均溫元件11A包括一平板式中空管體2,至少一導流元件5以及一工作流體W。平板式中空管體2之管體為一體成形,且於內壁表面佈滿有一連續之第一毛細結構4。導流元件5設置於平板式中空管體2內且導流元件5表面具有一第二毛細結構6。工作流體W設置於密封後之平板式中空管體2內部。其中,第一毛細結構4與第二毛細結構6係形成一連續式毛細結構。導流元件5除了可上下支撐均溫元件11A之兩平板之外,更可提昇工作流體W之回流速率,而提高散熱效率。凡標號相同之元件,其餘特徵或詳細敘述已於前詳加描述,故在此不再贅述。Figure 2 is an A-A' section of the first temperature diagram in which the temperature equalizing element is inverted. schematic diagram. The same or equivalent elements in the various embodiments are denoted by the same reference numerals. Referring to FIGS. 1A and 2 simultaneously, the temperature equalizing element 11A includes a flat hollow body 2, at least one flow guiding element 5, and a working fluid W. The tubular body of the flat hollow tubular body 2 is integrally formed, and a continuous first capillary structure 4 is covered on the inner wall surface. The flow guiding element 5 is disposed in the flat hollow tubular body 2 and has a second capillary structure 6 on the surface of the flow guiding element 5. The working fluid W is disposed inside the sealed flat hollow body 2 . Wherein, the first capillary structure 4 and the second capillary structure 6 form a continuous capillary structure. In addition to supporting the two flat plates of the temperature equalizing element 11A up and down, the flow guiding element 5 can increase the reflow rate of the working fluid W and improve the heat dissipation efficiency. For the components with the same reference numerals, the remaining features or detailed descriptions have been described in detail above, and therefore will not be further described herein.
在此必須特別說明的是,導流元件5可為一實心柱體,且第二毛細結構係披覆在該實心柱體之表面,如第1A圖中所示。或者,導流元件5與第二毛細結構6可為相同材質一體成型,例如是一金屬彈簧狀、網狀或以金屬粉粒成型之多孔質結構,如第2圖中所示。It must be particularly noted here that the flow guiding element 5 can be a solid cylinder and the second capillary structure is coated on the surface of the solid cylinder, as shown in FIG. 1A. Alternatively, the flow guiding member 5 and the second capillary structure 6 may be integrally formed of the same material, for example, a metal spring shape, a mesh shape, or a porous structure formed of metal powder particles, as shown in FIG.
第3圖係第1B圖中將均溫元件倒置後之B-B’剖面示意圖。第4圖係第1B圖中將均溫元件之倒置後之C-C’剖面示意圖。各實施例中相同或相當之元件係標示同一符號。請同時參照第1B圖、第3圖與第4圖,均溫元件11B包括一平板式中空管體2,至少一導流元件5以及一工作流體W。平板式中空管體2,具有至少一凸台3,且平板式中空管體2為一體成形,且於內壁表面佈滿有一連續之第一毛細結構4。導流元件5設置於平板式 中空管體2內且導流元件5表面具有一第二毛細結構6。工作流體W設置於密封後之平板式中空管體2內部。其中,第一毛細結構4與第二毛細結構6係形成一連續式毛細結構。導流元件5除了可上下支撐均溫元件11B之兩平板之外,更可提昇工作流體W之回流速率,而提高散熱效率。凡標號相同之元件,其餘特徵或詳細敘述已於前詳加描述,故在此不再贅述。Fig. 3 is a schematic cross-sectional view of the B-B' after the temperature equalizing element is inverted in Fig. 1B. Fig. 4 is a schematic cross-sectional view showing the C-C' of the inverted temperature element in Fig. 1B. The same or equivalent elements in the various embodiments are denoted by the same reference numerals. Referring to FIG. 1B, FIG. 3 and FIG. 4 simultaneously, the temperature equalizing element 11B includes a flat hollow body 2, at least one flow guiding element 5, and a working fluid W. The flat hollow tube body 2 has at least one boss 3, and the flat hollow tube body 2 is integrally formed, and a continuous first capillary structure 4 is covered on the inner wall surface. The flow guiding element 5 is arranged on the flat plate The hollow tube body 2 has a second capillary structure 6 on the surface of the flow guiding element 5. The working fluid W is disposed inside the sealed flat hollow body 2 . Wherein, the first capillary structure 4 and the second capillary structure 6 form a continuous capillary structure. In addition to supporting the two flat plates of the temperature equalizing element 11B up and down, the flow guiding element 5 can increase the reflow rate of the working fluid W and improve the heat dissipation efficiency. For the components with the same reference numerals, the remaining features or detailed descriptions have been described in detail above, and therefore will not be further described herein.
