CN107306486B

CN107306486B - Integrated heat dissipation device

Info

Publication number: CN107306486B
Application number: CN201610254815.1A
Authority: CN
Inventors: 蓝文基
Original assignee: Asia Vital Components Co Ltd
Current assignee: Asia Vital Components Co Ltd
Priority date: 2016-04-21
Filing date: 2016-04-21
Publication date: 2023-03-24
Anticipated expiration: 2036-04-21
Also published as: CN107306486A

Abstract

The invention provides an integrated heat dissipation device, which comprises at least a first shell, a second shell and a plurality of third shells, wherein the first shell and the second shell are respectively provided with a first shell cavity and a second shell cavity, each third shell is provided with a third shell cavity, each third shell is connected with the second shell through a first heat pipe, the first shell penetrates through the second shell through a second heat pipe and is connected to the corresponding third shell, and therefore working fluid in each third shell cavity is respectively subjected to vapor-liquid circulation heat dissipation in the first shell cavity and the second shell cavity through the first heat pipe and the second heat pipe which are respectively connected.

Description

Integrated heat dissipation device

[ technical field ] A method for producing a semiconductor device

The present invention relates to an integrated heat dissipation device, and more particularly, to an integrated heat dissipation device for heat dissipation.

[ background ] A method for producing a semiconductor device

With the demand of the current electronic devices to be light and thin as a target board, the size of each component should be reduced accordingly, but the heat generated by the size reduction of the electronic devices becomes a major obstacle for improving the performance of the electronic devices and systems. Therefore, in order to effectively solve the Heat dissipation problem of the components in the electronic device, a Vapor chamber (Vapor chamber) and a Heat pipe (Heat pipe) with better Heat conduction efficiency are respectively provided to effectively solve the Heat dissipation problem at the present stage.

The Vapor chamber is a rectangular shell (or plate), the inner wall of the cavity of the shell is provided with a capillary structure, and the shell is filled with a working fluid, and one side (i.e. an evaporation area) of the shell is attached to a heating element (such as a central processing unit, a north-south bridge chip, a transistor, a Micro Control Unit (MCU) or other electronic elements) to absorb heat generated by the heating element, so that the liquid working fluid is evaporated in the evaporation area of the shell and converted into a Vapor state, the heat is transferred to a condensation area of the shell, the Vapor working fluid is cooled in the condensation area and then condensed into a liquid state, and the liquid working fluid flows back to the evaporation area through gravity or the capillary structure to continue Vapor-liquid circulation, so as to effectively achieve the effect of uniform temperature heat dissipation.

The principle and theoretical structure of the Heat pipe (Heat pipe) are the same as those of the uniform temperature plate, and mainly includes filling metal powder (or placing woven mesh capillary or setting groove or composite capillary) into the hollow part of the Heat pipe with circular pipe diameter, forming a ring-shaped capillary structure on the inner wall of the Heat pipe by sintering, vacuumizing the Heat pipe and filling working liquid, and finally sealing to form the Heat pipe structure. When the working liquid is heated and evaporated by the evaporation part and then is diffused to the condensation end, the working liquid is in a vapor state in the evaporation part, is gradually cooled and condensed to be converted into a liquid state after leaving from the evaporation part and then is diffused to the condensation end, and then flows back to the evaporation part through the capillary structure.

Compared with the heat conduction mode of the uniform temperature plate and the heat pipe, the heat conduction mode of the uniform temperature plate is two-dimensional and is a surface heat conduction mode (mainly large-area uniform temperature effect); however, the heat conduction of the heat pipe is one-dimensional (mainly remote heat conduction).

Therefore, the current electronic device is not used with a single heat pipe or a temperature-equalizing plate, and how to combine the heat pipe and the temperature-equalizing plate together to make the heat pipe and the temperature-equalizing plate have temperature equalization and far-end heat conduction or heat dissipation, so as to greatly improve the heat conduction efficiency, and effectively solve the heat dissipation problem of the high-power electronic device, which is an improvement needed by the current manufacturers.

