KR100775013B1 - Flat type heat transfer device - Google Patents

Abstract

The present invention relates to a plate heat transfer apparatus that can be applied to electronic devices such as a CPU, an IC chip, a printed circuit board, and the like, comprising: a first plate and a second plate forming a sealed inner space; A refrigerant injected into the internal space; A capacitive wick in close contact with at least one of the first plate and the second plate in the inner space and absorbing the liquid refrigerant; And a bent portion that is bent after being partially cut to support a space between the first plate and the second plate so as to smoothly pass the gaseous refrigerant, and at the cut portion to form the bent portion. It is formed to include a plate-shaped hole structure having a hole through which the gaseous refrigerant evaporated in the capillary wick passes, the overall structure is simple, in particular the flow of the refrigerant is more smooth, the cooling efficiency can be greatly improved In addition, by increasing the rigidity of the device, it is possible to increase the stable and durable performance, thereby increasing the reliability of the system.

Heat pipes, wicks, hole structures, bends, holes

Description

Plate type heat transfer device

1A is an exploded perspective view showing an example of a conventional flat heat pipe.

FIG. 1B is a longitudinal cross-sectional view of the flat heat pipe shown in FIG. 1A.

2 is an exploded perspective view showing an example of another conventional flat heat pipe.

3 is an exploded perspective view showing a plate heat transfer apparatus according to a first embodiment of the present invention,

4 is a cross-sectional view of an essential part of the plate heat transfer apparatus shown in FIG. 3;

5 is a detailed view showing an embodiment of the support structure according to the invention,

6 is a detailed view showing another embodiment of the support structure according to the invention,

7 is a detailed view showing another embodiment of the support structure according to the invention,

8 is an exploded perspective view showing a plate heat transfer apparatus according to a second embodiment of the present invention;

9 is an exploded perspective view showing a plate heat transfer apparatus according to a third embodiment of the present invention;

10 is an exploded perspective view showing a plate heat transfer apparatus according to a fourth embodiment of the present invention;

11 is an exploded perspective view showing an operating state of the plate heat transfer apparatus according to the present invention.

12 is a cross-sectional view showing an operating state of the plate heat transfer apparatus according to the present invention.

<Explanation of symbols for the main parts of the drawings>

200: first plate 210, 211: second plate

213: pin

220: Capitol wick 230, 330, 430: plate-shaped hole structure

231, 331, 431: hole 235, 236, 335, 336, 435, 436: bend

500: IC chip 550: PCB

600: Flat Tube

The present invention relates to a plate heat transfer device that can be applied to electronic devices such as CPU, IC chip, printed circuit board, and more particularly, to a plate heat transfer device that transfers heat generated from a semiconductor chip to a low temperature part to perform a cooling action. It is about.

In recent years, as the integration of semiconductor chips such as memory, central processing unit (CPU), and embedded chips has increased, the smooth cooling of chips is becoming more important, and the ultra-light weight and slimness of electronic products such as notebooks, PDAs, mobile phones, etc. As the development of optical displays is increasing interest in the cooling problems of LCDs and LED panels, in order to cool semiconductor chips embedded in such electronic products, existing package technologies and cooling fan technologies may be used. The method is facing structural and functional limitations in order to achieve smooth cooling.

In order to overcome this limitation, recently, a microstructure called a heat pipe has been attracting attention as a new plate-shaped heat transfer device capable of performing a cooling function of a semiconductor chip.

1A and 1B show a planar heat pipe disclosed in Japanese Patent Laid-Open No. 2002-62068, which is a full exploded perspective view, and FIG. 1B is a longitudinal sectional view.

Referring to the drawings, in the conventional flat heat pipe, the lid portion 2 and the main body portion 5 constitute a container 1, and in the container 1, a plurality of struts are formed to prevent capillary phenomenon and deformation of the container. 8) (10) is provided.

The cover part 2 has a thick part 3 formed relatively thick at the center part of the inner surface, and the main body part 5 is formed in a box shape and is formed of a bottom wall part 6 and a side wall part 7.

The support (8) is formed so as to reach the cover (2) in the interior of the body portion 5, another support (10) is the cover (2) in the interior of the body portion (5) The height is formed to contact the thickness portion 3 of the).

