CN111412776A - Vapor-liquid flow-dividing capillary-core vapor chamber heat exchanger and preparation method thereof - Google Patents
Vapor-liquid flow-dividing capillary-core vapor chamber heat exchanger and preparation method thereof Download PDFInfo
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- CN111412776A CN111412776A CN202010324472.8A CN202010324472A CN111412776A CN 111412776 A CN111412776 A CN 111412776A CN 202010324472 A CN202010324472 A CN 202010324472A CN 111412776 A CN111412776 A CN 111412776A
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
- F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
- F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
- F28D15/04—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure
- F28D15/046—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with tubes having a capillary structure characterised by the material or the construction of the capillary structure
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F13/00—Arrangements for modifying heat-transfer, e.g. increasing, decreasing
- F28F13/18—Arrangements for modifying heat-transfer, e.g. increasing, decreasing by applying coatings, e.g. radiation-absorbing, radiation-reflecting; by surface treatment, e.g. polishing
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2245/00—Coatings; Surface treatments
- F28F2245/02—Coatings; Surface treatments hydrophilic
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- F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
- F28—HEAT EXCHANGE IN GENERAL
- F28F—DETAILS OF HEAT-EXCHANGE AND HEAT-TRANSFER APPARATUS, OF GENERAL APPLICATION
- F28F2245/00—Coatings; Surface treatments
- F28F2245/04—Coatings; Surface treatments hydrophobic
Abstract
A vapor-liquid split-flow capillary core vapor chamber heat exchanger and a preparation method thereof belong to the technical field of electronic device heat dissipation, and comprise a vapor cavity, fins and a heat dissipation fan; the steam cavity is filled with the integrally sintered capillary core, the capillary core is divided into an upper layer capillary core and a lower layer capillary core, and a tree-shaped steam channel is processed in the upper layer capillary core; the phase-change working medium filled in the steam cavity absorbs heat, boils and evaporates, flows to the side wall surface and the upper wall surface of the steam cavity in the tree-shaped steam channel in the steam cavity, and is condensed for heat exchange; the other capillary core structures except the steam channel are used for pumping the condensate to flow back to the heated area to form a working cycle, the gas-phase working medium and the liquid-phase working medium in the steam cavity respectively flow in the steam channel and the capillary core, so that the mutual influence in the flowing process of the two-phase working medium is reduced, the steam is favorably diffused to the condensing surface for heat exchange, and the condensate flows back to the hot end of the heat exchanger in time. The heat exchange performance of the soaking plate heat exchanger can be effectively improved.
Description
Technical Field
The invention belongs to the technical field of electronic device heat dissipation, relates to a capillary core vapor chamber heat exchanger and a preparation method thereof, and particularly relates to a gas-liquid two-phase flow radiator with a gas-liquid flow dividing function and a heat exchange effect improving function and a preparation method thereof.
Background
Along with the continuous progress of science and technology, the power density of electronic devices is bigger and bigger, and in order to guarantee the reliability of devices, higher and higher requirements are put forward on the heat dissipation of electronic devices, and aiming at the heat dissipation problem of electronic devices, the current heat radiators are various in form, such as ribbed type and heat pipe type, and due to the difference of the heat transfer modes in the heat radiators, the ribbed type heat radiators are weaker in performance than the heat pipe type heat radiators. In a heat pipe type radiator, a capillary core steam cavity radiator is widely applied to heat dissipation of electrical devices due to the advantages of strong heat exchange performance and good temperature uniformity. However, under the background that the power density of electronic devices is getting larger and larger, the steam cavity radiator also faces the problem of improving the heat exchange performance. According to the working principle of the steam cavity, whether the steam can be rapidly dispersed to the condensing and exchanging surface and the condensate can rapidly and smoothly flow back to the evaporation end is an important key factor for determining the heat exchange performance of the steam cavity radiator. In the capillary core vapor chamber heat exchanger, in the working process, the working medium is heated to evaporate/boil, steam flows to the condensation exchange surface along the pores in the capillary core, and condensed liquid after condensation flows back to the heated surface along the pores under the capillary suction effect. Therefore, the steam and the condensate have the phenomenon of mutual interference, the effective distribution and flow of the steam and the condensate are influenced, and the working performance of the capillary core vapor chamber is further restricted. In order to make the vapor distribution and the condensate reflux independent from each other, reduce mutual interference and improve the performance of the capillary core vapor chamber heat exchanger, it is important to design a capillary core vapor chamber heat exchanger which can meet the performance.
