CN214705906U - Air-cooled heat dissipation module for high-power-consumption chip in electronic system - Google Patents

Abstract

The utility model relates to an air-cooled heat dissipation module for a high-power chip in an electronic system, belonging to the technical field of heat management; comprises a first heat transfer body, a second heat transfer body and a fin group; one end of the second heat transfer main body is welded with the first heat transfer main body, and the other end of the second heat transfer main body is welded with the fin group; the first heat transfer body and the second heat transfer body form a series mode, and heat is spread in the plane and the vertical direction respectively. The utility model discloses an air-cooled heat dissipation module for among the electronic system high-power consumption chip can handle the air-cooled heat dissipation problem of big heat, high heat flux density component, with crossing the propagation efficiency of optimizing the heat in three dimension, provides compact, efficient heat dissipation solution.

Description

Air-cooled heat dissipation module for high-power-consumption chip in electronic system

Technical Field

The utility model relates to an air-cooled heat dissipation module for a high-power chip in an electronic system; belongs to the technical field of thermal management.

Background

The continued development of computers has resulted in a continuous increase in power consumption of chips, including CPUs, GPUs, FPGAs, ASICs, and the like. In recent years, the power consumption of these chips has been increased from less than 200W to 300W to 500W, and in the coming years, it is expected that chips larger than 500W will be applied to applications such as high-performance computing, super computing centers, communication switches, etc. on a large scale. Aiming at the heat dissipation requirements of the chips in the application scenes, a more efficient liquid cooling technology is needed for heat dissipation, but under the influence of many factors, the temperature of the chips is still required to be controlled by the traditional air-cooled heat dissipation module in the actual implementation process. For example, the problems of upgrading and modifying the infrastructure caused by the liquid cooling system, matching with the existing equipment, using the target environment limitation, and the like are the main considerations for using the air-cooled heat dissipation module.

Under the situation that the air-cooled heat dissipation module is used for cooling a high-power-consumption chip, heat generated by the chip is absorbed by a heat sink attached to the chip and is diffused to fins of the heat sink, and further the heat is transferred to airflow flowing through the surfaces of the fins in a convection heat transfer mode. In this process, how to efficiently diffuse heat from the chip to the fins is the most critical. In practical applications, this objective is usually achieved by means of phase-change heat transfer technology with strong heat conduction effect, such as heat pipe and vapor chamber. The heat pipes are tubular structures, a plurality of heat pipes are usually adopted in the heat dissipation module to conduct heat transfer in a parallel mode, meanwhile, the heat pipes can be bent into different shapes, and in a limited structural space, considerable design freedom is provided to enhance heat transfer between the near ends and the far ends of the fins; the temperature equalizing plate can be regarded as a plate-shaped heat pipe, and compared with the heat pipe, the heat pipe has the advantages of high heat quantity and heat flow density, and heat diffusion in a plane is greatly advantageous. However, both of these techniques are limited in different respects when dealing with high power chip heat dissipation. For the heat pipes, the upper limit of the heat quantity and the upper limit of the heat flow density which can be processed by the heat pipes are small, and once the upper limit is exceeded, the drying failure can be caused, although the upper limit can be improved to a certain extent by using a plurality of groups of heat pipes in parallel, the number of the heat pipes which can be arranged in a unit area is limited, and after the heat quantity exceeds 300W, the mode of connecting the heat pipes in parallel is difficult to meet the requirement; the heat that the temperature-uniforming plate technique can be handled is many more than the heat pipe height, but after exceeding 500W, heat transfer performance descends also great, what the temperature-uniforming plate mainly gone on in plane heat transfer in addition, inside has large tracts of land cavity structure, it is comparatively difficult to implement deformation, but the heat of transfer after the deformation simultaneously can descend by a wide margin, this characteristic of temperature-uniforming plate helps very limitedly to improving distal end fin radiating efficiency, and in high-power consumption chip heat dissipation module, because the thermal increase of handling, need bigger fin area, the heat can high-efficiently transmit the fin distal end very important in whole design.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model aims at providing an air-cooled heat dissipation module for high-power consumption chip in electronic system combines one or more phase transition heat transfer mechanism, with two or more heat transfer monomers, carries out heat transfer between chip and module fin with parallelly connected, or the series mode, promotes the temperature uniformity on the fin to reach the radiating efficiency who improves whole heat dissipation module, the control chip temperature is in the safe threshold value within range.