As described above, two kinds of struts 8 and 10 having different heights have a wick formed of a porous layer on the outer circumferential surface thereof, so that capillary pressure is generated to improve the reflux of the working fluid (refrigerant).

The conventional flat heat pipe as described above is operated when the heat generating element such as a CPU (not shown) is installed on the outer surface of the cover portion 2 and is absorbed by the support 8 and 10 by the heat of the heat generating element. When the fluid evaporates, the evaporated fluid flows inside the bottom wall portion 6 of the main body portion 5, which functions as a heat radiating portion, and then condenses while radiating heat to the outside of the bottom wall portion 6. Thereafter, the condensed working fluid is absorbed by the wick formed on the outer circumferential surface of the support 8, 10 and refluxed toward the cover part 2, which is a heat generating part, to perform a continuous cooling function of the heating element.

However, the above-described prior art heat pipe has a problem in that the thickness of the entire heat pipe becomes thick because a plurality of struts 8 and 10 are installed in the container in the vertical direction, and the heat pipe disclosed by this problem. The problem arises that it is difficult to apply for cooling of an ultra-thin semiconductor element. In addition, failure to fabricate the height of each strut 8 and 10 to the correct design height may result in assembly failure due to the difference in height of the individual struts 8 and 10 between the cover part 2 and the bottom wall 6. There is a problem.

2 is an exploded perspective view showing a flat heat pipe disclosed in Japanese Patent Laid-Open No. 2002-62067.

The flat heat pipe shown in FIG. 2 is basically similar to the flat heat pipe shown in FIGS. 1A and 1B above, but with the shape of the lid 2 of the container 1 and the lid 2. The structure of the porous sheet 6 and the post 7 which are located in the inner space between the bottom wall 4 and the side part 5 of the main body 3 is different.

That is, the hole 8 is formed in the planar porous sheet 6, and the pillars 7 are coupled to the hole 8 in the vertical direction.

However, in the Japanese patent invention shown in Fig. 2, since the support posts 7 are each composed of a separate configuration and assembled in the container in the state of being assembled to the porous sheet 6, the structure for assembling each support post separately is Since the porous sheet 6 and the support 7 are made of the same material obtained by sintering microparticles such as metal or ceramics, the manufacturing cost of the heat pipe is increased as a whole, and thus a low cost and low weight heat pipe is manufactured. There is a limiting problem.

The present invention has been made to solve the above problems, the structure is simple by forming a bent portion and the hole at the same time by cutting a portion in the plate-shaped plate-hole structure, and to ensure a space for the refrigerant flows In addition, the purpose of the present invention is to provide a plate heat transfer device which can be made more smoothly with the flow of the refrigerant, thereby greatly improving the cooling efficiency.

In another aspect, the present invention is to increase the overall rigidity by using a plate-shaped hole structure, to provide a plate-type heat transfer device that is stable and improves durability by improving the durability.

In another aspect, the present invention is to provide a plate heat transfer apparatus that can reduce the production cost while having excellent cooling performance through a simplified structure and manufacturing process.

According to an aspect of the present invention, there is provided a plate heat transfer apparatus comprising: a first plate and a second plate constituting an upper surface and a lower surface, respectively, and forming a sealed inner space; A refrigerant injected into the internal space; A capacitive wick in close contact with at least one of the first plate and the second plate in the inner space and absorbing the liquid refrigerant; And a plurality of bent portions which form a space for smoothly passing the gaseous refrigerant between the first plate and the second plate after being partially cut and cut in the plate shape, and supporting the capacitive wick. And a plate-shaped hole structure having a plurality of holes formed in a portion cut to form the bent portion and through which gaseous refrigerant evaporated in the capillary wick passes.

In addition, the plate-shaped heat transfer apparatus according to the present invention for realizing the above object, the planar tube forming an outer cell; Refrigerant injected into the tube; A capillary wick in close contact with an inner surface of the planar tube; And a plurality of bent portions formed in a plate-shaped structure, which are bent after being partially cut in the plate shape to form a space for the gaseous refrigerant to pass smoothly in the planar tube, and at the same time support the capillary wick. It is characterized in that it comprises a plate-shaped hole structure having a plurality of holes formed in the cut portion to pass through the vaporized refrigerant vaporized in the capillary wick.

