CN209877718U - Phase change heat dissipation device - Google Patents
Phase change heat dissipation device Download PDFInfo
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- CN209877718U CN209877718U CN201920153756.8U CN201920153756U CN209877718U CN 209877718 U CN209877718 U CN 209877718U CN 201920153756 U CN201920153756 U CN 201920153756U CN 209877718 U CN209877718 U CN 209877718U
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Abstract
The utility model discloses a phase transition heat abstractor, including the inside phase transition subassembly that is provided with phase transition heat transfer medium, the phase transition heat transfer medium configuration that sets up in the phase transition subassembly is when phase transition heat abstractor operating condition, the inside atmospheric pressure of phase transition subassembly is greater than 0.15 MPa. The utility model discloses a phase transition heat abstractor during operation, the operating temperature scope is 30-80 ℃, and internal pressure is far greater than standard atmospheric pressure, and for the non-vacuum environment of malleation, the heat flux density of heat source is big, and the absolute pressure of phase transition subassembly evaporation portion is high, and the relative pressure difference under the same difference in temperature condition in different positions of phase transition subassembly is big, and pressure difference can drive more phase transition medium to reinforcing heat transfer capacity has improved the mobility of inside phase transition heat transfer medium, improves the heat flux density of heat transfer, realizes high-efficient heat dissipation more easily.
Description
Technical Field
The utility model belongs to the technical field of the phase transition heat abstractor, especially, relate to an electron device's phase transition heat abstractor.
Background
The phase change heat dissipation is a high-efficiency heat dissipation mode, and the principle is that a phase change heat exchange medium is boiled and gasified at a certain temperature to absorb heat, and then the gasified gas is condensed, liquefied and released at other positions to release heat, so that heat transfer is realized, and the phase change heat dissipation device is good in heat transfer effect and wide in application.
At present, a phase-change radiator generally adopts a heat pipe to perform phase-change heat dissipation, and compared with other traditional heat dissipation methods, the heat transfer efficiency of heat pipe heat dissipation is high, and the heat dissipation effect is good. A common heat pipe radiator mainly comprises three major parts, namely a heat pipe, a heat dissipation fin and a heat conduction base. The heat pipe is used as a phase change component, heat is transferred in a phase change mode, the heat conduction base is connected with the heating source and the radiator, the heat source can transfer heat to the heat pipe through the heat conduction base, and the radiating fins transfer heat of phase change heat media in the heat pipe and the heat pipe to the outside. One end (evaporation part) of the heat pipe is embedded in or welded on the heat conduction base, and the other end (condensation part) of the heat pipe is connected with the heat dissipation fins.
For the common phase change heat radiator at present, in order to realize the evaporation of the phase change heat exchange medium at a proper temperature, the boiling point of the phase change heat radiator is mostly reduced by adopting a vacuum pumping mode. The traditional heat pipe adopts deionized water or ethanol as a working medium, and can be vaporized at a working point only by maintaining a certain negative pressure.
Because the heat pipes are tubular, the number of the heat pipes which are suitable for being configured by one heat pipe radiator is very limited, and the direct contact area between the heat pipes and a heat source is not large, great obstacles are generated when heat is transferred to the phase change assembly (the heat pipe) from the heat source, the heat transfer efficiency is not high, the heat dissipation performance is severely limited, and the local high temperature of the base can be caused. In addition, the heat dissipation mode of the heat pipe is one-dimensional, heat is conducted in a linear mode, the heat dissipation capacity and the heat dissipation effect of the heat pipe are not optimal, the cost for processing the heat pipe radiator is high, most of the phase-change radiators work in an internal vacuum environment, the flow of internal phase-change heat media is limited, and heat dissipation is not facilitated.
In addition, present heat pipe shell material is mostly red copper, and the base material is mostly the aluminum alloy, adopts low temperature tin to braze usually or the cementation packing heat pipe and the base gap after taking shape, will produce certain thermal resistance like this, is unfavorable for heat transfer, and the shortcoming of low temperature tin lead welding includes: before welding, the radiator must be subjected to surface treatment such as nickel plating or copper plating, and the welding and the surface treatment cause high cost and pollution to the environment; the tin soldering is difficult to ensure that the heat pipe and the aluminum alloy base are well filled in the plane, and no local gap is generated, so that the heat pipe is arranged below the power device, the heat flow density is high, and the gap can cause the local temperature rise of a heat source device, thereby causing the loss of the device. The heat pipe radiator has high processing cost and pollutes the environment.
