US20110005727A1 - Thermal module and manufacturing method thereof - Google Patents

Thermal module and manufacturing method thereof Download PDF

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Publication number
US20110005727A1
US20110005727A1 US12/560,353 US56035309A US2011005727A1 US 20110005727 A1 US20110005727 A1 US 20110005727A1 US 56035309 A US56035309 A US 56035309A US 2011005727 A1 US2011005727 A1 US 2011005727A1
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United States
Prior art keywords
substrate
tube
thermal module
heat pipe
heat
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Abandoned
Application number
US12/560,353
Inventor
Ye-Fei Yu
Xin-Xiang Zha
Xian-Min Jin
Jer-Haur Kuo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fu Zhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Original Assignee
Fu Zhun Precision Industry Shenzhen Co Ltd
Foxconn Technology Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority to CN200910304100.2 priority Critical
Priority to CN2009103041002A priority patent/CN101945561A/en
Application filed by Fu Zhun Precision Industry Shenzhen Co Ltd, Foxconn Technology Co Ltd filed Critical Fu Zhun Precision Industry Shenzhen Co Ltd
Assigned to FOXCONN TECHNOLOGY CO., LTD., FU ZHUN PRECISION INDUSTRY (SHEN ZHEN) CO., LTD. reassignment FOXCONN TECHNOLOGY CO., LTD. ASSIGNMENT OF ASSIGNORS INTEREST (SEE DOCUMENT FOR DETAILS). Assignors: JIN, XIAN-MIN, KUO, JER-HAUR, YU, Ye-fei, ZHA, XIN-XIANG
Publication of US20110005727A1 publication Critical patent/US20110005727A1/en
Abandoned legal-status Critical Current

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Classifications

    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0275Arrangements for coupling heat-pipes together or with other structures, e.g. with base blocks; Heat pipe cores
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28DHEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/04Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
    • F28D15/046Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
    • FMECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28HEAT EXCHANGE IN GENERAL
    • F28FDETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
    • F28F3/00Plate-like or laminated elements; Assemblies of plate-like or laminated elements
    • F28F3/02Elements or assemblies thereof with means for increasing heat-transfer area, e.g. with fins, with recesses, with corrugations
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L23/00Details of semiconductor or other solid state devices
    • H01L23/34Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/427Cooling by change of state, e.g. use of heat pipes
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K7/00Constructional details common to different types of electric apparatus
    • H05K7/20Modifications to facilitate cooling, ventilating, or heating
    • H05K7/2029Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
    • H05K7/20336Heat pipes, e.g. wicks or capillary pumps
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2924/00Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001Technical content checked by a classifier
    • H01L2924/0002Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4935Heat exchanger or boiler making
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10TTECHNICAL SUBJECTS COVERED BY FORMER US CLASSIFICATION
    • Y10T29/00Metal working
    • Y10T29/49Method of mechanical manufacture
    • Y10T29/4935Heat exchanger or boiler making
    • Y10T29/49353Heat pipe device making

Abstract

A thermal module includes a substrate and a heat pipe integrally embedded in the substrate by insert molding technique. An end of the heat pipe protrudes laterally out of the substrate. The heat pipe includes a tube, a wick structure attached to an inner surface of the tube and a working fluid filled in the tube. A method for manufacturing the thermal module includes following steps: providing a tube with a wick structure attached to an inner surface thereof, an end of the tube being open; placing the tube into a mold; injecting a molten metal into the mold to form a substrate with the tube being integrally embedded in the substrate and the open end of the tube protruding laterally out of the substrate; filling a working fluid into the tube via the open end; sealing the open end of the tube.

