CN112512264B - Heat radiating device and heat radiating system - Google Patents
Heat radiating device and heat radiating system Download PDFInfo
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- CN112512264B CN112512264B CN201910867966.8A CN201910867966A CN112512264B CN 112512264 B CN112512264 B CN 112512264B CN 201910867966 A CN201910867966 A CN 201910867966A CN 112512264 B CN112512264 B CN 112512264B
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- 230000017525 heat dissipation Effects 0.000 claims abstract description 52
- 238000004891 communication Methods 0.000 claims abstract description 51
- 239000002184 metal Substances 0.000 claims description 25
- 229910052751 metal Inorganic materials 0.000 claims description 25
- 239000000843 powder Substances 0.000 claims description 14
- 238000002955 isolation Methods 0.000 claims description 13
- 239000000835 fiber Substances 0.000 claims description 10
- 239000006260 foam Substances 0.000 claims description 5
- 239000004020 conductor Substances 0.000 claims description 4
- 239000000463 material Substances 0.000 claims description 2
- 238000005245 sintering Methods 0.000 claims 4
- 150000002739 metals Chemical class 0.000 claims 3
- 238000003466 welding Methods 0.000 claims 1
- 230000007547 defect Effects 0.000 abstract description 4
- 239000007788 liquid Substances 0.000 description 26
- 238000009833 condensation Methods 0.000 description 15
- 230000005494 condensation Effects 0.000 description 15
- 238000000926 separation method Methods 0.000 description 15
- 239000006262 metallic foam Substances 0.000 description 5
- 238000001816 cooling Methods 0.000 description 4
- 230000009471 action Effects 0.000 description 3
- 239000000126 substance Substances 0.000 description 3
- 230000005540 biological transmission Effects 0.000 description 2
- 238000010586 diagram Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000009834 vaporization Methods 0.000 description 2
- 230000008016 vaporization Effects 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 230000005484 gravity Effects 0.000 description 1
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20309—Evaporators
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20318—Condensers
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20327—Accessories for moving fluid, for connecting fluid conduits, for distributing fluid or for preventing leakage, e.g. pumps, tanks or manifolds
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The invention discloses a heat dissipation device, comprising: evaporator, condenser tube and fin group. The evaporator is internally provided with a first capillary core and a second capillary core. At least one of the condensing pipes is provided with at least two communication ports with the evaporator. The second capillary core is arranged at least one communication port of the condenser pipe with at least two communication ports of the evaporator so as to prevent gaseous working medium from passing through the communication ports, and the second capillary core is not arranged at the rest communication ports of the condenser pipe and the evaporator. The fin group is laid outside the condenser tube. The heat dissipation device can overcome the defects of the temperature equalization plate and the heat pipe, has the advantages of high heat dissipation capacity, high heat dissipation efficiency, simplicity and reliability, and provides a more advanced solution for the increasingly severe heat dissipation problem of power electronic products. In addition, the invention also discloses a heat dissipation system using the heat dissipation device.
Description
Technical Field
The invention belongs to the technical field of heat dissipation, and relates to a heat dissipation device and a heat dissipation system.
Background
The air-cooled heat dissipation device has the advantages of simplicity, reliability, low cost and the like, and is widely applied to the field of power electronic heat dissipation. However, with the rapid development of industries such as big data, AI, internet of things and the like, the power consumption of the hardware integrated circuit is larger and larger, and the heat productivity and the heat flux density are also larger and larger. The traditional air-cooling heat dissipation device such as a heat pipe radiator and a temperature equalizing plate has smaller heat dissipation capability, and cannot meet the heat dissipation requirement of the current electronic equipment. The liquid cooling system is complex, the fault frequency is high, the liquid leakage risk exists, and the use is limited. Therefore, there is a need for a more efficient and reliable heat dissipation device for electronic devices.
Disclosure of Invention
In order to solve the problem of difficult heat dissipation of the current power electronic equipment, the invention provides the heat dissipation device and the heat dissipation system, which can overcome the inherent technical defects of the temperature equalization plate and the heat pipe, have the advantages of large heat dissipation capacity, high efficiency, small volume, convenient use and the like, inherit the advantages of simplicity, reliability and low price of the air cooling heat dissipation device, and provide a more advanced solution for the increasingly severe heat dissipation problem of the power electronic products.