[ summary of the invention ]

In order to effectively solve the above problems, an object of the present invention is to provide an integrated heat dissipation device in which a second housing is connected to a plurality of third housings through a plurality of first heat pipes, and at least one first housing is connected to a corresponding third housing through at least one second heat pipe penetrating through the second housing, so that working fluids in the third housings are respectively flowed to the second housing through the connected first heat pipes for heat dissipation and flowed to the first housing through the second heat pipes for heat dissipation.

Another objective of the present invention is to provide an integrated heat dissipation device, wherein the first housing is located above the second housing, the second housing is located above the third housings, the third housings are respectively connected to the lower portion of the second housing through a first heat pipe and the lower portion of the first housing through a second heat pipe, so that the working fluid in the third housings is heated and evaporated, flows into the second housing and the first housing through the first and second heat pipes, and then flows back to each third housing from the first and second housings through gravity and capillary force after dissipating heat.

Another objective of the present invention is to provide an integrated heat dissipation device that can achieve better heat dissipation efficiency.

Another objective of the present invention is to provide an integrated heat dissipation device with increased heat dissipation area.

Another objective of the present invention is to provide a heat pipe having a plurality of first ribs and a plurality of first grooves on an inner surface of a first pipe wall, a plurality of second ribs and a plurality of second grooves on an inner surface of a second pipe wall, wherein the first and second heat pipe capillary structures are formed on the respective ribs and grooves, so as to increase an area of the heat pipe capillary structures and to improve a capillary channel in the heat pipe channel.

To achieve the above object, the present invention provides an integrated heat dissipation device, comprising: at least one first shell defining a first shell cavity and having at least one first opening communicating with the first shell cavity, the first shell cavity having a first shell capillary structure therein, the first shell cavity having an inner wall with a top side spaced relative to the first opening; a second shell defining a second shell cavity and having at least a second opening and a plurality of third openings, the second opening and the third openings being in communication with the second shell cavity, the second shell cavity having a second shell capillary structure therein; a plurality of third shells, each third shell defining a third shell cavity and being provided with at least one fourth opening communicated with the third shell cavity, the third shell cavity being internally provided with a working fluid and a third shell capillary structure, the third shell cavity being provided with an inner wall bottom side which is spaced and opposite to the fourth opening; a plurality of first heat pipes, each first heat pipe having a first heat pipe channel, two ends of the first heat pipes being respectively inserted into the third and fourth openings, the first heat pipe channels being respectively communicated with the second and third housing chambers, a first heat pipe capillary structure being disposed in the first heat pipe channel and respectively connected to the second housing capillary structure and the third housing capillary structure; and at least one second heat pipe having a second heat pipe channel, one end of the second heat pipe being inserted into the first opening, the other end of the second heat pipe penetrating through the second opening and a first heat pipe channel opposite to the second opening to a corresponding third housing chamber, the second heat pipe channel being respectively communicated with the first housing chamber and the third housing chamber, a second heat pipe capillary structure being disposed in the second heat pipe channel and respectively connected to the first housing capillary structure and the corresponding third housing capillary structure.

The first shell is provided with a first outer top surface to define a heat dissipation area, the second shell is provided with a second outer top surface to define a heat dissipation area, each third shell is provided with a third outer bottom surface to define a heat absorption area, the heat dissipation area of the first shell is larger than or equal to the heat absorption area of any third shell, and the heat dissipation area of the second shell is larger than the heat absorption area of any third shell.

Each first heat pipe is provided with a first pipe wall and a first extending part which form a first open end, and a second extending part which form a second open end, and the first heat pipe channel and the first heat pipe capillary structure are arranged in the first pipe wall and are positioned between the first open end and the second open end.

The second heat pipe has a second pipe wall and a third extending part to form a third open end and a fourth extending part to form a fourth open end, and the second heat pipe channel and the second heat pipe capillary structure are arranged in the second pipe wall and between the third open end and the fourth open end.

