CN112736046B - Integrated chip heat dissipation device and heat dissipation method thereof - Google Patents
Integrated chip heat dissipation device and heat dissipation method thereof Download PDFInfo
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- CN112736046B CN112736046B CN202011460953.8A CN202011460953A CN112736046B CN 112736046 B CN112736046 B CN 112736046B CN 202011460953 A CN202011460953 A CN 202011460953A CN 112736046 B CN112736046 B CN 112736046B
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- heat dissipation
- cooling
- cooling liquid
- integrated chip
- evaporation tank
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- 230000017525 heat dissipation Effects 0.000 title claims abstract description 42
- 238000000034 method Methods 0.000 title claims abstract description 10
- 239000000110 cooling liquid Substances 0.000 claims abstract description 59
- 238000001704 evaporation Methods 0.000 claims abstract description 36
- 230000008020 evaporation Effects 0.000 claims abstract description 36
- 238000001816 cooling Methods 0.000 claims abstract description 32
- 230000005484 gravity Effects 0.000 claims abstract description 9
- 239000007788 liquid Substances 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 27
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 3
- 229910052782 aluminium Inorganic materials 0.000 claims description 3
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 claims description 3
- 239000002826 coolant Substances 0.000 claims description 3
- 229910052802 copper Inorganic materials 0.000 claims description 3
- 239000010949 copper Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 229910052751 metal Inorganic materials 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 3
- 229910000679 solder Inorganic materials 0.000 claims description 3
- 238000003466 welding Methods 0.000 claims description 3
- 238000005245 sintering Methods 0.000 claims 1
- 230000000694 effects Effects 0.000 abstract description 8
- 230000010354 integration Effects 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 description 2
- 230000004907 flux Effects 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000000428 dust Substances 0.000 description 1
- 239000012530 fluid Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012466 permeate Substances 0.000 description 1
- 230000000630 rising effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/36—Selection of materials, or shaping, to facilitate cooling or heating, e.g. heatsinks
- H01L23/367—Cooling facilitated by shape of device
- H01L23/3675—Cooling facilitated by shape of device characterised by the shape of the housing
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
- H01L23/427—Cooling by change of state, e.g. use of heat pipes
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
- H01L23/46—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids
- H01L23/473—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements involving the transfer of heat by flowing fluids by flowing liquids
Abstract
The invention discloses an integrated chip heat dissipation device and a heat dissipation method thereof. The traditional heat dissipation mode can not meet the development requirements of chip miniaturization and integration. The invention discloses an integrated chip heat dissipation device, which comprises a loading shell and a siphon heat dissipation device. One of the vertical side plates of the loading shell is a base plate. The siphon heat dissipation device comprises an evaporator, a condenser, a steam pipe, a return pipe, an evaporation tank and a cooling tank. The evaporation tank is arranged on the evaporator. The invention takes away the heat generated by the chip by using the cooling liquid by utilizing the siphon heat dissipation principle and the gravity effect, the heat is sunk to the bottom and enters the evaporation tank, the evaporator evaporates the cooling liquid in the evaporation tank, the evaporated gaseous cooling liquid enters the condenser through the steam pipe, and then the condenser cools the gaseous cooling liquid in the condenser, and the cooling liquid flows back to the cooling tank through the pipeline, so that the cooling liquid is further cooled.
Description
Technical Field
The invention belongs to the technical field of integrated chips, and particularly relates to an integrated chip heat dissipation device and a heat dissipation method thereof.
Background
With the development of integrated chips towards integration and miniaturization, the traditional air cooling method has the defects of larger overall size, lower heat dissipation efficiency, easy dust accumulation of a fan and the like, so that the traditional method cannot meet the requirements of the chipsMiniaturization and integration are required. Research shows that the average heat flow density of the chip can reach 500W/cm 2 The local temperature will reach 1000W/cm 2 . If the heat cannot be timely dissipated, the temperature of the chip exceeds 70 ℃, and the performance of the integrated chip is greatly reduced. When the temperature of the chip is between 70 and 80 ℃, the performance of the whole system is reduced by 50 percent, and when the temperature of the chip exceeds 85 ℃, the chip is damaged due to overhigh temperature. In order to improve the performance of the integrated chip, the heat dissipation device is not suitable for excessive and oversized heat dissipation devices because of the continuous reduction of the whole size, and the heat dissipation efficiency of the integrated chip is improved as much as possible while the chip is miniaturized and integrated.