In order to solve the above problems, the present invention provides a heat dissipating device. The invention also provides a heat dissipation system using the heat dissipation device.
The invention adopts the following technical scheme:
a heat dissipating device, comprising: evaporator, condenser pipe and fin group, its characterized in that:
the evaporator comprises a bottom plate and an upper cover, wherein the bottom plate and the upper cover are welded to form an evaporator cavity, a first capillary core and a second capillary core are arranged in the evaporator cavity, the first capillary core is of a porous structure made of powder and is metallurgically bonded with the surface of the bottom plate, which is positioned on the side of the evaporator cavity, the second capillary core is positioned on the surface of the upper cover, which is positioned on the side of the evaporator cavity, and the first capillary core and the second capillary core are directly and/or indirectly connected together.
The condenser pipes are positioned outside the evaporator, all the condenser pipes are communicated with the evaporator, at least one condenser pipe is provided with at least two communication ports with the evaporator, at least one communication port of each condenser pipe with at least two communication ports with the evaporator is provided with a second capillary core so as to prevent gaseous working media from passing through the communication ports, and conversely, the rest of the communication ports of the condenser pipes and the evaporator are not provided with the second capillary core.
The fin group is thermally coupled to an exterior of the condenser tube.
Optionally, the first capillary core has a protruding portion facing the second capillary core to directly connect the second capillary core and/or the second capillary core has a protruding portion facing the first capillary core to directly connect the first capillary core.
Optionally, a capillary support structure is arranged in the evaporator, and the capillary support structure is respectively and directly connected with the first capillary core and the second capillary core, so that the first capillary core and the second capillary core are indirectly connected together through the capillary support structure.
Optionally, the first capillary wick is a continuous monolithic wick of equal or unequal thickness.
Optionally, the first capillary core is a discontinuous multi-block core with equal thickness or unequal thickness, and each first capillary core is directly and/or indirectly connected with the second capillary core.
Alternatively, the communication port between the condenser pipe and the evaporator may be located on any one or a combination of two of the upper wall or the side wall of the upper cover of the evaporator.
Optionally, the upper cover is made of a plate, the bottom plate is welded with the upper cover, and the communication port of the condenser tube and the evaporator is positioned at the welded joint of the bottom plate and the upper cover.
Optionally, a capillary isolation structure is further disposed at the communication port of the condenser tube and the evaporator, where the second capillary core is provided, and the capillary isolation structure is directly connected with the second capillary core.
Optionally, the condensation tube is a light pipe.
Optionally, a third capillary core is arranged in the condensation tube along the length direction of the condensation tube, and the cross section of the third capillary core occupies part of the flow area of the condensation tube.
Optionally, the second capillary core, the third capillary core, the capillary supporting structure and the capillary isolation structure are all capillary structures, and may be one or more of a wire mesh, a foam metal, a metal felt, a fiber bundle and a metal powder sintered porous structure.
The invention also provides a heat dissipation system comprising any one of the heat dissipation devices.
Optionally, the heat source is thermally coupled to the bottom plate and/or the top cover of the evaporator of the heat sink by a thermally conductive material and/or a heat transfer element, preferably a heat pipe.
Optionally, the bottom plate and/or the top cover of the evaporator of the plurality of heat sinks are thermally coupled by a thermally conductive material and/or a heat transfer element, preferably a heat pipe.
The invention has the beneficial effects that:
(1) The invention can increase the effective contact area of the evaporator and the heat source, improve the temperature uniformity of the heat source, shorten the heat transfer path from the heat source to the vaporization position of the working medium, and enhance the heat exchange capability of the evaporator.
(2) All the condensing pipes work under the same saturation pressure of the working medium, so that the heat transfer efficiency is enhanced; the circulation resistance of working media is reduced, and the heat transfer capacity is increased. Therefore, the heat dissipating device has high heat transmission efficiency and transmission capacity.
(3) The condensing tube can be longer than the heat tube, more fins are laid, and the heat dissipation area is large; the condensing tube can have smaller bending radius than the heat tube, so that the condensing tube is distributed more uniformly and reasonably in the fin group, the isothermicity of the fins is enhanced, and therefore, the heat dissipation device provided by the invention has relatively better heat dissipation efficiency at the heat dissipation end.