The first plate and the second plate are copper, aluminum, titanium, plastic, metalized plastic, graphite or other metallic materials and plastic combinations. It may be formed of at least one of).

The plate-shaped hole structure may include at least one of copper, aluminum, titanium, plastic, hardened plastic, graphite, or other metal material and plastic combinations. Can be formed.

The plate-shaped hole structure may be installed to be attached to either one of the first plate or the second plate. In this case, the plate-shaped hole structure is preferably attached to the first plate or the second plate by welding or soldering.

In addition, at least one surface of the plate-shaped hole structure may be installed in close contact with the capital wick.

On the other hand, the bent portion of the plate-shaped hole structure of the plate-shaped heat transfer device, characterized in that one side is bent upward, the other side is bent downward.

The bent portion of the plate-shaped hole structure has a structure in which one side is bent upwardly and the other side is bent downwardly around the hole.

In addition, the bent portion of the plate-shaped hole structure may have a structure in which both sides of the plate are bent.

In addition, the bent portion of the plate-shaped hole structure may be a structure bent in a substantially vertical direction.

The plate heat transfer apparatus may be configured to be provided with a plurality of fins (outside) so as to enlarge the heat exchange area. In this case, the fin may be configured to have a space to allow the refrigerant to flow therein.

The planar tube may be made of at least one of copper, aluminum, titanium, plastic, hardened plastic, graphite or other metallic materials, and plastic combinations. Can be formed.

Hereinafter, exemplary embodiments of the present invention will be described with reference to the accompanying drawings.

3 is an exploded perspective view showing a plate heat transfer apparatus according to a first embodiment of the present invention, Figure 4 is a cross-sectional view of the main portion of the plate heat transfer apparatus shown in Figure 3, Figure 5 is a main portion of the support structure used in FIG. Detailed view.

As illustrated, the plate heat transfer apparatus includes a first plate 200 constituting the upper surface and a second plate 210 constituting the lower surface.

The first plate 200 and the second plate 210 is composed of a plate having a rigid enough to sufficiently protect the internal structure, such as aluminum (aluminum), titanium (titanium), plastic ( It may be made of plastic, metalized plastic, graphite or other metal materials, plastic combinations, or the like, and preferably, a copper plate having a high heat transfer rate may be used.

The first plate 200 and the second plate 210 as described above form an upper plate and a lower plate, and the edges of the two plates 200 and 210 are bonded to each other to form a structure in which the inside is sealed so that the refrigerant does not flow out. And either plate is in close contact with the heat source side, such as a PCB board or IC chip is configured to cool.

For example, the first plate 200 may be formed in a planar structure such that the first plate 200 can be easily adhered to a PCB, an IC chip, or the like, and an adhesive layer may be formed on the plane.

The interior spaces of the two plates 200 and 210 are provided with a capacitive wick 220 in close contact with the first plate 200. Of course, the capacitive wick 220 may be installed to be in close contact with the second plate 210.

In addition, the inner space of the two plates (200, 210) is provided with a plate-shaped hole structure 230 to form a space between the two plates (200, 210) and support the capacitive wick 220.

The plate-shaped hole structure 230, like the two plates 200 and 210 described above, is made of aluminum, titanium, plastic, hardened plastic, graphite, or other metal materials and synthetic resins. (plastic combinations) or the like, and preferably, a copper plate which is a metal material having high heat transfer rate is used.

The plate-shaped hole structure 230 has a plurality of holes 231 are formed to pass the vaporized vapor of the liquid refrigerant from one side to the other side, and to form the holes 231 around the hole 231 After a portion is cut, the bent or folded bends 235 and 236 are provided.

That is, when the plate-shaped hole structure 230 is cut into an 'H'-shaped structure to form the hole 231, and then bent to both sides with a center portion, the bent portions 235 and 236 together with the hole 231. Is formed at the same time.

In addition, the hole 231 and the bent portions 235 and 236 may be formed by cutting and bending in various shapes and shapes such as the 'c' structure or the 'C' structure, in addition to the 'H' structure.