Disclosure of Invention
The invention aims to provide a device for radiating a miniature integrated chip and a radiating method thereof.
The invention discloses an integrated chip heat dissipation device, which comprises a loading shell and a siphon heat dissipation device. One of the vertical side plates of the loading shell is a base plate. The substrate is used for vertically mounting the chip. The top of the loading shell is provided with a liquid inlet, and the bottom of the loading shell is provided with one or more lower liquid outlets. The substrate is provided with a side liquid outlet hole group. The siphon heat dissipation device comprises an evaporator, a condenser, a steam pipe, a return pipe, an evaporation tank and a cooling tank. The evaporation tank is arranged on the evaporator. The evaporator can gasify the cooling liquid in the evaporation tank. The evaporation tank is provided with an input port and an output port, and the output port is positioned at the top of the evaporation tank. The evaporation tank is lower than the loading shell; the cooling tank is higher than the loading housing. The lower liquid outlet and the side liquid outlet hole groups of the loading shell are connected to the input port of the evaporation tank through return pipes. The output port of the evaporator is connected to the input port of the condenser through a steam pipe. The output port of the condenser is connected to the input port of the cooling tank; the outlet of the cooling tank is connected to the inlet of the loading housing.
Preferably, a plurality of chips mounted on the substrate are stacked in order and disposed with a gap therebetween. A gap is left between the chip closest to the substrate and the substrate.
Preferably, the side liquid outlet hole group on the substrate comprises a square hole array positioned at the center of the substrate and a plurality of circular holes which are arranged around the square hole array in an array mode.
Preferably, the aperture size of the chip heat sink substrate is 300 to 500 μm.
Preferably, the diameter of the steam pipe and the return pipe is 3mm.
Preferably, the evaporation tank, the steam pipe and the return pipe are all made of metal materials.
Preferably, a metal mesh sintered part is arranged in the cooling tank.
Preferably, the siphon heat radiator is internally provided with a cooling liquid. The cooling liquid adopts ZnO-H with the volume fraction of 0.2 percent 2 O nanofluids.
Preferably, the condenser comprises a serpentine tube and fins. A plurality of fins are sequentially arranged at intervals; the serpentine tube reciprocates multiple times through each fin.
Preferably, the coiled pipe is made of pure copper, and the fins are made of aluminum materials with the surfaces plated; the fins are connected with the pipeline in a solder paste welding mode.
The heat dissipation method of the integrated chip heat dissipation device specifically comprises the following steps:
under the action of gravity, the cooling liquid in the cooling tank flows from top to bottom into the loading shell and enters between gaps of adjacent chips, and heat generated by the chips is taken away. The cooling liquid in the loading shell flows out to the evaporation tank through the return pipe; the evaporator enables the cooling liquid in the evaporation tank to evaporate to a gaseous state, and the gaseous cooling liquid rises into the condenser to exchange heat and liquefy; the cooled liquid coolant flows into the cooling tank and again into the loading enclosure.
The beneficial effects of the invention are as follows:
1. the invention utilizes the siphon heat dissipation principle and the gravity effect to vertically weld the chip on the substrate, after the chip generates heat, the cooling liquid takes away the heat generated by the chip to sink to the bottom and flows into the return pipe to enter the evaporation tank, the evaporator evaporates the cooling liquid in the evaporation tank, the evaporated gaseous cooling liquid enters the condenser through the steam pipe, and then the condenser cools the gaseous cooling liquid in the condenser into liquid state and flows back into the cooling tank through the pipeline, thus being beneficial to further cooling the cooling liquid, and after a certain amount of liquid cooling liquid is accumulated, the cooling liquid flows into the periphery of the chip again through the pipeline. The difference of cold and hot flow densities is utilized to promote the circulation flow of the cooling liquid, and the cold flow is utilized to take away the heat generated by the chip, so that the heat dissipation effect of the chip is greatly improved.
2. The chip is welded on the substrate, and heat generated by the chip directly welded with the substrate is difficult to dissipate, so that the cooling liquid near the chip is led out by arranging the side liquid outlet hole group on the substrate; meanwhile, square holes with larger density are formed in the center of the substrate, round holes are formed in the periphery of the substrate, and targeted heat dissipation is carried out on the heavy point heat area.
