WO2017148197A1

WO2017148197A1 - Heat-dissipation apparatus

Info

Publication number: WO2017148197A1
Application number: PCT/CN2016/108965
Authority: WO
Inventors: 刘伟明; 洪宇平; 惠晓卫
Original assignee: 华为技术有限公司
Priority date: 2016-03-01
Filing date: 2016-12-08
Publication date: 2017-09-08
Also published as: CN105682423B; CN105682423A

Abstract

Disclosed is a heat-dissipation apparatus, of which the weight is lowered and the heat-dissipation efficiency is improved. The heat-dissipation apparatus comprises an evaporator (110), a first-stage pressure balancer (120), a manifold (130), a condenser (140), and a second-stage pressure balancer (150), wherein multiple steam pipelines (111) are provided in the evaporator (110); a working medium is separately added in the multiple steam pipelines (111); the upper side of the evaporator (110) is communicated with the lower side of the first-stage pressure balancer (120) by means of the multiple steam pipelines (111); the upper side of the first-stage pressure balancer (120) is communicated with the lower side of the manifold (130); the upper side of the manifold (130) is communicated with the lower side of the condenser (140); the upper side of the condenser (140) is communicated with the lower side of the second-stage pressure balancer (150).

Description

Heat sink

The present application claims priority to Chinese Patent Application No. PCT Application No. No. No. No. No. No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No No

Technical field

Embodiments of the present application relate to the field of heat dissipation, and more particularly, to a heat dissipation device.

Background technique

In the future 5G technology, hardware devices will be highly integrated, and with the requirements of miniaturization, high heat flux density and device temperature uniformity, the existing heat dissipation equipment will not be able to meet the demand for heat dissipation in future products. For example, the existing straight tooth radiator or the die-cast straight tooth radiator is bulky, cumbersome, and difficult to disassemble, and has the disadvantages of uneven heat dissipation and low heat dissipation efficiency. The Loop Thermosiphon (LTS) heatsink uses phase-change heat dissipation technology. The heat dissipation performance of the LTS heatsink is improved compared with the die-casting heatsink. However, the volume and weight are still large, and it cannot be miniaturized. Lightweight. Moreover, since the LTS heat sink has an external pipe, the heat dissipation efficiency of the heat dissipation substrate is limited.

Therefore, it is desirable to provide a new type of heat sink to meet the cooling needs of future products.

Summary of the invention

The embodiment of the present application provides a heat dissipation device, which can reduce the weight of the heat dissipation device and improve the heat dissipation efficiency of the heat dissipation device.

In a first aspect, a heat dissipating device is provided, the heat dissipating device comprising: an evaporator 110, a primary pressure balancer 120, a manifold 130, a condenser 140, and a secondary pressure balancer 150, and an internal setting of the evaporator (110) There are a plurality of steam pipes (111), the working medium is added inside the plurality of steam pipes (111), and the upper side of the evaporator (110) passes through the plurality of steam pipes (111) and the first-stage pressure balancer (120) The lower side of the primary pressure balancer (120) is in communication with the lower side of the manifold (130); the upper side of the manifold (130) is in communication with the lower side of the condenser (140); the condenser (140) The upper side is in communication with the lower side of the secondary pressure balancer (150).

The heat dissipation device of the embodiment of the present application, on the one hand, the evaporator 110 and the condenser 140 are integrated The evaporator 110 and the condenser 140 are connected by the primary pressure balancer 120 and the manifold 130, so that the heat dissipation device can be miniaturized and lightened.

On the other hand, by providing a two-stage pressure balancer (i.e., the primary pressure balancer 120 and the secondary pressure balancer 150), steam that is not pressure balanced in the primary pressure balancer 120 can be balanced in the secondary pressure. The secondary pressure balance is performed in the device 150, thereby improving the heat dissipation efficiency.

According to the first aspect, in the first possible implementation of the first aspect, the lower side of the primary pressure balancer 120 is provided with a steam balance groove 121, and the upper side of the evaporator 110 is embedded in the steam balance groove 121, and A gap is left between the upper side of the evaporator 110 and the vapor balance groove 121.