Disclosure of Invention
The invention aims to provide a vapor-liquid split capillary core vapor chamber heat exchanger and a preparation method thereof, aiming at the defects that in the working process of the existing capillary core vapor chamber heat exchanger, a working medium is heated, evaporated and boiled, steam flows to a condensation and exchange surface along pores in a capillary core, condensed liquid after condensation flows back to a heated surface along the pores under the action of capillary suction, the steam and the condensed liquid have the phenomenon of mutual interference, the effective distribution and the flow of the steam and the condensed liquid are influenced, the working performance of the capillary core vapor chamber is restricted, and the like.
The technical scheme of the invention is as follows: the utility model provides a vapour-liquid reposition of redundant personnel's capillary core soaking plate heat exchanger which characterized in that: the capillary core vapor chamber heat exchanger consists of a cooling fan, cover plate fins and a steam chamber; the steam cavity comprises a steam cavity side wall and a side wall rib, a steam cavity upper cover plate, a steam cavity capillary core and a steam cavity lower cover plate, the steam cavity capillary core comprises an upper layer capillary core and a lower layer capillary core, a steam channel is processed in the upper layer capillary core, a gap for steam condensation is formed between the upper layer capillary core and the side wall surface and the upper wall surface of the steam cavity, the lower layer capillary core is tightly attached to the lower wall surface of the steam cavity, a phase change working medium is filled in the steam cavity, and in the working process of the capillary core heat exchanger, steam and condensate in the steam cavity respectively flow in the steam channel and the capillary core, so that the flow resistance of the two-phase working medium is reduced, the steam flows to the condensation wall surface more smoothly, and the condensate flows back more quickly, so that the working performance of the heat exchanger is improved.
And gaps of 0.2-0.5 mm are formed between the upper capillary core and the side wall surface and the upper wall surface of the steam cavity.
The steam cavity capillary core is formed by loose sintering of metal powder, the metal powder selects different particle sizes according to the heat exchange performance requirement, and the particle size range is 50-200 microns.
The steam channel is of a multi-stage branched tree structure, the steam channel is composed of steam channel main branches and steam channel branches, the steam channel main branches are distributed from the center of a steam cavity to the periphery, branch steam channels are distributed on two sides of the steam channel main branches, the length and the depth of each stage of steam channel main branches are the same, the width of each stage of main branch steam channel and the width of the upper stage of steam channel main branches meet the Murray law, the cross sections of each stage of steam channel main branches and the steam channel branch are the same in size, and the length of each steam channel branch extends to the edge of a capillary core.
The steam cavity side wall and the side wall rib are of an integral processing structure, the steam cavity side wall and the side wall rib are respectively connected with the steam cavity upper cover plate and the steam cavity lower cover plate in a welding mode to form a closed space, and the cooling fan is fixedly connected with the cover plate fins and the side wall rib through screws.
The vapor cavity is filled with and packaged with a liquid working medium which can generate phase change after being heated.
The side wall and the upper wall of the steam cavity are subjected to hydrophobic modification treatment to strengthen steam condensation heat exchange; the bottom surface and the capillary core are subjected to hydrophilic modification treatment to strengthen the boiling heat transfer of the working medium and the suction and reflux effects of the condensate.
The steam cavity and the tree-shaped steam channel are rectangular or circular in shape, so that the applicability of the steam cavity and the tree-shaped steam channel is improved.