3. The traditional integrated chip is transversely placed on the substrate, when the cooling liquid flows in from top to bottom, the fluidity of the cooling liquid is poor, so the cooling liquid is difficult to take away the heat between the chips, the local temperature of the chips is overhigh, the heat dissipation effect is poor, the chips are overheated and deform, and the performance of the chips is influenced. Compared with the traditional mode, the chip heat dissipation device is used for vertically placing the chip, the cooling liquid flows better due to the action of gravity, and the cooling liquid can flow into micro channels arranged between the chip and the chip in a staggered way by utilizing the gravity, so that the temperature of the part of the chip with overhigh local temperature is reduced, the overall temperature of the chip is generally average, and the performance of the chip is improved.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
FIG. 2 is a schematic view of a substrate according to the present invention;
FIG. 3 is a schematic view of a condenser according to the present invention.
Detailed Description
The invention is further described below with reference to the accompanying drawings.
As shown in fig. 1 and 2, an integrated chip heat sink includes a loading case 1 and a siphon heat sink. The joints of the loading housing 1 are closed, so that the cooling liquid cannot leak in the loading housing 1. One of the vertical side plates of the loading enclosure 1 is a base plate 4. A plurality of chips 2 arranged vertically and with a gap are mounted on a substrate 4. A gap is left between the chip 2 closest to the substrate 4 and the substrate 4. The top of the loading shell 1 is provided with a liquid inlet, and the bottom is provided with a plurality of lower liquid outlets. The base plate 4 is provided with a side liquid outlet hole group. The side liquid outlet hole group comprises a square hole array 4-1 positioned at the center of the substrate 4 and a plurality of circular holes 4-2 which are arranged in an array shape and surround the square hole array 4-1.
Because the heat productivity of the central part of the chip 2 is larger, square holes with larger porosity are arranged at the central part, and round holes 4-2 are arranged at the periphery, so that targeted heat dissipation is realized. When the cooling liquid flows from the cooling tank 9 into the holes of the base plate 4, the cooling liquid takes away this part of the heat and flows into the return pipe 5 through the porous pipe. The chip 2 is subjected to auxiliary heat dissipation by utilizing the multiple holes, so that the heat dissipation efficiency of the chip 2 can be greatly improved. Considering the effect of the viscosity of the nanofluid itself, if the diameter of the hole in the base plate 4 is too small, the thermosiphon force cannot overcome the flow resistance, and the coolant will not flow into the return pipe 5 on the right through the hole in the base plate 4. When the heat flux density of the chip 2 is small, the performance of the chip 2 can be met, and when the heat flux density is increased, the heat dissipation effect is greatly reduced. The aperture size of the heat sink substrate 4 of the chip 2 is 300-500 μm. Furthermore, the diameter of the steam pipe 8 and the return pipe 5 is 3mm.
The siphon heat sink comprises an evaporator 6, a condenser 3, a steam pipe 8, a return pipe 5, an evaporation tank 7 and a cooling tank 9. The evaporation tank 7, the steam pipe 8 and the return pipe 5 are all made of metal materials. The evaporation tank 7 is mounted on the evaporator 6. The evaporator 6 can gasify the cooling liquid in the evaporation tank 7 by heating or depressurizing. The side of the evaporation tank 7 is provided with an input port, and the top is provided with an output port. The evaporation tank 7 is lower than the loading shell 1; the cooling tank 9 is higher than the loading housing 1; so that the cooling liquid in the cooling tank 9 can enter the loading shell 1 under the combined action of gravity and capillary effect and permeate into the gap of the chip for full cooling; after absorbing the heat released from the chips, the cooling liquid in the loading housing 1 can be output from the lower liquid outlet and side liquid outlet hole group of the loading housing 1 to the evaporation tank 7.
The lower liquid outlet and the side liquid outlet hole groups of the loading shell 1 are all connected to the input port of the evaporation tank 7 in a gathering way through the return pipe 5. The output of the evaporator 6 is connected to the input of the condenser 3 by a steam pipe 8. The output port of the condenser 3 is connected to the input port of the cooling tank 9; the outlet of the cooling tank 9 is connected to the inlet of the loading housing 1. A metal mesh sintered part is placed on the inner wall of the cooling tank 9, and when the cooling liquid enters the cooling tank, the principle of capillary phenomenon is utilized, so that the gaseous cooling liquid is cooled to liquid dripping.