The first extending part extends into the second shell cavity from the corresponding third opening, so that the first opening end is abutted against the top side of the inner wall in the second shell cavity, and the second extending part extends into the third shell cavity from the corresponding fourth opening, so that the second opening end is abutted against the bottom side of the inner wall in the third shell cavity.

The third extending part extends into the first shell cavity from the corresponding first opening hole, so that the third opening end is abutted against the top side of the inner wall in the first shell cavity, the fourth extending part extends into the corresponding first heat pipe channel from the second opening hole to the third shell cavity, and the fourth opening end is abutted against the bottom side of the inner wall in the third shell cavity.

The first heat pipe capillary structure is connected with the second shell capillary structure and the third shell capillary structure through the first open end and the second open end.

The second heat pipe capillary structure is connected with the first shell capillary structure and the third shell capillary structure through the third open end and the fourth open end.

The first extending portion and the second extending portion are respectively provided with a first through hole and a second through hole which penetrate through the first pipe wall, and the first heat pipe channel is communicated with the second shell cavity and the third shell cavity through the first through hole and the second through hole.

The third extending part and the fourth extending part are respectively provided with a third through hole and a fourth through hole which penetrate through the second pipe wall, and the second heat pipe channel is communicated with the first shell cavity and the third shell cavity through the third through hole and the fourth through hole.

The first pipe wall has a first inner surface facing the first heat pipe channel, the first heat pipe capillary structure is formed on the first inner surface, the first inner surface is provided with a plurality of first convex ribs arranged at intervals, the first convex ribs are provided with first grooves, and the first convex ribs and the first grooves are arranged in a staggered manner and extend along a long direction of the first heat pipe.

The second pipe wall has a second inner surface facing the second heat pipe channel, the second heat pipe capillary structure is formed on the second inner surface, the second inner surface is provided with a plurality of second convex ribs arranged at intervals, the second convex ribs are provided with second grooves, and the second convex ribs and the second grooves are arranged in a staggered manner and extend along a long direction of the second heat pipe.

The first shell, the second shell and the third shell are temperature-equalizing plates or flat-plate temperature-equalizing heat pipes.

The pipe diameter of each first heat pipe is larger than that of the second heat pipe.

The second heat pipe has at least one support body set inside the second heat pipe passage, and the support body has one end contacting the top of the inner wall inside the first casing cavity and the other end contacting the bottom of the inner wall inside the third casing cavity.

The support body is provided with a capillary structure which is formed on the outer peripheral side of the support body.

The first shell is provided with a first part and at least one second part which are integrally and outwards extended from at least one side edge of the first part, the first opening is formed to penetrate through the first part of the first shell, the second part is provided with at least one fifth opening, the fifth opening is formed to penetrate through the second part of the first shell, and two ends of at least one third heat pipe are respectively connected with the fifth opening and a fourth opening corresponding to one of the third shells in an inserting mode.

The second shell is provided with a first part and at least one second part which integrally extend outwards from at least one side edge of the first part, wherein at least two third openings are formed and penetrate through the first part of the second shell, at least one third opening is formed and penetrates through the second part of the second shell, two ends of at least one first heat pipe are respectively inserted into the fourth opening corresponding to the at least one third opening and the at least one third shell, and the first heat pipe capillary structure of the at least one first heat pipe is respectively connected with the second shell capillary structure corresponding to the second part of the second shell and the third shell capillary structure corresponding to the at least one third shell.

[ description of the drawings ]

The accompanying drawings, which are included to provide a further understanding of the invention and are incorporated in and constitute a part of this specification, illustrate embodiments of the invention and together with the description serve to explain the principles of the invention. Through the embodiments herein and with reference to the corresponding drawings, the embodiments of the present invention will be explained in detail and the operation principle of the invention will be explained.