Here, the holes 231 are formed to move as gaseous refrigerants, that is, vapors, pass through when the refrigerant absorbed in the capacitive wick 220 is vaporized while absorbing heat transferred from a heat source.

The bent portions 235 and 236 are bent from the holes 231 to the upper or lower surface of the plate-shaped hole structure 230 to form a space in which a gaseous (gas) refrigerant can flow between the two plates 200 and 210. In addition, the capacitive wick 220 is in close contact with one plate and serves to increase heat exchange efficiency.

The bent portions 235 and 236 as described above may be formed in various ways from the hole 231. In this embodiment, as illustrated in FIGS. The 235 is bent in the upward direction of the plate-shaped hole structure 230 to form a folding structure, and the other bent portion 236 is bent in the downward direction of the plate-shaped hole structure 230 to form a folding structure.

Therefore, by the bent portion 235, 236 folded up and down as described above, the upper bent portion 235 as shown in Figure 4 serves to close the capacitive wick 220 to the first plate 200 side, the lower side The bent portion 236 is in contact with the lower plate 210 to maintain a constant distance from the first plate 200, and at the same time through the passage to the vaporized refrigerant through the space spaced with the second plate 210 To form.

Meanwhile, in the plate-shaped hole structure 330 illustrated in FIG. 6, unlike the structures of the bent portions 235 and 236 illustrated in FIGS. 3 to 5, both of the bent portions 335 and 336 with respect to the hole 331 are upward. The plate-shaped hole structure 430 illustrated in FIG. 7 is bent and then folded, and both bent portions 435 and 436 are bent up and down, respectively, about the hole 431, and are not completely folded in the vertical direction. It is shown to be formed in a positioned structure.

In addition, in the present invention, it is possible to have a structure in which the bent portion is formed by bending only one side of the hole, as described above, without bending to both sides.

As such, the shape of the holes formed in the plate-shaped hole structures 230, 330, and 430 and the structure of the bent parts may be variously selected and used. That is, as long as the bent parts are bent from the hole to maintain a proper gap between the two plates 200 and 210, any structure can be selected and used in various ways according to the implementation conditions.

Meanwhile, the plate-shaped hole structures 230, 330 and 430 may be attached to and fixed to the first plate 200 or the second plate 210. Thus, the plate-shaped hole structures 230, 330 and 430 may be fixed. ) Is attached to and fixed between the two plates 200 and 210 in order to improve heat transfer efficiency and to secure a more stable fixing structure.

As a specific attachment method, the upper and lower side bent portions 235 and 236 of the plate-shaped hole structures 230, 330, and 430 are attached to the plates 200 or 210 in contact with them. However, various well-known attachment fixing methods, such as a welding method, can be used. Here, the welding method may be a method such as Tig welding, plasma welding, seam welding, high frequency welding, or the like.

Of course, the plate-shaped hole structures 230, 330 and 430 are simply inserted into and assembled between the first plate 200 and the second plate 210 without attaching them using a separate attachment means as described above. It may also be in close contact with the first plate 200 or the second plate 210 by the method.

Since various embodiments of the present invention to be described below are basically similar to those of the above-described embodiment, the same components as those of the heat transfer device of an embodiment are given the same reference numerals in order to avoid redundant description, and a detailed description thereof will be provided. Omit.

8 is an exploded perspective view showing a plate heat transfer apparatus according to a second embodiment of the present invention.

As shown, in the plate heat transfer apparatus according to the second embodiment of the present invention, two capacitive wicks 220 are inserted into a space between the first plate 200 and the second plate 210, and the capillary wicks are inserted. The plate-shaped hole structure 330 is positioned between the 220.

As used herein, the plate-shaped hole structure 330 may use a plate-shaped hole structure in which both bent portions 335 and 336 are folded upward as shown in FIG. 6. Of course, it is also possible to use the plate-shaped hole structure 230, 430 shown in FIG.

Such a plate-shaped heat transfer apparatus according to the second embodiment can be more useful when the heat source is located on both sides of the two plates (200, 210).

