CN112492853B - Liquid cavity heat dissipation device based on pool boiling heat dissipation - Google Patents
Liquid cavity heat dissipation device based on pool boiling heat dissipation Download PDFInfo
- Publication number
- CN112492853B CN112492853B CN202011400608.5A CN202011400608A CN112492853B CN 112492853 B CN112492853 B CN 112492853B CN 202011400608 A CN202011400608 A CN 202011400608A CN 112492853 B CN112492853 B CN 112492853B
- Authority
- CN
- China
- Prior art keywords
- liquid
- heat dissipation
- cavity
- area
- micro
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/20009—Modifications to facilitate cooling, ventilating, or heating using a gaseous coolant in electronic enclosures
- H05K7/20136—Forced ventilation, e.g. by fans
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
- H05K7/20409—Outer radiating structures on heat dissipating housings, e.g. fins integrated with the housing
Abstract
A liquid chamber heat sink based on pool boiling heat dissipation includes a liquid chamber and an external heat sink. The liquid cavity is composed of a liquid cavity bottom plate, a liquid cavity top plate and a radiating pipe, and is filled with a phase-change working medium. The liquid phase-change working medium absorbs heat at the bottom of the boiling area, then carries out boiling heat exchange and generates steam, the steam rises into the heat-radiating pipe through the through hole on the top plate of the liquid cavity, and is condensed into liquid by means of an air-cooled or water-cooled external heat-radiating device to flow back into the liquid cavity. The compensation chamber and the liquid conveying area can effectively supply the phase-change working medium to the boiling area. The invention adopts a pool boiling heat exchange mode, and has stronger heat dissipation capability. Compared with the existing heat radiator based on the steam cavity design, such as the temperature equalizing plate, the heat radiator has the advantages that a capillary core structure is not needed, the processing is convenient, the internal evaporation to dryness can be effectively prevented while the thickness is thin, and the heat radiator is suitable for heat radiation of high-power heating equipment.
Description
Technical Field
The invention belongs to the technical field of heat dissipation of electronic devices, relates to a heat dissipation device, and particularly relates to a liquid cavity heat dissipation device based on pool boiling heat dissipation.
Background
With the increasing processing technology and process level of electronic devices, electronic chips are developed toward high integration, miniaturization and high frequency, so that the heat generation amount per unit area of the devices is increased sharply, and the heat dissipation problem is increasingly severe. If the heat cannot be dissipated timely, the temperature of the device rises continuously, and the operation performance of the device is obviously reduced, even the device is permanently damaged. Today, sharp increases in temperature are a major factor in electronic device failure. For highly integrated devices with high heating power such as a Central Processing Unit (CPU), a conventional method is to diffuse concentrated heat to a heat dissipation surface with a larger surface area by using a Vapor Chamber (VC), mount a finned heat sink with an expanded area on the surface, and finally take away the heat in a forced air cooling heat dissipation manner by using a fan. However, this form of heat dissipation is difficult to meet the current drastically increased heat dissipation requirements, and has some disadvantages: firstly, a capillary core structure needs to be filled in the temperature-uniforming plate based on liquid phase-change evaporation heat dissipation to provide driving force for liquid circulation in the cavity, and the internal structure is complex and difficult to process. Secondly, because the existence of the capillary core in the cavity occupies a large part of space, the liquid filling amount in the cavity is limited, and the liquid supply shortage is easy to occur under the condition of high heat dissipation amount, so that the liquid on the heat dissipation surface is evaporated to dryness, and the heat dissipation capacity is limited. In addition, although the heat dissipation area can be increased by the fin radiator, the heat dissipation capability is difficult to be further improved due to the limitation of fin efficiency and the forced-air-convection heat transfer coefficient.
Therefore, in order to meet the requirement of high heat dissipation power, it is urgently needed to improve the conventional heat dissipation method of the electronic device so as to realize high-efficiency high-power heat dissipation, simplify the structure of the heat sink, and be applicable to a wider heat dissipation scene.
