CN113053840B - Bionic double-loop three-dimensional micro-channel heat dissipation device - Google Patents
Bionic double-loop three-dimensional micro-channel heat dissipation device Download PDFInfo
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- CN113053840B CN113053840B CN202110261270.8A CN202110261270A CN113053840B CN 113053840 B CN113053840 B CN 113053840B CN 202110261270 A CN202110261270 A CN 202110261270A CN 113053840 B CN113053840 B CN 113053840B
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- 239000011664 nicotinic acid Substances 0.000 title claims abstract description 65
- 230000017525 heat dissipation Effects 0.000 title claims abstract description 26
- 239000007788 liquid Substances 0.000 claims abstract description 43
- 238000001704 evaporation Methods 0.000 claims abstract description 21
- 239000000758 substrate Substances 0.000 claims abstract description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims abstract description 16
- 229910052802 copper Inorganic materials 0.000 claims abstract description 16
- 239000010949 copper Substances 0.000 claims abstract description 16
- 230000008020 evaporation Effects 0.000 claims abstract description 13
- 238000009833 condensation Methods 0.000 claims abstract description 11
- 230000005494 condensation Effects 0.000 claims abstract description 11
- 230000010349 pulsation Effects 0.000 claims description 5
- 230000008016 vaporization Effects 0.000 claims description 4
- 238000009834 vaporization Methods 0.000 claims description 2
- 210000003462 vein Anatomy 0.000 claims description 2
- 238000012546 transfer Methods 0.000 abstract description 7
- 239000012535 impurity Substances 0.000 abstract description 5
- 239000000126 substance Substances 0.000 abstract description 2
- 239000012071 phase Substances 0.000 description 23
- 239000010410 layer Substances 0.000 description 12
- 238000000034 method Methods 0.000 description 10
- 230000008569 process Effects 0.000 description 7
- 238000001816 cooling Methods 0.000 description 4
- 238000010586 diagram Methods 0.000 description 4
- 229910003460 diamond Inorganic materials 0.000 description 4
- 239000010432 diamond Substances 0.000 description 4
- 230000004907 flux Effects 0.000 description 4
- 238000005516 engineering process Methods 0.000 description 3
- AHADSRNLHOHMQK-UHFFFAOYSA-N methylidenecopper Chemical compound [Cu].[C] AHADSRNLHOHMQK-UHFFFAOYSA-N 0.000 description 3
- 239000002103 nanocoating Substances 0.000 description 3
- 230000007704 transition Effects 0.000 description 3
- 230000033228 biological regulation Effects 0.000 description 2
- 230000005540 biological transmission Effects 0.000 description 2
- 230000008859 change Effects 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 239000000110 cooling liquid Substances 0.000 description 2
- 238000011161 development Methods 0.000 description 2
- 238000009792 diffusion process Methods 0.000 description 2
- 239000012530 fluid Substances 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 238000004377 microelectronic Methods 0.000 description 2
- 239000002070 nanowire Substances 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000011148 porous material Substances 0.000 description 2
- 238000012545 processing Methods 0.000 description 2
- 238000002791 soaking Methods 0.000 description 2
- 238000011144 upstream manufacturing Methods 0.000 description 2
- 238000003466 welding Methods 0.000 description 2
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000003592 biomimetic effect Effects 0.000 description 1
- 239000004020 conductor Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 238000013461 design Methods 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005265 energy consumption Methods 0.000 description 1
- 229910021389 graphene Inorganic materials 0.000 description 1
- 238000005098 hot rolling Methods 0.000 description 1
- 230000010354 integration Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000011160 research Methods 0.000 description 1
- 238000004088 simulation Methods 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 238000003746 solid phase reaction Methods 0.000 description 1
- 238000002490 spark plasma sintering Methods 0.000 description 1
- 238000004381 surface treatment Methods 0.000 description 1
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3672—Foil-like cooling fins or heat sinks
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
- H01L23/4735—Jet impingement
Abstract
The invention relates to a bionic double-loop three-dimensional micro-channel heat dissipation device, belonging to the field of heat dissipation of electronic devices; the device comprises a copper-based high-heat-conductivity substrate, a self-driven two-phase temperature equalization loop and a three-dimensional bionic heat exchange loop which are arranged in the copper-based high-heat-conductivity substrate; the self-driven two-phase temperature equalizing circuit is positioned on the inner bottom surface of the copper-based high-heat-conductivity substrate, and the three-dimensional bionic heat exchange circuit is nested above the self-driven two-phase temperature equalizing circuit; the self-driven two-phase temperature equalization loop is of a closed circulation structure filled with working liquid and comprises an evaporation section and a condensation section; the three-dimensional bionic heat exchange loop is an open circulation structure filled with working liquid, takes the central point as the midpoint and is outwards radial, and comprises an upper sub-loop and a lower sub-loop, wherein the lower sub-loop is nested on the condensing section. The three-dimensional bionic heat exchange circuit is distributed in multiple layers in a three-dimensional space, each layer is a bionic venation structure conforming to Murray law, and the structure has unique advantages in the aspects of substance transportation and energy transfer, has the characteristics of low flow resistance and good impurity capacity, and simultaneously increases the heat exchange surface area.
