CN114126323B - Radiator for power electronic equipment - Google Patents
Radiator for power electronic equipment Download PDFInfo
- Publication number
- CN114126323B CN114126323B CN202010882309.3A CN202010882309A CN114126323B CN 114126323 B CN114126323 B CN 114126323B CN 202010882309 A CN202010882309 A CN 202010882309A CN 114126323 B CN114126323 B CN 114126323B
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- China
- Prior art keywords
- pipe
- capillary tissue
- capillary
- group
- power electronic
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- 239000011148 porous material Substances 0.000 claims description 26
- 239000002184 metal Substances 0.000 claims description 10
- 239000000835 fiber Substances 0.000 claims description 6
- 239000000843 powder Substances 0.000 claims description 6
- 239000006260 foam Substances 0.000 claims description 4
- 230000005855 radiation Effects 0.000 claims description 4
- 239000002131 composite material Substances 0.000 claims description 2
- 239000007788 liquid Substances 0.000 description 14
- 230000017525 heat dissipation Effects 0.000 description 8
- 238000009833 condensation Methods 0.000 description 3
- 230000005494 condensation Effects 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 230000005484 gravity Effects 0.000 description 3
- 238000000926 separation method Methods 0.000 description 3
- 230000009471 action Effects 0.000 description 2
- 239000006262 metallic foam Substances 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 238000005245 sintering Methods 0.000 description 2
- 239000000126 substance Substances 0.000 description 2
- 239000012530 fluid Substances 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2029—Modifications to facilitate cooling, ventilating, or heating using a liquid coolant with phase change in electronic enclosures
- H05K7/20336—Heat pipes, e.g. wicks or capillary pumps
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Thermal Sciences (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The invention discloses a radiator for power electronic equipment, which comprises a shell, an opening group, a pipe body group and a filling pipe. The housing includes a cover plate and a base plate, which are combined to form a chamber. The chamber has a first capillary tissue and a second capillary tissue therein. At least one opening group is positioned on the cover plate. Each aperture group includes a first aperture and an odd number of second apertures. The pipe body sets are in one-to-one correspondence with the opening sets. The number of the pipe bodies in the pipe body group is half of the sum of the numbers of the first holes and the second holes in the hole group where the pipe bodies are located, the pipe bodies are provided with two ports, in the same pipe body group, two ports of one pipe body are communicated with a first hole and a second hole of the hole group where the pipe bodies are located, and two ports of the other pipe bodies are communicated with two second holes of the hole group where the pipe bodies are located. The radiator for the power electronic equipment has high radiating efficiency and is particularly suitable for the condition that a heat source is vertically or obliquely installed.
Description
Technical Field
The invention belongs to the technical field of heat dissipation, and relates to a radiator for power electronic equipment.
Background
The air-cooled radiator has the advantages of simplicity, reliability, low cost and the like, and is widely applied to the field of power electronic heat dissipation. However, with the rapid development of industries such as big data, AI, internet of things and the like, the power consumption of the hardware integrated circuit is larger and larger, and the heat productivity and the heat flux density are also larger and larger. The heat dissipation capability of conventional air-cooled heat sinks, such as heat pipe heat sinks and temperature plates, is increasingly difficult to meet. Particularly, when the heat source in the device is vertically or obliquely installed, the heat dissipation effect of the radiator is affected, and the performance is reduced. Therefore, there is a need for an air-cooled heat sink with higher efficiency and higher adaptability for electronic devices.
Disclosure of Invention
In order to solve the problem of difficult heat dissipation of the current power electronic equipment, the invention provides the radiator which has the advantages of high heat dissipation capacity, high efficiency, strong adaptability and the like and is particularly suitable for the situation that a heat source in the power electronic equipment is vertically or obliquely installed.
The invention adopts the following technical scheme:
a heat sink for a power electronic device, comprising:
the shell comprises a cover plate and a bottom plate, wherein the cover plate is combined with the bottom plate, and a cavity is formed inside the shell;
a first capillary tissue is positioned in the cavity and fixed on the bottom plate, a second capillary tissue is positioned in the cavity and fixed on the cover plate, and the first capillary tissue is directly or indirectly contacted or connected with the second capillary tissue;
the opening group is positioned on the cover plate and comprises a first opening and an odd number of second openings, the second openings are covered with the second capillary tissues, and the first openings are free of the second capillary tissues, so that the first openings and the cavity penetrate through;
the pipe body group corresponds to the open pore groups one by one, the number of the pipe bodies in the pipe body group is half of the sum of the number of the first open pores and the number of the second open pores in the open pore group where the pipe bodies are positioned, the pipe bodies are provided with two ports, in the same pipe body group, two ports of one pipe body are communicated with a first open pore and a second open pore of the open pore group where the pipe bodies are positioned, and two ports of the other pipe bodies are communicated with two second open pores of the open pore group where the pipe bodies are positioned;
and one end of the filling pipe is closed, and the other end of the filling pipe is communicated with the cavity.