Disclosure of Invention
In order to solve the technical defects of complex internal structure, insufficient heat dissipation capacity and the like of a radiator of an electronic device in the prior art, the invention aims to provide a Liquid Chamber (LC) heat dissipation device radiator based on pool boiling heat dissipation, which has the characteristics of simple internal structure, convenience in processing, high heat dissipation capacity and the like, and can be used for customizing various parameters of the structure according to actual heat dissipation requirements.
In order to achieve the purpose, the following technical scheme can be adopted for realizing the purpose:
a liquid cavity heat sink based on pool boiling heat dissipation comprises a liquid cavity and an external heat sink mounted on the liquid cavity; the liquid cavity comprises a liquid cavity bottom plate, a liquid cavity top plate and a radiating pipe; the lower surface of the liquid cavity bottom plate is provided with a groove used for being attached to a heating surface of a heating device, the upper surface of the liquid cavity bottom plate is sequentially provided with a boiling area, a liquid conveying area and a compensation chamber from inside to outside, the upper surface of the liquid cavity top plate is provided with a plurality of radiating pipes, the bottom ends of the radiating pipes are provided with holes, the lower surface of the liquid cavity top plate is provided with a cavity communicated with the boiling area, the liquid conveying area and the compensation chamber, and the top of the cavity is provided with a plurality of through holes communicated with the radiating pipes; the liquid cavity bottom plate and the liquid cavity top plate are connected to form a closed vacuum cavity.
The invention is further improved in that the boiling zone is provided with a micro-column array, the liquid conveying zone is provided with a plurality of channels, the depth of each channel is the same as the height of the micro-column array on the surface of the boiling zone, and the depth of the compensation chamber is larger than that of each channel.
The invention is further improved in that the surface of the boiling area, the two side wall surfaces and the bottom surface of the channel of the liquid conveying area and the inner side wall surface of the compensation chamber are covered with a layer of porous micro-nano structure.
The invention is further improved in that the thickness of the porous micro-nano structure is 10-200 mu m.
The invention is further improved in that the micro-column array comprises a plurality of micro-columns, the cross sections of the micro-columns are square or circular, the width of each micro-column is 0.1-0.5 mm when the micro-columns are square, the diameter of each micro-column is 0.1-0.5 mm when the micro-columns are circular, the gap between every two adjacent micro-columns is 0.1-0.5 mm, and the height of each micro-column is 1-1.5 mm.
The invention is further improved in that the width of the channel is millimeter level, the phase-change heat dissipation working medium, the liquid cavity bottom plate, the liquid cavity top plate and the heat dissipation pipe are filled in the vacuum cavity and made of red copper.
The invention is further improved in that the area of the top surface of the groove is larger than that of the heating surface of the heating device, the top of the radiating pipe is provided with a liquid filling port, and the area of the cavity is the same as the total area of the boiling area, the liquid conveying area and the compensation chamber on the upper surface of the bottom plate of the liquid cavity.
The invention is further improved in that the height of the cavity is 1-5 mm, the diameter of the through hole is 2-10 mm, and the height of the radiating pipe is 50-150 mm.
The invention is further improved in that the external heat dissipation device comprises a plurality of heat dissipation fins sleeved on the heat dissipation pipe, and fans are arranged at two ends of the heat dissipation fins.
The invention is further improved in that the external heat sink comprises a cooling cavity arranged on the bottom plate of the liquid cavity, the heat dissipation pipes are all positioned in the cooling cavity, and the cooling cavity is provided with an inlet and an outlet.