In summary, the heat dissipation device has high heat dissipation capacity and high efficiency, overcomes the inherent defects of the heat pipe and the temperature equalization plate of the traditional air-cooled heat dissipation device, and is simple, reliable and convenient to use. The heat dissipation device and the heat dissipation system provide a more advanced solution to the increasingly severe heat dissipation problem of the power electronic products, and have great economic value.
Drawings
FIG. 1 is a cross-sectional view of a first embodiment of a heat dissipating device according to the present invention;
FIG. 2 is a cross-sectional view of a second embodiment of a heat dissipating device according to the present invention;
FIG. 3 is a cross-sectional view of a third embodiment of a heat dissipating device according to the present invention;
FIG. 4 is a cross-sectional view of a fourth embodiment of a heat dissipating device according to the present invention;
FIG. 5 is a cross-sectional view of a fifth embodiment of a heat dissipating device according to the present invention;
FIG. 6 is a cross-sectional view of a sixth embodiment of a heat dissipating device according to the present invention;
FIG. 6a is a cross-sectional view showing the relative positions of a third wick and a condenser tube in a sixth embodiment of a heat dissipating device according to the present invention;
FIG. 7 is a cross-sectional view of a seventh embodiment of a heat dissipating device according to the present invention;
fig. 8 is a schematic structural diagram of an embodiment of a heat dissipation system to which the heat dissipation device of the present invention is applied.
In the above figures: the heat sink comprises a 1-evaporator, 2a, 2 b-condensing tubes, 3-fin groups, 4-capillary isolation structures, 5-liquid filling ports, 6-third capillary cores, 11-evaporator bottom plates, 12-evaporator upper covers, 13-first capillary cores, 14-second capillary cores, 15-capillary support structures, 100a,100b and 100 c-the heat sink of the invention, 200a and 200 b-heat pipes and A, B, C, D-heat sources.
Detailed Description
In the following detailed description, reference is made to the accompanying drawings which form a part hereof wherein like numerals designate like parts throughout, and in which is shown by way of illustration embodiments in which the subject matter may be practiced.
For the purposes of this disclosure, the term "a and/or B" means (a), (B) or (a and B).
The term "one condenser tube" as used herein means that the condenser tube surrounded by all the communication ports which are communicated with each other without passing through the evaporator is one condenser tube. Therefore, one condensing tube may have a plurality of communication ports communicating with the inside of the evaporator.
As used herein, the term "joined" refers to two objects that are brought together by an external force or that are metallurgically bonded to form a non-self-separable whole.
Fig. 1 is a cross-sectional view of a heat dissipating device according to a first embodiment of the present invention. It comprises an evaporator 1, a plurality of condensing tubes 2, a fin group 3, a capillary separation structure 4 and a liquid filling tube 5. The evaporator 1 includes a bottom plate 11 and an upper cover 12, the bottom plate 11 and the upper cover 12 being welded, and an inner space thereof forming an evaporator chamber. The evaporator cavity has a first wick 13 and a second wick 14. The first wick 13 is a porous structure made of powder and metallurgically bonded to the surface of the base plate 11 on the evaporator cavity side. The second wick 14 is provided on the surface of the upper wall of the upper cover 12 on the evaporator chamber side. The first capillary core 13 is a monolithic capillary core with equal thickness, and the first capillary core 13 has a portion protruding toward the second capillary core 14 for directly connecting with the second capillary core 14. The capillary separation structure 4 and the second capillary wick 14 may be composed of one or more of a wire mesh, a metal foam, a metal felt, a fiber bundle, a metal powder sintered porous structure. The fin group 3 is laid on the condenser tube 2. Each condensation pipe 2 and the evaporator 1 are provided with two communication ports, the two communication ports are all positioned on the upper wall of the upper cover 12, one communication port is directly communicated with the cavity of the evaporator 1, and the other communication port is provided with a capillary isolation structure 4 and a second capillary core 14, so that gaseous working media are prevented from passing through the communication ports. The capillary separation structure 4 is connected to the second wick 14.