The preparation method of the vapor-liquid split-flow capillary core vapor chamber heat exchanger comprises the following steps:
(1) preparing a steam cavity side wall, side wall ribs and cover plate ribs by adopting an extrusion forming method;
(2) respectively cutting the side wall of the steam cavity, the side wall ribs and the cover plate ribs into small sections with required lengths for later use;
(3) milling two ends of the cut side wall of the steam cavity and the side wall of the side wall rib by 1-3 mm, then welding a lower cover plate of the steam cavity and an upper cover plate of the steam cavity with the side wall in sequence, and enabling the upper cover plate and the lower cover plate to be flush with the side wall rib;
(4) before welding the upper cover plate of the steam cavity, processing a sintered capillary core in a space enclosed by the side wall and the lower cover plate by using metal powder by adopting a powder sintering method, wherein the particle size of the metal powder is 50-200 microns;
(5) processing a tree-shaped steam channel in the capillary core by utilizing the processes of laser engraving and milling, electric spark processing and the like; the capillary core attached to the lower cover plate of the steam cavity is kept and is not processed to serve as a bottom capillary core, the rest is an upper layer capillary core, and the thickness of the bottom layer capillary core is 0.5-2 mm;
(6) processing a gap with the width of 0.2-1 mm on the upper capillary core, the side wall of the steam cavity and the upper cover plate by utilizing the processes of laser engraving and milling, electric spark processing and the like;
(7) before welding the upper cover plate of the upper steam cavity, performing hydrophobic modification treatment on the side wall of the steam cavity and the upper cover plate, and performing hydrophilic modification treatment on the capillary core and the lower cover plate;
(8) after the side wall and the upper cover plate of the steam cavity are welded, the pressure in the steam cavity is forcibly pumped to 10 DEG-3Pa or lessInjecting a phase change working medium into the steam cavity, and sealing the steam cavity after the injection is finished so as to ensure the air tightness;
(9) and after the liquid filling is finished, welding the cover plate fins with the upper cover plate, and ensuring that the cover plate fins are opposite to the side wall ribs.
The invention has the beneficial effects that: the vapor-liquid flow-dividing capillary core vapor chamber heat exchanger and the preparation method thereof have simple and compact structure, and the capillary core radiator consists of a vapor chamber, fins and a cooling fan; the steam cavity is filled with an integrally sintered capillary core and is divided into an upper layer capillary core and a lower layer capillary core according to functions, wherein a tree-shaped steam channel is processed in the upper layer capillary core; radiating fins are welded on the outer side of the steam cavity and fixedly installed together with the radiating fan. The lower wall of the steam cavity is in contact with the electronic chip to take away the heat generated by the electronic chip; the phase-change working medium filled in the steam cavity absorbs heat, boils and evaporates, flows to the side wall surface and the upper wall surface of the steam cavity in the tree-shaped steam channel in the steam cavity, and is condensed for heat exchange; and other capillary core structures except the steam flow channel are used for pumping the condensate to flow back to the heated area to form a working cycle. In the working process of the vapor chamber heat exchanger, the gas-phase working medium and the liquid-phase working medium in the steam chamber respectively flow in the steam channel and the capillary core, so that the mutual influence in the flowing process of the two-phase working medium is reduced, the steam is favorably and rapidly diffused to the condensing surface for heat exchange, and the condensate is timely refluxed to the hot end of the heat exchanger. Meanwhile, the side wall and the upper wall of the steam cavity are subjected to hydrophobic modification treatment, and the bottom surface and the capillary core are subjected to hydrophilic modification treatment, so that the steam condensation, the boiling heat exchange of condensate and the quick backflow of the condensate are enhanced. Therefore, the heat exchange performance of the soaking plate heat exchanger can be effectively improved.
Drawings
Fig. 1 is a schematic view of the overall structure of the present invention.
Fig. 2 is a schematic diagram of the overall explosion structure of the present invention.
Fig. 3 is a schematic diagram of the working principle of the present invention.
Fig. 4 is a cross-sectional structural view of a vapor chamber of the present invention.
Fig. 5 is a schematic view of the wick structure of the present invention.
FIG. 6 is a schematic view of the structure of the side wall and the side wall rib of the steam chamber of the present invention.
FIG. 7 is a schematic view of the rib structure of the cover plate of the present invention.
In the figure: the heat radiation device comprises a heat radiation fan 1, a cover plate rib 2, a steam cavity side wall and side wall rib 3, a steam cavity upper cover plate 4, a steam cavity capillary core 5, an upper layer capillary core 501, a bottom layer capillary core 502, a steam cavity lower cover plate 6, a heat transfer path 7, a steam flowing direction 8, a condensate backflow direction 9, cooling air 10, a steam channel 11, a steam channel main branch 1101 and a steam channel branch 1102.