Compared with the prior art, the invention has the beneficial effects that:
the invention adopts a pool boiling heat exchange mode and utilizes a liquid cavity with a certain liquid filling rate. Through direct contact of the liquid cavity bottom plate and the heating device, the phase change working medium in the liquid cavity absorbs heat, generates boiling phase change to generate steam, takes heat away from the liquid cavity bottom plate, cools the inner wall of the heat dissipation pipe on the liquid cavity top plate, condenses into liquid and flows back to the bottom of the liquid cavity, working medium circulation is completed, a stable and efficient heat dissipation effect is achieved, and higher heat dissipation power is achieved. Compared with a temperature equalizing plate, the key heat dissipation component liquid cavity is simpler in internal structure and does not need a capillary core structure, so that the effective space in the liquid cavity is enlarged, the liquid filling amount of a phase change working medium is increased, the bottom plate of the liquid cavity is prevented from being evaporated to dryness, and the heat dissipation power is improved. A micro-column array is processed in a central boiling area on the upper surface of the liquid cavity bottom plate, so that the heat exchange area can be obviously increased, and the boiling heat exchange performance is further improved. The periphery of the bottom plate of the liquid cavity is provided with the compensation chamber, and liquid in the compensation chamber can supply liquid to the boiling area when the liquid in the boiling area is evaporated to dryness under ultrahigh heating power, so that the higher heat dissipation capability is maintained. Open on liquid chamber roof has the through-hole and installs many cooling tubes, and steam takes place the phase transition condensation heat transfer at the cooling tube inner wall, compares in the radiating mode of samming board only by the upper surface, thereby can effectively increase heat radiating area and improve heat-sinking capability.
Furthermore, the liquid cavity still has the characteristic of ultrathin temperature-equalizing plate, the effective thickness of the liquid cavity is small, the liquid level of the internal phase-change working medium is low, the heat transfer resistance can be reduced, and the boiling heat exchange performance is effectively improved.
Furthermore, a plurality of channels are processed in the liquid conveying area between the central boiling area and the peripheral compensation chamber of the bottom plate, so that the flowing pressure drop of liquid can be reduced, and the pump-free directional conveying of the liquid is realized by means of the Laplace pressure difference, so that the liquid conveying capacity is improved, the liquid supply rate is increased, and the extremely high heat dissipation capacity of the boiling area is maintained.
Furthermore, a layer of porous micro-nano structure covers the upper surface of the liquid cavity bottom plate so as to further improve the boiling heat exchange coefficient of the boiling area and effectively reduce the temperature of the heating surface. Meanwhile, the liquid supply rate of the conveying area is improved, and the heat dissipation capacity is further improved.
Furthermore, stacked fins are arranged outside the radiating pipe when forced air cooling radiating is carried out by means of the fan, so that the radiating area is remarkably increased, and the radiating capacity is further improved; the cooling chamber is installed outside the radiating pipe using forced liquid cooling to enhance the heat radiating capability if conditions permit.
Drawings
FIG. 1 is a schematic perspective view of a fluid chamber according to the present invention;
FIG. 2 is a cross-sectional view of a fluid chamber structure according to the present invention;
FIG. 3 is a perspective view of the bottom plate of the liquid chamber of the present invention;
FIG. 4 is a partially enlarged schematic view of a liquid chamber floor of the present invention;
FIG. 5 is a schematic perspective view of example 1 of the present invention;
FIG. 6 is a schematic perspective view of example 2 of the present invention;
fig. 7 is an assembly structure diagram of embodiment 2 of the present invention.
In the figure, 1 is a bottom plate of a liquid chamber, 2 is a top plate of the liquid chamber, 3 is a heat dissipation pipe, 4 is a groove, 5 is a boiling region, 6 is a liquid delivery region, 7 is a compensation chamber, 8 is a chamber, 9 is a through hole, 10 is a heat dissipation fin, 11 is a fan, 12 is an inlet, 13 is a cooling chamber, and 14 is an outlet.
Detailed Description
The invention will be further described with reference to the accompanying drawings.
