CN216818326U

CN216818326U - High-power chip efficient heat dissipation cooling device

Info

Publication number: CN216818326U
Application number: CN202220583239.6U
Authority: CN
Inventors: 李骥; 李晨夕
Original assignee: University of Chinese Academy of Sciences
Current assignee: University of Chinese Academy of Sciences
Priority date: 2022-03-17
Filing date: 2022-03-17
Publication date: 2022-06-24
Anticipated expiration: 2032-03-17

Abstract

The utility model discloses a high-efficiency heat dissipation and cooling device for a high-power chip, which is applied to the technical field of heat dissipation and cooling and comprises the following components: a base plate and a cover plate; the heat dissipation side of the substrate is provided with a micro-channel, and the evaporation side of the substrate is attached to a heat source; the microchannel is arranged in a radiation manner around the heat source joint position; and fluid working media are filled in the micro-channel. The utility model discloses a high-efficiency heat dissipation cooling device for a high-power chip, wherein micro channels are dense in the center and sparse in the edge, the whole body is in a radial shape with the center diffusing to the edge, a heat source is arranged in the center, the area of the heat source is perfectly matched with that of an evaporation area, and the heat absorption area is increased; the microgrooves are tightly arranged to realize global coverage, heat is simultaneously and uniformly dissipated to the periphery from the evaporation side, heat transfer is carried out to the maximum extent, and temperature uniformity is improved; the micro-channel is approximately symmetrical in arrangement, consistent in equivalent diameter, simple in manufacture and low in cost, and has no extra capillary structure.

Description

High-power chip efficient heat dissipation cooling device

Technical Field

The utility model relates to the technical field of heat dissipation and cooling, in particular to a high-power chip efficient heat dissipation and cooling device.

Background

With the development of processing technology, the manufacturing process of chips has entered the 5-7nm era, and more advanced manufacturing processes can integrate more transistors inside the CPU and the GPU, so that the processor has more functions and higher performance, but the increase of transistors will bring higher heat dissipation design power consumption. 250W starting from a single CPU heat dissipation design in a high-power server, a Sapphire rapid series server processor pushed by Intel and a fourth generation EPYC (Chinese trumpet) product pushed by AMD, the heat dissipation design power consumption is as high as 400W! If the accumulated heat cannot be dissipated in time to ensure that the temperature of the chip is below the safe temperature, the operation performance of the chip is affected if the temperature is low, and paralysis is directly burnt out if the temperature is high, so that the development of a high-performance computer is severely restricted, and therefore, the development and design of a clean and efficient chip heat dissipation technology has important research and application values.

The current chip cooling technology mainly comprises a wind cooling heat dissipation technology, a liquid cooling heat dissipation technology and a traditional heat pipe heat dissipation technology. Wherein, the air-cooled heat dissipation limit is about 50W/cm²When a high-power chip generates heat seriously, the heat is difficult to be led out in time, so that the working environment of the chip is deteriorated. Compared with air cooling heat dissipation, the liquid cooling technology is improved greatly, but an auxiliary power device needs to be arranged, the structure is complex, the manufacturing cost is high, and the occupied space is large. Traditional heat pipe heat dissipation is said to utilize the gas-liquid phase transition principle, can take away more heat, but its design installation often receives structural constraint, and heat transfer capacity also receives the influence of factors such as capillary limit, carrying limit.

In view of the above, in order to meet the requirements of small space, high power, and low cost in operation and production, a pulsating heat pipe technology is provided that can solve the above-mentioned heat dissipation problem. The pulsating heat pipe technology was originally proposed by Akachi in 1990 as a novel efficient passive heat transfer device. The heat dissipation device can be divided into a tubular pulsating heat plate and a plate pulsating heat plate according to the heat dissipation purpose, and in order to be attached to a heat dissipation chip more tightly and reduce the contact thermal resistance, a plate pulsating heat pipe which is more compact as a whole is generally adopted in the heat dissipation of electronic devices.

In the prior art, the pulsating heat pipe adopts the evaporation section of the bionic runner, so that heat exchange thermal resistance and flow resistance are reduced, the starting speed is increased, and unidirectional circulation is generated earlier, but the structure is more complex, the volume is larger, and the compactness is not strong.

Therefore, a problem to be solved by those skilled in the art is how to provide a high-power chip efficient heat dissipation cooling device with a simple structure and a high compactness, which meets the heat dissipation requirement of local high heat flux density.

SUMMERY OF THE UTILITY MODEL

In view of this, the utility model provides a high-efficiency heat dissipation cooling device for a high-power chip, which meets the heat dissipation requirement of local high heat flux density and has a simple structure and strong compactness.