Since the condenser 3 is capable of exchanging heat of the passing cooling liquid; thereby making the formation density of the whole loop different; due to the difference of the densities of the heat flow and the cold flow, the cooling liquid circularly flows in the direction of the evaporation tank 7, the condenser 3, the cooling tank 9 and the loading shell 1 (anticlockwise direction in figure 1, namely, the right side is rising heat flow, the left side is sinking cold flow, and the cooling liquid in the loop adopts ZnO-H with the volume fraction of 0.2 vol%) 2 O nanofluids. The nano fluid has good heat conductivity, and can greatly improve the heat dissipation efficiency of the integrated chip.
As shown in fig. 3, the condenser 3 adopts an enhanced heat exchange structure. The condenser 3 includes a serpentine tube 3-1 and fins 3-2. The fins 3-2 are sequentially arranged at intervals; the serpentine tube 3-1 reciprocates through each fin 3-2 a plurality of times. The coiled pipe 3-1 is made of pure copper, and the fins 3-2 are made of aluminum materials with electroplated surfaces; the fins 3-2 are connected with the pipeline in a solder paste welding mode.
The heat dissipation method of the integrated chip heat dissipation device specifically comprises the following steps:
during operation, the cooling tank 9 is filled with cooling liquid; when the chip 2 works to generate heat, the cooling liquid flows into the loading shell 1 from top to bottom under the action of gravity, and the heat generated by the chip 2 is taken away. Compared with the traditional mode, the chip heat dissipation device has the advantages that the chips 2 are vertically placed, so that cooling liquid can flow into micro channels arranged between the chips in a staggered mode through gravity, the temperature of the part of the chips 2 with overhigh local temperature is reduced, the whole temperature of the chips 2 is kept average in a total mode, and the service performance of the chips 2 is improved. At the same time, the cooling liquid flowing between the base plate 4 and the chip 2 also takes away heat and then flows into the return pipe 5 on the right. The cooling liquid can thus carry away the heat generated on the chip 2 both vertically and laterally. The cooling liquid then flows into the evaporation tank 7 through the return pipe 5, the evaporator 6 heats the evaporation tank 7, evaporates the cooling liquid therein to a gaseous state and flows into the condenser 3 through the steam pipe 8. The gaseous cooling liquid in the cooling tank is cooled through the condenser 3, the gaseous cooling liquid is liquefied into liquid, the emitted heat is emitted to the environment through the condenser 3, the cooled liquid cooling liquid flows into the cooling tank 9, so that the cooling liquid can be cooled again, after a certain amount of cooling liquid is accumulated, the cooling liquid flows back to the periphery of the chip 2 again through the pipeline, and the cooling liquid is circulated and reciprocated, so that a continuous heat dissipation effect on the chip 2 is achieved.
Claims (10)
1. An integrated chip heat dissipation device comprises a loading shell (1) and a siphon heat dissipation device; the method is characterized in that: one vertical side plate of the loading shell (1) is a base plate (4); the base plate (4) is used for vertically mounting the chip (2); the top of the loading shell (1) is provided with a liquid inlet, and the bottom of the loading shell is provided with one or more lower liquid outlets; the base plate (4) is provided with a lateral liquid outlet hole group; the siphon heat dissipation device comprises an evaporator (6), a condenser (3), a steam pipe (8), a return pipe (5), an evaporation tank (7) and a cooling tank (9); the evaporation tank (7) is arranged on the evaporator (6); the evaporator (6) can gasify the cooling liquid in the evaporation tank (7); an input port and an output port are arranged on the evaporation tank (7), and the output port is positioned at the top of the evaporation tank (7); the evaporation tank (7) is lower than the loading shell (1); the cooling groove (9) is higher than the loading shell (1); the lower liquid outlet and the side liquid outlet hole groups of the loading shell (1) are connected to the input port of the evaporation tank (7) through the return pipe (5); the output port of the evaporator (6) is connected to the input port of the condenser (3) through a steam pipe (8); the output port of the condenser (3) is connected to the input port of the cooling tank (9); the outlet of the cooling tank (9) is connected to the inlet of the loading housing (1).
2. The integrated chip heat sink of claim 1, wherein: a plurality of chips (2) mounted on the substrate (4) are sequentially overlapped and are arranged in a clearance way; a gap is left between the chip (2) closest to the substrate (4) and the substrate (4).
3. The integrated chip heat sink of claim 1, wherein: the cooling groove (9) is internally provided with a metal net sintering piece.