9 is an exploded perspective view showing a plate heat transfer apparatus according to a third embodiment of the present invention.

The plate heat transfer apparatus according to the third embodiment of the present invention is generally similar to the configuration of the above-described embodiment, but has a plurality of fins 213 like a heat exchanger structure typical of the second plate 211 so as to improve cooling performance. Are different.

In the plate heat transfer apparatus according to the second exemplary embodiment, the heat exchange area is further enlarged by the fins 213 formed on the second plate 211, thereby greatly improving the heat exchange performance.

10 is an exploded perspective view showing a plate heat transfer apparatus according to a fourth embodiment of the present invention.

Unlike the various embodiments described above, the plate heat transfer apparatus according to the fourth embodiment of the present invention does not include the first plate 200 and the second plate 210, and includes a single flat tube constituting the outer cell ( The capacitive wick 220 and the plate-shaped hole structure 230 are inserted and fixed in the 600.

The planar tube 600 presses a cylindrical tube having a predetermined length into a plate-like structure, and inserts a capacitive wick 220 and a plate-shaped hole structure 230 as used in the above-described embodiment. Then, it consists of the structure which seals both opening parts. Of course, it is also possible to configure by inserting the plate-shaped hole structure of another embodiment.

Like the two plates 200 and 210 of the above-described embodiment, the flat tube 600 may also be made of aluminum, titanium, plastic, metalized plastic, graphite, or other metal materials and synthetic resins. (copper combinations) or the like, and more preferably, a copper plate which is a metal material having a high heat transfer rate is preferably used.

Since the plate-shaped heat transfer device according to the fourth embodiment uses a flat tube 600 having a simple structure, manufacturing is very simple, thereby lowering the manufacturing cost and enabling a compact structure as a whole.

Looking at the operating state of the plate-shaped heat transfer device according to the present invention as described above with reference to Figures 11 and 12 as follows.

11 and 12 illustrate a structure in which a heating element 500 such as an IC chip is installed on an upper surface of a heating element supporting plate 550 such as a PCB, and the first plate 200 is installed in close contact with the heating element supporting plate 550. will be. Of course, a configuration in which the heating element 500 is in close contact with the first plate 200 without the heating element support plate 550 may be installed. Here, the configuration in which the heating element support plate 550 is included will be described as an example.

When heat is generated in the heating element 500, the heat is transferred to the first plate 200 through the heating element support plate 550. In addition, the capillary wick 220 in close contact with the inside of the first plate 200 is in a state where the liquid refrigerant is absorbed by the capillary force.

Therefore, the heat transferred through the first plate 200 is transferred to the liquid refrigerant contained in the capacitive wick 220, thereby vaporizing the liquid refrigerant. At this time, the liquid refrigerant is evaporated to absorb the heat transferred from the heating element, a portion of the vaporized gaseous refrigerant is moved to the surroundings through the upper surface space between the capillary wick 220 and the plate-shaped hole structure 230, The remaining gaseous refrigerant moves towards the second plate 210 through the hole 231 of the plate-shaped hole structure 230 and then through the lower space between the plate-shaped hole structure 230 and the second plate 210 of the device. It spreads rapidly in all directions, including the periphery, that is, the width direction of the device as well as the longitudinal direction.

That is, the upper space between the capillary wick 220 and the plate-shaped hole structure 230 is formed and maintained by the upper bent portion 235, and between the plate-shaped hole structure 230 and the second plate 210. Since the lower space is formed and maintained by the lower bent portion 236, the refrigerant vaporized in the capacitive wick 220 is quickly and quickly through the upper space of the plate-shaped hole structure 230, as well as the hole 231 and the lower space. It will flow smoothly to the surroundings. Accordingly, the bent portions 235 and 236 of the plate-shaped hole structure 230 have a simple structure to stably support the apparatus according to the present invention and to improve durability, and in particular, to sufficiently fill the refrigerant flow space inside the apparatus. It is possible to ensure that the cooling device according to the present invention contributes to have a better cooling efficiency.

Thereafter, the gaseous refrigerant flowing to the surroundings is condensed by heat transfer to the outside, and is converted into a liquid refrigerant, and then moved again toward the position where the heating element 500 is located by the capillary force of the capillary wick 220, and the above-described procedure is repeated. The heating element 500 is cooled quickly and effectively.