The utility model discloses a following technical means reaches the purpose that improves forced air cooling heat dissipation module efficiency:

an air-cooled heat dissipation module for a high-power chip in an electronic system is used as a first heat transfer main body of the heat dissipation module, absorbs heat from a heat source and diffuses the heat to the whole heat conducting strip, the back of the heat conducting strip further comprises fins, meanwhile, corresponding groove structures are processed on the heat conducting strip, heat pipes are further embedded in the groove structures, the heat pipes are inserted into holes or grooves which are pre-processed at the far ends of the fins in a bending mode and are welded with the heat conducting strip and the fins of the first main body, the heat pipes are used as second heat transfer main bodies, and part of heat diffused to the heat conducting strip of the first heat transfer main body is further guided to the far ends of the fins, so that the temperature of the fins at the far ends is actually increased, and the heat diffusion efficiency on the whole heat dissipation module is improved; at the same time, the first heat transfer body absorbs heat from the heat source, a portion of which is conducted to the air flowing over the fins by the fins welded to the first heat transfer body.

Further, the heat conducting sheet based on the Self-Organizing Thermodynamic System phase change heat transfer mechanism (SOTS) is composed of a micro-channel network which is constructed and embedded in a solid basic plate and has a communication relation, and the micro-channel network is filled with one or more working media with coexisting vapor and liquid phases; the micro-channel network with communication relation can be a single communication network or a plurality of sub-networks without communication relation; meanwhile, all networks, including sub-networks, are filled with the vapor-liquid two-phase working medium; the networks are closed in the external environment, wherein the working medium generates different pressures in the heating area and the cooling area under the premise of temperature difference, so that the movement starts to be generated in the micro-channel network, the movement meets the condition of self-organization criticality of a complex dynamic system, and a stable convective phase change heat transfer process is formed between the heating end and the cooling end.

Further, the base material of the heat conducting sheet based on the phase change heat transfer mechanism of the self-organized thermodynamic system is processed and prepared by adopting a light material including an aluminum alloy, so that the weight of the whole heat dissipation module is reduced.

Furthermore, the heat pipe is used as a second main body, and is connected with a first heat transfer main body with a self-organizing critical characteristic in series on a heat transfer chain from a heat source to a heat dissipation module to air, the main function of the heat pipe is to transfer part of heat diffused to the first heat transfer main body to a fin structure far away from the first heat transfer main body by a small temperature difference, the second heat transfer main body comprises a plurality of heat pipes, and the heat pipes are connected in parallel on the heat transfer chain.

Furthermore, the first heat transfer main body with the self-organizing critical characteristic is provided with a groove structure on the surface which is contacted with a heat source, one section of a group of heat pipes is embedded in the groove structures and welded together, the other section of the group of heat pipes is inserted into a fin far away from the upper part through bending, a hole or a groove structure is formed in advance and welded together, a second heat transfer main body formed by the group of heat pipes and the first heat transfer main body directly absorb heat generated by a chip at the same time, and a parallel heat transfer relation is formed between the second heat transfer main body and the first heat transfer main body, wherein the first heat transfer main body mainly conducts in-plane heat expansion, and the second heat transfer main body conducts non-plane heat transfer from a lower chip position to a higher fin.

Furthermore, a groove is further formed at the far end of the first heat transfer main body and the position far away from the chip, a group of heat pipes are embedded and welded to form a third heat transfer main body, heat diffused to the far end of the first heat transfer main body is further guided to the fin part at the higher position, the fin heat dissipation efficiency of the areas is improved, and the third heat transfer main body and the first heat transfer main body are in series connection.