In order to achieve the purpose, the utility model adopts the following technical scheme:

high-power chip high-efficient heat dissipation cooling device includes: a base plate and a cover plate; the heat dissipation side of the substrate is provided with a micro-channel, and the evaporation side of the substrate is attached to a heat source; the microchannel is arranged in a radiation manner around the heat source joint position; and fluid working media are filled in the micro-channel.

Through the technical scheme, the heat source device has the technical effects that the centers of the micro channels are dense, the edges of the micro channels are sparse, the whole micro channels are in a radial shape with the center diffusing to the edges, the heat source is located at the center, the areas of the heat source and the evaporation area are perfectly matched, and the heat absorption area is increased.

Optionally, in the above high-power chip efficient heat dissipation cooling device, a liquid filling pipe is further included; the liquid charging pipe is communicated with the micro-channel.

Optionally, in the above high-power chip efficient heat dissipation cooling device, the microchannel is a single loop or at least two loops that are in nested communication.

Optionally, in the above high-power chip efficient heat dissipation cooling device, the substrate is provided with a mounting hole; the center of the heat source joint part and the mounting hole are used as boundaries to divide the substrate into a plurality of areas; a plurality of microchannels are provided in each region and one or more microchannels adjacent through the mounting holes are smoothly connected in an arc.

Optionally, in the above high-power chip efficient heat dissipation cooling device, the fluid working medium is one of water, acetone, HFE7X00, R113, R134a, and R1336 mzz.

Optionally, in the above high-power chip efficient heat dissipation cooling device, a heat dissipation fin is further included; the radiating fins are fixedly connected with the base plate in a welding mode.

Optionally, in the above high-power chip efficient heat dissipation cooling device, a heat dissipation fan is further included; the heat radiation fan is arranged above or on the side of the heat radiation fin through the mounting seat.

Optionally, in the above high-power chip efficient heat dissipation cooling device, the mounting hole attaches the substrate to the heat source through a spring bolt.

Further, the micro-channel equivalent diameter D needs to satisfy the following formula:

wherein g is gravitational acceleration ρ_lAnd ρ_gRespectively representing the densities of the liquid working medium and the vapor working medium, and sigma represents the surface tension of the working medium.

According to the technical scheme, compared with the prior art, the high-efficiency heat dissipation cooling device for the high-power chip is provided, the centers of the micro channels are dense, the edges of the micro channels are sparse, the whole micro channels are in a radial shape with the center diffusing to the edges, the heat source is located at the center, the perfect matching of the areas of the heat source and the evaporation area is realized, and the heat absorption area is increased; the microgrooves are tightly arranged, global coverage is realized, heat is simultaneously and uniformly dissipated to the periphery from the evaporation side, heat transfer is carried out to the maximum extent, and temperature uniformity is improved; the micro-channel is approximately symmetrical in arrangement, consistent in equivalent diameter, simple in manufacture and low in cost, and has no extra capillary structure.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the provided drawings without creative efforts.

FIG. 1 is a top view of a conventional solution with an upper cover plate hidden;

FIG. 2(a) is a schematic exploded perspective view of example 1 of the present invention;

FIG. 2(b) is a top view of example 1 of the present invention with the upper cover plate hidden;

FIG. 3(a) is a schematic exploded perspective view of embodiment 2 of the present invention;

FIG. 3(b) is a top view of example 2 of the present invention with the upper cover plate hidden;

FIG. 4(a) is a schematic exploded perspective view of embodiment 3 of the present invention;

FIG. 4(b) is a top view of example 3 of the present invention with the upper cover plate hidden;

FIG. 5(a) is a schematic exploded perspective view of embodiment 4 of the present invention;

FIG. 5(b) is a top view of example 4 of the present invention with the upper cover plate hidden;

FIG. 6 is a schematic diagram of a heat dissipation case including the structure according to the embodiment of the present application;

in the figure: 1. the heat pipe comprises an upper cover plate, 2 parts of a heat conducting base plate, 3 parts of a micro channel, 4 parts of a liquid filling pipe, 5 parts of a mounting hole, 6 parts of a heat source, 7 parts of a flat pulsating heat pipe, 8 parts of a spring bolt and 9 parts of a radiating fin.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be obtained by a person skilled in the art without making any creative effort based on the embodiments in the present invention, belong to the protection scope of the present invention.