Therefore, the traditional phase change radiator has the problems of large heat transfer resistance, uneven heat transfer, high production cost, low heat exchange efficiency and the like.
SUMMERY OF THE UTILITY MODEL
For solving the problem among the above-mentioned prior art, the utility model provides an electron device phase transition heat abstractor to improve heat transfer efficiency, promote the heat and spread fast.
In order to achieve the above object, the utility model discloses an electron device phase transition heat abstractor's concrete technical scheme as follows:
a phase change heat dissipation device comprises a phase change component, wherein a phase change heat exchange medium is arranged in the phase change component, and when the phase change heat dissipation device is in a working state, the air pressure in the phase change component is greater than 0.15 MPa.
Further, the phase change heat exchange medium arranged in the phase change module is any one or more of R134a, R142b, R114, R124, R1233Zd (E), R1234Ze (Z), R1234Ze (E), R600a, RC318, RE245cb2, R22, R32, R407C and R410A.
Further, the phase change component includes evaporation portion and condensation portion, and the inside of evaporation portion has the evaporation chamber, and the inside of condensation portion has the condensation chamber, the evaporation chamber with condensation chamber intercommunication, the heat that generates heat the source can be absorbed to the phase change heat transfer medium in the evaporation chamber and to the transmission of condensation chamber, the condensation chamber outwards gives off the heat and cools off in order to generating heat the source.
Further, the evaporation cavity is a planar or curved cavity.
Furthermore, the condensation part comprises a plurality of condensation support plates, and the condensation cavity is a planar cavity correspondingly arranged in the condensation support plates; or the condensation part comprises a plurality of condensation branch pipes, and the condensation cavity is a cylindrical cavity correspondingly arranged in the condensation branch pipes; or the condensation part comprises a plurality of condensation conical pipes, and the condensation cavity is a conical cavity correspondingly arranged in the condensation conical pipes.
Further, the condensing part is connected to the evaporating part directly or through a pipe.
Furthermore, the inner wall of the condensation part is provided with a condensation strengthening structure, and the outer wall of the condensation part is provided with fins or fins for increasing the condensation area.
Furthermore, a plurality of fins, salient points or fins are arranged in the evaporation part and the condensation part to improve the pressure bearing capacity.
Further, the outer wall of the evaporation part is arranged in contact with the heat generation source.
Furthermore, the outer surface of the evaporation part is provided with a contact heat absorption surface, the heating source is provided with a heat source surface, the contact heat absorption surface of the evaporation part is in contact with the heat source surface of the heating source, and the heat source surface and the contact heat absorption surface are both planes.
The utility model discloses a phase transition heat abstractor has following advantage:
1) the evaporation part of the phase change component is in direct contact with the heating source, the evaporation part can be fully in contact with the heating source, the heat transfer area is large, the heat transfer effect is good, when the heat flux density of the heating source is large, the temperature of the phase change medium in direct contact with the bottom of the evaporation cavity is gasified, other local pressures are increased, the evaporation cavity and the part with the highest heat flux density in contact with the heating source form pressure difference with other parts, the rapid heat diffusion of the evaporation part of the phase change component can be realized, and the overall temperature difference of the evaporation part is small.
2) The phase change component is of a three-dimensional heat dissipation structure, and after the phase change heat exchange medium is vaporized, the phase change heat exchange medium can be rapidly diffused to any low-pressure part of the phase change component, so that the temperature of the phase change component is uniform, the heat transfer efficiency is high, and the heat transfer is uniform.
3) When the phase change heat dissipation device works, the working temperature range is 30-80 ℃, the internal pressure is far greater than the standard atmospheric pressure, and the phase change heat dissipation device is in a positive pressure non-vacuum environment. The heat source has high heat flux density, the phase change device has high absolute pressure of the evaporation part, the phase change device has high relative pressure difference under the same temperature difference condition at different parts, and the pressure difference can drive more phase change media, thereby enhancing the heat exchange capacity, improving the mobility of the internal phase change heat exchange media, improving the heat flux density of heat transfer and more easily realizing high-efficiency heat dissipation.
4) When the phase change heat dissipation device works, the internal absolute pressure is large, and the pressure to be borne by the evaporation part and the condensation part is large. A plurality of fins, salient points or fins are arranged in the evaporation part and the condensation part to improve the pressure bearing capacity.
5) The phase change component is internally brazed or sintered to have a structure for enhancing boiling and evaporation heat exchange, a phase change heat exchange medium can carry out boiling heat exchange more efficiently, heat expansion is more uniform and rapid, and heat transfer is more efficient due to the increase of heat exchange area.