The steam balance groove 121 is provided on the lower side of the primary pressure balancer 120 (i.e., the side connected to the evaporator 110), so that the rapid balance of the rising steam can be achieved, and the temperature equalization performance of the evaporator 110 can be improved.

According to the above-mentioned possible implementation manner of the first aspect, in a second possible implementation manner of the first aspect, the upper side of the primary pressure balancer 120 is provided with a plurality of openings 122, and the lower side of the collecting tube 130 is disposed At least one opening 131 allows the primary pressure balancer 120 to communicate with the manifold 130.

By providing a plurality of openings on the upper side of the primary pressure balancer 120 (i.e., the side connected to the manifold 130), on the lower side of the manifold 130 (i.e., the side connected to the primary pressure balancer 120) At least one opening is provided such that the primary pressure balancer 120 is in communication with the manifold 130.

According to the above-mentioned possible implementation manner of the first aspect, in a third possible implementation manner of the first aspect, the at least one opening 131 disposed on the lower side of the manifold 130 is disposed on the upper side of the primary pressure balancer 120 The number of the plurality of openings 122 is the same.

Further, the number of openings provided on the upper side of the primary pressure balancer 120 and the number of openings provided on the lower side of the manifold 130 may be the same to allow the primary pressure balancer 120 to communicate with the header 130.

According to the above-mentioned possible implementation manner of the first aspect, in the fourth possible implementation manner of the first aspect, the at least one opening 131 disposed on the lower side of the manifold 130 is disposed on the upper side of the primary pressure balancer 120 The positions of the openings 122 correspond one-to-one.

Further, the number of the openings provided on the upper side of the primary pressure balancer 120 is the same as the number of the openings provided on the lower side of the manifold 130, and each of the openings on the upper side of the primary pressure balancer 120 corresponds to One opening of the lower side of the manifold 130 (ie, the same number and one-to-one correspondence).

According to the above possible implementation manner of the first aspect, in the fifth possible implementation manner of the first aspect, the primary pressure balancer 120 is a square tube.

By setting the primary pressure balancer 120 as a square tube, the primary pressure balancer 120 can be enlarged. The area of connection (e.g., soldering) with the evaporator 110 can increase the rigidity of the heat sink.

According to the above possible implementation of the first aspect, in the sixth possible implementation of the first aspect, the secondary pressure balancer 150 is a square tube.

By arranging the secondary pressure balancer 150 as a square tube, the connection (e.g., welding) area between the secondary pressure balancer 150 and the condenser 140 can be increased, and the rigidity of the heat sink can be increased.

According to the above-mentioned possible implementation manner of the first aspect, in a seventh possible implementation manner of the first aspect, the condenser 140 is configured by a plurality of square tubes arranged in parallel, one end of each square tube is connected to the collecting tube 130, The other end is in communication with the secondary pressure balancer 150.

According to the above possible implementation of the first aspect, in the eighth possible implementation of the first aspect, the manifold 130 is a square tube.

In the embodiment of the present application, by setting the primary pressure balancer 120, the secondary pressure balancer 150, the manifold 130, and the condenser 140 as a square tube, the evaporator 110 and the primary pressure balancer 120, one can be increased. The contact pressure balancer 120 and the manifold 130 and the contact (e.g., welding) area between the condenser 140 and the manifold 130, the secondary pressure balancer 150, thereby increasing the overall rigidity of the heat sink.

According to the above-mentioned possible implementation manner of the first aspect, in a ninth possible implementation manner of the first aspect, the heat dissipating device further includes at least one fan 111 disposed at an outer side of the condenser 140.

The fan 111 is disposed on the condenser 140 to speed up the airflow exchange around the heat dissipation device and improve the heat dissipation rate of the heat dissipation device.

DRAWINGS

1 is a schematic structural view of a prior art LTS heat sink.