Description
Technical Field
The invention belongs to the field of electronic device heat dissipation, and particularly relates to a bionic double-loop three-dimensional micro-channel heat dissipation device.
Background
The microelectronics industry has evolved dramatically over the last decades, with dramatic improvements in the performance of electrical/electronic devices such as integrated circuit chips, phased array antennas, high power lasers, etc., and with a trend toward high integration, scalability, and miniaturization. The joule heat generated in the operation process of the electronic device can not be effectively reduced, and the overall performance and reliability of the system are seriously restricted by the temperature rise caused by the joule heat. The problem of heat dissipation has become a major bottleneck limiting the development of the microelectronics industry.
With the development of electronic systems, various efficient heat dissipation techniques have been developed. The microchannel heat dissipation technology has the advantages of large heat dissipation potential, simple and reliable modes and the like, is expected by the industry, and becomes a research hot spot at home and abroad. The current heat dissipation device mainly focuses on the impingement jet cooling technology and the conventional micro-channel cooling technology.
The invention patent CN110769642A relates to a jet radiator which consists of a substrate, a jet orifice plate and a diamond nano coating, wherein the diamond nano coating is attached to the substrate and a chip, and liquid passes through the jet orifice plate to form jet to impact the surface of the diamond nano coating for heat exchange. The self-adaptive regulation and control performance is poor, the self-adaptive regulation and control performance is sensitive to heat flow density and flow parameters, the requirement on the back pressure of a system is high, and the performance is unstable under variable working conditions; the economy is poor.
The invention patent CN109755199a relates to a jet radiator with a pit type micro-channel, wherein the micro-channel is formed by pits and jet pipes on a substrate, and the cooling liquid is subjected to heat exchange through the channel and is discharged. The jet pressure of each hole of the device is difficult to ensure, and the heat exchange is uneven; poor impurity capacity and easy blockage at jet pipes and pits.
The invention patent CN111415915a relates to a two-dimensional microchannel radiator structure formed by rib plate columns. The pressure difference at two sides of the device is overlarge, and the heat dissipation capacity of the plane surface is uneven.
The invention patent CN109275311B relates to a three-dimensional micro-channel and a pulsating flow heat dissipation device. The micro-channel of the device has a three-dimensional structure, but the temperature of the heat conducting material substrate is not uniform, and the problem of local ultrahigh heat flux density can occur.
Disclosure of Invention
The technical problems to be solved are as follows:
in order to avoid the defects of the prior art, the invention provides a bionic double-loop three-dimensional microchannel heat dissipation device, which solves the problems of uneven temperature, limited heat exchange capacity and poor impurity containing capacity in a radiator. In the double-loop heat dissipation configuration, the self-driven two-phase temperature equalization loop is driven by temperature difference, so that high-efficiency three-dimensional body diffusion of ultra-high heat flow can be realized, and the crisis of local ultra-high heat flow density is broken; the three-dimensional bionic heat exchange circuit is closely nested with the space of the three-dimensional bionic heat exchange circuit, so that the heat exchange area is greatly increased, the high-efficiency heat emission of a high-power and ultrahigh-heat-flux chip is realized, and the bionic heat exchange circuit has stronger impurity capacity.