FIG. 1A is a schematic exploded view of a first embodiment of the present invention;

FIG. 1B is a perspective exploded view of the first embodiment of the present invention from another perspective;

FIG. 2 is a perspective assembly view of the first embodiment of the present invention;

FIG. 3 is a partial cross-sectional view of a first embodiment of the present invention;

FIG. 4A is a top view partially schematic illustration of another implementation of the first and second heat pipes according to the first embodiment of the present invention;

FIG. 4B is a partial cross-sectional view of another embodiment of the first and second heat pipes according to the present invention;

FIG. 5 is a perspective assembly view of another embodiment of the first embodiment of the present invention;

FIG. 6 is a schematic cross-sectional view of a first embodiment of the present invention;

FIG. 7 is a schematic partial cross-sectional view of a second embodiment of the present invention;

FIG. 8A is a schematic exploded view of a third embodiment of the present invention;

FIG. 8B is an exploded perspective view of another perspective of the third embodiment of the present invention;

FIG. 9A is a perspective assembly view of a third embodiment of the present invention;

FIG. 9B is a partial cross-sectional view of a third embodiment of the present invention;

FIG. 10A is an exploded perspective view of a fourth embodiment of the present invention;

FIG. 10B is an exploded perspective view of another perspective of the fourth embodiment of the present invention;

FIG. 11A is a perspective assembly view of a fourth embodiment of the present invention;

FIG. 11B is a partial cross-sectional view of a fourth embodiment of the present invention.

Description of the symbols:

first housing … 11

First housing chamber … 111

Inner wall topside … 1111

First outer top surface … 112

First outer bottom surface … 113

First opening … 114

First housing capillary structure … 115

First section … 116

Second portion … 117

Fifth opening 118

Second housing … 12

Second housing chamber … 121

Inner wall topside … 1211

Second outer top surface … 122

Second outer bottom surface … 123

Second opening … 124

Third opening … 125

Second shell capillary structure … 126

First section … 127

Second portion … 128

Third housing … 13

Third housing chamber … 131

Inner wall bottom side … 1311

Third outer top surface … 132

Third outer bottom surface … 133

Fourth aperture … 134

Working fluid … 135

Third housing capillary structure … 136

First heat pipe … 14

First tube wall … 141

First inner surface … 1411

First rib … 1412

First trench … 1413

First extension … 142

First open end … 1421

First through opening … 1422

Second extension … 143

Second open end … 1431

Second through hole … 1432

First heat pipe channel … 144

First heat pipe capillary structure … 145

Second heat pipe … 15

Second tube wall … 151

Second inner surface … 1511

The second rib … 1512

Second groove … 1513

Third extension … 152

Third open end … 1521

Third through hole … 1522

Fourth extension … 153

Fourth open end … 1531

Fourth through hole … 1532

Second heat pipe channel … 154

Second heat pipe capillary structure … 155

Support … 16

Capillary structure … 161

Third heat pipe … 17

Third tube wall … 171

Fifth extension … 172

Fifth open end … 1721

Fifth through hole … 1722

Sixth extension … 173

Sixth open end … 1731

Sixth through hole … 1732

Third heat pipe channel … 174

Third heat pipe capillary structure … 175

Heat sink ….

[ detailed description ] embodiments

The above objects of the invention, together with the structure and functional features thereof, are best understood from the following description of the embodiments when read in connection with the accompanying drawings.

The invention provides an integrated heat dissipation device, please refer to fig. 1A, fig. 1B, and fig. 2, which are exploded and assembled views of a first embodiment of the invention. As shown in the figures, the integrated heat dissipation device includes at least a first housing 11, a second housing 12, a plurality of third housings 13, a plurality of first heat pipes 14 and at least a second heat pipe 15, where the first housing 11 in this embodiment means that one first housing 11 is located above the second housing 12, and the third housings 13 in this embodiment means that two third housings 13 are located below the second housing 12 and are arranged in a left-right manner. The first case 11, the second case 12 and the second cases 12 are preferably made of a metal having good thermal conductivity, such as gold, silver, copper or alloys and metals thereof. The first and

second cases

11, 12 and the second case 12 are embodied as a temperature equalization plate or a flat plate type temperature equalization heat pipe. In other embodiments, the number of the first housings 11 is not limited to one, and may also be two or more than two, as shown in fig. 5, two first housings 11 are located above the second housing 12 and separated by two third housings 13 below the second housing 12, and each of the two first housings 11 penetrates through the second housing 12 via a second heat pipe 15 and is connected to two corresponding third housings 13.