2 is a schematic structural view of a heat dissipating device according to an embodiment of the present invention.

3 is a schematic cross-sectional view of a heat dissipating device in accordance with an embodiment of the present invention.

4 is a primary pressure balancer in accordance with an embodiment of the present invention.

Figure 5 is a manifold, condenser and secondary pressure balancer in accordance with an embodiment of the present invention.

Figure 6 is an evaporator in accordance with an embodiment of the present invention.

Reference mark:

110-evaporator

111-steam pipeline

112-cross tube

120-level pressure balancer

121-steam balance tank

122-opening

130-convex tube

131-opening

140-condenser

150-second pressure balancer

160-fan

210-evaporator

220-steam rising pipeline

230-balancer

240-condenser

250-convex tube

260-liquid return pipe

270-fan

detailed description

The technical solutions of the embodiments of the present application are described below with reference to the accompanying drawings.

The heat dissipation device according to the embodiment of the present application can be applied to any heat dissipation application scenario. For example, the chip of a high-power-density single-board heats off, or the ordinary single-board heat sinks. For ease of understanding, the terms involved in the heat dissipation technology are briefly described first.

Working fluid: A medium that transfers heat energy and relies on changes in state to transfer heat. In the process of transferring heat energy, the working fluid has only physical changes, and there is no chemical change.

Phase change heat dissipation: A technique that uses the phase change of a substance to release latent heat.

At present, the radiators commonly used in the prior art mainly include profile radiators, die-cast spur radiators and LTS radiators. The profile heat sink or the die-cast straight tooth heat sink has a relatively simple structure, and the heat generating device is conducted to the substrate of the heat sink by contacting the heat generating device with the substrate of the heat sink, and then the heat is dissipated into the air through the teeth of the heat sink. . Although, profile radiators or die-cast spur radiators The technology is mature and the cost is low. However, the heat sink is uneven in heat and cold, the efficiency is not high, and the volume is large, and the weight can not be achieved.

Fig. 1 shows a schematic structural view of an LTS heat sink. As shown in FIG. 1 , the LTS heat sink mainly includes an evaporator 210 , a steam rising pipe 220 , a balancer 230 , a condenser 240 , a manifold 250 , and a liquid return pipe 260 . The evaporator 210 is provided with a working medium and an evaporator. 210 and condenser 240 are connected by a line (see steam rising line 220 and liquid return line 260 shown in Fig. 1) and can be dissipated by vapor-liquid phase. The heat conducting device conducts heat to the working medium of the evaporator 210, and the working medium changes from the liquid state to the vapor state and enters the balancer 230 along the steam rising pipe 220. In the balancer 230, the steam is pressure balanced into the condenser 240, and the working medium is The heat is released from the condenser 240 and is converted from a vapor state to a liquid state into the manifold 250, and finally, is returned to the evaporator 210 through the liquid return pipe 260 to complete a cycle (see the process shown by the broken line in Fig. 1).

It can be seen that the evaporator 210 of the LTS radiator and the condenser 240 are connected by a pipeline, and the volume and the weight are large, and it is difficult to achieve miniaturization and weight reduction.

The heat dissipation device of the embodiment of the present application will be described in detail below with reference to FIG. 2 to FIG. 6 .

FIG. 2 shows a schematic structural view of a heat dissipating device according to an embodiment of the present application. As shown in FIG. 2, the heat dissipation apparatus according to an embodiment of the present application may include an evaporator 110, a primary pressure balancer 120, a manifold 130, a condenser 140, and a secondary pressure balancer 150. Among them, the primary pressure balancer 120 is disposed on the upper side of the evaporator 110, and the manifold 130 is disposed on the upper side of the primary pressure balancer 120. The upper side of the manifold 130 is provided with a condenser 140, and the upper side of the condenser 140 is provided with a secondary pressure balancer 150, which together constitute a heat dissipating device according to an embodiment of the present application. The interior of the evaporator 110 is provided with a plurality of steam pipes 111, the inside of which is added with a working medium, and the upper side of the evaporator 110 is connected to the lower side of the primary pressure balancer 120; the primary pressure balancer 120 The upper side communicates with the lower side of the manifold 130; the upper side of the manifold 130 communicates with the lower side of the condenser 140; the upper side of the condenser 140 communicates with the lower side of the secondary pressure balancer 150.