Furthermore, the utility model discloses a phase change heat abstractor's manufacturing need not pass through surface treatment processes such as copper facing and nickel plating, and heat abstractor's phase change structure and condensing fin directly adopt high temperature brazing to weld integratively, and the gap is filled through low temperature tin soldering again in heating source (like power device CPU) and the contact of phase change heat abstractor, avoids producing the clearance, makes the utility model discloses a phase change heat abstractor's heat transfer limit is showing and is improving (being far more than 200W).
The utility model discloses can use power electronics components heat dissipation such as chip, resistance, electric capacity, inductance, storage medium, light source, battery package.
Drawings
Fig. 1a is a perspective view of a first embodiment of the phase change heat dissipation device of the present invention, wherein a plurality of condensation support plates are not connected;
FIG. 1b is a cross-sectional view of the phase change heat sink of FIG. 1a, wherein a plurality of cold plates are interconnected by a cold top plate;
fig. 2 is a perspective view of a second embodiment of the phase change heat dissipation device of the present invention;
fig. 3a is a perspective view of a third embodiment of the phase change heat dissipation device of the present invention;
FIG. 3b is a cross-sectional view of the phase change heat sink of FIG. 3 a;
fig. 4a is a perspective view of a fourth embodiment of the phase change heat dissipation device of the present invention;
FIG. 4b is a cross-sectional view of the phase change heat sink of FIG. 4 a;
fig. 5a is a perspective view of a fifth embodiment of the phase change heat dissipation device of the present invention, in which an evaporation portion and a condensation portion are separately disposed and communicated with each other through a pipeline, the evaporation portion has a hollow rectangular cavity, and the condensation portion includes a plurality of condensation support plates;
FIG. 5b is a cross-sectional view of the phase change heat sink of FIG. 5 a;
fig. 6a is a perspective view of a sixth embodiment of the phase change heat dissipation device of the present invention, wherein an evaporation portion and a condensation portion are separately disposed and communicated with each other through a pipeline, the evaporation portion is a hollow rectangular cavity, the condensation portion includes a plurality of condensation branch pipes, and the condensation branch pipes have a plurality of cylindrical cavities;
FIG. 6b is a cross-sectional view of the phase change heat sink of FIG. 6 a;
7-8 show schematic diagrams of the flow of the phase change heat transfer medium of the present invention in the phase change assembly;
fig. 9 is a schematic diagram illustrating an enhanced heat exchange structure on the phase-change heat dissipation device.
Detailed Description
In order to better understand the purpose, structure and function of the present invention, the following description is made in detail with reference to the accompanying drawings.
The related terms of the present invention are defined as follows:
boiling heat transfer refers to a heat transfer process in which heat is transferred from a wall surface to a liquid to boil and vaporize the liquid.
The gasification core, which is the carrier that initiates the boiling of the liquid.
Thermal conductivity, defined as the two 1 meter apart inside the body, perpendicular to the direction of heat conductionParallel planes of 1 square meter area, and if the temperature difference between the two planes is 1K, the amount of heat transferred from one plane to the other in 1 second is defined as the thermal conductivity of the material, which is given in Watt-meters-1Opening of-1 (W·m-1·K-1)。
Thermal resistance, defined as the ratio between the temperature difference across an object and the power of a heat source when heat is transferred across the object, is expressed in degrees Kelvin per Watt (K/W) or degrees Celsius per Watt (C/W).
The heat transfer coefficient refers to the heat transferred by unit area in unit time under the condition of stable heat transfer, wherein the temperature difference of air at two sides of the enclosure structure is 1 degree (K or ℃), the unit is watt/(square meter DEG) (W/. K, where K can be replaced by DEG C), and the strength of the heat transfer process is reflected.
The heat flow density refers to the heat flow density of heat transferred by unit area in unit time, Q is Q/(S t) — Q is the heat, t is the time, S is the cross-sectional area, and the unit of the heat flow density is: j/(m)2S) transitional boiling, as the heat flux density increases, a vapor column is formed from a large amount of vapor ejected from the vaporization core, and the vapor flow interferes with the liquid not supplied to the heat transfer surface, causing liquid drying up on the heat transfer surface in a short time, resulting in a rapid temperature rise on the heat transfer surface.