Furthermore, the second heat transfer main body and/or the third heat transfer main body formed by the heat pipe is replaced by one or more bent heat conducting fins with self-organizing critical characteristics.

The utility model has the advantages that:

the utility model discloses in the heat transfer mechanism who has the critical characteristic of self-organizing who adopts, compare in the heat pipe have higher can handle heat and thermal current density upper limit, simultaneously for traditional samming board technique, insensitive to deformation, can process into the non-plane even, have the heat conduction device of complicated three-dimensional structure, consequently can the heat dissipation demand of effective processing high-power consumption chip to through the efficiency of geometric construction optimization promotion heat dissipation module. The utility model discloses in, through several groups of heat transfer assembly or series connection, or parallelly connected, or the mode that has concurrently, optimize fin heat transfer efficiency, in finite space, wholly reduce the thermal resistance between heat dissipation module and the air. The self-organized thermodynamic heat transfer component can be processed and prepared from light materials, and the weight reduction effect of the whole heat dissipation module is achieved. In some embodiments, the second or third heat transfer body composed of the heat pipe is replaced by the heat conducting fin with the same self-organizing critical characteristic, so that the contact area between the heat conducting fin and the fin can be greatly increased, and the heat transfer efficiency of the fin at the far end is further improved.

The invention is further illustrated by the accompanying drawings and the detailed description, which are not meant to limit the scope of the invention. The conditions and apparatus used in the examples are conventional in the art and commercially available unless otherwise noted.

Drawings

Fig. 1A is a high power consumption chip heat dissipation module 100 and an exploded view thereof according to the embodiment of the present invention.

Fig. 1B is a schematic structural diagram of a heat conducting plate body 110 with a self-organizing critical thermal power (SOTS) system enclosed therein according to embodiment 1 of the present invention.

Fig. 1C is a front view, a side view, and another side view of the fin assembly of the heat dissipation module according to embodiment 1 of the present invention.

Fig. 2 is a schematic structural diagram of an embodiment of a heat dissipation module in embodiment 2 of the present invention.

Fig. 3A is an embodiment of a heat dissipation module including two heat transfer bodies according to embodiment 3 of the present invention and an exploded view thereof.

Fig. 3B is an assembly exploded view of two heat transfer bodies in the heat dissipation module according to embodiment 3 of the present invention.

Detailed Description

Example 1

As shown in fig. 1A, the high power consumption chip heat dissipation module 100 according to embodiment 1 of the present invention and an exploded view thereof are shown. Wherein, 110 is a heat conducting plate body with a self-organizing critical thermodynamic system sealed therein, and is used as a first heat transfer main body. The upper surface of the substrate 110 is provided with a plurality of grooves 112, and the lower surface of the substrate 110 is used for contacting a chip heat source. 120 are a set of bent heat pipes as a second heat transfer body, one end of which is embedded in 112 and finally soldered with 110, the other end is inserted into the upper opening of the fin set 130 and soldered with the fin set 130, and the bottom plane of the fin set 130 is soldered on the upper surface of 110.

Fig. 1B is a schematic structural diagram of a heat conducting plate body 110 having a self-organizing critical thermal power (SOTS) system enclosed therein according to embodiment 1 of the present invention. Wherein, the upper part of the fin 110 is welded with the fin group 130 and is provided with a groove 112; 110 has a boss structure 114, the center of which contacts with the heat source of the target chip and locks the whole heat dissipation module on the corresponding circuit main board (PCB) through four screw holes 115; inside 110, a network of microchannels 116 is machined by etching, CNC or the like and then encapsulated inside via high temperature welding such as vacuum brazing, vacuum diffusion welding or the like, and inside 116, a vapor-liquid two-phase working medium is filled and isolated from the outside. The design of the closed microchannel network is not limited to the form shown in fig. 1B, and the design may be customized according to the form and power consumption of a specific chip, wherein the heat transfer mechanism based on the self-organization critical is consistent.