Detailed Description
The invention will be further described with reference to the accompanying drawings in which:
as shown in fig. 1-2, a vapor-liquid split-flow capillary core vapor chamber heat exchanger is composed of a heat radiation fan 1, cover plate fins 2, steam chamber side walls and side wall ribs 3, a steam chamber upper cover plate 4, a steam chamber capillary core 5 and a steam chamber lower cover plate 6, in order to ensure good working performance of a heat radiator, a steam chamber shell and the fins can be made of metal materials with good heat conductivity, and particularly, in order to reduce the weight of the heat radiator, aluminum alloy materials with low density and high heat conductivity coefficient can be adopted for processing. The steam cavity is filled with a sintered capillary core, and a steam channel is processed in the capillary core. The steam cavity is filled with liquid working media such as water, acetone, alcohol, ammonia, refrigerant and the like which are heated to generate phase change, and the volume of the working media accounts for 40-60% of the effective volume of the steam cavity.
As shown in fig. 3, the operation process and principle of a vapor-liquid split-flow capillary core vapor chamber heat exchanger are as follows: heat generated in the working process of the electronic chip is transferred to the working medium dispersed in the capillary core through the lower cover plate 6 of the steam cavity according to the heat transfer path 7; the working medium is heated to evaporate/boil, the generated steam is transported to the side wall 3 of the steam cavity and the inner wall surface (cold wall surface) of the upper cover plate 4 of the steam cavity through the steam channel 11, and the steam is condensed into liquid condensate after the heat of the carried electronic chip is released; under the capillary suction action of the capillary core, the condensate reflows to a high-temperature area contacted with the electronic chip along the condensate reflowing direction 9 to be continuously heated, evaporated and boiled, and the heat generated by the electronic chip is taken away through circulation. The heat released by the condensation of the steam is transferred to the side wall ribs 3 and the cover plate ribs 2 through the side wall of the steam cavity and the upper cover plate, and then released to the external environment through heat exchange with the cooling air 10.
As shown in fig. 4-5, the vapor-liquid split-flow capillary core vapor chamber heat exchanger suitable for electronic chip heat dissipation according to the present invention has a sintered capillary core disposed in a vapor chamber, the sintered capillary core 5 is sintered in the vapor chamber by loose powder, and the capillary core is divided into an upper capillary core 501 and a lower capillary core 502 according to functional division. A multi-stage branched tree-shaped distributed steam channel 11 is processed in the upper-layer capillary core 501 and comprises a steam channel main branch 1101 and a steam channel branch 1102; the steam channel main branches 1101 are distributed from the center of the steam cavity to the periphery, and the branch steam channels 1102 are distributed on two sides of the steam channel main branches 1101; the lengths and the depths of the steam channel main branches 1101 at all levels are the same, but the width of the steam channel main branches 1101 at all levels and the width of the steam channel main branches 1101 at the upper level meet the Murray law; each stage of the main branch 1101 of the steam channel is the same as the cross-sectional size of the branch 1102 of the steam channel, but the length of the branch 1102 of the steam channel extends all the way to the edge of the capillary wick. A gap with the width of 0.2-1 mm is processed between the upper-layer capillary core 501 and the side wall of the steam cavity and the upper cover plate. The bottom capillary core 502 is not processed and is paved on the bottom of the whole steam cavity, and the thickness is 0.5-2 mm. Since the upper wick 501 is divided into multiple areas of non-communication by the vapor channel 11, condensate cannot be drawn directly through the upper wick 1101 and will be near the hot end of the electronic chip. However, the condensate can be pumped through the upper capillary wick 1101 to the bottom capillary wick 502, and then pumped along the bottom capillary wick 502 to the hot end of the vapor chamber, i.e., to the place where the electronic chip is attached.