As shown in fig. 1 and 2, the present invention includes a liquid chamber having a sealed vacuum environment and an external heat sink. The liquid cavity comprises a liquid cavity bottom plate 1, a liquid cavity top plate 2 and a radiating pipe 3 which are all made of red copper materials. The sizes of the liquid cavity bottom plate 1 and the liquid cavity top plate 2 can be designed according to actual heat dissipation conditions, the shapes of the liquid cavity bottom plate 1 and the liquid cavity top plate 2 can be designed into a circle or a rectangle according to the shape and the requirement of an actual heat dissipation surface, and the shapes and the areas of the two are the same. It has circular through-hole 9 to open on liquid chamber roof 2, cooling tube 3 is one end opening one end confined hollow pipe, and its open end is installed on the circular through-hole 9 of liquid chamber roof 2 and is realized the intercommunication through screw thread or welded mode. The liquid cavity bottom plate 1 and the liquid cavity top plate 2 can be connected by bolts and are arranged on the heating device substrate, and a sealed vacuum liquid cavity can be formed between the two by means of a sealing gasket, so that an effective space for filling the phase-change working medium is formed. The external heat radiating means is installed on the radiating pipe 3.
The liquid cavity is filled with a phase-change heat dissipation working medium, the liquid cavity bottom plate 1 is provided with a groove 4 for being attached to a heating surface, the upper surface of the groove 4 is a heating surface attached to the heating surface, the phase-change working medium is evaporated and rises to the inside of the heat dissipation tube 3 after absorbing heat, the external heat dissipation device is right the heat dissipation tube 3 is cooled, so that steam in the heat dissipation tube 3 is condensed into liquid and flows back to the inside of the liquid cavity, and the circulation process of the heat dissipation working medium is completed.
As shown in fig. 3, the area of the liquid chamber bottom plate 1 is larger than the actual heat generating area of the device, so that the heat dissipation area can be increased, and the heat dissipation capability can be improved. The central area of the lower surface of the liquid cavity bottom plate 1 is contacted with a heating device and is a heating surface. The upper surface of the liquid cavity bottom plate 1 is contacted with the phase change working medium and is a heat dissipation surface. The area of the center of the upper surface of the liquid cavity bottom plate 1, which is equal to the heating area of the device, is a boiling area 5, and the phase change working medium absorbs heat of the heating device transmitted by the liquid cavity bottom plate 1 on the surface of the boiling area 5 and then carries out boiling heat exchange, so that phase change is carried out and steam is generated.
As shown in fig. 4, a micro-column array is processed on the surface of the boiling zone 5 by a milling machine or a linear cutting method, the micro-column array comprises a plurality of micro-columns, the cross section of each micro-column can be square or round, when the micro-columns are square, the width of each micro-column is 0.1-0.5 mm, when the micro-columns are round, the diameter of each micro-column is 0.1-0.5 mm, the gap between every two adjacent micro-columns is 0.1-0.5 mm, and the height of each micro-column is 1-1.5 mm, so that the heat exchange area and the gasification core density can be increased, and the heat dissipation capacity of the radiator can be improved. The upper surface of the liquid cavity bottom plate 1 is sequentially provided with a boiling area 5, a liquid conveying area 6 and a compensation chamber 7 from inside to outside, specifically, the liquid conveying area 6 is arranged around the boiling area 5 on the upper surface of the liquid cavity bottom plate 1, a channel with a millimeter-scale width is processed in the area through a milling machine, the depth of the channel is the same as the height of a microcolumn on the surface of the boiling area 5, and a phase-change working medium flows in the channel so as to supply the boiling area 5. The channel of liquid conveying district 6 can be designed into different geometric patterns by reference to thoughts such as natural bionics, mathematics fractal and wedge gradient, and preferably, the channel is fractal bifurcation passageway to process into the wedge, the both sides wall face contained angle of wedge channel is 5 ~ 30, and the channel is wedge gradient passageway promptly, thereby reduces the flow resistance of liquid working medium in the channel, realizes simultaneously that the working medium carries out directional transport to boiling district 5 in the channel, and then improves the ability of liquid supply. The tops of the microcolumns in the boiling region 5 and the tops of the channels in the liquid transport region 6 are at the same level. The periphery of the liquid conveying area 6 on the upper surface of the liquid cavity bottom plate 1 is provided with the compensation chamber 7, the depth of the compensation chamber 7 is 2-4 mm, namely the bottom surface of the compensation chamber 7 is lower than that of the liquid conveying area 6, so that a part of phase change working medium can be stored, and the liquid conveying area 6 is used for continuously supplying liquid to the boiling area 5. On the basis, a porous micro-nano structure with the thickness of 10-200 microns is covered on the surface of the boiling area 5 on the upper surface of the liquid cavity bottom plate 1, the two side wall surfaces and the bottom surface of the channel of the liquid conveying area 6 and the inner side wall surface of the compensation chamber 7 by using methods such as cathode deposition, sintering, spraying and the like, and the porous micro-nano structure is provided with micro-nano gaps, so that the diffusivity of a working medium on the upper surface of the liquid cavity bottom plate 1 is improved, the liquid supply capacity is improved, the gasification core density is increased, and the boiling heat exchange performance is improved. In order to reduce the heat conduction resistance and ensure the rigidity of the liquid cavity bottom plate 1, the thicknesses of the boiling area 5 and the liquid conveying area 6 are both 2mm, and the thicknesses of the lower surface of the compensation chamber 7 and the bottom surface of the lower surface of the liquid cavity bottom plate 1 are 1 mm.