在此必須特別說明的是,導流元件5可為一實心柱體,且第二毛細結構係披覆在該實心柱體之表面,如第1B圖中所示。或者,導流元件5與第二毛細結構6可為相同材質一體成型,例如是一金屬彈簧狀、網狀或以金屬粉粒成型之多孔質結構,如第3圖與第4圖中所示。另外,請參照第4圖,於平板式中空管體2之兩端封邊處13的內側可更包括至少一支撐件24(例如是一高導熱棒材或是由銅粉燒結而成的支撐件),使平板式中空管體2在兩端部密封時能保持平整。It must be particularly noted here that the flow guiding element 5 can be a solid cylinder and the second capillary structure is coated on the surface of the solid cylinder, as shown in FIG. 1B. Alternatively, the flow guiding element 5 and the second capillary structure 6 may be integrally formed of the same material, for example, a metal spring shape, a mesh shape or a porous structure formed of metal powder particles, as shown in FIGS. 3 and 4 . In addition, referring to FIG. 4, the inner side of the edge seal 13 of the flat hollow tubular body 2 may further include at least one support member 24 (for example, a high thermal conductive bar or sintered from copper powder). The support member) enables the flat hollow tubular body 2 to be kept flat when sealed at both ends.
再請參閱第5A及5C圖。如第5A圖所示,該散熱模組10包含有一散熱鰭片40、一均溫元件11以及一固定板50,該均溫元件11係以第1B圖中之均溫元件11B為例。該固定板50,包括有一底板51、至少二側板52及至少二連接板53,該底板51與該些側板52形成有一容置空間55,用以容置該均溫元件11,且該固定板50之底板51具有一開孔54,係用以容置該凸台3,如第6B圖所示;或該開孔54可容納部份均溫元件11及凸台22,如第6C圖所示。該散熱鰭片40,係連接於該均溫 元件11之凸台22的相對側,並與該連接板53固接,使該均溫元件受散熱鰭片與固定板之挾持而穩固。Please refer to Figures 5A and 5C again. As shown in FIG. 5A, the heat dissipation module 10 includes a heat dissipation fin 40, a temperature equalizing element 11 and a fixing plate 50. The temperature equalizing element 11 is exemplified by the temperature equalizing element 11B in FIG. The fixing plate 50 includes a bottom plate 51, at least two side plates 52, and at least two connecting plates 53. The bottom plate 51 and the side plates 52 form an accommodating space 55 for accommodating the temperature grading component 11 and the fixing plate The bottom plate 51 of the 50 has an opening 54 for receiving the boss 3 as shown in FIG. 6B; or the opening 54 can accommodate a portion of the temperature equalizing element 11 and the boss 22, as shown in FIG. Show. The heat dissipation fin 40 is connected to the temperature equalization The opposite side of the boss 22 of the component 11 is fixed to the connecting plate 53, so that the temperature equalizing element is stabilized by the holding of the heat radiating fin and the fixing plate.
再請參閱第6圖,該散熱模組10包含有一散熱鰭片40、一均溫元件11以及一固定板50,該均溫元件11為密封之平板式中空管體並充填有工作流體,該均溫元件11內具有至少一導流元件形成並連接相對之內壁表面,使該工作流體可藉由該導流元件回流循環。至少二固定板60,該固定板60具有一底板61與一側板62,二固定板60係相對設置於均溫元件11兩側,且其側板62抵靠並夾緊該均溫元件11;以及一散熱鰭片40,其連接該均溫元件11之凸台22相對側,並與該底板61固接。Referring to FIG. 6 again, the heat dissipation module 10 includes a heat dissipation fin 40, a temperature equalizing element 11 and a fixing plate 50. The temperature equalizing element 11 is a sealed flat hollow tube body and is filled with a working fluid. The temperature equalizing element 11 has at least one flow guiding element formed therein and connected to the opposite inner wall surface, so that the working fluid can be recirculated by the flow guiding element. At least two fixing plates 60 having a bottom plate 61 and a side plate 62, the two fixing plates 60 are oppositely disposed on both sides of the temperature equalizing element 11, and the side plates 62 abut against and clamp the temperature equalizing element 11; A heat dissipation fin 40 is connected to the opposite side of the boss 22 of the temperature equalizing element 11 and is fixed to the bottom plate 61.