When the temperature of the contact part of the radiator and the heating source is stable, the pressure in the phase change component of the radiator is more than 1.5 times of standard atmospheric pressure (more than 0.15MPa), and the pressure is defined as positive pressure.
Micro-positive pressure: when the temperature of the contact part of the radiator and the heating source is stable, the pressure in the phase change component of the radiator is slightly positive pressure between 0.1MPa and 0.15 MPa. For example, ethanol and the like are used as a phase change heat exchange medium, and the air pressure inside the phase change component is slightly positive pressure during operation.
Negative pressure: when the temperature of the contact part of the radiator and the heating source is stable, the pressure in the phase change component of the radiator is negative pressure which is less than 0.1 MPa. For example: when water is used as a phase-change heat exchange medium, the pressure inside the phase-change assembly must be negative during working, otherwise the phase-change heat exchange medium cannot be started, and the radiator fails.
As shown in fig. 1a-6b, the phase change heat dissipation device 10 of the present invention includes an evaporation portion 11, a condensation portion 12 and a phase change heat transfer medium 20 disposed in the evaporation portion 11 or the condensation portion 12, wherein the evaporation portion 11 and the condensation portion 12 together form a three-dimensional heat transfer structure. When the phase change heat dissipation device 10 is in a working state, the working pressure inside the phase change heat dissipation device 10 is greater than 0.15MPa, and the phase change heat dissipation device is in a positive pressure state. Wherein the evaporation part 11 and the condensation part 12 can be directly connected together (as shown in fig. 1 a-4 b), or the evaporation part 11 and the condensation part 12 can be a split structure (as shown in fig. 5 a-6 b) connected together by a pipeline.
In the embodiment shown in fig. 5 a-6b, the condensing portion 12 can be placed horizontally or vertically, and the structure and the placing direction are changed according to the design requirement of the system structure of the CPU board. The heat source 30 is directly installed in the evaporation part 11 of the phase change component, the heat is directly transferred to the phase change heat transfer medium 20 through the thin wall of the evaporation part 11, the phase change heat transfer medium 20 absorbs heat and changes phase to generate pressure difference between the evaporation part 11 and the condensation part 12 inside the phase change heat dissipation device 10, so that the phase change heat transfer medium 20 is driven to flow to the condensation part 12, and the phase change medium returns to the evaporation part 11 through gravity or capillary force after being condensed in the condensation part 12 to form circulation.
As shown in fig. 1a-1b, the utility model discloses a phase change heat abstractor 10 includes the phase change subassembly, and the phase change subassembly has the enclosed construction of cavity for inside, and phase change heat transfer medium 20 is equipped with to phase change subassembly inside, and the inside cavity of phase change subassembly is full open structure, and phase change heat transfer medium 20 can be in the whole inside cavity mesocycle of phase change subassembly and flow.
The phase change component has evaporation portion 11 and condensation portion 12, and the inside of evaporation portion 11 has the evaporation chamber, and the inside of condensation portion 12 has the condensation chamber, and the evaporation chamber of evaporation portion 11 and the condensation chamber intercommunication of condensation portion 12, evaporation chamber and condensation chamber constitute the inside cavity of phase change component, and condensation portion 12 links to each other with the condensation fin. The phase-change heat exchange medium 20 in the evaporation cavity absorbs the heat of the heat source 30, then is vaporized, evaporated and flows into the condensation cavity to be cooled and liquefied, and the condensation cavity emits the heat outwards through the condensation fins. Therefore, the phase-change heat sink 10 can transfer the heat of the heat generating source 30 to the air or other gaseous cooling medium to achieve the effect of heat dissipation and cooling of the heat source.
The evaporation part 11 of the phase change element is a planar plate or a curved plate with a cavity inside, the evaporation part 11 is provided with a planar evaporation cavity or a curved evaporation cavity inside, and the planar cavity or the curved evaporation cavity inside the evaporation part 11 is communicated with the condensation cavity inside the condensation part 12.
Condensation portion 12 includes that a plurality of inside have the condensation extension board of cavity, and the inside of condensation extension board is plane condensation chamber, and a plurality of condensation extension boards are connected on evaporation portion 11, and the inside plane condensation chamber of condensation extension board is linked together with the inside plane evaporation chamber or the curved surface evaporation chamber of evaporation portion 11. The above-mentioned a plurality of condensation extension boards are preferred in bank parallel arrangement, and the condensation extension board is connected with evaporation portion 11 perpendicularly, and the outside of condensation extension board is connected with the condensation fin, and the heat in the condensation extension board gives off to the external world through the condensation fin. The evaporation part 11 is not limited to a plate-like structure, and may be other column structures as long as the lower bottom surface is a plane.
