CN113251837A - Pulsating heat pipe temperature equalizing plate - Google Patents
Pulsating heat pipe temperature equalizing plate Download PDFInfo
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- CN113251837A CN113251837A CN202110630781.2A CN202110630781A CN113251837A CN 113251837 A CN113251837 A CN 113251837A CN 202110630781 A CN202110630781 A CN 202110630781A CN 113251837 A CN113251837 A CN 113251837A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a pulsating heat pipe temperature-equalizing plate, which comprises a heat-conducting substrate and a heat-conducting cover plate, wherein the heat-conducting substrate and the heat-conducting cover plate are both disc-shaped; the heat conducting substrate is provided with a boiling tank and a micro-channel; the boiling tank is arranged in the center of the heat-conducting substrate and is used for absorbing heat generated by a hot spot at a preset position; the micro channel comprises a plurality of channels which are communicated with the boiling tank and extend along the radial direction of the heat-conducting substrate; the heat-conducting cover plate is attached to the heat-conducting substrate so as to seal the openings of the boiling tank and the micro-channel; one end of each two channels far away from the boiling tank is communicated through a connecting bridge to form a circulation loop; the connecting bridge is provided with a one-way valve, and the circulating loop is filled with working media; the working medium is heated in the boiling tank so as to circularly flow in the same direction in the circulating loop, thereby dissipating heat. The invention has simple processing and assembling process and does not need to adopt a capillary pipeline structure for assembly, thereby reducing the material cost; meanwhile, the defects of repeated oscillation, reverse reflux and the like of the traditional pulsating heat pipe are avoided, and the heat dissipation performance is ensured.
Description
[ technical field ] A method for producing a semiconductor device
The invention relates to the technical field of electronic equipment, in particular to a pulsating heat pipe temperature-equalizing plate.
[ background of the invention ]
With the increase of integration level of electronic packages and the increasing of chip performance and power consumption, heat accumulation occurs at local positions inside electronic devices. Therefore, heat dissipation is required at the portion where heat is accumulated. The commonly used temperature-equalizing heat-dissipating materials in electronic devices, particularly consumer electronics, include graphite, copper foil, nano carbon copper and the like, but the heat conductivity coefficient is limited and cannot meet higher heat-dissipating requirements, so that two-phase liquid cooling devices such as heat pipes, temperature-equalizing plates and the like appear.
However, devices such as heat pipes and vapor chambers require an ultra-thin wick structure, which requires a high process and costs correspondingly, and thus prevents the application of two-phase liquid cooling technology in consumer electronics. The pulsating heat pipe well combines the advantages of high heat transfer limit, low cost and simple structure, and is one of the most potential ways for heat dissipation of miniaturized high heat flow density equipment in the future. However, the conventional pulsating heat pipe has the defects of repeated oscillation, reverse reflux and the like, and the performance of the heat pipe is reduced to a certain extent; in addition, the traditional pulsating heat pipe is complex in machining and assembling process and high in material cost.
In view of the above, it is desirable to provide a pulsating heat pipe temperature equalization plate to overcome the above-mentioned drawbacks.
[ summary of the invention ]
The invention aims to provide a pulsating heat pipe temperature equalizing plate, which aims to solve the problem that the performance of a traditional pulsating heat pipe is reduced to a certain extent due to the defects of repeated oscillation, reverse reflux and the like, simplify the processing and assembling process of the pulsating heat pipe and reduce the material cost.
In order to achieve the above object, the present invention provides a pulsating heat pipe temperature equalization plate, comprising a heat conduction substrate and a heat conduction cover plate, both of which are disc-shaped; the heat conducting substrate is provided with a boiling tank and a micro-channel; the boiling tank is arranged in the center of the heat-conducting substrate and is used for absorbing heat generated by a hot spot at a preset position; the micro-channel comprises a plurality of channels which are communicated with the boiling tank and extend along the radial direction of the heat-conducting substrate; the heat-conducting cover plate is attached to the heat-conducting substrate so as to seal the openings of the boiling tank and the micro-channel; one end of each two of the channels, which is far away from the boiling tank, is communicated through a connecting bridge to form a circulation loop; the connecting bridge is provided with a one-way valve, and the circulating loop is filled with working media; the working medium is heated by the hot spot in the boiling tank so as to circularly flow in the same direction in the circulating loop, and then the heat of the hot spot is transferred to one side of the micro-channel, which is far away from the boiling tank, so as to dissipate the heat.