It should be understood that the length of each of the plurality of steam pipes 111 is the same as the height of the evaporator 110 (i.e., the distance between the upper side of the evaporator and the lower side of the evaporator).

It should also be understood that the steam conduit 111 described above is a passage for vapor rise obtained by opening the evaporator 110.

It should be noted that a heat generating device (for example, a single board) is placed on the outer surface of the evaporator 110, and heat of the heat generating device is transmitted to the working medium added in the plurality of steam pipes 111 through the evaporator 110, and the working medium absorbs heat. Passing heat through changes in phase and by implementing according to the present application The sealed circulating heat dissipation system of the heat dissipating device radiates heat from the heat generating device to dissipate heat (the heat dissipation process will be described in detail below).

3 is a schematic side cross-sectional view of a heat dissipation device in accordance with an embodiment of the present application. As shown in FIG. 3, the evaporator 110 is internally provided with a steam pipe, and the upper side of the evaporator 110 is embedded in the steam balance groove 121 of the primary pressure balancer 120, so that the evaporator 110 passes through the plurality of steam pipes 111 and the first stage. The internal space of the pressure balancer 120 is connected. The internal spaces of the primary pressure balancer 120, the manifold 130, the condenser 140, and the secondary pressure balancer 150 are in communication to form a closed, circulating heat rejection system.

The heat dissipating device of the embodiment of the present application, on the one hand, connects the evaporator 110 and the condenser 140 through the primary pressure balancer 120 and the confluence pipe 130 because there is no external piping (ie, the steam rising pipe and the liquid return pipe), The integrated design of the evaporator 110 and the condenser 140 is realized, the structure of the heat dissipation device is simplified, the weight and volume of the heat dissipation device are reduced, and the heat dissipation device tends to be lightweight and miniaturized.

On the other hand, due to the arrangement of the primary pressure balancer 120, the entire heat dissipating device has two balancers (i.e., the primary pressure balancer 120 and the secondary pressure balancer 150) even if the steam is in the primary pressure balancer 120. The internal pressure is not fully balanced, and the secondary pressure balance can be performed in the secondary pressure balancer 150, which can improve the heat dissipation efficiency.

On the other hand, a first-stage pressure balancer 120 is provided between the evaporator 110 and the manifold 130, which can shorten the steam path as compared with the prior art, and can further improve the heat dissipation efficiency of the heat dissipation device.

Optionally, as an embodiment, the lower side of the primary pressure balancer 120 is provided with a steam balance tank 121, the upper side of the evaporator 110 is embedded in the steam balance tank 121, and the upper side of the evaporator 110 and the steam balance tank There is a gap between 121.

FIG. 4 illustrates a primary pressure balancer 120 in accordance with an embodiment of the present application. As shown in FIG. 4, the lower side of the primary pressure balancer 120 (i.e., the side connected to the evaporator 110) has a groove-like structure, and with such a structure, it is possible to rise from the steam pipe 111 into the steam balance groove 121 ( In other words, the trough-like structure of the steam achieves a rapid balance (or, in other words, the uneven heat of steam entering the steam balance tank from the steam line 111 can exchange heat in the steam balance tank, so that the temperature of the entire heat dissipating device tends to Uniform), thereby improving the temperature uniform performance of the evaporator 110.

Optionally, as an embodiment, the upper side of the primary pressure balancer 120 (ie, the side connected to the manifold 130) is provided with a plurality of openings 122, and the lower side of the manifold 130 is provided with at least one opening 131, causing the manifold 130 to communicate with the primary pressure balancer 120.