依本發明之均溫元件之製造方法,可以一體成型方式取代傳統之上下板方式,不僅焊道路徑較少導致可靠度增加,且可在任意位置設置導流元件並可與冷凝端及蒸發端的毛細結構形成連續式的毛細結構,幫助工作流體自冷凝端藉由此導流元件回流至蒸發端過程中的毛細力不會間斷,因而加快工作流體的循環流動,進而達到有效增加散熱效率,相較習知具有一毛細結構不連續區的均溫板,依本發明之均溫元件之結構與製造方法,可提供一更佳之毛細結構使工作流體能快速循環而增加熱傳效率。According to the manufacturing method of the temperature equalizing element of the present invention, the conventional upper and lower plate method can be replaced by the integral molding method, and not only the bead path is less, the reliability is increased, and the flow guiding element can be disposed at any position and can be combined with the condensation end and the evaporation end. The capillary structure forms a continuous capillary structure, which helps the working fluid to flow back from the condensation end by the flow guiding element to the evaporation end without interrupting, thereby accelerating the circulating flow of the working fluid, thereby effectively increasing the heat dissipation efficiency. It is known that a temperature equalizing plate having a discontinuous region of capillary structure, according to the structure and manufacturing method of the temperature equalizing element of the present invention, can provide a better capillary structure for rapid circulation of the working fluid and increase heat transfer efficiency.
並且,本發明之均溫元件之製造方法,係利用管材沖壓形成均溫板的外壁,不需複雜成形方式或成本昂貴的材料,並可依不同使用者之個別需求,調整該均溫元件之長度,且模具便宜又可共用,可達到簡化製程步驟之 優點,整體而言,本發明之均溫元件之製造方法,具有幾何形狀變化容易,且成本便宜等優點。Moreover, the method for manufacturing the temperature equalizing element of the present invention is to form the outer wall of the temperature equalizing plate by pipe punching, without complicated forming method or expensive material, and can adjust the temperature equalizing element according to individual needs of different users. Length, and the mold is cheap and can be shared, which can simplify the process steps Advantages As a whole, the method for manufacturing a temperature-sensing element of the present invention has the advantages of easy change in geometry and low cost.
以上所述僅為本發明之較佳實施例而已,上述實施例僅係用來說明而非用以限定本發明之申請專利範圍,本發明之範疇係由以下之申請專利範圍所界定。凡依本發明申請專利範圍所作之變化與修飾,皆應屬本發明之涵蓋範圍。The above is only the preferred embodiment of the present invention, and the above-described embodiments are intended to be illustrative only and not to limit the scope of the invention, which is defined by the following claims. Variations and modifications made within the scope of the invention as claimed should be within the scope of the invention.
1‧‧‧圓形管材1‧‧‧round pipe
10‧‧‧散熱模組10‧‧‧ Thermal Module
11、11A、11B‧‧‧均溫腔體11, 11A, 11B‧‧‧ equal temperature cavity
2‧‧‧平板式中空管體2‧‧‧ Flat hollow body
24‧‧‧支撐件24‧‧‧Support
3‧‧‧凸台3‧‧‧Boss
4‧‧‧第一毛細結構4‧‧‧First capillary structure
40‧‧‧散熱鰭片40‧‧‧ Heat sink fins
5‧‧‧導流元件5‧‧‧Flow elements
50、60‧‧‧固定板50, 60‧‧‧ fixed plate
51、61‧‧‧底板51, 61‧‧‧ bottom plate
52、62‧‧‧側板52, 62‧‧‧ side panels
53‧‧‧連接板53‧‧‧Connecting plate
54‧‧‧開孔54‧‧‧Opening
55‧‧‧容置空間55‧‧‧ accommodating space
6‧‧‧第二毛細結構6‧‧‧Second capillary structure
7‧‧‧注水管7‧‧‧Water injection pipe
第1A圖與第1B圖係依據本發明之二種均溫元件之製程圖。1A and 1B are process diagrams of two temperature equalizing elements in accordance with the present invention.
第2圖係第1A圖中將均溫元件倒置後之A-A’剖面示意圖。Fig. 2 is a schematic cross-sectional view showing the A-A' after the temperature equalizing element is inverted in Fig. 1A.
第3圖係第1B圖中將均溫元件倒置後之B-B’剖面示意圖。Fig. 3 is a schematic cross-sectional view of the B-B' after the temperature equalizing element is inverted in Fig. 1B.
第4圖係第1B圖中將均溫元件之倒置後之C-C’剖面示意圖。Fig. 4 is a schematic cross-sectional view showing the C-C' of the inverted temperature element in Fig. 1B.