In a preferred embodiment, the channel is a multi-level fractal structure.
In a preferred embodiment, the channels of the next stage are arranged on the basis of the channels of the previous stage at equal intervals and vertically extend towards two sides; the width of each stage of channel meets the default requirementLaw of miles Wj＝W1Aj(j-1, 2, …, M-1), wherein W1The width of the first-stage channel is shown, A is the fractal dimension of the width, and M is the fractal progression.
In a preferred embodiment, the distance between the same-stage channels is defined as L, and the spacing between different-stage channels satisfies the configuration principle Lj＝L2Bj(j-1, 2, …, M-2), wherein L2Is the spacing between the second stage channels, and B is the fractal dimension of the spacing.
In a preferred embodiment, the lengths of the slots of the same stage are arranged in an arithmetic progression from one end adjacent the bridge to the other end adjacent the boil sump.
In a preferred embodiment, the one-way valve is a tesla valve; the Tesla valve comprises Y-shaped unit bodies with preset quantity, and the branches of the Y-shaped unit bodies are arranged at preset angles.
In a preferred embodiment, a side of the heat-conducting cover plate away from the heat-conducting base is provided with a plurality of heat-radiating fins arranged at equal intervals; the heat dissipation fins are perpendicular to the surface of the heat conduction cover plate.
In a preferred embodiment, the channel has a cross-section that is one of rectangular, semi-circular and triangular.
In a preferred embodiment, the distance between the bottom surface of the channel and the surface of the thermally conductive substrate on the side remote from the microchannels corresponds to the thickness of the thermally conductive cover sheet.
In a preferred embodiment, the working fluid is at least one of ultrapure water, methanol and acetone.
According to the pulsating heat pipe temperature equalizing plate provided by the invention, the boiling groove and the micro-channel are directly formed on the heat conducting substrate, and then the boiling groove and the micro-channel are sealed through the heat conducting cover plate, so that the function of the capillary structure of the traditional pulsating heat pipe is realized, the processing and assembling process is simple, the capillary structure is not required to be adopted for assembling, and the material cost is reduced. The heat absorbed by the boiling grooves on the heat conducting substrate is conducted through the radial grooves, so that the heat transfer speed is high, and the heat dissipation requirement of ultrahigh local heat flux density can be met. In addition, the one-way valve is arranged in the circulation loop, so that the working medium can only flow in the circulation loop in a single direction, the defects of repeated oscillation, reverse reflux and the like of the traditional pulsating heat pipe are avoided, and the heat dissipation performance is ensured.
[ description of the drawings ]
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present invention and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained according to the drawings without inventive efforts.
FIG. 1 is a top view of a pulsating heat pipe temperature equalization plate provided by the present invention with a heat conductive cover hidden;
FIG. 2 is an exploded perspective view of the pulsating heat pipe temperature equalization plate shown in FIG. 1;
FIG. 3 is a schematic diagram illustrating a heat dissipation direction of the pulsating heat pipe temperature-uniforming plate shown in FIG. 1;
FIG. 4 is a distribution diagram of the working medium of the pulsating heat pipe temperature-uniforming plate shown in FIG. 1 in the circulation loop;
FIG. 5 is a schematic diagram of a pulsating heat pipe temperature-uniforming plate according to the present invention, in which the grooves have different fractal stages;
fig. 6 is a top view of a heat conducting substrate of a pulsating heat pipe vapor chamber provided by the present invention when M is 1;
fig. 7 is a top view of a heat conducting substrate of a pulsating heat pipe vapor chamber provided by the present invention when M is 2;
fig. 8 is a top view of a heat conducting substrate of a pulsating heat pipe vapor chamber provided by the present invention when M is 3;
FIG. 9 is a schematic diagram of the operation of a Tesla valve in the pulsating heat pipe temperature equalization plate according to the present invention;
fig. 10 is a front half-sectional view of another embodiment of a pulsating heat pipe temperature equalization plate provided by the present invention.