The embodiment of the utility model discloses a high-efficiency heat dissipation cooling device for a high-power chip, wherein micro channels are dense in the center and sparse in edge, the whole body is in a radial shape with the center diffusing to the edge, a heat source is arranged in the center, the area of the heat source is perfectly matched with that of an evaporation area, and the heat absorption area is increased; the microgrooves are tightly arranged to realize global coverage, heat is simultaneously and uniformly dissipated to the periphery from the evaporation side, heat transfer is carried out to the maximum extent, and temperature uniformity is improved; the micro-channel is approximately symmetrical in arrangement, consistent in equivalent diameter, simple in manufacture and low in cost, and has no extra capillary structure.

The conventional flat pulsating heat pipe heat dissipation scheme is shown in fig. 1. The microchannels are arranged in parallel in a loop mode, and the processing is simple. However, due to structural limitation, the starting is possible only by filling a large amount of working medium, and the oscillation direction is random in the early stage of starting, so that the pulse is usually caused by wandering near the original position, and the heat is difficult to be quickly and effectively dissipated all around.

In view of this, in the embodiment of the present application, a high-power chip efficient heat dissipation cooling device is provided, and four plate-type pulsating heat pipe structures with different microchannel arrangements are designed. The method mainly comprises the steps of processing a silicon/red copper/aluminum heat-conducting substrate 2 with micro-channels 3 by CNC (computerized numerical control) processing or a printed circuit board etching method, an upper cover plate 1 and a liquid filling pipe 4, and combining the components in a bonding mode, a brazing mode, a molecular diffusion welding mode and an induction welding mode, wherein the combination is shown in figures 2-5. The embodiment meets the heat dissipation requirement of local high heat flux density on the premise of simplifying the manufacturing process, and can be used in the temperature-equalizing heat dissipation and other scenes of ultra-thin electronic chips.

Embodiment 1 discloses a high-efficiency heat dissipation and cooling device for a high-power chip, as shown in fig. 2(a), a plate-type pulsating heat pipe includes an upper cover plate 1, a heat-conducting substrate 2 and a cylindrical liquid-filled pipe 4, which are rectangular and have the same area, and are made of high-heat-conducting materials, such as silicon, red copper and aluminum, to ensure the reliability of heat dissipation. One side of the heat conducting substrate 2 is provided with a micro channel 3, and the other side of the heat conducting substrate is tightly attached to a heat source 6, and the thickness of the heat conducting substrate is set according to the actual use requirement. The upper cover plate 1 is used for attaching and sealing the heat-conducting substrate 2 to form a closed micro-channel space, so that the thickness of the upper cover plate can be thinner than that of the heat-conducting substrate 2, and the requirements of stress caused by internal and external pressure difference and assembly stress can be met.

As shown in fig. 2(b), a rectangular microchannel 3 with an equivalent diameter of 1mm is processed on the heat conducting substrate 2, and the equivalent diameter D of the rectangular microchannel needs to satisfy the following formula, so that working media in the microchannel can be ensured to form vapor/liquid plug alternate distribution.

The channel equivalent diameter D needs to satisfy the following formula:

wherein g is the acceleration of gravity, ρ_lAnd ρ_gRespectively representing the densities of the liquid working medium and the vapor working medium, and sigma represents the surface tension of the working medium.

The plate-type pulsating heat pipe substrate is made of high-heat-conduction materials, the intersection point of diagonal lines of 4 mounting holes on the surface of one side is taken as the center, the vertical line passing through the center and the vertical line are taken as boundary lines, the surface of the plate-type pulsating heat pipe is divided into 4 rectangular areas, and a plurality of micro-channels 3 are arranged in each rectangular area. All the channels are arranged in sequence in a line form, one U-shaped turning part is connected with the liquid filling port, and no outermost fluid working medium converges the channels. In addition, the 4 rectangular areas are smoothly connected in an arc line only through the channel closest to the mounting hole, and the machining difficulty is moderate. The microchannel 3 is in a radial shape with the center diffusing to the edge, heat sources such as an electronic chip and the like are located in the central area of the mounting hole, a rapid transmission path from the point to the surface to the body of heat is formed, working media in a circulation loop are guaranteed to be updated in time and alternately, heat is convenient to distribute from the periphery simultaneously and uniformly, and temperature uniformity is improved.

Embodiment 2 discloses a high-power chip efficient heat dissipation cooling device, as shown in fig. 3(a) (b), which is basically the same as the embodiment, and the same parts are omitted. Except that the equivalent diameter of the microchannels 3 is 2 mm. Accordingly, the channels per unit area are more sparse.