It should be understood that the embodiment of the present application does not limit the shape, size, and spacing of the plurality of openings 122 on the primary balancer, and should be designed according to the application scenario of the heat dissipation device. For example, the shape of the opening 122 may be a circular hole, a square hole, an elliptical hole, a polygonal hole or the like. For another example, for a heat source (eg, a chip) with uneven heat generation, the pitch of the plurality of openings 122 in the primary pressure balancer 120 may be designed to be smaller to increase the number of the openings 122, and the opening 122 is designed. The larger one is to speed up the exchange of heat and improve the uniform temperature performance of the heat-dissipating substrate, thereby achieving balanced heat dissipation.

Optionally, as an embodiment, at least one opening 131 disposed on the lower side of the manifold 130 is the same as the number of the plurality of openings 122 in the primary pressure balancer 120.

Similar to the above-described first-stage pressure balancer 120, the shape, the spacing and the size of the at least one opening 131 on the manifold 130 are not limited in any way, and are not described herein.

In this case, the lower side of the manifold 130 is provided with at least two openings 131, and the at least two openings 131 are the same as the number of the plurality of openings 122 provided on the upper side of the primary pressure balancer 120. The primary pressure balancer 120 communicates with the internal space of the manifold 130 through the at least two openings 131 and the plurality of openings 122.

It should be noted that, in the above embodiment, the connection between the primary pressure balancer 120 and the manifold 130 according to the embodiment of the present application is taken as an example only by providing openings in the primary pressure balancer 120 and the manifold 130. Be explained. In the embodiment of the present application, the specific communication form between the primary pressure balancer 120 and the manifold 130 is not limited. For example, the primary pressure balancer 120 is in communication with the internal space of the manifold 130 by a plurality of openings 122 and a plurality of openings 131 of the same number and position. For example, a groove structure is disposed on the upper side of the primary pressure balancer 120, and a plurality of openings 131 are disposed on the lower side of the manifold 130, and the primary pressure balancer 120 and the manifold 130 pass through the groove structure and the plurality of openings 131 makes the internal space connected.

Optionally, as an embodiment, at least one opening 131 disposed on the lower side of the manifold 130 is in one-to-one correspondence with the positions of the plurality of openings 122 on the primary pressure balancer 120.

FIG. 5 illustrates a manifold 130, a condenser 140, and a secondary pressure balancer 150 in accordance with an embodiment of the present application. As shown in FIG. 5, the upper side of the manifold 130 communicates with the lower side of the condenser 140, and the lower side of the manifold 130 is provided with a plurality of openings 131, which are disposed on the primary pressure balancer 120. The number of the plurality of openings 122 is the same and the positions are one-to-one correspondence. The manifold 130 and the primary pressure balancer 120 communicate with each other through the plurality of openings 122 and the plurality of openings 131. The lower side of the condenser 140 communicates with the upper side of the connection of the manifold 130, and the upper side of the condenser 140 communicates with the lower side of the secondary pressure balancer 150.

Optionally, as an embodiment, the condenser 140 is composed of a plurality of square tubes arranged in parallel, one end of each of the square tubes is in communication with the manifold 130, and the other end is in communication with the secondary pressure balancer 150.

In the embodiment of the present application, the condenser 140 may be composed of a plurality of square tubes disposed in parallel, so that the contact (eg, welding) area of the condenser 140 with the manifold 130 and the secondary pressure balancer 150 may be increased, thereby Improve the overall rigidity of the heat sink.

In the embodiment of the present application, the specific configuration of the condenser 140 is not limited. As long as the function of the condenser 140 can be realized, it should be considered to fall within the protection scope of the embodiment of the present application. For example, it may be a plurality of square tubes arranged in parallel, or may be a plurality of flat tubes, D-shaped tubes, rectangular tubes, round tubes, or other structural forms arranged in parallel.

FIG. 6 shows an evaporator 110 in accordance with an embodiment of the present application. As shown in FIG. 6, the interior of the evaporator 110 is provided with a plurality of steam pipes 111 through which the evaporator 110 communicates with the internal space of the primary pressure balancer 120.