Optionally, in the same hole group, a concave structure is formed on a surface of the cover plate, which is located at the side of the cavity, between two second holes of the two different pipe bodies, wherein the two second holes are adjacent to each other in position and are respectively communicated with each other, a channel is formed between the concave structure and the second capillary tissue, and the channel is communicated with the two second holes.
Optionally, in the same hole group, a concave structure is formed on the second capillary tissue between two second holes, adjacent to each other and respectively communicated with two different pipe bodies, a channel is formed between the concave structure and the cover plate, and the channel is communicated with the two second holes.
Optionally, the first capillary tissue and the second capillary tissue are any one or more of a silk screen, foam metal, metal felt, fiber bundles, powder porous structures, and the first capillary tissue and the second capillary tissue are the same structure or different structures.
Optionally, the first capillary tissue is provided with an uneven pattern or a part of the first capillary tissue is hollowed out.
Optionally, a third capillary tissue is arranged in the cavity, and is respectively contacted or connected with the first capillary tissue and the second capillary tissue so as to realize indirect contact or connection between the first capillary tissue and the second capillary tissue, and the third capillary tissue is a composite structure of any one or more of silk screen, foam metal, metal felt, fiber bundles or powder porous structures.
Optionally, the inner surface of the tube body is smooth or has a micro-rib structure.
Optionally, the tube body is a round tube or a flat tube or a micro-channel tube or a tube body with a round tube part and a flat tube part.
Optionally, a heat radiation fin group is laid on the outer surface of the tube body.
Optionally, a supporting body is arranged in the cavity, and the supporting body is connected with the cover plate and the bottom plate.
In summary, the heat sink of the present invention has a larger effective contact area with the heat source than the heat pipe. And the flow direction of the vapor working medium and the liquid working medium in the pipe body is consistent, so that the liquid working medium is prevented from gathering on the inner wall of the pipe body. Particularly when a heat source in the power electronic equipment is vertically or obliquely installed, the liquid working medium flows more smoothly under the action of gravity, and the real-time gas-liquid separation and condensation heat dissipation effects are better.
Drawings
Fig. 1 is a schematic external view of a first embodiment of a radiator for power electronics equipment according to the present invention;
fig. 2 is a cross-sectional view of a first embodiment of a heat sink for power electronics according to the present invention;
FIG. 3 is a cross-sectional view of a tube in a first embodiment of a heat sink for power electronics according to the present invention;
fig. 4 is a cross-sectional view of a second embodiment of a heat sink for power electronics according to the present invention;
FIG. 5 is a schematic view of a first capillary structure of a heat sink for power electronics according to a second embodiment of the present invention;
FIG. 6 is a schematic view of a third embodiment of a heat sink for power electronics according to the present invention;
in the above figures: 1-shell, 2-tube group, 3-filling tube, 4-fin group, 11-cover plate, 12-bottom plate, 13-first capillary tissue, 14-second capillary tissue, 15-third capillary tissue, 16-support, 20-tube, 201-micro rib structure, 202-micro channel, 100-chamber, 110-open pore group, 111-first open pore, 112-second open pore, 112 o-second open pore, 112 p-second open pore, 112 q-second open pore, 113-channel, a-heat source.
Detailed Description
In the following detailed description, reference is made to the accompanying drawings which form a part hereof wherein like numerals designate like parts throughout, and in which is shown by way of illustration embodiments in which the subject matter may be practiced.