第5A圖係為本發明散熱模組之分解圖。Figure 5A is an exploded view of the heat dissipation module of the present invention.
第5B圖係為本發明散熱模組之第一實施例示意圖。FIG. 5B is a schematic view of the first embodiment of the heat dissipation module of the present invention.
第5C圖係為本發明散熱模組之第二實施例示意圖。Figure 5C is a schematic view of a second embodiment of the heat dissipation module of the present invention.
第6圖係為本發明散熱模組之第三實施例示意圖。Figure 6 is a schematic view showing a third embodiment of the heat dissipation module of the present invention.
1‧‧‧圓形管材1‧‧‧round pipe
2‧‧‧平板式中空管體2‧‧‧ Flat hollow body
3‧‧‧凸台3‧‧‧Boss
4‧‧‧第一毛細結構4‧‧‧First capillary structure
5‧‧‧導流元件5‧‧‧Flow elements
6‧‧‧第二毛細結構6‧‧‧Second capillary structure
7‧‧‧注水管7‧‧‧Water injection pipe
Claims (50)
Priority Applications (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW097132974A TWI426859B (en) | 2008-08-28 | 2008-08-28 | Heat dissipation module, flat heat column thereof and manufacturing method for flat heat column |
US12/348,511 US20100051239A1 (en) | 2008-08-28 | 2009-01-05 | Dissipation module,flat heat column thereof and manufacturing method for flat heat column |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
TW097132974A TWI426859B (en) | 2008-08-28 | 2008-08-28 | Heat dissipation module, flat heat column thereof and manufacturing method for flat heat column |
Publications (2)
Publication Number | Publication Date |
---|---|
TW201010590A TW201010590A (en) | 2010-03-01 |
TWI426859B true TWI426859B (en) | 2014-02-11 |
Family
ID=41723598
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
TW097132974A TWI426859B (en) | 2008-08-28 | 2008-08-28 | Heat dissipation module, flat heat column thereof and manufacturing method for flat heat column |
Country Status (2)
Country | Link |
---|---|
US (1) | US20100051239A1 (en) |
TW (1) | TWI426859B (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI650523B (en) * | 2017-12-22 | 2019-02-11 | 大陸商深圳興奇宏科技有限公司 | Heat dissipation device and manufacturing method thereof |
Families Citing this family (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN102205485A (en) * | 2010-03-31 | 2011-10-05 | 富准精密工业(深圳)有限公司 | Flat plate heat pipe and manufacturing method thereof |
TWI542850B (en) * | 2010-04-26 | 2016-07-21 | Asia Vital Components Co Ltd | Flat plate heat pipe structure and manufacturing method thereof |
US10598442B2 (en) * | 2012-03-12 | 2020-03-24 | Cooler Master Development Corporation | Flat heat pipe structure |
US11454454B2 (en) | 2012-03-12 | 2022-09-27 | Cooler Master Co., Ltd. | Flat heat pipe structure |
TWI573521B (en) * | 2014-06-17 | 2017-03-01 | 奇鋐科技股份有限公司 | Heat dissipation structure of handheld electronic device |
US11131511B2 (en) | 2018-05-29 | 2021-09-28 | Cooler Master Co., Ltd. | Heat dissipation plate and method for manufacturing the same |
CN108917439B (en) * | 2018-08-30 | 2024-04-19 | 无锡格林沃科技有限公司 | Phase change radiator |
US11913725B2 (en) | 2018-12-21 | 2024-02-27 | Cooler Master Co., Ltd. | Heat dissipation device having irregular shape |
JP7029009B1 (en) * | 2021-03-09 | 2022-03-02 | 古河電気工業株式会社 | heatsink |
WO2022230296A1 (en) * | 2021-04-28 | 2022-11-03 | 株式会社村田製作所 | Heat dissipation device |
TWI799247B (en) * | 2022-04-28 | 2023-04-11 | 邁萪科技股份有限公司 | Vapor chamber and heat pipe combined structure |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200722701A (en) * | 2005-12-06 | 2007-06-16 | Ind Tech Res Inst | A permeable supporting structure of flat plate heat spreader |
Family Cites Families (14)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3680189A (en) * | 1970-12-09 | 1972-08-01 | Noren Products Inc | Method of forming a heat pipe |
US5029389A (en) * | 1987-12-14 | 1991-07-09 | Hughes Aircraft Company | Method of making a heat pipe with improved end cap |
US6269866B1 (en) * | 1997-02-13 | 2001-08-07 | The Furukawa Electric Co., Ltd. | Cooling device with heat pipe |
JP4057455B2 (en) * | 2002-05-08 | 2008-03-05 | 古河電気工業株式会社 | Thin sheet heat pipe |