The technical scheme of the invention is as follows: a bionic double-loop three-dimensional micro-channel heat dissipation device is characterized in that: the device comprises a copper-based high-heat-conductivity substrate, a self-driven two-phase temperature equalization loop and a three-dimensional bionic heat exchange loop which are arranged in the copper-based high-heat-conductivity substrate; the self-driven two-phase temperature equalization circuit is positioned on the inner bottom surface of the copper-based high-heat-conductivity substrate, and the three-dimensional bionic heat exchange circuit is nested above the self-driven two-phase temperature equalization circuit;
the self-driven two-phase temperature equalization loop is of a closed circulation structure filled with working liquid and comprises an evaporation section and a condensation section; the evaporation section is positioned at the bottom and close to the heat source, and the liquid channels of the evaporation section are arranged in the isothermal surface in a reciprocating manner and are used for absorbing the heat of the heat source and vaporizing the working liquid; the condensing section is positioned above the evaporating section and is used for releasing heat and liquefying the vaporization working liquid of the evaporating section again, so that the heat at the heat source can be rapidly and uniformly diffused into the whole heat dissipating device;
the three-dimensional bionic heat exchange loop is of an open circulation structure filled with working liquid, takes the central point of the three-dimensional bionic heat exchange loop as a midpoint, and is outwards radial, and comprises an upper sub-loop, a lower sub-loop, an inlet pipeline and an outlet pipeline, wherein the lower sub-loop is nested on the condensation section, and the upper sub-loop is positioned right above the lower sub-loop; each sub-loop is composed of an upper layer liquid channel and a lower layer liquid channel, condensate diffuses from the upper layer and is recovered from the lower layer, and the sub-loops are connected in series by two main channels; the upper layer of each sub-loop is connected with an inlet pipeline, the lower layer is connected with an outlet pipeline, and meanwhile, the inlet pipeline and the outlet pipeline are externally connected with a pulsation pump, and the pulsation pump drives the circulation of working liquid in the three-dimensional bionic heat exchange loop so as to realize heat dissipation.
The invention further adopts the technical scheme that: the liquid channel of the evaporation section is parallel to the inner bottom surface of the copper-based high-heat-conductivity substrate and is arranged in a reciprocating manner along the radial direction by taking the central point of the liquid channel as the middle point.
The invention further adopts the technical scheme that: the liquid channel of the condensing section is perpendicular to the liquid channel of the evaporating section, and is outwards radial with the central axis as a midpoint, and is arranged in a reciprocating manner along the vertical direction.
The invention further adopts the technical scheme that: the liquid channels of the upper sub-loop are wavy, the upper layer liquid channel and the lower layer liquid channel are parallel to each other, and radiate outwards along the radial direction from the central axis of the three-dimensional bionic heat exchange loop and are communicated at the periphery.
The invention further adopts the technical scheme that: the upper liquid channel of the lower sub-loop is wavy and parallel to the liquid channel of the upper sub-loop, and radiates outwards along the radial direction from the central axis of the three-dimensional bionic heat exchange loop; the lower liquid channels are arranged in a reciprocating manner along the vertical direction and are nested on the condensation section.
The invention further adopts the technical scheme that: the inlet pipeline and the outlet pipeline are arranged along the vertical direction and are positioned above the middle of the heat dissipation device.
The invention further adopts the technical scheme that: the three-dimensional bionic heat exchange loop follows the bionic vein structure of Murray law.
Advantageous effects
The invention has the beneficial effects that: the self-driven two-phase temperature equalization loop is uniformly distributed in the heat dissipation device, the evaporation section of the self-driven two-phase temperature equalization loop is close to a heat source, the condensation section of the self-driven two-phase temperature equalization loop is nested with the three-dimensional bionic heat exchange loop, and the heat conduction capability of the self-driven two-phase temperature equalization loop exceeds that of any known metal due to the rapid heat transfer property of a phase change medium, so that the heat of the heat source can be rapidly and uniformly and rapidly diffused into the whole heat dissipation device, the whole temperature is ensured to be uniform, the problem of local ultrahigh heat flow density is avoided, and the three-dimensional bionic heat exchange loop is convenient to transfer heat.
The three-dimensional bionic heat exchange circuit is distributed in multiple layers in a three-dimensional space, each layer is a bionic venation structure conforming to Murray law, and the structure has unique advantages in the aspects of substance transportation and energy transfer, has the characteristics of low flow resistance and good impurity capacity, and simultaneously increases the heat exchange surface area.