Further, the inner wall of condensation portion 12 is equipped with the condensation and strengthens the structure, and the condensation is strengthened the structure and can be the capillary structure that condensation portion 12 inner wall spreads the setting, capillary structure is waist shape column or cylinder or circular cone structure, and capillary structure has the capillary action, enables phase change heat transfer medium 20 after the vaporization and flows along the condensation chamber more fast uniformly, also is favorable to phase change heat transfer medium 20 after the condensation to flow back to the evaporation chamber fast. In addition, the capillary structure can increase the heat exchange area of the condensation cavity, so that the heat transfer speed is increased.
As shown in fig. 2, the condensation portion 12 further includes a condensation top plate 121, a planar condensation cavity or a curved condensation cavity is provided inside the condensation top plate 121, the condensation cavity inside the condensation top plate 121 is communicated with the condensation cavity inside the condensation support plate, and the condensation portion 12 is overall in a comb shape. The phase change heat exchange medium 20 absorbs heat in the evaporation cavity of the evaporation part 11, and dissipates heat through the condensation support plate and the condensation top plate 121 of the condensation part 12, and the phase change heat exchange medium 20 circularly flows in the evaporation cavity of the evaporation part 11 and the condensation cavity in the condensation support plate and the condensation top plate 121, so as to dissipate heat of the heat source 30. The condensation top plate 121 can be integrally formed with the condensation support plate. The evaporation part 11 and the condensation part 12 of the phase change unit are also preferably integrally formed.
In the present embodiment, as shown in fig. 3a-3b, the condensing plate in the condensing portion 12 takes other forms, that is, the condensing portion 12 includes a plurality of cylindrical condensing branch pipes, and the condensing cavity is a cylindrical cavity correspondingly disposed inside the condensing branch pipes. As shown in fig. 4a-4b, the condensation portion 12 may further include a plurality of condensation tapered tubes, and the condensation chamber is a conical cavity correspondingly disposed inside the condensation tapered tubes.
As shown in fig. 5a, 5b, 6a, and 6b, the condensation chamber of the condensation portion 12 is not directly connected to the evaporation portion 11, and the condensation chamber of the condensation portion 12 is connected to the evaporation portion 11 through a pipeline, so that the condensation portion 12 can be conveniently and reasonably arranged according to the internal structure of the heat source 30 system.
From this, the evaporation portion 11 and the condensation portion 12 of phase change component directly communicate, the evaporation portion 11 of phase change component one end and the condensation portion 12 of the phase change component other end directly communicate, the inside phase change heat transfer medium 20 of phase change component is in evaporation and condensation process, can realize that the heat from phase change component one end to the level of the phase change component other end to, vertical three-dimensional solid diffusion, promote whole phase change component inner cavity, especially the temperature homogeneity in condensation chamber in the condensation portion 12.
The evaporation part 11 directly contacts the heat source 30, that is, the surface of the evaporation part 11 (the outer surface of the evaporation cavity) directly contacts the heat source 30, and the surface of the evaporation part 11 directly replaces the substrate of the conventional heat dissipation device, so as to improve the heat transfer efficiency between the heat source 30 and the evaporation part 11. The evaporation portion 11 is preferably a flat plate-shaped body having a cavity therein, one side of the evaporation portion 11 has a contact heat absorbing surface, the heat source 30 has a flat heat source surface, and the contact heat absorbing surface of the evaporation portion 11 is disposed in contact with the heat source surface of the heat source 30.
The area of the heat source surface of the heat source 30 is smaller than the area of the heat absorption surface of the evaporation part 11 of the phase change component, and the internal phase change heat exchange medium 20 can rapidly transfer heat from the heat source 30 to the evaporation part 11 of the phase change component along the two-dimensional direction through phase change flow, so that the temperature uniformity in the evaporation cavity of the phase change component can be ensured. The vaporized phase-change heat exchange medium 20 enters the condensing support plates and flows along a third direction, which is perpendicular to the evaporation part 11 of the planar plate-shaped body, i.e., perpendicular to the two-dimensional heat dissipation direction inside the evaporation part 11.
A plurality of fins, protruding points or fins are arranged inside the evaporation part 11 and/or the condensation part 12 to improve the pressure-bearing capacity.