Reference numbers in the figures: 100. a pulsating heat pipe temperature equalizing plate; 10. a thermally conductive substrate; 20. a heat conducting cover plate; 30. a boiling tank; 40. a microchannel; 41. a channel; 50. a connecting bridge; 60. working medium; 61. gaseous working medium; 62. a liquid working medium; 70. a one-way valve; 71. a Y-shaped unit cell; 80. and heat dissipation fins.
[ detailed description ] embodiments
In order to make the objects, technical solutions and advantageous effects of the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and the detailed description. It should be understood that the detailed description and specific examples, while indicating the preferred embodiment of the invention, are intended for purposes of illustration only and are not intended to limit the scope of the invention.
It is also to be understood that the terminology used in the description of the invention herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. As used in the specification of the present invention and the appended claims, the singular forms "a," "an," and "the" are intended to include the plural forms as well, unless the context clearly indicates otherwise.
It should be further understood that the term "and/or" as used in this specification and the appended claims refers to and includes any and all possible combinations of one or more of the associated listed items.
In the embodiment of the present invention, a pulsating heat pipe temperature-equalizing plate 100 is provided, which can meet the heat dissipation requirement of ultrahigh local heat flux density on the premise of simplifying the manufacturing process, and can be applied to the temperature-equalizing heat dissipation of ultra-thin electronic devices and other scenes.
As shown in fig. 2, the pulsating heat pipe temperature equalization plate 100 includes a heat conductive substrate 10 and a heat conductive cover plate 20, both of which are disk-shaped. In the present embodiment, the heat conducting substrate 10 and the heat conducting cover plate 20 are both disc-shaped and have the same area, and are made of high heat conducting metal or alloy, such as red copper, aluminum, silver, etc., to ensure the reliability of heat dissipation. The thicknesses of the heat-conducting substrate 10 and the heat-conducting cover plate 20 are set according to actual use requirements. Specifically, the thickness of the heat conductive substrate 10 may be adjusted according to the space of actual assembly. The heat conductive cover plate 20 is used to attach and seal the heat conductive substrate 10, so the thickness can be set to be thinner than that of the heat conductive substrate 10, thereby ensuring that the requirements of stress and assembly stress caused by the difference between the internal pressure and the external pressure can be satisfied.
As shown in fig. 1, 3 and 10, the heat conducting substrate 10 is provided with a boiling tank 30 and a micro-channel 40. The boiling bath 30 is provided at the center of the heat conductive substrate 10 to absorb heat generated from the hot spot 200 at a predetermined position. When the heat conducting cover plate 20 closes the opening at the top of the boiling tank 30, the boiling tank 30 forms a boiling cavity structure. In the present embodiment, the boiling tank 30 has a circular shape concentrically disposed with the heat conductive substrate 10, and has a size slightly larger than the area of the hot spot 200. The hot spot 200 may be a device having a large local heat generation amount, such as an external CPU (central processing unit).