The specific working principle is as follows: the evaporator 1 is vacuumized through the liquid filling pipe 5, and welded and sealed after the working medium is filled. The evaporator 1 is in contact with a heat source, and the working medium in the evaporator 1 is vaporized at the first capillary core 13. Due to the capillary pressure difference between the capillary separation structure 4 and the second capillary wick 14, the generated vapor cannot penetrate through the communication port (hereinafter referred to as the liquid end) where the capillary separation structure 4 and the second capillary wick 14 are located and is forced to enter the condensation tube 2 from the communication port (hereinafter referred to as the vapor end) without capillary structure. The steam is gradually condensed after being released from heat in the condensing tube 2 through the fin group 3, and condensed liquid flows back to the liquid end under the action of steam carrying and pressure difference. As the working medium is vaporized at the first wick 13, a capillary pressure difference is formed, such that the liquid side of the first wick 13 has a relatively low pressure compared to the liquid end of the condenser tube 2, which pressure difference directs the liquid through the capillary separation structure 4 back into the first wick 13 via the second wick 14. With this circulation, heat is dissipated from the heat source to the environment.
Fig. 2 is a cross-sectional view of a second embodiment of a heat dissipating device according to the present invention. The evaporator 1 has a first capillary core 13, a second capillary core 14 and a capillary support structure 15 in its cavity. The first wick 13 is a monolithic wick of unequal thickness. The capillary support structure 15 is directly connected to the first and second capillary cores 13 and 14, respectively. The first wick 13 is thus indirectly connected to the second wick 14 via a capillary support structure 15. The second wick 14 and the wick support structure 15 may be formed of one or more of wire mesh, metal foam, metal felt, fiber bundles, metal powder sintered porous structures. Each condensation pipe 2 and the evaporator 1 are provided with two communication ports, the two communication ports are all positioned on the upper wall of the upper cover 12, one communication port is directly communicated with the cavity of the evaporator 1, and the other communication port is provided with a second capillary core 14 to prevent gaseous working medium from passing through the communication port. The structure and working principle of other parts of the embodiment are the same as those of the first embodiment of the present invention, and will not be described again.
Fig. 3 is a cross-sectional view of a third embodiment of a heat dissipating device according to the present invention. The evaporator 1 has a first capillary core 13, a second capillary core 14 and a capillary support structure 15 in its cavity. The first wick 13 is a plurality of wicks of unequal thickness. The portion of one of the first capillary cores 13 protruding toward the second capillary core 14 is directly connected to the second capillary core 14. The other first wick 13 is indirectly connected to the second wick 14 via a capillary support structure 15. The second wick 14 and the wick support structure 15 may be formed of one or more of wire mesh, metal foam, metal felt, fiber bundles, metal powder sintered porous structures. In this embodiment, the first capillary core 13 is a plurality of capillary cores with different thicknesses, and the plurality of first capillary cores 13 may correspond to the same heat source or may radiate heat corresponding to a plurality of heat sources. The structure and working principle of other parts of the embodiment are the same as those of the second embodiment of the present invention, and will not be described again.
Fig. 4 is a cross-sectional view of a fourth embodiment of a heat dissipating device according to the present invention. It comprises an evaporator 1, condenser tubes 2a and 2b, a fin group 3, a capillary separation structure 4 and a liquid filling tube 5. The condenser tube 2a and the evaporator 1 are provided with two communication ports, both of which are positioned on the upper wall of the upper cover 12, one communication port is directly communicated with the cavity of the evaporator 1, and the other communication port is provided with a capillary isolation structure 4 and a second capillary core 14. The condensation pipe 2b and the evaporator 1 are provided with three communication ports, the three communication ports are all positioned on the upper wall of the upper cover 12, two communication ports are directly communicated with the cavity of the evaporator 1, and the other communication port is provided with a capillary isolation structure 4 and a second capillary core 14. The capillary separation structure 4 is connected to the second wick 14. The structures of other parts of this embodiment are the same as those of the first embodiment of the present invention, and will not be described in detail.