As shown in fig. 1C, it is a front view, a side view and another side view of the fin set of the heat dissipation module in embodiment 1 of the present invention; one end of the fin 120 is embedded in the groove 112 of the fin 110, and the other end is inserted into the upper part of the fin group 130, wherein most of the fins of the fin group 130 are provided with holes 132 at the upper part for inserting the straight parts of the fin 120, and a part of the fins of the fin group 130 are provided with grooves 133 for avoiding the bent parts of the fin group 120, so that the fin group 130 can be completely embedded with the fin group 120.

Example 2

As shown in fig. 2, it is a schematic structural diagram of an embodiment of a heat dissipation module in embodiment 2 of the present invention; the heat dissipation module 200 includes a first heat transfer body 210, a set of second heat transfer bodies 222, and a set of third heat transfer bodies 224. The first heat transfer body 210 is a heat conductor of a self-organized thermodynamic system (SOTS) in which a closed microchannel network and a vapor-liquid two-phase working medium are embedded, and has channels 214 formed on the surface of an upper welding fin 230 for embedding and welding a third heat transfer body 224 composed of a set of heat pipes, and also has channels 212 formed on the lower surface of the first heat transfer body 210 in a region for contacting a heat source of a target chip for embedding and welding a second heat transfer body 222 composed of a set of heat pipes, in such a manner that the target chip will simultaneously partially contact the first heat transfer body 210 and the second heat transfer body 222. 210 are open at their sides with through slots to allow the bent portions of the second heat transfer bodies 222 to pass through and extend over the fins. The second and third heat transfer bodies 222 and 224 direct heat from the target chip contact surface and the distal end of the first heat transfer body 210, respectively, to the upper region of the fin 230, thereby enhancing the heat transfer efficiency of that region. In this manner, the first heat transfer body 210 and the second heat transfer body 222 are in a parallel heat transfer mode, wherein 210 diffuses the absorbed heat to a plane and then transfers it to the air primarily through the lower regions of the fin groups 230, and 222 directs the absorbed heat to the tip regions of the fin groups 230 and further transfers it to the air. The first heat transfer body 210 and the second heat transfer body 222 are milled flat in the area contacting the heat source of the chip after soldering, ensuring uniform contact with the heat source. The function and operation of the third heat transfer body 224 are the same as 120 in example 1.

Example 3

As shown in fig. 3A, an embodiment of a heat dissipation module including two heat transfer bodies in embodiment 3 of the present invention and an exploded view thereof are illustrated; an embodiment of the air-cooled heat dissipation module 300 is formed by two heat conductive plates with self-organized thermodynamic systems (SOTS). Wherein 310 is a first heat transfer body, which is contacted with a chip heat source under the lower step surface, absorbs all heat and diffuses to the whole plate body surface; 320 is a second heat transfer body, which is a heat conducting plate body bent into a C shape and provided with a self-organizing thermodynamic system (SOTS), and the lower part of the heat conducting plate body is not provided with structures except the contact welding position with the chip 310, so that the contact and the fastening of the chip 310 and a chip heat source are avoided; 332 is a set of fins welded to the upper surface of 310 to transfer the absorbed heat of 310 to the air; 334 is a set of fins welded to the upper surface of 320 to transfer the heat absorbed by 320 from 310 to the air. 310 and 320 are in series relationship on the heat transfer chain.