As shown in fig. 6-8, the microchannels 40 include a plurality of channels 41 each in communication with the boiling slots 30 and extending radially along the thermally conductive substrate 10. That is, one end of each of the channels 41 communicates with the boiling groove 30, and the other end extends in the radial direction of the heat conductive substrate 10, so that the plurality of channels 41 are entirely radially extended from the center to the edge. The plurality of channels 41 are arranged around the boiling tank 30 at equal angles to ensure uniformity of heat dissipation. Specifically, the microchannels 40 may be realized by directly forming grooves on the heat conductive substrate 10, and when the heat conductive cover plate 20 closes the opening at the top of the microchannels 40, the microchannels 40 are equivalent to the capillary structure of a conventional heat pipe, i.e., the microchannels 40 may function as the conventional capillary structure. For ease of manufacture and assembly, the cross-section of the channel 41 may be of regular geometric shapes such as rectangular, semi-circular and triangular. I.e. the cross-section of the channel 41 is perpendicular to the radial direction of the heat conducting substrate 10; that is, the channel 41 is formed by extending the cross section in a regular geometric shape such as a rectangle, a semicircle and a triangle in the radial direction of the heat conductive substrate 10 with the boiling groove 30 as a starting point. The distance between the bottom surface of the channel 41 and the bottom surface of the heat conducting substrate 10 is consistent with the thickness of the heat conducting cover plate 20, that is, the distance between the upper side and the lower side of the micro channel 40 is the same, which is convenient for heat to be simultaneously and uniformly emitted from the two sides of the micro channel 40, and the temperature uniformity is improved. Wherein the bottom surface of the heat conductive substrate 10 is defined as the surface of the heat conductive substrate 10 on the side away from the microchannel 40.
Further, in one embodiment, as shown in fig. 5 to 8, the channel 41 is a multi-stage fractal structure, and the structural size of each stage of channel 41 satisfies a certain bionic principle. As shown in fig. 5, fig. 5a is a schematic diagram of a circulation loop when the fractal number M is 1, which corresponds to the structure of the microchannel 40 in fig. 6; fig. 5b is a schematic diagram of a circulation loop with a fractal order number M of 2, corresponding to the structure of the microchannel 40 in fig. 7; fig. 5c is a schematic diagram of a circulation loop when the fractal number M is 3, corresponding to the structure of the microchannel 40 in fig. 8.
Specifically, the lower-stage channels are arranged on the basis of the upper-stage channels at equal intervals and vertically extend towards two sides; the width of each stage of the slot 41 satisfies the law of Muli Wj＝W1Aj(j-1, 2, …, M-1), wherein W1The width of the first-stage channel is shown, M is a fractal series, and A is a fractal dimension of the width. Generally A is less than or equal to 1, and 1/2 is taken for reducing the flow resistance according to the law of bionics to have better effect.
In addition, the distance between the same-level channels can be defined as L, and the space between different-level channels meets the configuration principle Lj＝L2Bj(j-1, 2, …, M-2), wherein L2Is the spacing between the second stage channels, and B is the fractal dimension of the spacing. Typically B.ltoreq.1.
Wherein, the length S of the same-step channels is arranged in an equal-difference array along the direction from one end close to the connecting bridge 50 to one end close to the boiling tank 30, the maximum tolerance is determined by the radial outermost channel, and the adjacent outermost channels are ensured not to have the crossing phenomenon. Namely, the length S of the channels of different stages can be adjusted according to the actual structure size, and meanwhile, the phenomenon of crossing of the channels of different stages can be avoided. For example, S2I.e., the length of the next stage channel extending from the previous stage channel.
As can be seen from the figure, with the increase of the fractal progression M, the effective area of the microchannels 40 on the heat conducting substrate 10 also increases continuously, which also greatly increases the comparative area of heat exchange and enhances the heat exchange capability of the temperature equalization plate. Meanwhile, the channel 41 is designed into a fractal structure according to the bionics principle, a rapid transmission path from a point to a surface to a body of heat is formed, flowing resistance can be reduced to the maximum extent, flowing resistance loss is effectively reduced, timely alternate updating of the working medium 60 in the circulation loop is guaranteed, and circulating flowing of the internal working medium 60 is accelerated.