Referring to fig. 1 and 2, an outline schematic and a cross-sectional view of a first embodiment of a radiator for power electronic equipment according to the present invention are shown. It comprises a shell 1, a tube body group 2 and a filling tube 3. The housing 1 includes a cover plate 11 and a bottom plate 12, the periphery of the cover plate 11 and the bottom plate 12 being welded, and an inner space thereof forming a chamber 100. One end of the filling pipe 3 is communicated with the chamber 100 to fill working medium, and the other end is sealed. The tube set 2 includes two tubes 20. The cover 11 has an aperture set 110 comprising a first aperture 111 and second apertures 112o,112p,112q, and the three second apertures are sequentially arranged at one side of the first aperture 111. Two ends of a tube 20 are inserted into the first opening 111 and the second opening 112o, respectively, and welded and fixed. The other pipe 20 is inserted into the second openings 112p and 112q at both ends thereof, respectively, and is welded and fixed.
The chamber 100 has a first capillary tissue 13, a second capillary tissue 14, and a support 16. The first capillary structure 13 is fixed to the base plate 12, and the second capillary structure 14 is fixed to the cover plate 11. The support body 16 connects the cover plate 11 and the base plate 12. The first opening 111 extends through the chamber 100 and the second capillary tissue 14 is disposed at each of the second openings 112o,112p and 112 q. The second capillary 14 has a concave structure at a portion between the second openings 112o and 112p, and forms a channel 113 with the cover 11.
In the present embodiment, the first capillary tissue 13 has a portion protruding toward the second capillary tissue 14 to contact or connect the second capillary tissue 14, but is not limited thereto. The second capillary tissue 14 may have a portion protruding toward the first capillary tissue 13 to contact or connect the first capillary tissue 13; or the first capillary tissue 13 and the second capillary tissue 14 each have a portion protruding toward each other to be in contact with or connected to each other. The first capillary tissue 13 and the second capillary tissue 14 may be connected by sintering, but not limited to.
The first and second capillary tissues 13 and 14 may be selected from any one or more of a mesh, a metal foam, a metal felt, a fiber bundle, and a powder porous structure. The first capillary tissue 13 and the second capillary tissue 14 are the same structure or different structures.
Referring to fig. 3, a cross-sectional view of a tube body of a heat sink for power electronic equipment according to a first embodiment of the present invention is shown. The tube body 20 may be selected from a round tube, a flat tube, or a microchannel tube having a microchannel 202, the inner surface of which is smooth or has a micro-rib structure 201, and the shape of the micro-rib structure 201 is not limited.
The specific working principle is as follows: the cavity 100 is vacuumized through the filling pipe 3, then working medium is filled, and finally the opening end of the filling pipe 3 is welded and sealed. At least one heat source is in contact with the bottom plate 12 of the heat sink of the present invention. The working substance in the first capillary tissue 13 absorbs the heat of the heat source and then is vaporized. Since the three second openings are covered with the second capillary tissue 14, the vaporous working substance cannot penetrate, but is forced to enter the tube body 20 from the first opening 111 without capillary tissue. The vapor state working medium flows in the pipe body 20 and gradually releases heat to the outside, part of the working medium is condensed into a liquid state, and when flowing to the second opening 112o, the liquid state working medium is adsorbed by the second capillary tissue 14 at the position, flows along the second capillary tissue 14, and returns to the inside of the first capillary tissue 13 through the contact part with the first capillary tissue 13. The vapor state working medium continues to flow forward, enters the channel 113, enters the other pipe body 20 through the second opening 112p, and continues to release heat and condense. The final working fluid condenses into a liquid state, enters the second capillary tissue 14 from the second opening 112q, and finally returns into the first capillary tissue 13. With this circulation, heat is dissipated from the heat source to the environment.
Referring to fig. 4, a cross-sectional view of a second embodiment of a heat sink for power electronics according to the present invention is shown. As shown, it includes a housing 1, a tube set 2, a fill tube 3, and a fin set 4. The fin group 4 is laid on the surface of the tube body 20. The filling pipe 3 is located at the side of the cover plate 11. The chamber 100 has a first capillary tissue 13, a second capillary tissue 14, a third capillary tissue 15, and a support 16. The third capillary tissue 15 is in contact with or connected to the first capillary tissue 13 and the second capillary tissue 14, respectively, to achieve indirect contact with or connection of the first capillary tissue 13 and the second capillary tissue 14. The third capillary structure 15 may be connected to the first capillary structure 13 and the second capillary structure 14 by sintering, but is not limited to the above. The third capillary structure 15 may be selected from any one or more of a wire mesh, a metal foam, a metal felt, a fiber bundle, and a powder porous structure. The portion of the cover 11 between the second openings 112o and 112p has a concave structure, and forms a channel 113 with the second capillary 14 therein.