As shown in fig. 6-7, the vapor-liquid split-flow capillary core soaking plate heat exchanger suitable for electronic chip heat dissipation according to the present invention has an integral structure of the vapor chamber side wall and the side wall rib 3 and the cover plate rib 2, and the side wall rib 3 and the cover plate rib 2 are opposite to each other except the vapor chamber to facilitate the flow of the cold zone air 10. The invention relates to a vapor-liquid diversion capillary core vapor chamber heat exchanger suitable for electronic chip heat dissipation, wherein a heat dissipation fan is fixedly connected with a cover plate rib through a screw.
Claims (9)
1. The utility model provides a vapour-liquid reposition of redundant personnel's capillary core soaking plate heat exchanger which characterized in that: the capillary core vapor chamber heat exchanger consists of a cooling fan (1), cover plate fins (2) and a steam cavity; the steam cavity comprises a steam cavity side wall and a side wall rib (3), a steam cavity upper cover plate (4), a steam cavity capillary core (5) and a steam cavity lower cover plate (6), the steam cavity capillary core (5) comprises an upper layer capillary core (501) and a lower layer capillary core (502), a steam channel (11) is processed in the upper layer capillary core (501), a gap for steam condensation is arranged between the upper layer capillary core (501) and the side wall surface and the upper wall surface of the steam cavity, the lower layer capillary core (502) is tightly attached to the lower wall surface of the steam cavity, a phase-change working medium is filled in the steam cavity, the capillary core heat exchanger flows in the working process, steam and condensate in the steam cavity respectively flow in the steam channel (11) and the capillary core (5), the flow resistance of the two-phase working medium is reduced, the steam flows to the condensation wall surface more smoothly, and the condensate flows back more quickly, so as to improve the working performance of the heat exchanger.
2. The vapor-liquid split capillary wick heat spreader plate exchanger of claim 1, wherein: and gaps of 0.2-0.5 mm are formed among the upper capillary core (501), the side wall surface and the upper wall surface of the steam cavity.
3. The vapor-liquid split capillary wick heat spreader plate exchanger of claim 1, wherein: the steam cavity capillary core (5) is formed by loose sintering of metal powder, the metal powder selects different particle sizes according to the performance requirement of the heat exchange wire, and the particle size range is 50-200 micrometers.
4. The vapor-liquid split capillary wick heat spreader plate exchanger of claim 1, wherein: the steam channel (11) is of a multi-stage branched tree structure, the steam channel (11) is composed of steam channel main branches (1101) and steam channel branches (1102), the steam channel main branches (1101) are distributed from the center of a steam cavity to the periphery, the branch steam channels (1102) are distributed on two sides of the steam channel main branches (1101), the lengths and the depths of all stages of steam channel main branches (1101) are the same, the width of each stage of main branch steam channel (1101) and the width of an upper stage steam channel main branch (1101) meet the Murray law, the cross-sectional sizes of all stages of steam channel main branches (1101) and the steam channel branches (1102) are the same, and the lengths of the steam channel branches (1102) extend to the edge of a capillary core.
5. The vapor-liquid split capillary wick heat spreader plate exchanger of claim 1, wherein: the steam cavity side wall and the side wall rib (3) are of an integral processing structure, the steam cavity side wall and the side wall rib (3) are respectively welded with the steam cavity upper cover plate (4) and the steam cavity lower cover plate (6) to form a closed space, and the cooling fan (1) is fixedly connected with the cover plate fins (2) and the side wall rib through screws.
6. The vapor-liquid split capillary wick heat spreader plate exchanger of claim 1, wherein: the vapor cavity is filled with and packaged with a liquid working medium which can generate phase change after being heated.
7. The vapor-liquid split capillary wick heat spreader plate exchanger of claim 1, wherein: the side wall and the upper wall of the steam cavity are subjected to hydrophobic modification treatment to strengthen steam condensation heat exchange, and the bottom surface and the capillary core are subjected to hydrophilic modification treatment to strengthen working medium boiling heat transfer and strengthen condensate liquid suction and reflux effects.
8. The vapor-liquid split capillary wick heat spreader plate exchanger of claim 1, wherein: the steam cavity and the tree-shaped steam channel are rectangular or circular in shape, so that the applicability of the steam cavity and the tree-shaped steam channel is improved.