The phase change assembly and the condensing fin may be made of copper, aluminum, copper alloy, aluminum alloy, magnesium alloy, or stainless steel, for example, the phase change assembly and the condensing fin are made of copper or aluminum material, and the phase change assembly and the condensing fin are preferably connected by brazing to reduce the contact thermal resistance of the phase change assembly and the condensing fin, thereby reducing the temperature difference between the condensing fin and the heat generating source 30. After the heat source 30 (such as a power device CPU) and the phase change heat sink 10 (such as the evaporation part 11) are contacted and connected, the gap can be filled by low-temperature tin soldering, so as to avoid generating a gap.
The cooling fins and the outer wall of the condensation support plate are welded together, the pressure bearing capacity of the condensation support plate is increased, when the radiator works, the internal working pressure of the condensation part 12 and the internal working pressure of the evaporation part 11 can be increased, if the internal working pressure is increased to more than 1MPa, the interwoven structure formed by welding the cooling fins and the condensation support plate can ensure that the condensation part 12 bears the strength required by work, the condensation part 12 does not deform, and the normal work of the radiator is ensured.
As shown in fig. 9, other heat exchange enhancing structures may be used instead of the condensation fins, and the heat exchange enhancing structures may be protrusions or channels formed on the outer surface of the condensation portion 12 or the evaporation portion 11 (fig. 9), or may be porous structures formed on the surface of the condensation portion 12 or the evaporation portion 11 by sintering. Through the enhanced heat exchange structure, the phase change heat exchange medium 20 can more efficiently perform boiling heat exchange, the heat expansion is more uniform and rapid, the transfer with the external heat is more efficient due to the increase of the heat exchange area, and the enhanced heat exchange structure can be selected according to the power density and the processing and manufacturing cost of the heat source 30.
As shown in fig. 7-8, illustrating the circulation flow of the phase change heat exchange medium 20 in the phase change assembly, the phase change heat exchange medium 20 of the evaporation portion 11 absorbs the heat of the heat generating source 30 and then diffuses along a two-dimensional plane in the internal evaporation cavity of the evaporation portion 11, then the phase change heat exchange medium 20 vaporizes and flows into the condensation strip perpendicular to the condensation portion 12 of the evaporation portion 11 and then flows into the condensation top plate 121, the condensation strip and the condensation top plate 121 are externally connected with condensation fins, and the heat carried by the phase change heat exchange medium 20 in the condensation strip and the condensation top plate 121 diffuses outwards through the condensation fins, thereby obtaining more favorable heat dissipation effect and performance.
The utility model discloses an among the phase transition heat abstractor, the evaporation chamber of evaporation portion is plane or curved surface form thin wall cavity, is provided with the capillary structure of strengthening the boiling heat transfer in the evaporation portion, and the condensation portion includes a plurality of hollow condensation extension boards or condensation branch pipe or condensation conical tube, and hollow extension board, hollow cylinder or the inside structure of strengthening the condensation heat transfer that is provided with of hollow circular cone, and the external connection of condensation section has multiplicable condensation heat transfer area's fin or fin, has good heat transfer performance.
When the phase-change component is in a non-working state, the environment temperature of the radiator is lower than the boiling point of the phase-change medium, the pressure of each part of the internal cavity of the phase-change component is the same, and the internal pressure can be in a standard atmospheric pressure or negative pressure state. When the phase change component is in a working state, the ambient temperature is higher than the boiling point of the phase change medium, the temperature of each point in the phase change component is different, so that the pressure is different, the heat exchange in the phase change component is different through the different temperatures of the phase change component, the pressure difference occurs, and the phase change heat exchange medium 20 of the evaporation part 11 is conveyed to the condensation part 12 to realize the heat exchange. The power for transporting the phase-change heat exchange medium 20 from the evaporation part 11 to the condensation part 12 is derived from the pressure difference of the phase-change heat exchange medium 20 at different temperatures. The greater the pressure difference, the greater the capacity of the transport medium. The transport capacity of the phase change unit from the evaporation part 11 to the condensation part 12 is mainly determined by the pressure difference of the phase change heat exchange medium 20 between the evaporation part 11 and the condensation part 12, the latent heat of vaporization of the phase change heat exchange medium 20, and the density of the phase change heat exchange medium 20.
In the prior art, the commonly used phase-change heat-exchange media 20 include water, methanol, ethanol and acetone, and in a working state, these existing phase-change heat-exchange media 20 are in a negative pressure or micro-positive pressure state.