A cavity 8 is processed on the lower surface of the liquid cavity top plate 2, the area of the cavity 8 is the same as the total area of the boiling area 5, the liquid conveying area 6 and the compensation chamber 7 on the upper surface of the liquid cavity bottom plate 1, and the depth is 1-5 mm. In order to reduce the heat conduction resistance and ensure the rigidity, the thickness from the upper surface of the cavity 8 to the upper surface of the liquid cavity top plate 2 is 1-2 mm. The chamber 8 of the liquid chamber top plate 2 forms together with the boiling zone 5, the liquid delivery zone 6 and the compensation chamber 7 of the liquid chamber bottom plate 1 an effective space of the liquid chamber. Through holes 9 with different diameters, different numbers and different arrangement modes can be formed in the upper wall surface of the cavity 8 as required, and the diameter of the through holes can be 2-10 mm. A plurality of radiating pipes 3 having the same inner diameter and number are welded according to the size and number of the through holes, and the height of the radiating pipes 3 may be 50-150 mm. The bottom end opening of the radiating pipe 3 is communicated with the cavity 8 of the liquid cavity top plate 2, and the top end is closed, so that the inside of the radiating pipe 3 and the liquid cavity form a closed space. The inner diameter, the quantity and the arrangement mode of the radiating pipes are consistent with those of the through holes of the top plate of the liquid cavity. A liquid filling port is arranged at the top end of any radiating pipe 3, and phase change working media are filled into the liquid cavity through the liquid filling port and are vacuumized. The charged phase-change working medium can be water or perfluorohexane and other safe, environment-friendly and nontoxic low-temperature refrigerants, and the liquid filling rate of the working medium is 10-90% of the effective space of the liquid cavity.
When the device does not generate heat, the boiling region 5, the liquid conveying region 6 and the compensation chamber 7 are completely covered by the phase-change working medium, and the liquid level heights of the working medium in the liquid cavity are the same. When the device starts to heat, the boiling area 5 is heated firstly, meanwhile, as the surface of the boiling area 5 is processed with the micro-column array and covered with the porous micro-nano structure, the working medium is subjected to phase change in the boiling area 5 and starts to boil, absorbs the heat of the device to generate steam and rises along the radiating pipe 3. The steam is condensed to generate liquid after contacting the inner wall of the radiating pipe 3, and the liquid flows back to the liquid cavity along the inner wall of the radiating pipe 3, so that the circulation of the phase-change working medium is realized. When the device has extremely high heat productivity, the liquid working medium on the surfaces of the boiling area 5 and the liquid conveying area 6 completely changes phase into steam due to the absorption of a large amount of heat, so that the surfaces are evaporated to dryness. Since the bottom surface of the compensation chamber 7 is located below the boiling zone 5 and the liquid delivery zone 6, part of the liquid working substance remains. At the moment, the liquid working medium flows to the boiling zone 5 under the capillary wicking action of the porous micro-nano structure on the surface and the directional transportation action of the wedge-shaped gradient channel on the surface of the liquid conveying zone 6, so that liquid is supplied, and high heat dissipation capacity is maintained.