Simulation experiments prove that the bionic double-loop three-dimensional micro-channel heat dissipation device can realize that the cooling capacity of the heat sink is more than or equal to 1600W/cm 2 The cooling capacity is more than or equal to 3kW, the surface temperature of the radiator is less than or equal to 70 ℃, and the high-efficiency discharge of the heat of the chip can be realized.
Drawings
FIG. 1 is an overall schematic diagram of a bionic dual-circuit three-dimensional microchannel heat sink of the present invention;
FIG. 2 is a schematic diagram of a specific structure of a bionic dual-loop three-dimensional microchannel heat dissipating device according to the present invention;
FIG. 3 is a schematic diagram of a self-driven two-phase soaking circuit according to the present invention;
FIG. 4 is a cross-sectional view of a self-driven two-phase soaking circuit of the present invention;
FIG. 5 is a top view of a three-dimensional bionic heat exchange circuit of the present invention;
FIG. 6 is a cross-sectional view of a three-dimensional biomimetic heat exchange circuit of the present invention;
FIG. 7 is a schematic diagram of a stacked fabrication method of the present invention;
fig. 8 is a schematic view of the principle of operation of the present invention.
Reference numerals illustrate: 1. the heat-conducting type heat-exchanging device comprises a copper-based high-heat-conductivity substrate, a three-dimensional bionic heat-exchanging circuit, a self-driven two-phase temperature-equalizing circuit, a conductive core area, a two-phase transition area, a bionic heat-exchanging area, a evaporating section, a condensing section, an inlet pipeline, a 32, an outlet pipeline, a 33, an upper sub-circuit and a lower sub-circuit.
Note that: fig. 1 and 2 are schematic views of the internal structure after transparency, the straight line is the outer contour line of the device, and the broken line indicates the region.
Detailed Description
The embodiments described below by referring to the drawings are illustrative and intended to explain the present invention and should not be construed as limiting the invention.
In the description of the present invention, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", etc. indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be configured and operated in a specific orientation, and thus should not be construed as limiting the present invention.
Referring to fig. 1 and 2, the bionic dual-loop three-dimensional microchannel heat dissipation device of the invention comprises: the device comprises a copper-based high-heat-conductivity substrate 1, a three-dimensional bionic heat exchange loop 2 and a self-driven two-phase uniform temperature loop 3. The self-driven two-phase temperature equalizing loop 2 and the three-dimensional bionic heat exchange loop 3 are closely nested and do not interfere with each other. The copper-based high-heat-conductivity substrate 1 is cuboid in overall appearance, and the internally processed gaps form a self-driven two-phase uniform temperature loop 2 and a three-dimensional bionic heat exchange loop 3.
Referring to fig. 3 and 4, the self-driven two-phase temperature equalizing circuit 2 is uniformly distributed in a three-dimensional space, the evaporation section 21 is close to a heat source, the condensation section 22 is regularly and uniformly distributed in the three-dimensional space, the working liquid is filled in the three-dimensional space, absorbs heat and is vaporized in the evaporation section 21, and the heat at the heat source can be rapidly and uniformly diffused into the whole heat dissipating device by releasing heat and liquefying in the condensation section 22.
Referring to fig. 5 and 6, the three-dimensional bionic heat exchange circuit 3 adopts a bionic configuration theoretical design, is regularly and uniformly distributed in the heat dissipating device, an inlet pipeline 31 and an outlet pipeline 32 are arranged at the top of the circuit, the three-dimensional bionic heat exchange circuit 3 is divided into an upper sub-circuit 33 and a lower sub-circuit 34 at the downstream of the inlet 31, and the upper sub-circuit 33 and the lower sub-circuit 34 are assembled at the upstream of the outlet. The three-dimensional bionic heat exchange loop is connected with a pulsating pump, the pulsating pump generates pulsating flow through pulse current input by the PWM pulse frequency signal generator, the cooling liquid is driven to circulate in the whole loop through the pulsating pump, and the three-dimensional bionic structure of the three-dimensional bionic heat exchange loop further enhances fluid disturbance, so that thermal resistance in the heat transfer process is reduced, and efficient discharge of heat is realized. The three-dimensional bionic heat exchange circuit is a bionic venation structure following Murray law, and has recognized unique advantages in material transportation and energy transfer.