The specific working principle is as follows: the evaporator 1 is vacuumized through the liquid filling pipe 5, and welded and sealed after the working medium is filled. The evaporator 1 is in contact with a heat source, and the working medium in the evaporator 1 is vaporized at the first capillary core 13. Due to the capillary pressure difference between the capillary separation structure 4 and the second capillary wick 14, the generated vapor cannot penetrate through the communication port (hereinafter referred to as liquid end) where the capillary separation structure 4 and the second capillary wick 14 are located and is forced to enter the condensation pipes 2a and 2b from the communication port (hereinafter referred to as vapor end) without capillary structure of the condensation pipes 2a and 2b, respectively. The steam is gradually condensed after being released from heat in the condensing pipes 2a and 2b, and the condensed liquid flows back to the liquid end under the action of steam carrying and pressure difference. On the other hand, the working substance, after vaporization at the first wick 13, forms a capillary pressure difference, such that the liquid side of the first wick 13 has a relatively low pressure compared to the liquid ends of the condensation tubes 2a and 2b, which pressure difference directs the liquid through the capillary separation structure 4 back into the first wick 13 via the second wick 14. With this circulation, heat is dissipated from the heat source to the environment.
Fig. 5 is a cross-sectional view of a fifth embodiment of a heat dissipating device according to the present invention. It comprises an evaporator 1, a condenser tube 2, a fin group 3 and a liquid filling tube 5. The evaporator 1 includes a bottom plate 11 and an upper cover 12, the bottom plate 11 and the upper cover 12 being welded, and an inner space thereof forming an evaporator chamber. The evaporator cavity has a first wick 13 and a second wick 14. The first wick 13 is a powder porous structure and metallurgically bonded to the surface of the base plate 11 on the evaporator cavity side. The first capillary wick 13 is a monolithic capillary wick of equal thickness. The second wick 14 may be constructed of one or more of wire mesh, metal foam, metal felt, fiber bundles, metal powder sintered porous structures. The condenser tube 2 and the evaporator 1 are provided with two communication ports which are symmetrically distributed on the two side walls of the upper cover 12. One communication port is directly communicated with the cavity of the evaporator 1, and a second capillary core 14 is arranged at the other communication port so as to prevent gaseous working medium from passing through the communication port. The second wick 14 here extends from the second wick 14 on the upper wall of the evaporator and extends all the way to the first wick 13. The working principle of the embodiment is the same as that of the first embodiment of the heat dissipating device of the present invention, and will not be described again.
Fig. 6 is a cross-sectional view of a sixth embodiment of a heat dissipating device according to the present invention. It comprises an evaporator 1, a plurality of condensation pipes 2, a fin group 3, a capillary isolation structure 4, a liquid filling pipe 5 and a third capillary core 6. A third capillary wick 6 is provided in each condenser tube 2. One end of the third wick 6 is metallurgically bonded to the capillary separation structure 4. The capillary separation structure 4 is metallurgically bonded to the second wick 14. The second wick 14, the capillary separation structure 4, and the third wick 6 may be formed of one or more of a wire mesh, a metal foam, a metal felt, a fiber bundle, a metal powder sintered porous structure. As shown in fig. 6a, the cross-section of the third wick 6 occupies part of the flow area of the condenser tube 2 and may be a circular ring along the inner wall of the condenser tube 2; or a circular arc section along the inner wall of the condenser tube 2; or occupies any part of the cross section of the condenser tube 2 and does not contact the inner wall of the condenser tube 2. The structures of other parts of this embodiment are the same as those of the first embodiment of the present invention, and will not be described in detail.
The specific working principle is as follows: because of the specific use of the electronic device, the orientation is often uncertain, i.e. the heat source space is oriented differently. When the heat radiator is used obliquely or reversely, liquid working medium is gathered at the bottom of the heat radiator due to the action of gravity. Particularly in the case of inversion, the liquid working substance is collected in the horizontal tube section of the condenser tube 2, while the first capillary core 13 in the evaporator 1 is free of liquid working substance, and the heat sink cannot be started. The third capillary core 6 in the condensation tube 2 in this embodiment can guide the liquid working medium to the first capillary core 13 via the capillary isolation structure 4 and the second capillary core 14, so that the first capillary core 13 is fully infiltrated to ensure starting. The basic working principle of the embodiment is the same as that described above, and will not be repeated.