Embodiment 3 discloses a high-power chip efficient heat dissipation cooling device, which is basically the same as embodiment 1, and the same points are omitted as shown in fig. 4(a) and (b). The difference lies in that a circle of fluid working medium gathering channel is processed at a position 1mm away from the edge of the substrate and is also a main channel connected with a liquid filling port, and four rectangular areas are respectively provided with a channel connected with the main channel. In addition, 4 rectangular areas are smoothly connected on the diagonal lines of the 4 mounting holes 5 through a plurality of arc-shaped channels. Compare in

embodiment

1, 2 after the improvement, can realize mutual nested correlation between the microchannel, the pulsation effect influences each other, is favorable to thermal circumference to spill more, promotes the temperature uniformity nature, but the whole processing degree of difficulty is a little higher.

Embodiment 4 discloses a high-power chip efficient heat dissipation cooling device, which is basically the same as embodiment 3, and the same parts are omitted as shown in fig. 5(a) and (b). Except that the equivalent diameter of the microchannels 3 is 2 mm. Accordingly, the channels per unit area are more sparse.

When the heat pump works, the central heat source heats, part of liquid-phase working medium is heated to generate steam bubbles, the long liquid plug is blocked into the short liquid plug, the pressure difference on two sides of the liquid plug is improved, meanwhile, the pressure in the adjacent channels is unbalanced, so that the steam/liquid plug pulsates up and down, and heat is transferred to the periphery. If the heat dissipation space allows, a heat dissipation fin 9 can be additionally arranged on the upper side of the plate type pulsating heat pipe, and the heat dissipation fin 9 is welded on the plate type pulsating heat pipe through low-temperature solder paste; the spring bolt 8 contacts the plate-type pulsating heat pipe with the radiating fins 9 with the heat source 6, and the heat radiating capacity of the cold end is enhanced in a mode of forced convection by a radiating fan, as shown in fig. 6.

The flat pulsating heat pipe circumferential heat expansion mode provided by the embodiment of the application has the advantages of high heat dissipation performance, good temperature uniformity, low processing cost and controllable thickness, and is suitable for heat dissipation of high-heat-flux-density parts such as computer chips, military radars and laser equipment. Particularly, the working principle of the heat pipe is different from that of the traditional heat pipe, the circulating power is mainly that partial heat is converted into steam/liquid plug kinetic energy, and the influence of gravity is small, so that the heat pipe can also be used for heat dissipation of electronic devices in the aerospace field, and the application scenes of the heat pipe are greatly widened.

The embodiments in the present description are described in a progressive manner, each embodiment focuses on differences from other embodiments, and the same and similar parts among the embodiments are referred to each other. The device disclosed by the embodiment corresponds to the method disclosed by the embodiment, so that the description is simple, and the relevant points can be referred to the method part for description.

The previous description of the disclosed embodiments is provided to enable any person skilled in the art to make or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the generic principles defined herein may be applied to other embodiments without departing from the spirit or scope of the utility model. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. The utility model provides a high-efficient heat dissipation cooling device of high-power chip which characterized in that includes: a base plate and a cover plate; the heat dissipation side of the substrate is provided with a micro-channel, and the evaporation side of the substrate is attached to a heat source; the micro-channel is arranged in a radiation manner around the heat source joint; and fluid working media are filled in the micro-channel.

2. The efficient heat dissipation and cooling device for high power chips as claimed in claim 1, further comprising a liquid filling tube; the liquid charging pipe is communicated with the micro-channel.

3. The high power chip efficient heat dissipation cooling device as claimed in claim 1, wherein said micro channels are in single loop or at least two loops in nested communication.

4. The efficient heat dissipation and cooling device for high power chips as claimed in claim 1, wherein the substrate is provided with mounting holes; the center of the heat source joint part and the mounting hole are used as boundaries to divide the substrate into a plurality of areas; a plurality of microchannels are provided in each region and one or more microchannels adjacent through the mounting holes are smoothly connected in an arc.

5. The high-power chip efficient heat dissipation cooling device as claimed in claim 1, wherein the fluid medium is one of water, acetone, HFE7X00, R113, R134a and R1336 mzz.

6. The efficient heat dissipation and cooling device for high power chips as claimed in claim 4, further comprising heat dissipation fins; the radiating fins are fixedly connected with the base plate in a welding mode.

7. The high-power chip efficient heat dissipation cooling device as claimed in claim 6, further comprising a heat dissipation fan; the heat radiation fan is arranged above or on the side of the heat radiation fin through the mounting seat.

8. The efficient heat dissipation and cooling device for high power chips as claimed in claim 6, wherein said mounting holes are used to attach said substrate to said heat source through spring bolts.