In addition, a plurality of horizontal tubes 112 are disposed inside the evaporator 110 (for example, one horizontal tube is disposed inside the evaporator 110 shown in FIG. 2), and the horizontal tube 122 communicates with the steam tube 111 (see FIG. 2) In this manner, the heat balance inside the evaporator 110 can be accelerated, and the temperature equalization performance of the evaporator 110 can be improved.

Optionally, as an embodiment, the heat dissipation device further includes at least one fan 160 disposed outside the condenser 140.

It should be understood that a fan 160 (see FIG. 2) is disposed on the condenser 140 to speed up airflow exchange around the heat dissipating device and increase the rate of heat dissipation.

It should be noted that the condenser 140 of the heat dissipation device shown in FIG. 2 is only provided with two fans 160 as an example. The embodiment of the present application does not limit the number of the fans 160, and the specificity should be determined according to the requirements of the heat dissipation scenario. . For example, in a scenario where the heat dissipation requirement is high, the number of fans 160 may be increased, and in a scenario where the heat dissipation requirement is low, the number of fans 160 may be correspondingly reduced.

Alternatively, as an embodiment, the primary pressure balancer 120 is a square tube.

In the prior art, the balancer 230 of the radiator generally uses a circular tube, has a small welding contact area, is insufficient in rigidity, and is easily deformed. The use of a square tube can increase the contact area of the weld and enhance the rigidity of the heat sink.

It should be noted that the primary pressure balancer 120 can be a square tube, a D-shaped tube, a rectangular tube, or other types of hollow tubes, etc., and can also increase the contact (eg, welding) area. Thereby improving the overall rigidity of the heat sink.

Alternatively, as an embodiment, the secondary pressure balancer 150 is a square tube.

It should be understood that, similar to the above-described primary pressure balancer 120, the secondary pressure balancer 150 can be a square tube, a D-shaped tube, a rectangular tube, or other types of hollow tubes, etc., for the sake of brevity, here is not Let me repeat.

Optionally, as an embodiment, the manifold 130 is a square tube.

As described above, when the manifold 130 is a circular tube, the welding area with the primary pressure balancer 120 is small, and the square tube (or D-tube, rectangular tube) can be used to improve the overall rigidity of the heat-dissipating device.

It should be understood that, in the embodiment of the present application, the primary pressure balancer 120, the secondary pressure balancer 150, and the manifold 130 may be both configured as a square tube (or a D-shaped tube, a rectangular tube), or any one of them may be used. Combination. For example, the primary pressure balancer 120, the secondary pressure balancer 150, and the manifold 130 are all designed as square tubes. For another example, the primary pressure balancer 120 is a circular tube, and the secondary pressure balancer 150 and the manifold 130 are rectangular tubes.

It should be noted that the heat dissipation device (or the components of the heat dissipation device, for example, the primary pressure balancer 120) illustrated in FIG. 2 to FIG. 6 is only the heat dissipation device (or the component of the heat dissipation device) according to the embodiment of the present application. The example of the structural form does not impose any limitation on the structural form of the heat dissipating device of the embodiment of the present application.

The structure of the heat dissipating device according to the embodiment of the present application is described in detail with reference to FIG. 2 to FIG. 6 . The heat dissipation process of the heat dissipating device according to the embodiment of the present application will be described below with reference to FIG. 2 .

First, the heat generating device is placed on the outer surface of the evaporator, and the heat of the heat generating device is conducted to the working medium of the evaporator 110 (or the steam pipe 111 of the evaporator 110) through the evaporator, and after the working medium absorbs heat, The liquid is converted from a liquid state to a vapor state and rises along a plurality of steam pipes 111 inside the evaporator 110, passes through the steam balance tank 121 and enters the primary pressure balancer 120, and after the steam is rapidly balanced in the primary pressure balancer 120, the steam passes. The manifold 130 enters the condenser 140. If there is unsaturated steam, it continues to rise along the condenser 140 into the secondary pressure balancer 150 to achieve a secondary pressure balance. Finally, the steam is released into the liquid state in the condenser 140 and then returned to the evaporator 110 via the header 130 and the primary pressure balancer 120. Thus, a liquid-vapor-liquid circulation process is completed. When the working medium absorbs heat again, it will start a new cycle, so that it will reciprocate and act as a heat sink to form a closed heat dissipation system.