The external heat sink includes a plurality of heat dissipation fins 10 sleeved on the heat dissipation pipe 3, and fans 11 are installed at both ends of the heat dissipation fins 10.
Or the external heat sink comprises a cooling cavity 13 arranged on the liquid cavity bottom plate 1, the heat dissipation pipes 3 are all positioned in the cooling cavity 13, and the cooling cavity 13 is provided with an inlet 12 and an outlet 14.
Example 1
As shown in fig. 5, the external heat sink is composed of heat dissipating fins and a fan. A radiating fin 10 and a fan 11 are installed outside the radiating pipe 3 on the liquid chamber structure. The size parameters of the fan 11 and the size of the heat dissipating fins 10 are customized according to the heat dissipating requirements and the use environment. The heat radiating fins 10 are formed with a plurality of through holes having sizes, numbers and arrangement thereof matched with the outer diameters, numbers and arrangement of the heat radiating pipes 3 so as to pass through the heat radiating pipes 3. The plurality of layers of heat dissipation fins 10 sequentially penetrate through the heat dissipation pipe 3 and are stacked, and are fixed and thermally conductive to the heat dissipation pipe 3 by welding or punching. The two fans 11 are respectively installed on two sides of the heat dissipation fin 10, and the installation directions of the two fans 11 are consistent, so that the flow velocity of air flowing through the heat dissipation fin 10 is increased, and the heat dissipation capability is improved. The heat dissipation area remarkably increased by the heat dissipation fins 10 and the forced convection heat transfer of the air generated by the fan 11 can effectively condense the steam in the heat dissipation tube 3 into liquid, so that the working medium rapidly flows back to the bottom of the liquid cavity, thereby realizing the circulation of the working medium and maintaining higher heat dissipation capability.
Example 2
As shown in fig. 6 to 7, the present embodiment is different from embodiment 1 in that a cooling chamber 13 is installed outside a radiating pipe 3. Cooling chamber 13 one side is provided with import 12, and the opposite side is provided with export 14, and cooling chamber 13 forms the cooling chamber body with the upper surface of liquid chamber roof 2, wraps up cooling tube 3 completely, is full of the coolant liquid in the cooling chamber body completely. According to different use requirements, the cooling liquid can be water, glycol, silicon oil and other working media. The low-temperature cooling liquid flows into the cooling cavity from the inlet 12, performs liquid forced convection heat transfer with the outer wall surface of the radiating pipe 3, flows out from the outlet 14, is cooled by an external refrigerator and then flows in from the inlet again through the pump, and circulation of the cooling liquid is realized. Compared with the embodiment 1, the heat dissipation capacity of the heat dissipation pipe 3 is further enhanced, and the phase change working medium backflow speed is higher, so that the heat dissipation capacity of the heat radiator is improved.