Description

    BACKGROUND
  • 1. Technical Field
  • The present disclosure relates to a thermal module and a manufacturing method of the thermal module.
  • 2. Description of Related Art
  • With continuing development of electronic technology, heat-generating electronic components such as CPUs (central processing units) are generating more and more heat which requires immediate dissipation. Generally, thermal modules are attached to the electronic components to provide such dissipation.
  • A conventional thermal module includes a substrate, a fin assembly and a plurality of heat pipes connecting the fin assembly with the substrate. The substrate defines a plurality of elongated recesses for receiving the evaporator sections of the heat pipes. The evaporator sections of the heat pipes are respectively received in the recesses of the substrate and fixed to the substrate by soldering. Usually, a thermal interface material such as thermal grease is applied in the recesses to reduce air gaps between the heat pipes and the substrate. In manufacturing the thermal module, the substrate is defined with the recesses, and the heat pipes are assembled to the recesses of the substrate, which is time-consuming and complex. Furthermore, due to a technical restriction, the thermal grease can not be uniformly filled in a gap between the heat pipes and the substrate, which increases a heat resistance of the thermal module, and a heat dissipation capability of the thermal module is thus greatly reduced.
  • Therefore, a thermal module having a high heat dissipation capability and a simple manufacturing process is desired to overcome the above described shortcomings.
  • BRIEF DESCRIPTION OF THE DRAWINGS
  • FIG. 1 is an isometric view of a thermal module according to a first embodiment.
  • FIG. 2 is a cross-sectional view of the thermal module of FIG. 1, taken along a line II-II thereof.
  • FIG. 3 is a flow chart showing a method for manufacturing the thermal module of FIG. 1.
  • FIG. 4 shows a mold and plural tubes for forming the thermal module according to the method of FIG. 3.
  • FIG. 5 is a bottom plan view of a thermal module according to a second embodiment.
  • FIG. 6 is an isometric view of a thermal module according to a third embodiment.
  • DETAILED DESCRIPTION
  • Referring to FIGS. 1 and 2, the thermal module 100 includes a substrate 12 and a plurality heat pipes 16 integrally embedded in the substrate 12 by insert molding technique. The substrate 12 is made of metal such as aluminum which has a high heat conductivity coefficient. The substrate 12 is rectangular, including a planar bottom surface 122 adapted for contacting with a heat-generating electronic component (not shown) and a planar top surface 124 opposite to the bottom surface 122.
  • The heat pipes 16 have the same shape and structure. The heat pipes 16 each are elongated. Each of the heat pipes 16 includes a tube 162, a wick structure 164 received in the tube 162 and a working fluid (not shown) filled in the tube 162. The tube 162 is made of metal with high heat conductivity coefficient, such as copper. The tube 162 is hollow, defining a chamber 163 therein. The working fluid with a relatively low boiling point is filled in the chamber 163. The wick structure 164 is attached to an inner surface of the tube 162 surrounding the chamber 163. The wick structure 164 may be sintered powder, tiny grooves, or screen mesh. In this embodiment, the wick structure 164 is sintered powder. The wick structure 164 defines a plurality of pores therein which generate a capillary force to the working fluid.
  • The heat pipes 16 are parallel to and evenly spaced from each other in the substrate 12. Each of the heat pipes 16 extends from one lateral side of the substrate 12 to an opposite lateral side of the substrate 12 with two distal ends of each of the heat pipes 16 protruding laterally out of the substrate 12. The heat pipes 16 each are flat, and thus a planar contacting surface 161 is formed at a bottom side of each of the heat pipes 16. The contacting surfaces 161 of the heat pipes 16 are coplanar with the bottom surface 122 of the substrate 12.
  • Referring to FIGS. 3 and 4, in a method of manufacturing the thermal module 100, a plurality of hollow tubes 162 a each with a wick structure 164 a attached to an inner surface thereof are firstly provided, wherein one end of each of the tubes 162 a is open, and the other end of each of the tubes 162 a is sealed. A mold 18 is provided and the tubes 162 a are positioned in the mold 18. A molten metal is injected into the mold 18 to form the substrate 12 wherein the tubes 162 a are integrally embedded in the substrate 12 with two ends of each of the tubes 162 a protruding laterally out of the substrate 12. The tubes 162 a together with the substrate 12 are then taken out from the mold 18. Each of the tubes 162 a is vacuumed and a working fluid is filled into each of the tubes 162 a via the open end of each of the tubes 162 a, and then the open end of each of the tubes 162 a is sealed to form the heat pipes 16. Thus, the thermal module 100 with the heat pipes 16 integrally embedded in the substrate 12 is formed.
  • Before the tubes 162 a are positioned in the mold 18, the tubes 162 a each are flattened to form a contacting surface 161. The contacting surfaces 161 of the heat pipes 16 are coplanar to the bottom surface 122 of the substrate 12 such that the contacting surfaces 161 can contact the electronic component directly, to thereby absorb heat from the electronic component directly. The open ends of the tubes 162 a protrude laterally out of the substrate 12 such that the working fluid can be filled into the tubes 162 a via the open end of each of the tubes 162 a, and the open end of each of the tubes 162 a can be conveniently sealed.
  • As the heat pipes 16 are embedded in the substrate 12 by insert molding technique, the substrate 12 needs not to define recesses therein for receiving the heat pipes 16, and the heat pipes 16 need not to be assembled and soldered to the substrate 12, whereby the manufacturing process of the thermal module 100 is simple and convenient. In addition, the heat pipes 16 are integrally formed with the substrate 12 with no air gaps therebetween, whereby a heat resistance between the substrate 12 and the heat pipes 16 is greatly reduced; thus, a heat dissipation efficiency of the thermal module 100 is increased accordingly
  • During operation, the bottom surface 122 of the substrate 12 and the contacting surfaces 161 of the heat pipes 16 directly contact with the electronic component to absorb heat from the electronic component. The bottom surface 122 of the substrate 12 transfers the heat to the top surface 124 of the substrate 12, and then the top surface 124 of the substrate 12 radiates the heat to an outside environment or a fin assembly attached on the top surface 124. The contacting surfaces 161 of the heat pipes 16 absorb the heat and transfer the heat to the working fluid received in the chambers 163 of the heat pipes 16, and then the working fluid in the chambers 163 absorbs the heat and evaporates, the vapor carrying the heat moves to every area of the chambers 163 and releases the heat to the substrate 12. Thus, the heat is rapidly and uniformly spread to everywhere of the substrate 12. Since the heat pipes 16 are integrally connected with the substrate 12 by insert molding technique, the heat pipes 16 are intimately connected with the substrate 12 with no air gaps therebetween, such that the heat can be quickly transferred to the substrate 12, and a heat transfer capability of the thermal module 100 is thus increased accordingly.
  • FIG. 5 shows a thermal module 200 according to an alternative embodiment. The thermal module 200 is similar to the previous thermal module 100 of the first embodiment. The thermal module 200 includes a rectangular substrate 22 and plural heat pipes 26, 27. The thermal module 200 differs from the previous thermal module 100 in that the heat pipes 26, 27 of the thermal module 200 are different from the heat pipes 16 of the previous thermal module 100. In this embodiment, the heat pipes 26, 27 includes a first heat pipe 26 and two second heat pipes 27 which have a different shape from the first heat pipe 26. The first heat pipe 26 is linearly shaped, while the second heat pipes 27 each are bent to have a bow shape. The first heat pipe 26 is arranged centrally through the substrate 22. The second heat pipes 27 are located at two opposite lateral sides of the first heat pipe 26. Each of the second heat pipes 27 includes a linear portion 272 and two bent portions 271, 273 respectively extending slantwise from two ends of the linear portion 272 towards corners of the substrate 22. Ends of each of the first heat pipe 26 and the second heat pipes 27 protrude laterally out of the substrate 22. A method of manufacturing the thermal module 200 is the same as the method of manufacturing the previous thermal module 100 of the first embodiment.
  • FIG. 6 shows a thermal module 300 according to a third embodiment. The thermal module is similar to the previous first thermal module 100. The thermal module 300 includes a substrate 32 and a plurality of heat pipes 36. The substrate 32 forms a bottom surface 322 and a top surface 324 opposite to the bottom surface 322. The thermal module 300 differs from the first thermal module 100 in that a plurality of fins 34 are integrally formed on the top surface 324 of the substrate 32, and a shape of the heat pipes 36 is different from the heat pipes 16 of the first thermal module 100. The heat pipes 36 of the thermal module 300 each are U-shaped, including an evaporating section 362 and a condensing section 362 parallel to the evaporating section 362. The evaporating section 362 is integrally embedded in the substrate 32, while the condensing section 364 extends through and thermally connects with the fins 34. The evaporating section 362 of each of the heat pipes 36 forms a planar contacting surface 361 coplanar with the bottom surface 322 of the substrate 32.
  • A method of manufacturing the thermal module 300 is similar to the method of manufacturing the previous thermal module 100 of the first embodiment. When the thermal module 300 is manufactured, a plurality of tubes each with a wick structure attached to an inner surface thereof are firstly provided. Each of the tubes is flat in cross section and U-shaped in profile. Each tube includes a first section used for forming the evaporating section 362 of the heat pipe 36 and a second section used for forming the condensing section 364 of the heat pipe 36. One end of each of the tubes is open and the other end of each of the tubes is sealed. Secondly, the tubes are placed into a mold which is applied for forming the substrate 32 and the fins 34. Thirdly, a molten metal is injected into the mold to simultaneously form the substrate 32 and the fins 34 wherein the first sections of the tubes are integrally embedded in the substrate 32 and the second sections of the tubes integrally extend through the fins 34. Two ends of each of the tubes protrude laterally outside from the substrate 32. Then, a working fluid is filled into the tubes via the open ends of the tubes, and finally the open ends of the tubes are sealed, to thereby form the heat pipes 36 and the thermal module 300.
  • It is to be understood, however, that even though numerous characteristics and advantages of the disclosure have been set forth in the foregoing description, together with details of the structure and function of the embodiments, the disclosure is illustrative only, and changes may be made in detail, especially in matters of shape, size, and arrangement of parts within the principles of the invention to the full extent indicated by the broad general meaning of the terms in which the appended claims are expressed.

Claims (9)

1. A thermal module, comprising:
a substrate; and
a heat pipe being integrally embedded in the substrate by insert molding technique with at least one end of the heat pipe protruding laterally out of the substrate, the heat pipe comprising a hollow tube, a wick structure attached to an inner surface of the tube and a working fluid filled in the tube.
2. The thermal module of claim 1, wherein the substrate forms a bottom surface adapted for contacting with an electronic component, and the heat pipe is flat and forms a planar contacting surface coplanar to the bottom surface of the substrate.
3. The thermal module of claim 2, wherein the substrate further comprises a top surface opposite to the bottom surface, a plurality of fins integrally extending upwardly from the top surface of the substrate.
4. The thermal module of claim 3, wherein the heat pipe is U-shaped, including an evaporating section integrally embedded in the substrate and a condensing section extending through the fins.
5. The thermal module of claim 1, wherein the substrate is rectangular, the heat pipe extends centrally through the substrate, additional two heat pipes are provided at two opposite lateral sides of the heat pipe and integrally embedded in the substrate, the additional two heat pipes each includes a linear portion and two bent portions extending slantwise from two ends of the linear portion towards corners of the substrate.
6. A method of manufacturing a thermal module, comprising:
providing a hollow tube with a wick structure being attached to an inner surface of the tube, at least one end of the tube being open;
providing a mold and positioning the tube in the mold;
injecting a molten metal into the mold to form a substrate with the tube being integrally embedded in the substrate and the at least one open end of the tube protruding laterally out of the substrate;
filling a working fluid into the tube via the at least one open end and sealing the at least one open end of the tube.
7. The method of claim 6, wherein the substrate comprises a bottom surface and a top surface opposite to the bottom surface, a plurality of fins are integrally formed on the top surface of the substrate during the manufacturing of the substrate.
8. The method of claim 7, wherein the heat pipe is U-shaped, including an evaporating section embedded in the substrate and a condensing section extending through the fins.
9. The method of claim 6, wherein the substrate comprises a bottom surface, the heat pipe is flat and forms a planar contacting surface coplanar with the bottom surface of the substrate.
US12/560,353 2009-07-07 2009-09-15 Thermal module and manufacturing method thereof Abandoned US20110005727A1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
CN200910304100.2 2009-07-07
CN2009103041002A CN101945561A (en) 2009-07-07 2009-07-07 Dissipation device and preparation method thereof

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CN (1) CN101945561A (en)

Cited By (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120012281A1 (en) * 2010-01-26 2012-01-19 Hewlett-Packard Developement Company L.P. Heat sink with multiple vapor chambers
US20120067550A1 (en) * 2010-09-22 2012-03-22 David Shih Heat sink structure embedded with heat pipes
US20120222839A1 (en) * 2011-03-04 2012-09-06 Tsung-Hsien Huang Heat pipe assembly
EP2615398A1 (en) * 2012-01-13 2013-07-17 Cooler Master Co., Ltd. Heat-conducting module and method for manufacturing the same
EP2620239A1 (en) * 2012-01-24 2013-07-31 Cooler Master Co., Ltd. Heat-dissipating module and method for manufacturing the same
US20140165400A1 (en) * 2011-08-05 2014-06-19 Asia Vital Components Co., Ltd. Heat-dissipation unit and method of manufacturing same
EP2763166A4 (en) * 2011-09-28 2016-01-27 Nhk Spring Co Ltd Heat dissipation structure, power module, method for manufacturing heat dissipation structure and method for manufacturing power module
US20160262284A1 (en) * 2015-03-03 2016-09-08 Asia Vital Components (China) Co., Ltd. Cold plate structure
US20170102745A1 (en) * 2014-06-04 2017-04-13 Huawei Technologies Co., Ltd. Electronic Device
US20170142863A1 (en) * 2015-11-16 2017-05-18 Erin Hurbi Insert molded heat pipe
US20170156240A1 (en) * 2015-11-30 2017-06-01 Abb Technology Oy Cooled power electronic assembly
US20180051936A1 (en) * 2014-12-25 2018-02-22 Mitsubishi Aluminum Co., Ltd. Cooling device
US10638639B1 (en) * 2015-08-07 2020-04-28 Advanced Cooling Technologies, Inc. Double sided heat exchanger cooling unit

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CN102625635A (en) * 2011-01-27 2012-08-01 奇鋐科技股份有限公司 Cooling structure and manufacturing method thereof
CN103128259B (en) * 2011-11-30 2015-08-26 象水国际股份有限公司 Radiating module and method for making thereof
CN103128258A (en) * 2011-11-30 2013-06-05 讯凯国际股份有限公司 Heat guide module and manufacturing method thereof
CN104148617B (en) * 2013-05-15 2016-07-13 苏州春兴精工股份有限公司 The method of die casting radiating fin

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US7047640B2 (en) * 2004-09-21 2006-05-23 Foxconn Technology Co., Ltd. Method of manufacturing a heat dissipating device
US7047639B1 (en) * 2005-04-25 2006-05-23 Actron Technology Corporation Method for manufacturing a heat-dissipating structure of a rectifier
US7669642B1 (en) * 2008-09-24 2010-03-02 Aisa Vital Components Co., Ltd. Thermal module

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US6321452B1 (en) * 2000-03-20 2001-11-27 Liken Lin Method for manufacturing the heat pipe integrated into the heat sink
US20030182799A1 (en) * 2002-03-27 2003-10-02 Jefferson Liu Method for forming heat conductive device of superconductive metal block
US7047640B2 (en) * 2004-09-21 2006-05-23 Foxconn Technology Co., Ltd. Method of manufacturing a heat dissipating device
US7047639B1 (en) * 2005-04-25 2006-05-23 Actron Technology Corporation Method for manufacturing a heat-dissipating structure of a rectifier
US7669642B1 (en) * 2008-09-24 2010-03-02 Aisa Vital Components Co., Ltd. Thermal module

Cited By (15)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20120012281A1 (en) * 2010-01-26 2012-01-19 Hewlett-Packard Developement Company L.P. Heat sink with multiple vapor chambers
US20120067550A1 (en) * 2010-09-22 2012-03-22 David Shih Heat sink structure embedded with heat pipes
US20120222839A1 (en) * 2011-03-04 2012-09-06 Tsung-Hsien Huang Heat pipe assembly
US20140165400A1 (en) * 2011-08-05 2014-06-19 Asia Vital Components Co., Ltd. Heat-dissipation unit and method of manufacturing same
EP2763166A4 (en) * 2011-09-28 2016-01-27 Nhk Spring Co Ltd Heat dissipation structure, power module, method for manufacturing heat dissipation structure and method for manufacturing power module
EP2615398A1 (en) * 2012-01-13 2013-07-17 Cooler Master Co., Ltd. Heat-conducting module and method for manufacturing the same
EP2620239A1 (en) * 2012-01-24 2013-07-31 Cooler Master Co., Ltd. Heat-dissipating module and method for manufacturing the same
US20170102745A1 (en) * 2014-06-04 2017-04-13 Huawei Technologies Co., Ltd. Electronic Device
US10409340B2 (en) * 2014-06-04 2019-09-10 Huawei Technologies Co., Ltd. Electronic device
US20180051936A1 (en) * 2014-12-25 2018-02-22 Mitsubishi Aluminum Co., Ltd. Cooling device
US10544993B2 (en) * 2014-12-25 2020-01-28 Mitsubishi Aluminum Co., Ltd. Cooling device with a plurality of pipe units connected to a common base
US20160262284A1 (en) * 2015-03-03 2016-09-08 Asia Vital Components (China) Co., Ltd. Cold plate structure
US10638639B1 (en) * 2015-08-07 2020-04-28 Advanced Cooling Technologies, Inc. Double sided heat exchanger cooling unit
US20170142863A1 (en) * 2015-11-16 2017-05-18 Erin Hurbi Insert molded heat pipe
US20170156240A1 (en) * 2015-11-30 2017-06-01 Abb Technology Oy Cooled power electronic assembly

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