Fig. 7 is a cross-sectional view of a seventh embodiment of a heat dissipating device according to the present invention. It comprises an evaporator 1, a condensation tube 2, a fin group 3, a capillary separation structure 4 and a liquid filling tube 5. The capillary structure inside the evaporator 1 is the same as that of the first embodiment of the present invention, and will not be described again. The upper cover 12 of the evaporator 1 is partially protruded, and the protruded portion is communicated with the condenser tube 2. The condensation pipe 2 and the evaporator 1 are provided with three communication ports, wherein the communication ports with the convex part of the evaporator 1 are free of any capillary structure, and the other two communication ports are provided with a capillary isolation structure 4 and a second capillary core 14. The structure and working principle of other parts of this embodiment are the same as those of the first embodiment of the present invention, and will not be described again. In this embodiment, the gaseous working medium enters the condenser tube 2 from one end of the evaporator 1, reaches the other end of the evaporator 1, and is condensed in the condenser tube 2 at the upper part thereof. The embodiment is particularly suitable for the situation that the space right above the heat source is small, and can transfer heat to the position with larger external space of the heat source for heat dissipation.
Fig. 8 is a schematic structural diagram of an embodiment of a heat dissipation system to which the heat dissipation device of the present invention is applied. As shown, there are four heat sources, heat source a, heat source B, heat source C, and heat source D. The heat source A, the heat source B and the heat source C have larger heat loads, and are radiated by the radiating device of the invention, and are respectively marked as 100A,100B and 100C correspondingly. Since the heat source D generates heat with a small power and a certain distance from the heat source a, the heat generated by the heat source D is transmitted to the evaporator top cover of the heat sink 100A by the heat pipe 200A, and is dissipated by the heat sink 100A. The peak heat generating power of the heat source B and the peak heat generating power of the heat source C do not necessarily occur at the same time, and in order to fully utilize the cooling resources of the heat dissipating devices 100B and 100C, the upper covers of the heat dissipating devices 100B and 100C are thermally coupled through the heat pipe 200B, so that the heat dissipating device with low heat generating power of the heat source shares a part of the heat load of the heat source with high heat generating power of the other heat source, and the isothermicity of the two heat sources can be improved. Each of heat pipes 200a and 200b may comprise one or more heat pipes. 200a and 200b may also be replaced with other high efficiency heat transfer elements or high thermal conductivity materials.
According to the embodiment of the heat dissipation device, the heat is transferred in a mode of unidirectional circulation flow of working media, so that the defect of heat dissipation of the heat pipe and the temperature equalization plate is overcome, and the heat dissipation device can better meet the heat dissipation requirements of high power and high efficiency. The heat dissipation device has the advantages of compact structure, reliable performance, flexible use and low cost, provides a more advanced solution for the increasingly severe heat dissipation problem of power electronic products, and has great economic value.
Finally, it should be emphasized that the foregoing description is merely illustrative of the preferred embodiments of the invention, and that various changes and modifications can be made by those skilled in the art without departing from the spirit and principles of the invention, and any such modifications, equivalents, improvements, etc. are intended to be included within the scope of the invention.
Claims (19)
1. A heat dissipating device, comprising: evaporator, condenser pipe and fin group, its characterized in that:
the evaporator comprises a bottom plate and an upper cover, wherein the bottom plate and the upper cover are welded to form an evaporator cavity, a first capillary core and a second capillary core are arranged in the evaporator cavity, the first capillary core is of a porous structure made of powder and is metallurgically combined with the surface of the bottom plate, which is positioned on the side of the evaporator cavity, the second capillary core is positioned on the surface of the upper cover, which is positioned on the side of the evaporator cavity, and the first capillary core and the second capillary core are directly and/or indirectly connected together;
the condenser pipes are positioned outside the evaporator, all the condenser pipes are communicated with the evaporator, at least one condenser pipe is provided with at least two communication ports with the evaporator, at least one communication port of each condenser pipe with at least two communication ports with the evaporator is provided with a second capillary core so as to prevent gaseous working medium from passing through the communication ports, and conversely, the rest of communication ports between the condenser pipes and the evaporator are not provided with the second capillary cores;
the fin group is thermally coupled to an exterior of the condenser tube.
2. The heat sink as recited in claim 1, wherein:
the first capillary core is provided with a convex part which is directed to the second capillary core so as to be directly connected with the second capillary core and/or the second capillary core is provided with a convex part which is directed to the first capillary core so as to be directly connected with the first capillary core.
3. The heat sink as recited in claim 1, wherein:
the evaporator is internally provided with a capillary supporting structure, and the capillary supporting structure is respectively and directly connected with the first capillary core and the second capillary core so as to realize that the first capillary core and the second capillary core are indirectly connected together through the capillary supporting structure.