In the embodiment of the present invention, as shown in fig. 1, fig. 3 and fig. 4, one end of each two channels 41 (i.e., the radial channel with M ═ 1) away from the boiling tank 30 is communicated through the connecting bridge 50 to form a circulation loop, and the circulation loop is filled with the working medium 60. I.e. working medium 60 can flow in boiling tank 30, two radial channels 41 and connecting bridge 50. The working medium 60 may be ultrapure water, methanol, acetone, or the like, or the working medium 60 may be doped with nanoparticles to form nanofluid to further enhance heat exchange. It should be noted that, as shown in fig. 4, the working medium 60 has two forms, i.e., a gaseous working medium 61 and a liquid working medium 62, in the circulation loop.
For example, the boiling slot 30 may be attached to the hot spot 200 (e.g., a heat-generating chip). When the heating chip generates heat, the working medium 60 is heated by the hot spot 200 in the boiling tank 30 to generate a large amount of bubbles and steam, the bubbles are pushed into each circulation loop to be condensed to release heat, and then the heat of the hot spot 200 is transferred to one side of the micro-channel 40 away from the boiling tank 30 to be radiated. Certainly, the working medium 60 begins to dissipate heat when leaving the boiling tank 30, so that the heat is prevented from being locally accumulated in the electronic equipment, and the temperature uniformity of the electronic equipment is improved. In addition, two adjacent channels 41 are interconnected through the connecting bridge 50 to form a circulation loop with the function of a pulsating heat pipe, so that the stability and the transmission capacity of the operation of the heat pipe are improved.
As shown in fig. 4, the connecting bridge 50 is provided with a one-way valve 70, so that the working medium 60 circularly flows in the same direction in the circulation loop, the oscillation of the working medium 60 is in a state similar to one-way circulation, and the directional transfer of heat is ensured.
Specifically, the check valve 70 is a Tesla valve. As shown in fig. 9, the tesla valve 70 includes a predetermined number of Y-shaped unit bodies 71, and the branches of the Y-shaped unit bodies 71 are arranged at a predetermined angle. The tesla valve 70 is a one-way valve without moving parts, which is composed of a series of straight pipes and bent pipes, and the branching angle and the number of the Y-shaped unit bodies 71 can be adjusted according to the actual structure to ensure a high forward and reverse flow resistance ratio. Fig. 9a shows the flow direction of the tesla valve, and fig. 9b and 9c show the flow field inside the tesla valve 70 in the forward acceleration and reverse check states, respectively. As shown in fig. 9b, it can be clearly seen from the schematic flow field diagram that when the working medium 60 flows through the tesla valve 70 in the forward direction, the flow direction of the fluid in the merged segment of the working medium 60 of each Y-shaped unit body 71 is consistent, and the cross-sectional area is reduced after the merging, so as to accelerate the working medium 60. As shown in fig. 9c, when the fluid flows in the reverse direction, one of the fluids is reversed after passing through the Y-shaped unit body 71, and the flow direction of the fluid is opposite to that of the other fluid, and the two fluids collide to generate a vortex, thereby causing energy loss of the flow, the more the Y-shaped unit body 71, the greater the corresponding flow resistance, the greater the flow resistance ratio of the forward flow to the reverse flow of the tesla valve 70, and the more the one-way valve characteristic can be exhibited.
In this embodiment, the working medium 60 is injected into the circulation circuit in a vacuum pumping and filling manner, and the working medium 60 is distributed in a disordered gas-liquid two-phase slug manner inside the circulation circuit because the circulation circuit does not include a wick in a conventional design. When the boiling tank 30 is heated to generate a large amount of bubbles and steam, the working medium 60 exhibits a periodic oscillation characteristic due to the pressure difference. However, due to the existence of the one-way tesla valve 70, the oscillation of the working medium 60 is in a state similar to one-way circulation, and the directional transmission of heat is ensured.