9. A method of making a vapor-liquid split capillary wick heat spreader heat exchanger, characterized in that a vapor-liquid split capillary wick heat spreader heat exchanger according to any one of claims 1-8 is made, the method comprising:
(1) preparing the side wall of the steam cavity, the side wall ribs (3) and the cover plate ribs (2) by adopting an extrusion forming method;
(2) respectively cutting the side wall of the steam cavity, the side wall rib (3) and the cover plate rib (2) into small sections with required lengths for later use;
(3) milling two ends of the cut side wall of the steam cavity and the side wall of the side wall rib (3) by 1-3 mm, and then welding a lower cover plate (6) of the steam cavity and an upper cover plate (4) of the steam cavity with the side wall in sequence, and enabling the upper cover plate and the lower cover plate to be flush with the side wall rib;
(4) before welding the upper cover plate (4) of the steam cavity, processing a sintered capillary core in a space enclosed by the side wall and the lower cover plate by using metal powder by using a powder sintering method, wherein the particle size of the metal powder is 50-200 microns;
(5) processing a tree-shaped steam channel in the capillary core by utilizing the processes of laser engraving and milling, electric spark processing and the like; the capillary core attached to the lower cover plate (6) of the steam cavity is kept and is not processed to serve as a bottom capillary core (502), and the rest is an upper capillary core (501); the thickness of the bottom capillary core (502) is 0.5-2 mm;
(6) processing a gap with the width of 0.2-1 mm on the upper capillary core (501), the side wall of the steam cavity and the upper cover plate by utilizing the processes of laser engraving and milling, electric spark processing and the like;
(7) before welding an upper cover plate (4) of the upper steam cavity, performing hydrophobic modification treatment on the side wall (3) of the steam cavity and the upper cover plate (4), and performing hydrophilic modification treatment on the capillary core (5) and the lower cover plate (6);
(8) after the side wall and the upper cover plate of the steam cavity are welded, the pressure in the steam cavity is forcibly pumped to 10 DEG-3Below Pa, injecting a phase change working medium into the steam cavity, and sealing the steam cavity after filling to ensure the air tightness;
(9) after the liquid filling is finished, the cover plate fins (2) are welded with the upper cover plate (4), and the cover plate fins (2) are ensured to be opposite to the side wall ribs.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202010324472.8A CN111412776A (en) | 2020-04-23 | 2020-04-23 | Vapor-liquid flow-dividing capillary-core vapor chamber heat exchanger and preparation method thereof |
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| CN202010324472.8A CN111412776A (en) | 2020-04-23 | 2020-04-23 | Vapor-liquid flow-dividing capillary-core vapor chamber heat exchanger and preparation method thereof |
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Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113008057A (en) * | 2021-02-03 | 2021-06-22 | 江苏大学 | Preparation method of double-sided micro-channel flat pulsating heat pipe and application of double-sided micro-channel flat pulsating heat pipe in high-power chip heat dissipation device |
| CN113137885A (en) * | 2021-03-22 | 2021-07-20 | 广东工业大学 | High-speed backflow heat dissipation type vapor chamber |
| CN113819782A (en) * | 2021-07-22 | 2021-12-21 | 西安交通大学 | Phase change heat dissipation device |
| CN115842283A (en) * | 2023-01-03 | 2023-03-24 | 济南邦德激光股份有限公司 | Pump encapsulation casing |
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2020
- 2020-04-23 CN CN202010324472.8A patent/CN111412776A/en active Pending
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113008057A (en) * | 2021-02-03 | 2021-06-22 | 江苏大学 | Preparation method of double-sided micro-channel flat pulsating heat pipe and application of double-sided micro-channel flat pulsating heat pipe in high-power chip heat dissipation device |
| CN113137885A (en) * | 2021-03-22 | 2021-07-20 | 广东工业大学 | High-speed backflow heat dissipation type vapor chamber |
| CN113819782A (en) * | 2021-07-22 | 2021-12-21 | 西安交通大学 | Phase change heat dissipation device |
| CN115842283A (en) * | 2023-01-03 | 2023-03-24 | 济南邦德激光股份有限公司 | Pump encapsulation casing |
| CN115842283B (en) * | 2023-01-03 | 2023-06-02 | 济南邦德激光股份有限公司 | Pump packaging shell |
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