By adopting the phase-change heat exchange medium 20, the working pressure is in a negative pressure or micro-positive pressure state, and the working pressure is also in a negative pressure or micro-positive pressure stateI.e. the air pressure is less than 0.15 MPa. At present, the heating power of electronic devices is getting larger and larger, the heating power of a common CPU or GPU is more than 200W, and the power density is more than 60000J/m2S. At the surface temperature of the radiator of 60 ℃, corresponding to one radiatorThe maximum transmission capacity of the temperature of the condensation part 12 of the copper-water heat pipe is only 35W. The space of a CPU with the common size of 45mm multiplied by 69mm can be only 4, the maximum heat transfer capacity of the copper-water heat pipe is only about 140W, the residual heat needs to be conducted by the bottom of a radiator, and the ethanol, the methanol and the acetone are adopted as the phase change heat exchange medium 20, although the pressure difference is increased and the volume flow of transmission is increased, the latent heat of vaporization of the deionized water is far higher than that of the ethanol, the methanol, the acetone and the like when the volume flow is equal to the volume flow, so that the heat transfer capacity of the deionized water is stronger than that of the ethanol, the methanol, the acetone and the like under the condition of the same temperature difference when the heat. However, with the increase of the heat flux density and the limitation of the volume of the phase-change heat dissipation device, the heat transfer capacity of the conventional copper-water heat pipe is not enough to meet the requirement of high-power heat dissipation of electronic devices.
For the heating source 30 with the size of 42mm multiplied by 69mm, the power of the heating source 30 is adjusted by frequency conversion, the condensing part 12 adopts liquid cooling, the liquid amount is provided by a liquid cooling test device, the liquid inlet temperature is constant at 35 ℃, the temperature of the heating source 30 is ensured to be controlled at 40 ℃, different phase-change heat exchange media 20 are used for testing the working pressure and the heating power inside the phase-change component, and the test results are shown in table 1:
the heat flux density test results of different phase change heat exchange media 20 are as follows:
table 1:
in each heat exchange medium, R134a is tetrafluoroethaneAlkane (CF)3CH2F) R114 is dichlorotetrafluoroethane (CClF)2CClF2) R124 is tetrafluoromonochloroethane (CHClFCF)3) R125 is pentafluoroethane (CHF)2CF3) R1233Zd (E) or R1234Ze (Z) or R1234Ze (E) are each trans-Chlorotrifluoropropene (CF)3CH ═ CHCl), R600a is isobutane (CH)3)3) RC318 is octafluorocyclobutane (cyclo-C)4F8) R245fa or R245ca both denote pentafluoropropane (CHF)2CF2CH2F) R32 is trifluoromethane (CH)2F2) R22 is chlorodifluoromethane (CHClF)2)。
Example 1:
for a heating source 30 with the size of 30mm multiplied by 45mm, the power of the heating source 30 is adjusted by frequency conversion, the condensing part 12 is air-cooled, the air volume is provided by a test wind tunnel, the air inlet temperature is 25 ℃, the air outlet temperature is 50 ℃, the temperature of the heating source 30 is ensured to be controlled at 60 ℃, different phase-change heat exchange media 20 are used for testing the working pressure and the heating power inside the phase-change component, and the test results are shown in table 2:
TABLE 2
It can be seen from the data in table 2 that, the utility model discloses a phase change heat transfer medium 20 that boiling point is less than 30 ℃ under the standard atmospheric pressure, because of the pressure differential increase in the phase change subassembly, the transport capacity greatly increased of phase change subassembly, to 45mm 69 mm's of size CPU, with the radiator of volume, adopt R134a, R142b, R114, R124, R1233Zd (E), R1234Ze (Z), R1234Ze (E), R600a, RC318, RE245cb2 looks isophase change heat transfer medium 20, the transport capacity all shows the improvement (is far greater than 200W).
Therefore, by arranging the phase-change heat exchange media, namely R134a, R142b, R114, R124, R1233Zd (E), R1234Ze (Z), R1234Ze (E), R600a, RC318, RE245cb2 and the like or a combination thereof, in the phase-change heat dissipation device, when the phase-change heat dissipation device is in an operating state, the air pressure inside the phase-change component is greater than 0.15MPa, and the phase-change heat exchange media can be purchased from the market.
According to the test data, the heat transfer capacity of the phase change component is positively correlated with the air pressure in the phase change component, and the larger the pressure is, the larger the heat exchange power is.
The utility model discloses can use power electronics components heat dissipation such as chip, resistance, electric capacity, inductance, storage medium, light source, battery package.