As shown in fig. 3B, it is an assembly exploded view of two heat transfer bodies in the heat dissipation module in embodiment 3 of the present invention; the surface 322 of the second heat transfer body 320 is welded in contact with the region 312 of the first heat transfer body 310 outside the lower surface plateau, and the upper surface 314 of the first heat transfer body 310 is welded to the fin group 332; the upper surface 324 of the second heat transfer body 320 and the fin group 334 are welded, which has two benefits: first, the heat dissipation area of the first heat transfer body 310 and the fins are in sufficient contact, and the heat dissipation efficiency of this stage is higher compared to embodiments 1 and 2; second, 320 contacts under 310, without interfering with the heat dissipation of 310, and at the same time, the advantage is more sufficient for 320 to contact with the fin set 334 than for a heat pipe solution to contact with 310, which is very sufficient for 320 to contact with the fins due to the plate type structure, and the ratio of the area of the heat pipe to the fin contact is relatively small.

Although the claimed subject matter has been defined with specific structural features and/or methods, it is to be understood that the claimed subject matter is not limited to the specific features or acts described by the claims. Rather, the specific structural features and methods described in the claims are merely exemplary of the invention.

Claims (5)

1. The utility model provides an air-cooled heat dissipation module that is used for high power consumption chip in the electronic system which characterized in that: comprises a first heat transfer body, a second heat transfer body and a fin group; one end of the second heat transfer main body is welded with the first heat transfer main body, and the other end of the second heat transfer main body is welded with the fin group; the first heat transfer body and the second heat transfer body form a series mode;

the first heat transfer body further comprises one or more micro-channel network structures which are enclosed in the solid cavity, the micro-channel network structures are formed into parts or whole bodies in advance through numerical control machining, photochemical etching, extrusion or other machining modes, then the parts or the whole bodies are welded, brazed, vacuum diffusion welded and the like to form a closed cavity, and one or more gas-liquid two-phase working media are filled in the micro-channel network structures; the cooling surface of the first heat transfer body is welded to the fin set.

2. The air-cooled heat dissipation module for high-power-consumption chips in electronic systems of claim 1, wherein: the second heat transfer main body is composed of a group of bent heat pipes, one end of each bent heat pipe is embedded in a groove formed in the cooling surface of the first heat transfer main body in advance and welded together, and the bent heat pipes are bent upwards through different angles and inserted into holes formed in the upper portion of the fin group in advance and welded together.

3. The utility model provides an air-cooled heat dissipation module that is used for high power consumption chip in the electronic system which characterized in that: the heat exchanger comprises a first heat transfer main body, a second heat transfer main body, a third heat transfer main body and a group of fin groups, wherein the upper part of the first heat transfer main body is welded with the fin groups, the third heat transfer main body is welded, and meanwhile, the second heat transfer main body is welded on the lower surface of the first heat transfer main body;

the first heat transfer body further comprises one or more micro-channel network structures which are enclosed in the solid cavity, the micro-channel network structures are formed into parts or whole bodies in advance through numerical control machining, photochemical etching, extrusion or other machining modes, then the parts or the whole bodies are welded, brazed, vacuum diffusion welded and the like to form a closed cavity, and one or more gas-liquid two-phase working media are filled in the micro-channel network structures; the cooling surface of the first heat transfer main body is welded with the fin group;

the first heat transfer body is provided with a groove structure in advance in the area contacting with a chip heat source for embedding and welding a second heat transfer body, and the other groove structure is provided in advance on the cooling surface of the first heat transfer body for embedding and welding a third heat transfer body.

4. The air-cooled heat dissipation module for high-power-consumption chips in electronic systems of claim 3, wherein: the second heat transfer main body is composed of a group of bent heat pipes, one straight end of each bent heat pipe is embedded in a groove of the first heat transfer main body attached to a chip heat source area, and after the bent heat pipes are bent upwards, the other straight end of each bent heat pipe is embedded in a hole formed in the upper portion of the fin group in advance and welded together.

5. The air-cooled heat dissipation module for high-power-consumption chips in electronic systems of claim 4, wherein: the third heat transfer main body is composed of a group of heat pipes, the straight end of each heat pipe is embedded in a groove formed in the cooling surface of the first heat transfer main body in advance and is bent upwards, and the straight other end of each heat pipe is embedded in a hole formed in the upper portion of the corresponding fin group in advance and is welded together.

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