Further, if the heat dissipation space is sufficient, as shown in fig. 10, a plurality of heat dissipation fins 80 may be disposed on a side of the heat conductive cover plate 20 away from the heat conductive base 10. The heat dissipation fins 80 are perpendicular to the surface of the heat conductive cover plate 20, so that the heat dissipation capability of the cold end is further enhanced, and the problem that local hot spots cannot be naturally dissipated or forcibly cooled is effectively solved through the heat dissipation method. Because the sensitivity of pulsating heat pipe to gravity is not high, extension through the cold junction for example increase forced air cooling or the radiation fin can with the utility model discloses be applied to the samming heat dissipation of high heat flux density heat source such as space shuttle, military electronic equipment.
In summary, the pulsating heat pipe temperature equalization plate 100 provided by the present invention directly forms the boiling tank 30 and the micro channel 40 on the heat conducting substrate 10, and then seals the boiling tank 30 and the micro channel 40 through the heat conducting cover plate 20, so as to implement the function of the capillary structure of the conventional pulsating heat pipe, and the processing and assembling process is simple, and the capillary structure is not required for assembly, thereby reducing the material cost. By conducting the heat absorbed by the boiling troughs 30 of the heat conducting substrate 10 through the radial channels 41, the heat transfer speed is high, and the heat dissipation requirement of ultrahigh local heat flux density can be met. In addition, the one-way valve 70 is arranged in the circulation loop, so that the working medium 60 can only flow in a single direction in the circulation loop, the defects of repeated oscillation, reverse reflux and the like of the traditional pulsating heat pipe are avoided, and the heat dissipation performance is ensured. The invention adopts the capillary-core-free flat pulsating heat pipe as the heat transfer unit, can greatly reduce the processing difficulty and the production cost, has controllable thickness, can almost adapt to all common application scenes, and can promote the application of the two-phase liquid cooling technology in consumer electronic products.
The invention is not limited solely to that described in the specification and embodiments, and additional advantages and modifications will readily occur to those skilled in the art, so that the invention is not limited to the specific details, representative apparatus, and illustrative examples shown and described herein, without departing from the spirit and scope of the general concept as defined by the appended claims and their equivalents.
Claims (10)
1. A pulsating heat pipe temperature equalizing plate is characterized by comprising a heat conducting substrate and a heat conducting cover plate which are both disc-shaped; the heat conducting substrate is provided with a boiling tank and a micro-channel; the boiling tank is arranged in the center of the heat-conducting substrate and is used for absorbing heat generated by a hot spot at a preset position; the micro-channel comprises a plurality of channels which are communicated with the boiling tank and extend along the radial direction of the heat-conducting substrate; the heat-conducting cover plate is attached to the heat-conducting substrate so as to seal the openings of the boiling tank and the micro-channel; one end of each two of the channels, which is far away from the boiling tank, is communicated through a connecting bridge to form a circulation loop; the connecting bridge is provided with a one-way valve, and the circulating loop is filled with working media; the working medium is heated by the hot spot in the boiling tank so as to circularly flow in the same direction in the circulating loop, and then the heat of the hot spot is transferred to one side of the micro-channel, which is far away from the boiling tank, so as to dissipate the heat.
2. The pulsating heat pipe temperature equalization plate of claim 1, wherein said channel is a multi-level fractal structure.
3. A pulsating heat pipe temperature equalization plate as defined in claim 2, wherein the next stage channels are equally spaced on the basis of the previous stage channels and extend vertically to both sides; the width of each stage of channel satisfies the law of murre Wj＝W1Aj(j-1, 2, …, M-1), wherein W1The width of the first-stage channel is shown, A is the fractal dimension of the width, and M is the fractal progression.
4. A pulsating heat pipe temperature-uniforming plate as claimed in claim 3, wherein a distance between the same-stage channels is defined as L, and a spacing between different-stage channels satisfies a configuration principle Lj＝L2Bj(j-1, 2, …, M-2), wherein L2Is the spacing between the second stage channels, and B is the fractal dimension of the spacing.
5. A pulsating heat pipe temperature equalization plate as defined in claim 3, wherein the length of the channels of the same stage are arranged in an arithmetic progression from one end adjacent to the bridge to the other end adjacent to the boiling trough.