The heat dissipation device of the embodiment of the present invention achieves phase change and high efficiency heat dissipation through the above-mentioned structural design, and the heat dissipation efficiency per unit volume is further improved and the substrate temperature is uniform compared with the existing heat sink. For example, in a prototype with a volume of 6 L (for example, the length, width, and height of the heat dissipating device are 400 mm, 300 mm, and 50 mm, respectively), the heat dissipating device of the embodiment of the present application has a thickness of 20 mm, and the substrate temperature difference is within 2 degrees Celsius.

In addition, the heat dissipation device of the embodiment of the present application achieves weight reduction of the heat dissipation device. For example, taking a prototype with a volume of 6L as an example, the weight of the heat sink is reduced by 3Kg and the weight is reduced by 60% compared with the existing profile heatsink, so that the heat sink is lighter.

In addition, in the heat dissipation device of the embodiment of the present application, the evaporator 110 and the condenser 140 adopt an integrated device, which simplifies the structure of the heat dissipation device, and reduces the volume of the heat dissipation device and reduces the cost.

The foregoing is only a specific embodiment of the present application, but the scope of protection of the present application is not limited thereto, and any person skilled in the art can easily think of changes or substitutions within the technical scope disclosed by the present invention. It should be covered by the scope of the present invention. Therefore, the scope of protection of the present application should be determined by the scope of the claims.

Claims

A heat dissipating device, comprising: an evaporator (110), a primary pressure balancer (120), a manifold (130), a condenser (140), and a secondary pressure balancer (150),

The inside of the evaporator (110) is provided with a plurality of steam pipes (111), the inside of the plurality of steam pipes (111) is added with a working medium, and the upper side of the evaporator (110) passes through the plurality of strips a steam conduit (111) is in communication with a lower side of the primary pressure balancer (120);

The upper side of the primary pressure balancer (120) is in communication with the lower side of the manifold (130);

The upper side of the manifold (130) is in communication with the lower side of the condenser (140);

The upper side of the condenser (140) is in communication with the underside of the secondary pressure balancer (150).
The heat dissipating device according to claim 1, wherein a lower side of the primary pressure balancer (120) is provided with a steam balance tank (121), and an upper side of the evaporator (110) is embedded in the In the steam balance tank (121), a gap is left between the upper side of the evaporator (110) and the steam balance tank (121).
The heat dissipation device according to claim 1 or 2, wherein the upper side of the primary pressure balancer (120) is provided with a plurality of openings (122), and the lower side of the manifold (130) is disposed There is at least one opening (122) such that the primary pressure balancer (120) is in communication with the manifold (130).
The heat dissipating device according to claim 3, wherein at least one opening (131) disposed on a lower side of the manifold (130) is disposed more than an upper side of the primary pressure balancer (120) The number of openings (122) is the same.
The heat dissipating device according to claim 4, wherein at least one opening (131) disposed on a lower side of the manifold (130) is disposed more than an upper side of the primary pressure balancer (120) The positions of the openings (122) correspond one-to-one.
The heat dissipating device according to any one of claims 1 to 5, characterized in that the primary pressure balancer (120) is a square tube.
The heat dissipating device according to any one of claims 1 to 6, characterized in that the secondary pressure balancer (150) is a square tube.
The heat dissipating device according to any one of claims 1 to 7, wherein the condenser (140) is composed of a plurality of square tubes arranged in parallel, one end of each square tube and the manifold (130) Connected, the other end is in communication with the secondary pressure balancer (150).
The heat dissipating device according to any one of claims 1 to 8, wherein The heat sink device also includes at least one fan (160) disposed outside of the condenser (140).