Referring to fig. 5, in the present embodiment, the first capillary 13 has an uneven pattern (the shape of the pattern is not limited in the figure). The first capillary tissue 13 may further have a hollowed-out portion (not shown in the figure). The structure of other parts of this embodiment is the same as that of the first embodiment of the radiator for power electronic equipment according to the present invention, and will not be described again.
The heat sink of the present invention is particularly useful when the heat source is mounted vertically or obliquely, as shown in fig. 4. Heat source a is mounted vertically and base plate 12 is in thermal contact with heat source a. The working medium absorbs heat of the heat source and then evaporates, and enters the pipe body 20 from the first opening 111. By means of gravity, the working medium flows more smoothly, particularly, the condensed liquid working medium flows downwards along the pipe body 20, is adsorbed by the second capillary tissue 14 when flowing to the second opening 112o, vapor-liquid separation is realized, the liquid working medium returns into the first capillary tissue 13 through the third capillary tissue 15, and the vapor working medium passes through the channel 113 and enters the other pipe body 20 from the second opening 112p, and heat release and condensation are continued to the outside. The final working medium condenses and returns to the first capillary structure 13. With this circulation, heat is dissipated from the heat source to the environment.
Fig. 6 is a schematic external view of a radiator for power electronic equipment according to a third embodiment of the present invention. The difference from the first embodiment is that two opening groups 110 are provided on the cover 11, and each opening group 110 includes a first opening 111 and five second openings 112. The number of the opening groups 110 is equal to the number of the tube groups 2. The number of the inner tubes 20 in the tube group 2 is half of the sum of the number of the first openings 111 and the number of the second openings 112. Thus, in this embodiment there are two tube sets 2, each with three tubes 20. The number of the opening groups 110 and the tube groups 2 and the number of the tubes 20 in the tube groups 2 are not limited, and are set according to the specific requirements of the user. The outer surface of the tube body 20 can also be laid with a heat radiation fin group 4 to increase the heat radiation area.
In summary, the heat sink of the present invention has a larger effective contact area with the heat source than the heat pipe. And the flow direction of the vapor working medium and the liquid working medium in the pipe body is consistent, so that the liquid working medium is prevented from gathering on the inner wall of the pipe body. Particularly when a heat source in the power electronic equipment is vertically or obliquely installed, the liquid working medium flows more smoothly under the action of gravity, and the real-time gas-liquid separation and condensation heat dissipation effects are better.
Finally, it should be emphasized that the foregoing description is merely illustrative of the preferred embodiments of the invention, and that various changes and modifications can be made by those skilled in the art without departing from the spirit and principles of the invention, and any such modifications, equivalents, improvements, etc. are intended to be included within the scope of the invention.
Claims (10)
1. A heat sink for a power electronic device, comprising:
the shell comprises a cover plate and a bottom plate, wherein the cover plate is combined with the bottom plate, and a cavity is formed inside the shell;
the first capillary tissue is positioned in the cavity and fixed on the bottom plate, the second capillary tissue is positioned in the cavity and fixed on the cover plate, and the first capillary tissue is in partial contact with or connected with the second capillary tissue;
the opening group is positioned on the cover plate and comprises a first opening and an odd number of second openings, the second openings are covered with the second capillary tissues, and the first openings are free of the second capillary tissues, so that the first openings and the cavity penetrate through;
the pipe body group corresponds to the open pore groups one by one, the number of the pipe bodies in the pipe body group is half of the sum of the number of the first open pores and the number of the second open pores in the open pore group where the pipe bodies are positioned, the pipe bodies are provided with two ports, in the same pipe body group, two ports of one pipe body are communicated with a first open pore and a second open pore of the open pore group where the pipe bodies are positioned, and two ports of the other pipe bodies are communicated with two second open pores of the open pore group where the pipe bodies are positioned;
and one end of the filling pipe is closed, and the other end of the filling pipe is communicated with the cavity.
2. The heat sink for a power electronic device according to claim 1, wherein:
in the same opening group, the surfaces of the cover plates, which are positioned adjacently and respectively communicated with two second openings of two different pipe bodies, at the side of the cavity are provided with concave structures, channels are formed between the concave structures and the second capillary tissues, and the channels are communicated with the two second openings.
3. The heat sink for a power electronic device according to claim 1, wherein:
in the same open pore group, a concave structure is arranged on the second capillary tissue, wherein the concave structure and the cover plate form a channel, and the channel is communicated with the two second open pores.