Claims (6)
1. A liquid cavity heat sink based on pool boiling heat dissipation is characterized by comprising a liquid cavity and an external heat sink arranged on the liquid cavity; the liquid cavity comprises a liquid cavity bottom plate (1), a liquid cavity top plate (2) and a radiating pipe (3); the lower surface of the liquid cavity bottom plate (1) is provided with a groove (4) which is used for being attached to a heating surface of a heating device, the upper surface of the liquid cavity bottom plate (1) is sequentially provided with a boiling area (5), a liquid conveying area (6) and a compensation chamber (7) from inside to outside, the upper surface of the liquid cavity top plate (2) is provided with a plurality of radiating pipes (3), the bottom ends of the radiating pipes (3) are provided with holes, the lower surface of the liquid cavity top plate (2) is provided with a cavity (8) communicated with the boiling area (5), the liquid conveying area (6) and the compensation chamber (7), and the top of the cavity (8) is provided with a plurality of through holes (9) communicated with the radiating pipes (3); the liquid cavity bottom plate (1) and the liquid cavity top plate (2) are connected to form a closed vacuum cavity;
the boiling area (5) is provided with a micro-column array, the liquid conveying area (6) is provided with a plurality of channels, the depth of each channel is the same as the height of the micro-column array on the surface of the boiling area (5), and the depth of the compensation chamber (7) is greater than that of each channel;
the width of the channel is millimeter level, and a phase-change heat dissipation working medium is arranged in the vacuum cavity;
the surface of the boiling area (5), the two side wall surfaces and the bottom surface of the channel of the liquid conveying area (6) and the inner side wall surface of the compensation chamber (7) are covered with a layer of porous micro-nano structure;
the area of the top surface of the groove (4) is larger than that of the heating surface of the heating device, the top of the radiating pipe (3) is provided with a liquid filling port, and the area of the cavity (8) is the same as the total area of the boiling area (5), the liquid conveying area (6) and the compensation chamber (7) on the upper surface of the liquid cavity bottom plate (1);
the external heat dissipation device comprises a plurality of heat dissipation fins (10) sleeved on the heat dissipation pipe (3), and electric fans (11) are arranged at two ends of each heat dissipation fin (10).
2. The liquid chamber heat dissipation device based on pool boiling heat dissipation of claim 1, wherein the thickness of the porous micro-nano structure is 10-200 μm.
3. The liquid chamber heat dissipation device based on pool boiling heat dissipation of claim 1, wherein the micro-column array comprises a plurality of micro-columns, the cross-section of the micro-column is square or circular, the width of the micro-column is 0.1-0.5 mm when the micro-column is square, the diameter of the micro-column is 0.1-0.5 mm when the micro-column is circular, the gap between two adjacent micro-columns is 0.1-0.5 mm, and the height of each micro-column is 1-1.5 mm.
4. The liquid chamber heat sink based on pool boiling heat dissipation of claim 1, wherein the material of the liquid chamber bottom plate (1), the liquid chamber top plate (2) and the heat dissipation pipe (3) is red copper.
5. The liquid chamber heat sink based on pool boiling heat dissipation of claim 1, wherein the height of the chamber (8) is 1-5 mm, the diameter of the through hole (9) is 2-10 mm, and the height of the heat dissipation pipe (3) is 50-150 mm.
6. The liquid chamber heat sink based on pool boiling heat dissipation of claim 1, wherein the external heat sink comprises a cooling chamber (13) disposed on the liquid chamber bottom plate (1), the heat dissipation pipes (3) are all located in the cooling chamber (13), and the cooling chamber (13) is opened with an inlet (12) and an outlet (14).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011400608.5A CN112492853B (en) | 2020-12-03 | 2020-12-03 | Liquid cavity heat dissipation device based on pool boiling heat dissipation |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011400608.5A CN112492853B (en) | 2020-12-03 | 2020-12-03 | Liquid cavity heat dissipation device based on pool boiling heat dissipation |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN112492853A CN112492853A (en) | 2021-03-12 |
| CN112492853B true CN112492853B (en) | 2021-12-28 |
Family
ID=74939172