The Murray law isMeets the minimum energy consumption condition, wherein r is as follows 0 For the parent channel radius, r i Is the radius of the sub-channel; x is the mass change rate in the transmission process, and if the transmission process is a pure physical process, x is 0; alpha varies depending on the type of transfer medium, and is 3 when it is referred to as fluid.
The three-dimensional bionic heat exchange loop can also be composed of a plurality of sub-loops.
Referring to fig. 7, the whole set of apparatus is divided into a core conduction zone 4, a two-phase transition zone 5 and a bionic heat exchange zone 6. The specific working principle is that the heat dissipating device is mounted at the upper end of the chip, the bottom of the heat dissipating device is attached to the surface of the chip, a large amount of joule heat is generated during high-power operation of the chip, the core conduction region 4 generates high heat flux density, working liquid in the evaporation section 21 of the self-driven two-phase temperature equalization circuit 2 positioned in the two-phase transition region 5 absorbs heat and is vaporized, the vaporized working liquid flows to the condensation section 22 and uniformly diffuses the heat into the whole device, meanwhile, condensate flows in from the inlet pipeline 31 under the driving of the pulsation pump, flows into the upper sub-circuit 33 and the lower sub-circuit 34 at the downstream of the inlet, and the structures of the two circuits generate vortex flow to fully absorb heat in the bionic heat exchange region 6 and flow out at the upstream of the outlet pipeline 32. At this time, the vaporized working liquid in the condensing section 22 of the self-driven two-phase temperature equalization circuit 2 is liquefied by heat release and flows to the evaporating section 21. The two sets of lines work cyclically in this way.
In the embodiment, the radiator adopts a copper-carbon-based high-thermal-conductivity composite material, a copper nanowire with single-layer graphene is prepared through a high-temperature solid phase reaction, and then the copper nanowire and diamond particles are subjected to surface activation bonding, a spark plasma sintering process and a hot rolling process to prepare the copper-carbon-based high-thermal-conductivity composite material. The material can solve the problem that the heat flux density is 100-1000W/cm 2 The heat dissipation problem of the chip is solved, the adaptability is strong, the problem of high heat flux density is solved effectively, and the cost is low.
In this embodiment, referring to fig. 8, the whole heat dissipating device is manufactured by a lamination manufacturing process, and the process is divided into model establishment, slicing layering, sheet processing, lamination welding and surface treatment. The method comprises the steps of establishing a model through CAD software, layering the established model structure according to a certain thickness, designing the shape of a cross-section pore on each layer, processing the designed shape of the cross-section pore on a copper-carbon-based high-heat-conductivity sheet layer by using a femtosecond laser process, integrally forming the sheet layer after stacking through a vacuum diffusion welding process, simultaneously forming an internal three-dimensional bionic loop 2 and a self-driven two-phase uniform temperature loop 3, and improving the inner surface finish by adopting abrasive particle flow.
Although embodiments of the present invention have been shown and described above, it will be understood that the above embodiments are illustrative and not to be construed as limiting the invention, and that variations, modifications, alternatives, and variations may be made in the above embodiments by those skilled in the art without departing from the spirit and principles of the invention.