It is to be understood that the present invention has been described with reference to certain embodiments, and that various changes or equivalents may be substituted for elements thereof by those skilled in the art without departing from the spirit and scope of the invention. In addition, many modifications may be made to adapt a particular situation or material to the teachings of the invention without departing from the essential scope thereof. Therefore, the present invention is not limited to the specific embodiments disclosed herein, and all embodiments falling within the scope of the claims of the present application are intended to be covered by the present invention.
Claims (10)
1. The phase change heat dissipation device comprises a phase change component, wherein a phase change heat exchange medium is arranged in the phase change component, and the phase change heat exchange medium arranged in the phase change component is configured to have an internal air pressure of more than 0.15MPa when the phase change heat dissipation device is in a working state.
2. The phase-change heat sink according to claim 1, wherein the phase-change heat transfer medium provided in the phase-change module is any one or more of R134a, R142b, R114, R124, R1233Zd (E), R1234Ze (Z), R1234Ze (E), R600a, RC318, RE245cb2, R22, R32, R407C and R410A.
3. The phase-change heat dissipation device according to claim 1, wherein the phase-change assembly comprises an evaporation portion and a condensation portion, an evaporation cavity is formed inside the evaporation portion, a condensation cavity is formed inside the condensation portion, the evaporation cavity is communicated with the condensation cavity, the phase-change heat exchange medium in the evaporation cavity can absorb heat of the heat source and transfer the heat to the condensation cavity, and the condensation cavity emits the heat outwards to cool the heat source.
4. The phase-change heat sink as claimed in claim 3, wherein the evaporation cavity is a planar or curved cavity.
5. The phase-change heat dissipation device according to claim 3, wherein the condensation portion comprises a plurality of condensation plates, and the condensation chamber is a planar cavity correspondingly arranged inside the condensation plates; or the condensation part comprises a plurality of condensation branch pipes, and the condensation cavity is a cylindrical cavity correspondingly arranged in the condensation branch pipes; or the condensation part comprises a plurality of condensation conical pipes, and the condensation cavity is a conical cavity correspondingly arranged in the condensation conical pipes.
6. The phase-change heat dissipating device according to claim 3, wherein the condensing portion is connected to the evaporating portion directly or through a pipe.
7. The phase-change heat dissipating device as claimed in claim 3, wherein the inner wall of the condensing part is provided with a condensation enhancing structure, and the outer wall of the condensing part is provided with fins or ribs for increasing a condensation area.
8. The phase-change heat dissipating device as claimed in claim 3, wherein a plurality of ribs, protrusions or fins are provided inside the evaporation part and the condensation part to increase pressure-bearing capacity.
9. The phase-change heat dissipating device according to claim 3, wherein an outer wall of the evaporation portion is disposed in contact with a heat generating source.
10. The phase-change heat dissipating device as claimed in claim 9, wherein the outer surface of the evaporation part has a contact heat absorbing surface, the heat generating source has a heat source surface, the contact heat absorbing surface of the evaporation part is in contact with the heat source surface of the heat generating source, and the heat source surface and the contact heat absorbing surface are both flat surfaces.
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| CN201920153756.8U CN209877718U (en) | 2019-01-29 | 2019-01-29 | Phase change heat dissipation device |
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| CN201920153756.8U CN209877718U (en) | 2019-01-29 | 2019-01-29 | Phase change heat dissipation device |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109612314A (en) * | 2019-01-29 | 2019-04-12 | 株洲智热技术有限公司 | Phase-change heat radiating device |
| WO2020155899A1 (en) * | 2019-01-29 | 2020-08-06 | 株洲智热技术有限公司 | Phase change heat radiating device |
| EP4195894A4 (en) * | 2020-08-24 | 2024-01-24 | Huawei Tech Co Ltd | Heat dissipation device and manufacturing method therefor |
-
2019
- 2019-01-29 CN CN201920153756.8U patent/CN209877718U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109612314A (en) * | 2019-01-29 | 2019-04-12 | 株洲智热技术有限公司 | Phase-change heat radiating device |
| WO2020155899A1 (en) * | 2019-01-29 | 2020-08-06 | 株洲智热技术有限公司 | Phase change heat radiating device |
| WO2020155900A1 (en) * | 2019-01-29 | 2020-08-06 | 株洲智热技术有限公司 | Phase change heat radiating device |
| EP4195894A4 (en) * | 2020-08-24 | 2024-01-24 | Huawei Tech Co Ltd | Heat dissipation device and manufacturing method therefor |
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