4. The heat sink for a power electronic device according to claim 1, wherein:
the first capillary tissue and the second capillary tissue are any one or more of a silk screen, foam metal, metal felt, fiber bundles or powder porous structures, and the first capillary tissue and the second capillary tissue are the same structure or different structures.
5. The heat sink for a power electronic device according to claim 1, wherein:
the first capillary tissue is provided with rugged patterns or partially hollowed-out parts.
6. The heat sink for a power electronic device according to claim 1, wherein:
the chamber is internally provided with a third capillary tissue, the third capillary tissue is respectively contacted or connected with the first capillary tissue and the second capillary tissue so as to realize the connection of the first capillary tissue and the second capillary tissue, and the third capillary tissue is a composite structure of any one or more of silk screen, foam metal, metal felt, fiber bundles or powder porous structures.
7. The heat sink for a power electronic device according to claim 1, wherein:
the inner surface of the tube body is smooth or has a micro-rib structure.
8. The heat sink for a power electronic device according to claim 1, wherein:
the pipe body is a round pipe or a flat pipe or a micro-channel pipe or a pipe body with a round pipe part and a flat pipe part.
9. The heat sink for a power electronic device according to claim 1, wherein:
and the outer surface of the tube body is laid with a heat radiation fin group.
10. The heat sink for a power electronic device according to claim 1, wherein:
and a supporting body is arranged in the cavity and is connected with the cover plate and the bottom plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010882309.3A CN114126323B (en) | 2020-08-30 | 2020-08-30 | Radiator for power electronic equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010882309.3A CN114126323B (en) | 2020-08-30 | 2020-08-30 | Radiator for power electronic equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN114126323A CN114126323A (en) | 2022-03-01 |
| CN114126323B true CN114126323B (en) | 2024-01-30 |
Family
ID=80374909
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010882309.3A Active CN114126323B (en) | 2020-08-30 | 2020-08-30 | Radiator for power electronic equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN114126323B (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116669401B (en) * | 2023-07-26 | 2023-10-10 | 苏州圣荣元电子科技有限公司 | Radiator |
Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202015105829U1 (en) * | 2015-01-28 | 2015-11-17 | Cooler Master Co., Ltd. | Heat sink structure with heat exchange mechanism |
| CN107305107A (en) * | 2016-04-21 | 2017-10-31 | 奇鋐科技股份有限公司 | Heat abstractor |
| WO2020119436A1 (en) * | 2018-12-13 | 2020-06-18 | 华为技术有限公司 | Thin heat pipe, method for manufacturing thin heat pipe, and electronic device |
| CN210900115U (en) * | 2019-09-15 | 2020-06-30 | 上海巽科节能科技有限公司 | Heat radiator |
| CN212381612U (en) * | 2020-08-30 | 2021-01-19 | 上海巽科节能科技有限公司 | Radiator for power electronic equipment |
-
2020
- 2020-08-30 CN CN202010882309.3A patent/CN114126323B/en active Active
Patent Citations (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| DE202015105829U1 (en) * | 2015-01-28 | 2015-11-17 | Cooler Master Co., Ltd. | Heat sink structure with heat exchange mechanism |
| CN107305107A (en) * | 2016-04-21 | 2017-10-31 | 奇鋐科技股份有限公司 | Heat abstractor |
| WO2020119436A1 (en) * | 2018-12-13 | 2020-06-18 | 华为技术有限公司 | Thin heat pipe, method for manufacturing thin heat pipe, and electronic device |
| CN210900115U (en) * | 2019-09-15 | 2020-06-30 | 上海巽科节能科技有限公司 | Heat radiator |
| CN212381612U (en) * | 2020-08-30 | 2021-01-19 | 上海巽科节能科技有限公司 | Radiator for power electronic equipment |
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| Publication number | Publication date |
|---|---|
| CN114126323A (en) | 2022-03-01 |
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Effective date of registration: 20231227 Address after: Unit 301-21, Building 3, Phase I, University Science and Technology Park, No. 20 Jianxiong Road, Science and Education New City, Taicang City, Suzhou City, Jiangsu Province, 215400 Applicant after: Suzhou shengrongyuan Electronic Technology Co.,Ltd. Address before: 511 Liuli Central Road, Jiading District, Shanghai, 201899 Applicant before: SHANGHAI XUNKE ENERGY SAVING TECHNOLOGY Co.,Ltd. |
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