4. The heat sink as recited in claim 1, wherein:
the first capillary core is a continuous monolithic core body with equal thickness or unequal thickness.
5. The heat sink as recited in claim 1, wherein:
the first capillary cores are discontinuous multiple cores with equal thickness or unequal thickness, and each first capillary core is directly and/or indirectly connected with the second capillary core.
6. The heat sink as recited in claim 1, wherein:
the communication port between the condenser pipe and the evaporator may be located on any one or a combination of both of an upper wall and a side wall of the upper cover of the evaporator.
7. The heat sink as recited in claim 1, wherein:
the upper cover is made of a plate material, the bottom plate is welded with the upper cover, and the communication port of the condenser tube and the evaporator is positioned at the welding joint of the bottom plate and the upper cover.
8. The heat sink as recited in claim 1, wherein:
and a capillary isolation structure is further arranged at the communication port of the condenser pipe and the evaporator, which is provided with the second capillary core, and the capillary isolation structure is connected with the second capillary core.
9. The heat sink as recited in claim 1, wherein:
the condensing tube is a light pipe.
10. The heat sink as recited in claim 1, wherein:
and a third capillary core is arranged in the condensing tube along the length direction of the condensing tube, and the cross section of the third capillary core occupies part of the flow area of the condensing tube.
11. The heat sink of claim 1, 2, 3, 5, 8 or 10, wherein:
the second capillary core is of a capillary structure and can be formed by one or more of silk screens, foam metals, metal felts, fiber bundles and metal powder sintering porous structures.
12. A heat sink according to claim 3, wherein:
the capillary supporting structure is a capillary structure and can be formed by one or more of silk screens, foam metals, metal felts, fiber bundles and metal powder sintering porous structures.
13. The heat sink as recited in claim 8, wherein:
the capillary isolation structure is a capillary structure and can be formed by one or more of silk screens, foam metals, metal felts, fiber bundles and metal powder sintering porous structures.
14. The heat sink as recited in claim 10, wherein:
the third capillary core is of a capillary structure and can be formed by one or more of silk screens, foam metal, metal felts, fiber bundles and metal powder sintering porous structures.
15. A heat dissipation system, characterized by:
comprising a heat sink according to any of the claims 1-14.
16. The heat dissipation system according to claim 15, wherein:
the heat source is thermally coupled to the bottom plate and/or the top cover of the evaporator of the heat sink by a thermally conductive material and/or a heat transfer element.
17. The heat dissipation system of claim 16, wherein:
the heat transfer element is a heat pipe.
18. The heat dissipation system according to claim 15, wherein:
the bottom plates and/or the upper covers of the evaporators of the plurality of heat sinks are thermally coupled by thermally conductive material and/or heat transfer elements.
19. The heat dissipation system of claim 18, wherein:
the heat transfer element is a heat pipe.
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| CN201910867966.8A CN112512264B (en) | 2019-09-15 | 2019-09-15 | Heat radiating device and heat radiating system |
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| CN201910867966.8A CN112512264B (en) | 2019-09-15 | 2019-09-15 | Heat radiating device and heat radiating system |
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Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105277028A (en) * | 2015-11-16 | 2016-01-27 | 中国电子科技集团公司第十研究所 | Thermal control loop heat pipe of integrated structure |
| CN110411252A (en) * | 2018-04-26 | 2019-11-05 | 泰硕电子股份有限公司 | Has the loop heat pipe of different tube diameters |
| CN211792578U (en) * | 2019-09-15 | 2020-10-27 | 上海巽科节能科技有限公司 | Heat dissipation device and heat dissipation system |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| TWI279256B (en) * | 2005-12-13 | 2007-04-21 | Ind Tech Res Inst | A compact spray cooling module |
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Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN105277028A (en) * | 2015-11-16 | 2016-01-27 | 中国电子科技集团公司第十研究所 | Thermal control loop heat pipe of integrated structure |
| CN110411252A (en) * | 2018-04-26 | 2019-11-05 | 泰硕电子股份有限公司 | Has the loop heat pipe of different tube diameters |
| CN211792578U (en) * | 2019-09-15 | 2020-10-27 | 上海巽科节能科技有限公司 | Heat dissipation device and heat dissipation system |
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| CN112512264A (en) | 2021-03-16 |
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