6. A pulsating heat pipe temperature equalization plate as defined in claim 1, wherein said check valve is a tesla valve; the Tesla valve comprises Y-shaped unit bodies with preset quantity, and the branches of the Y-shaped unit bodies are arranged at preset angles.
7. A pulsating heat pipe temperature-uniforming plate as claimed in claim 1, wherein a side of said heat-conducting cover plate away from said heat-conducting base is provided with a plurality of heat-dissipating fins arranged at equal intervals; the heat dissipation fins are perpendicular to the surface of the heat conduction cover plate.
8. A pulsating heat pipe temperature equalization plate as defined in claim 1, wherein said channel has a cross-section that is one of rectangular, semi-circular, and triangular.
9. A pulsating heat pipe temperature equalization plate as defined in claim 1, wherein a distance between a bottom surface of said channel and a bottom surface of said thermally conductive base corresponds to a thickness of said thermally conductive cover plate.
10. A pulsating heat pipe temperature-uniforming plate as claimed in claim 1, wherein said working substance is at least one of ultrapure water, methanol and acetone.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202110630781.2A CN113251837A (en) | 2021-06-07 | 2021-06-07 | Pulsating heat pipe temperature equalizing plate |
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| CN202110630781.2A CN113251837A (en) | 2021-06-07 | 2021-06-07 | Pulsating heat pipe temperature equalizing plate |
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| CN202110630781.2A Pending CN113251837A (en) | 2021-06-07 | 2021-06-07 | Pulsating heat pipe temperature equalizing plate |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114745910A (en) * | 2022-03-30 | 2022-07-12 | 联想(北京)有限公司 | Heat dissipation device and electronic equipment |
| CN115540641A (en) * | 2022-09-30 | 2022-12-30 | 东南大学 | Tesla type micro-channel flowing boiling heat exchanger and preparation method thereof |
| TWI808656B (en) * | 2022-02-18 | 2023-07-11 | 建準電機工業股份有限公司 | Liquid cooling device and liquid cooling system having the liquid cooling device |
| CN116464293A (en) * | 2023-05-15 | 2023-07-21 | 中建八局第四建设有限公司 | Water circulation heating and temperature rising system for stretching of slow-bonding prestressed tendons under low-temperature condition |
| EP4319517A1 (en) * | 2022-08-02 | 2024-02-07 | Vast Glory Electronic & Hardware & Plastic (Hui Zhou) Ltd | Heat dissipating device |
| EP4317888A1 (en) * | 2022-08-02 | 2024-02-07 | Vast Glory Electronic & Hardware & Plastic (Hui Zhou) Ltd | Heat dissipating device |
-
2021
- 2021-06-07 CN CN202110630781.2A patent/CN113251837A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI808656B (en) * | 2022-02-18 | 2023-07-11 | 建準電機工業股份有限公司 | Liquid cooling device and liquid cooling system having the liquid cooling device |
| CN114745910A (en) * | 2022-03-30 | 2022-07-12 | 联想(北京)有限公司 | Heat dissipation device and electronic equipment |
| EP4319517A1 (en) * | 2022-08-02 | 2024-02-07 | Vast Glory Electronic & Hardware & Plastic (Hui Zhou) Ltd | Heat dissipating device |
| EP4317888A1 (en) * | 2022-08-02 | 2024-02-07 | Vast Glory Electronic & Hardware & Plastic (Hui Zhou) Ltd | Heat dissipating device |
| CN115540641A (en) * | 2022-09-30 | 2022-12-30 | 东南大学 | Tesla type micro-channel flowing boiling heat exchanger and preparation method thereof |
| CN115540641B (en) * | 2022-09-30 | 2023-06-16 | 东南大学 | Tesla type micro-channel flow boiling heat exchanger and preparation method thereof |
| CN116464293A (en) * | 2023-05-15 | 2023-07-21 | 中建八局第四建设有限公司 | Water circulation heating and temperature rising system for stretching of slow-bonding prestressed tendons under low-temperature condition |
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