TWI290612B (en) * | 2003-11-27 | 2007-12-01 | Lg Cable Ltd | Flat plate heat transfer device |
US6901994B1 (en) * | 2004-01-05 | 2005-06-07 | Industrial Technology Research Institute | Flat heat pipe provided with means to enhance heat transfer thereof |
US7159647B2 (en) * | 2005-01-27 | 2007-01-09 | Hul-Chun Hsu | Heat pipe assembly |
TWM283223U (en) * | 2005-07-15 | 2005-12-11 | Foxconn Tech Co Ltd | Protective cap |
US20070068657A1 (en) * | 2005-09-27 | 2007-03-29 | Kenichi Yamamoto | Sheet -shaped heat pipe and method of manufacturing the same |
KR100775013B1 (en) * | 2006-04-18 | 2007-11-09 | (주)셀시아테크놀러지스한국 | Flat type heat transfer device |
CN100513974C (en) * | 2006-05-19 | 2009-07-15 | 富准精密工业(深圳)有限公司 | Hot pipe |
KR100795753B1 (en) * | 2006-06-26 | 2008-01-21 | (주)셀시아테크놀러지스한국 | Flat type heat transfer device and its manufacturing method |
CN101309573A (en) * | 2007-05-18 | 2008-11-19 | 富准精密工业(深圳)有限公司 | Even heating board and heat radiating device |
US20090025910A1 (en) * | 2007-07-27 | 2009-01-29 | Paul Hoffman | Vapor chamber structure with improved wick and method for manufacturing the same |
-
2008
- 2008-08-28 TW TW097132974A patent/TWI426859B/en not_active IP Right Cessation
-
2009
- 2009-01-05 US US12/348,511 patent/US20100051239A1/en not_active Abandoned
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TW200722701A (en) * | 2005-12-06 | 2007-06-16 | Ind Tech Res Inst | A permeable supporting structure of flat plate heat spreader |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI650523B (en) * | 2017-12-22 | 2019-02-11 | 大陸商深圳興奇宏科技有限公司 | Heat dissipation device and manufacturing method thereof |
Also Published As
Publication number | Publication date |
---|---|
TW201010590A (en) | 2010-03-01 |
US20100051239A1 (en) | 2010-03-04 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
TWI426859B (en) | Heat dissipation module, flat heat column thereof and manufacturing method for flat heat column | |
US20110024085A1 (en) | Heat pipe and method for manufacturing the same | |
US20090308576A1 (en) | Heat pipe with a dual capillary structure and manufacturing method thereof | |
TWI329184B (en) | Vapor chamber and manufacturing method thereof | |
TWI407071B (en) | Thin heat pipe structure and manufacturing method thereof | |
JP2011009720A (en) | Vapor chamber and method of manufacturing the same | |
US20110005727A1 (en) | Thermal module and manufacturing method thereof | |
CN100413063C (en) | Heat pipe and manufacturing method thereof | |
TWM517314U (en) | Heat dissipation apparatus | |
CN110425918A (en) | A kind of ultrathin flexible flat-plate heat pipe | |
CN101995182A (en) | Uniform temperature plate and manufacturing method thereof | |
CN107421364B (en) | Temperature equalizing plate structure and manufacturing method thereof | |
US20180066897A1 (en) | Vapor chamber and upper casing member thereof | |
US8201618B2 (en) | Heat dissipation module and heat column thereof | |
US20120305223A1 (en) | Thin heat pipe structure and manufacturing method thereof | |
WO2008037134A1 (en) | A heat pipe radiator and manufacturing method thereof | |
US8869878B2 (en) | Flat plate heat pipe and method for manufacturing the same | |
CN103528035A (en) | Heat dissipation method and device for integrated heat pipe of large-power LED | |
TW200941195A (en) | Heat dissipation apparatus and heat pipe thereof | |
KR20050117482A (en) | Printed circuit board with built-in cooling apparatus and method therefor | |
KR101173767B1 (en) | Composite heat sink having heat spread function | |
CN1869574B (en) | Radiator | |
CN114641188A (en) | Built-in temperature-uniforming plate with heat radiation structure | |
CN100447992C (en) | Heat radiation module and its heat pipe | |
TWM532022U (en) | Vapor chamber and upper shell parts thereof |
Legal Events
Date | Code | Title | Description |
---|---|---|---|
MM4A | Annulment or lapse of patent due to non-payment of fees |