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202011400608.5A Active CN112492853B (en) | 2020-12-03 | 2020-12-03 | Liquid cavity heat dissipation device based on pool boiling heat dissipation |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN112492853B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN117848127A (en) * | 2023-06-01 | 2024-04-09 | 山东大学 | Loop heat pipe |
Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105890415A (en) * | 2016-05-26 | 2016-08-24 | 西安交通大学 | Integrated loop heat pipe cooling device with boiling pool |
| CN111642103A (en) * | 2020-04-29 | 2020-09-08 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | High heat flow density porous heat sink flow cooling device |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN100480488C (en) * | 2004-12-28 | 2009-04-22 | 蒋子刚 | Kneading positive-displacement method of fluid machinery and mechanism and purpose thereof |
| CN100383963C (en) * | 2005-07-08 | 2008-04-23 | 富准精密工业(深圳)有限公司 | Thin loop type radiating apparatus |
| CN201057602Y (en) * | 2007-03-15 | 2008-05-07 | 青岛科技大学 | CPU radiator with nano fluid working medium |
| CN201374890Y (en) * | 2008-11-18 | 2009-12-30 | 张平 | Flat-plate heat pipe and heat abstractor formed by integrated design thereof with porous medium |
| CN204042816U (en) * | 2014-08-30 | 2014-12-24 | 杭州桑帝照明电器有限公司 | A kind of LED radiator based on vapor chamber heat dissipation technology |
| CN204849125U (en) * | 2015-08-17 | 2015-12-09 | 山东科芯电子有限公司 | Improve furnace crown of heat preservation effect |
| CN205784766U (en) * | 2016-05-26 | 2016-12-07 | 西安交通大学 | A kind of integral type heat radiation device for loop heat pipe of band boiling pool |
| CN108321135B (en) * | 2018-01-24 | 2019-08-23 | 西安交通大学 | A kind of columnar chip enhanced boiling heat transfer micro-structure of combined type and its manufacturing method |
| CN210381774U (en) * | 2019-08-26 | 2020-04-21 | 东莞铭普光磁股份有限公司 | Heat dissipation plate and optical module |
-
2020
- 2020-12-03 CN CN202011400608.5A patent/CN112492853B/en active Active
Patent Citations (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105890415A (en) * | 2016-05-26 | 2016-08-24 | 西安交通大学 | Integrated loop heat pipe cooling device with boiling pool |
| CN111642103A (en) * | 2020-04-29 | 2020-09-08 | 西南电子技术研究所（中国电子科技集团公司第十研究所） | High heat flow density porous heat sink flow cooling device |
Also Published As
| Publication number | Publication date |
|---|---|
| CN112492853A (en) | 2021-03-12 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN111642103B (en) | High heat flux porous heat sink flow cooling device | |
| TWI317006B (en) | ||
| CN104634148B (en) | A kind of nanostructured flat-plate heat pipe | |
| CN111106411B (en) | Power battery module based on loop heat pipe and phase-change material coupling cooling | |
| CN110010569B (en) | Gradient-scale pore sintering core soaking plate heat exchanger and preparation method thereof | |
| WO2008101384A1 (en) | Heat transfer device and manufacturing method thereof | |
| CN109548363A (en) | A kind of porous media liquid cooling device for cooling, production method and application method | |
| CN111707117B (en) | Optimized heat dissipation device of flat-plate evaporator | |
| CN111412776A (en) | Vapor-liquid flow-dividing capillary-core vapor chamber heat exchanger and preparation method thereof | |
| CN112492853B (en) | Liquid cavity heat dissipation device based on pool boiling heat dissipation | |
| CN112113450A (en) | Oscillation composite capillary core soaking plate structure for aerospace electronic heat dissipation | |
| CN110620096A (en) | High aspect ratio foam metal micro-channel phase change cooling device compounded with aluminum substrate | |
| CN113613468A (en) | Brazing refrigerant radiator | |
| CN209515645U (en) | A kind of gradient scale hole sintering core soaking sheet heat exchanger for heat dissipation of electronic chip | |
| CN210014476U (en) | Radiator, air condensing units and air conditioner | |
| CN112000206A (en) | Heat radiation system based on pump-driven capillary phase change loop | |
| CN114894016B (en) | Metal wire array wick unidirectional heat pipe and manufacturing method thereof | |
| CN112736046B (en) | Integrated chip heat dissipation device and heat dissipation method thereof | |
| WO2023010836A1 (en) | Heat dissipation module and electronic device | |
| CN211457823U (en) | Air conditioner and fin type phase change heat dissipation control box thereof | |
| WO2007124652A1 (en) | Micro-slot group integrated heat-pipe radiator | |
| CN108323099B (en) | Fin type heat pipe coupling radiator | |
| CN217719576U (en) | Three-dimensional flat pulsating heat pipe device for radiating and cooling high-power chip | |
| CN213662271U (en) | Heat radiation module | |
| CN114828546B (en) | Heat radiation module and heat radiation assembly thereof |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |