CN200976725Y - Minisize fin type heat sink - Google Patents
Minisize fin type heat sink Download PDFInfo
- Publication number
- CN200976725Y CN200976725Y CN 200620046970 CN200620046970U CN200976725Y CN 200976725 Y CN200976725 Y CN 200976725Y CN 200620046970 CN200620046970 CN 200620046970 CN 200620046970 U CN200620046970 U CN 200620046970U CN 200976725 Y CN200976725 Y CN 200976725Y
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- CN
- China
- Prior art keywords
- fin
- heat sink
- heat
- utility
- model
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- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
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- 239000007769 metal material Substances 0.000 claims abstract description 4
- 238000005336 cracking Methods 0.000 claims description 6
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000001816 cooling Methods 0.000 abstract description 4
- 238000003466 welding Methods 0.000 abstract 1
- 230000005855 radiation Effects 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 7
- 239000010949 copper Substances 0.000 description 7
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 6
- 238000013461 design Methods 0.000 description 5
- 238000013459 approach Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 238000012546 transfer Methods 0.000 description 3
- 238000006243 chemical reaction Methods 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 230000003416 augmentation Effects 0.000 description 1
- 150000001879 copper Chemical class 0.000 description 1
- 230000002950 deficient Effects 0.000 description 1
- 238000011161 development Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000012423 maintenance Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000003801 milling Methods 0.000 description 1
- 238000005457 optimization Methods 0.000 description 1
- 230000008520 organization Effects 0.000 description 1
- 230000008092 positive effect Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000012827 research and development Methods 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Images
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a miniature finned heat sink, which mostly comprises the fin with hair crack made of metallic material of high heat conductivity coefficient and high heat capacity and a plurality of support welding spots, the utility model is characterized in that a plurality of gaps of 0.1 to 0.3mm are positioned between the each fin with an interval of 0.1 to 1mm, the pitch of the slitting is 25 to 55 degrees, the heat sink is formed by the superposition of multilayer fins, the multilayer fins are staggered arranged according to the slit direction, the thickness of the heat sink is 0.5 to 2cm, each thickness of 0.5cm is formed by the superposition of 20 to 25 fins. Each layer fin is supported and connected by a cylinder junction. The utility model has the advantages that the volume is small, the heat dissipating surface is big, the heat dissipating efficiency is high, reliability is good, and the cooling efficiency is a plurality of ten times higher than the traditional fin heat sink.
Description
Technical field
The utility model relates to a kind of radiator of electronic device, and is particularly a kind of miniature finned heat sink.
Technical background
The essence of any electronic device course of work is energy conversion process, and this process always is accompanied by heating, and the root of heating is that any energy conversion process all can not be 100% efficient, the energy of less than 100% part all or great majority become heat.Along with the high frequencyization of electronic device, integrated, high power development, the caloric value and the density of heat flow rate of unit volume electronic device significantly increase, and electronic chip generally all reaches 5～10W/cm at present
2, extra high even reach 100W/cm
2More than.Along with the increase of temperature, the failure rate exponentially growth trend of electronic device, 10 ℃ of the every risings of ambient temperature, failure rate increase be twice above, have report to think to have 55% above electronic device to lose efficacy be design of Cooling System bad cause.The temperature that reduces device in a word will greatly improve the working life of device performance relevant with temperature and raising device.Because above-mentioned background, become an important academic research direction gradually about the cooling of electronic device.Existing heat dissipation design mode is divided into: passive type and active.Two kinds of radiating modes respectively have excellent lacking: it is totally low than active that passive heat radiation is made simple and easy and cost, and security reliability is its another advantage; But in the time will obtaining identical heat dissipation capacity, the shortcoming that is difficult to overcome in the big design often of the spatial volume of passive heat radiation.Comparatively speaking, active heat radiation is because dynamic equipment, and its cost increases, and security reliability reduces, but active heat radiation can significantly reduce volume under power-equipment auxiliary, and radiating efficiency is also high.In commercialization competition of today, satisfying radiating requirements is primary Consideration, and under heat-sinking capability is equal situation, the security reliability of product and production cost of products and maintenance cost then are another important consideration, therefore the heat radiation of passive type has clear superiority, and the passive heat radiation mode of positive research and development high efficiency and heat radiation ability has positive effect.
Summary of the invention
Goal of the invention of the present utility model provides a kind of miniature finned heat sink at the defective that exists in the prior art.The utility model adopts the metal material of high thermal conductivity coefficient to make little fin such as copper, connect little fin of staggered stack and constitute whole heat sink by solder joint, a heat sink face and the device contacts that needs heat radiation, other five faces all are the free air-flow heat sink inside of fin in a subtle way.The utility model belongs to the passive heat radiation mode, mainly comprise: fin that contains slit that the metal material of high thermal conductivity coefficient and high heat capacity is made and support solder joint, it is characterized in that interval 0.1～1mm is apart from the slit that is provided with 0.1～0.3mm between described each fin, the gradient of cracking is 25 °～55 °, heat sinkly be formed by stacking by the multilayer fin, the multilayer fin when stack by the staggered arrangement of the direction of cracking, heat sink thickness is 0.5～2cm, and the thickness of every 0.5cm is formed by stacking by 20～25 fins.Between every layer of fin by the support and connection of cylinder point.
The utility model has the advantages that volume is little, area of dissipation is big, the radiating efficiency height, and good reliability has improved tens of times than the heat sink cooling effectiveness of traditional fin.
Description of drawings
Fig. 1 individual layer fin structure of the present utility model schematic diagram;
Fig. 2 double-deck fin structure schematic diagram of the present utility model.
1 fin, 2 cracks.
Embodiment
Further specify embodiment of the present utility model below in conjunction with accompanying drawing:
Basic theories according to thermal conduction study: the approach that strengthens heat-sinking capability shows as in the heat transfer formula and increases conductive coefficient (promptly reducing thermal resistance) or increase heat exchange area.Conductive coefficient is one and has comprised the various coefficient of colligation that influence the factor of heat conduction that the approach of optimizing conductive coefficient is more, also therefore difficult its optimization degree of estimation.And be simple and easy relatively and optimize approach intuitively by increasing heat exchange area.
For obtaining heat-transfer effect preferably, consider also that when increasing area of dissipation good air flows comes the enhanced heat exchange coefficient.Referring to Fig. 1, it is on the copper sheet of 1 * 1cm of 0.1mm that the fin 1 of present embodiment adopts thickness, every interval 0.5mm making 0.2mm's cracks 2,2 gradients of cracking are 45 °, little fin that whole 0.5cm is thick is superposeed by 25 layers of this copper coin, between the cracking of every layer of copper sheet for staggered, referring to Fig. 2, support by cylinder point between every layer of copper sheet, be the slot milling that enters of air.In such project organization, air fluid can enter by the sidewall from little fin, flows between within it each layer copper sheet.According to this routine design size, the surface area of one deck fin 1 that this kind is heat sink is for descending 1.616 times for there not being slitted fin with volume, if whole heat sink 1 * 1 * 0.5cm that is of a size of, the area of dissipation that little fin of the present utility model is heat sink will be 39.592 times of 1 * 1 * 0.5cm copper coin area of dissipation, therefore in theory, if suppose that inner heat exchange is abundant, the area of dissipation of little fin of the present utility model will improve 39.592 times, and heat-sinking capability is greatly improved.
In addition, by thermal conduction study knowledge as can be known, when having the temperature difference, air can produce strong flowing owing to the density contrast that thermal conductance causes, strong air stream is arranged in heat sink, and the air flows in little fin structure of this kind design belongs to the size of microfluidic, and the conduction in the mobile micro-system of bringing in the micro-dimension may bring the phenomenon of augmentation of heat transfer.
Claims (2)
- One kind miniature finned heat sink, mainly comprise: the fin that contains slit of the metal material of high thermal conductivity coefficient and high heat capacity and support solder joint, it is characterized in that interval 0.1～1mm is apart from the slit that is provided with 0.1～0.3mm between described each fin, the gradient of cracking is 25 °～55 °, heat sinkly be formed by stacking by the multilayer fin, the multilayer fin when stack by the staggered arrangement of the direction of cracking, between every layer of fin by the support and connection of cylinder point.
- 2. according to claim 1 a kind of miniature finned heat sink, it is characterized in that described heat sink thickness is 0.5～2cm, the thickness of every 0.5cm is formed by stacking by 20～25 fins.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620046970 CN200976725Y (en) | 2006-10-20 | 2006-10-20 | Minisize fin type heat sink |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN 200620046970 CN200976725Y (en) | 2006-10-20 | 2006-10-20 | Minisize fin type heat sink |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN200976725Y true CN200976725Y (en) | 2007-11-14 |
Family
ID=38903001
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN 200620046970 Expired - Lifetime CN200976725Y (en) | 2006-10-20 | 2006-10-20 | Minisize fin type heat sink |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN200976725Y (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101540206B (en) * | 2009-04-15 | 2012-09-05 | 中国科学院物理研究所 | External compression type low-thermoresistance separable heat sinking structure |
| CN114309810A (en) * | 2021-12-01 | 2022-04-12 | 北京卫星环境工程研究所 | Automatic spinning device for edge slotting forming of stainless steel heat sink plate |
-
2006
- 2006-10-20 CN CN 200620046970 patent/CN200976725Y/en not_active Expired - Lifetime
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN101540206B (en) * | 2009-04-15 | 2012-09-05 | 中国科学院物理研究所 | External compression type low-thermoresistance separable heat sinking structure |
| CN114309810A (en) * | 2021-12-01 | 2022-04-12 | 北京卫星环境工程研究所 | Automatic spinning device for edge slotting forming of stainless steel heat sink plate |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| ASS | Succession or assignment of patent right |
Owner name: GUANGDONG ZHAOXIN ELECTRO-OPTICAL TECHNOLOGY CO., Free format text: FORMER OWNER: LIU SHENG Effective date: 20080509 |
|
| C41 | Transfer of patent application or patent right or utility model | ||
| TR01 | Transfer of patent right |
Effective date of registration: 20080509 Address after: Industrial West Zone, Sha Mo hang bridge, Nanhai District, Guangdong City, Foshan Province, China: 528251 Patentee after: Guangdong Shaoxin Opto-electrical Technology Co., Ltd. Address before: Room 500, No. 309 blue wave road, Zhangjiang, Shanghai, China: 201203 Patentee before: Liu Sheng |
|
| EE01 | Entry into force of recordation of patent licensing contract |
Assignee: Hunan Yiyuan Photoelectric Technology Co., Ltd. Assignor: Guangdong Shaoxin Opto-electrical Technology Co., Ltd. Contract record no.: 2011430000048 Denomination of utility model: Minisize fin type heat sink Granted publication date: 20071114 License type: Exclusive License Record date: 20110421 |
|
| CX01 | Expiry of patent term |
Granted publication date: 20071114 |
|
| EXPY | Termination of patent right or utility model |