The plate heat transfer apparatus according to the present invention can be modified and applied in various forms within the scope of the technical idea of the present invention described in the claims, and is not limited to the various embodiments described above. In addition, the embodiments and drawings are merely for the purpose of describing the contents of the invention in detail, and are not intended to limit the scope of the technical idea of the invention, the present invention described above is common knowledge in the technical field to which the present invention belongs As those skilled in the art can have various substitutions, modifications, and changes without departing from the spirit and scope of the present invention, it is not limited to the embodiments and the accompanying drawings. And should be judged to include equality.

The plate-shaped heat transfer device according to the present invention constructed and acted as described above is sufficient for a thin plate cooling device because the plate-shaped hole structure can simultaneously form a hole through which a bent portion and steam pass by a portion cut out. Refrigerant movement space can be secured, and thus, the refrigerant flows more smoothly, thereby greatly improving the cooling efficiency.

In addition, since the present invention uses a plate-shaped hole structure that is inserted into two plates or tubes, the overall rigidity of the heat transfer device is increased, so that the durability and performance can be increased, thereby improving the reliability of the system.

In addition, the present invention has the advantage that the production cost can be lowered while having excellent cooling performance through the simplified structure and manufacturing process.

Claims (12)

A first plate and a second plate constituting the upper and lower surfaces, respectively, and forming a sealed interior space; A refrigerant injected into the internal space; A capacitive wick in close contact with at least one of the first plate and the second plate in the inner space and absorbing the liquid refrigerant; And It is formed in a plate-like structure, which is bent after being cut in a portion of the plate to form a space for the gaseous refrigerant to pass smoothly between the first plate and the second plate, and at the same time having a plurality of bent portion to support the capillary wick, And a plate-shaped hole structure having a plurality of holes formed in a portion cut to form the bent portion and through which gaseous refrigerant evaporated in the capillary wick passes. A planar tube forming an outer cell; Refrigerant injected into the tube; A capillary wick in close contact with an inner surface of the planar tube; And It is formed in a plate-like structure, a portion of which is cut after being cut in the plate to form a space for the gaseous refrigerant to pass smoothly in the planar tube and at the same time having a plurality of bent to support the capillary wick, forming the bent portion Plate-shaped heat transfer device is characterized in that it comprises a plate-shaped hole structure having a plurality of holes formed in the cut portion for the vaporized gaseous refrigerant vaporized in the wick. The method according to claim 1, The first plate and the second plate may be made of copper, aluminum, titanium, plastic, metalized plastic, graphite or metal materials and plastic combinations. Plate-shaped heat transfer device, characterized in that formed at least one. The method according to claim 1 or 2, The plate-shaped hole structure is formed of at least one of copper, aluminum, titanium, plastic, metalized plastic, graphite, or a metallic material and plastic combinations. Plate-type heat transfer device, characterized in that. The method according to claim 1, And the plate-shaped hole structure is attached to either one of the first plate and the second plate. The method according to claim 5, And the plate-shaped hole structure is welded or soldered to the first plate or the second plate. The method according to claim 1 or 2, The plate-shaped heat transfer device, characterized in that at least one surface is installed in close contact with the capillary wick. The method according to claim 1 or 2, The bent portion of the plate-shaped hole structure is a plate-shaped heat transfer device, characterized in that one side is bent toward the upper side, the other side is bent downward. The method according to claim 1 or 2, The bent portion of the plate-shaped hole structure, the plate-shaped heat transfer device, characterized in that both of the bent to the center. The method according to claim 1 or 2, The plate-shaped heat transfer device, characterized in that the bent portion of the plate-shaped hole structure is bent in a vertical direction. The method according to claim 1 or 2, The plate heat transfer device is a plate heat transfer device, characterized in that a plurality of fins (out) are provided on the outside to enlarge the heat exchange area. The method according to claim 2, The planar tube may be formed of at least one of copper, aluminum, titanium, plastic, hardened plastic, graphite, or a metallic material and plastic combinations. Plate-type heat transfer device characterized in that.

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