4. The integrated chip heat sink of claim 1, wherein: the side liquid outlet hole group on the substrate (4) comprises a square hole array (4-1) positioned at the center of the substrate (4) and a plurality of circular holes (4-2) which are arranged in an array shape and surround the square hole array (4-1).
5. The integrated chip heat sink of claim 1, wherein: the aperture size of the substrate (4) of the heat radiator of the chip (2) is 300-500 micrometers.
6. The integrated chip heat sink of claim 1, wherein: the diameters of the steam pipe (8) and the return pipe (5) are 3mm.
7. The integrated chip heat sink of claim 1, wherein: the siphon heat dissipation device is internally provided with cooling liquid; the cooling liquid adopts ZnO-H with the volume fraction of 0.2 percent 2 O nanofluids.
8. The integrated chip heat sink of claim 1, wherein: the condenser (3) comprises a coiled pipe (3-1) and fins (3-2); the fins (3-2) are sequentially arranged at intervals; the serpentine tube (3-1) is reciprocated through each fin (3-2) a plurality of times.
9. The integrated chip heat sink of claim 8, wherein: the coiled pipe (3-1) is made of pure copper, and the fins (3-2) are made of aluminum materials with electroplated surfaces; the fins (3-2) are connected with the pipeline in a solder paste welding mode.
10. The heat dissipation method of an integrated chip heat dissipation device as defined in claim 1, wherein: the cooling liquid in the cooling groove (9) flows from top to bottom into the loading shell (1) and enters between gaps of adjacent chips (2) under the action of gravity, so that heat generated by the chips (2) is taken away; the cooling liquid in the loading shell (1) flows out to the evaporation tank (7) through the return pipe (5); the evaporator (6) enables the cooling liquid in the evaporation tank (7) to evaporate to a gaseous state, and the gaseous cooling liquid rises into the condenser (3), exchanges heat and liquefies; the cooled liquid coolant flows into the cooling tank (9) and again into the loading housing (1).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011460953.8A CN112736046B (en) | 2020-12-11 | 2020-12-11 | Integrated chip heat dissipation device and heat dissipation method thereof |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011460953.8A CN112736046B (en) | 2020-12-11 | 2020-12-11 | Integrated chip heat dissipation device and heat dissipation method thereof |
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| Publication Number | Publication Date |
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| CN112736046A CN112736046A (en) | 2021-04-30 |
| CN112736046B true CN112736046B (en) | 2024-03-22 |
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| CN202011460953.8A Active CN112736046B (en) | 2020-12-11 | 2020-12-11 | Integrated chip heat dissipation device and heat dissipation method thereof |
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| CN113316361B (en) * | 2021-05-21 | 2022-08-12 | 浙江酷灵信息技术有限公司 | Thermosiphon heat sinks, systems and applications |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN104867890A (en) * | 2015-05-07 | 2015-08-26 | 上海交通大学 | Phase-change cooling structure for 3D chips |
| CN107532859A (en) * | 2015-03-06 | 2018-01-02 | 株式会社东芝 | Cooling device |
| JP2019110199A (en) * | 2017-12-18 | 2019-07-04 | 株式会社ケーヒン | Electronic component cooling apparatus |
| CN110030856A (en) * | 2017-12-28 | 2019-07-19 | 新光电气工业株式会社 | A kind of loop circuit heat pipe and its manufacturing method |
Family Cites Families (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US20040182551A1 (en) * | 2003-03-17 | 2004-09-23 | Cooligy, Inc. | Boiling temperature design in pumped microchannel cooling loops |
| JP6394331B2 (en) * | 2013-12-27 | 2018-09-26 | 富士通株式会社 | Cooling parts and electronic equipment |
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2020
- 2020-12-11 CN CN202011460953.8A patent/CN112736046B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN107532859A (en) * | 2015-03-06 | 2018-01-02 | 株式会社东芝 | Cooling device |
| CN104867890A (en) * | 2015-05-07 | 2015-08-26 | 上海交通大学 | Phase-change cooling structure for 3D chips |
| JP2019110199A (en) * | 2017-12-18 | 2019-07-04 | 株式会社ケーヒン | Electronic component cooling apparatus |
| CN110030856A (en) * | 2017-12-28 | 2019-07-19 | 新光电气工业株式会社 | A kind of loop circuit heat pipe and its manufacturing method |
Non-Patent Citations (1)
| Title |
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| 微通道环路热虹吸换热器传热性能及不稳定特性实验研究;黄官正;低温工程;第2020年卷(第1期);第42-49页 * |
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