Claims (7)
1. A bionic double-loop three-dimensional micro-channel heat dissipation device is characterized in that: the device comprises a copper-based high-heat-conductivity substrate, a self-driven two-phase temperature equalization loop and a three-dimensional bionic heat exchange loop which are arranged in the copper-based high-heat-conductivity substrate; the self-driven two-phase temperature equalization circuit is positioned on the inner bottom surface of the copper-based high-heat-conductivity substrate, and the three-dimensional bionic heat exchange circuit is nested above the self-driven two-phase temperature equalization circuit;
the self-driven two-phase temperature equalization loop is of a closed circulation structure filled with working liquid and comprises an evaporation section and a condensation section; the evaporation section is positioned at the bottom and close to the heat source, and the liquid channels of the evaporation section are arranged in the isothermal surface in a reciprocating manner and are used for absorbing the heat of the heat source and vaporizing the working liquid; the condensing section is positioned above the evaporating section and is used for releasing heat and liquefying the vaporization working liquid of the evaporating section again, so that the heat at the heat source can be rapidly and uniformly diffused into the whole heat dissipating device;
the three-dimensional bionic heat exchange loop is of an open circulation structure filled with working liquid, takes the central point of the three-dimensional bionic heat exchange loop as a midpoint, and is outwards radial, and comprises an upper sub-loop, a lower sub-loop, an inlet pipeline and an outlet pipeline, wherein the lower sub-loop is nested on the condensation section, and the upper sub-loop is positioned right above the lower sub-loop; the upper sub-loop and the lower sub-loop are both composed of an upper layer liquid channel and a lower layer liquid channel, condensate diffuses from the upper layer and is recovered from the lower layer, and the sub-loops are connected in series by two main channels; the upper layers of the upper sub-loop and the lower sub-loop are connected with the inlet pipeline, the lower layers are connected with the outlet pipeline, and meanwhile, the inlet pipeline and the outlet pipeline are externally connected with a pulsation pump, and the pulsation pump drives the circulation of working liquid in the three-dimensional bionic heat exchange loop so as to realize heat dissipation.
2. The bionic dual-circuit three-dimensional microchannel heat sink according to claim 1, wherein: the liquid channel of the evaporation section is parallel to the inner bottom surface of the copper-based high-heat-conductivity substrate and is arranged in a reciprocating manner along the radial direction by taking the central point of the liquid channel as the middle point.
3. The bionic dual-circuit three-dimensional microchannel heat sink according to claim 2, wherein: the liquid channel of the condensing section is perpendicular to the liquid channel of the evaporating section, and is outwards radial with the central axis as a midpoint, and is arranged in a reciprocating manner along the vertical direction.
4. The bionic dual-circuit three-dimensional microchannel heat sink according to claim 1, wherein: the liquid channels of the upper sub-loop are wavy, the upper liquid channel and the lower liquid channel are parallel to each other, and radiate outwards along the radial direction from the central axis of the three-dimensional bionic heat exchange loop, and are communicated at the periphery.
5. The bionic dual-circuit three-dimensional microchannel heat sink according to claim 4, wherein: the upper liquid channel of the lower sub-loop is wavy and parallel to the liquid channel of the upper sub-loop, and radiates outwards along the radial direction from the central axis of the three-dimensional bionic heat exchange loop; the lower liquid channels are arranged in a reciprocating manner along the vertical direction and are nested on the condensation section.
6. The bionic dual-circuit three-dimensional microchannel heat sink according to claim 1, wherein: the inlet pipeline and the outlet pipeline are arranged along the vertical direction and are positioned above the middle of the heat dissipation device.
7. The bionic dual-circuit three-dimensional microchannel heat sink according to claim 1, wherein: the three-dimensional bionic heat exchange loop follows the bionic vein structure of Murray law.
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| CN103066038A (en) * | 2012-12-20 | 2013-04-24 | 华南理工大学 | Insulated gate bipolar translator (IGBT) module radiator based on loop circuit heat pipes and manufacturing method of the same |
| CN103542749A (en) * | 2013-10-15 | 2014-01-29 | 华南理工大学 | Simulated liquid absorbing core for heat uniformizing plate |
| WO2016014710A1 (en) * | 2014-07-22 | 2016-01-28 | University Of Virginia Patent Foundation | Heat transfer device for high heat flux applications and related methods thereof |
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| EP3485215B1 (en) * | 2016-07-12 | 2023-06-07 | Alexander Poltorak | System and method for maintaining efficiency of a heat sink |
| WO2019018446A1 (en) * | 2017-07-17 | 2019-01-24 | Fractal Heatsink Technologies, LLC | Multi-fractal heat sink system and method |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN103066038A (en) * | 2012-12-20 | 2013-04-24 | 华南理工大学 | Insulated gate bipolar translator (IGBT) module radiator based on loop circuit heat pipes and manufacturing method of the same |
| CN103542749A (en) * | 2013-10-15 | 2014-01-29 | 华南理工大学 | Simulated liquid absorbing core for heat uniformizing plate |
| WO2016014710A1 (en) * | 2014-07-22 | 2016-01-28 | University Of Virginia Patent Foundation | Heat transfer device for high heat flux applications and related methods thereof |
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