The first housing 11 has a first housing cavity 111, a first outer bottom surface 113, a first outer top surface 112 and at least a first opening 114, the first opening 114 in this embodiment means that two first openings 114 are formed through the first outer bottom surface 113 of the first housing 11 and communicate with the first housing cavity 111, a first housing capillary structure 115 and an inner wall top side 1111 are disposed in the first housing cavity 111, the first housing capillary structure 115 is disposed on the inner wall of the first housing cavity 111, and the inner wall top side 1111 of the first housing cavity 111 is spaced from the first openings 114. The first outer top surface 112 is used for heat dissipation and defines a heat dissipation area, the heat dissipation area of the first housing 11 is the surface area of the first outer top surface 112, for example, the first outer top surface 112 is rectangular as shown in the figure, and the surface area is the length x width of the first outer top surface 112. In another embodiment, if the first outer top surface 112 is circular, the surface area is the square of the radius of the first outer top surface 112 x 3.14.

The second housing 12 has a second housing chamber 121, a second outer bottom surface 123, a second outer top surface 122, at least one second opening 124 and a plurality of third openings 125, the second outer top surface 122 faces the first outer bottom surface 113 of the first housing 11, the second opening 124 in this embodiment means two second openings 124 penetrating the second outer top surface 122 of the second housing 12 and communicating with the second housing chamber 121, the third openings 125 in this embodiment means two third openings 125 opposite to the two second openings 124, and the third openings 125 penetrating the second outer bottom surface 123 of the second housing 12 and communicating with the second housing chamber 121. A second housing capillary structure 126 is disposed in the second housing chamber 121, and the second housing capillary structure 126 is disposed on the inner wall of the second housing chamber 121. The second outer top surface 122 is used for heat dissipation and defines a heat dissipation area, the heat dissipation area of the second housing 12 is the surface area of the second outer top surface 122, for example, the second outer top surface 122 is rectangular as shown in the figure, and the surface area is the length x width of the second outer top surface 122. In another embodiment, the second outer top surface 122, if circular, has a surface area equal to the square of the radius of the second outer top surface 122 x 3.14. Wherein the aperture of the second opening 124 is equal to the aperture of the first opening 114, and the aperture of the second opening 124 is smaller than the aperture of the third opening 125.

Each third casing 13 has a third casing chamber 131, a third outer bottom surface 133, a third outer top surface 132 and at least a fourth opening 134, the third outer top surface 132 faces the second outer bottom surface 123 of the second casing 12, the fourth opening 134 is formed through the third outer top surface 132 and communicates with the third casing chamber 131, the third casing chamber 131 has a working fluid 135 (such as pure water, alcohols or ketones) and a third casing capillary structure 136 disposed on the inner wall of the third casing chamber 131, and the third casing chamber 131 has an inner wall bottom side 1311 spaced from the fourth opening 134. Each third housing 13 is connected to the second housing 12 through the first heat pipe 14, so that the third housing chambers 131 are respectively connected to the first housing chamber 111 of the first housing 11 through the first heat pipes 14. The third outer bottom surface 133 is shown as a downwardly convex surface in this figure, and serves as a heat absorbing surface defining a heat absorbing area, which is the surface area of the third outer bottom surface 133, for example, the third outer bottom surface 133 is shown as a rectangle having a surface area equal to the length x width of the third outer bottom surface 133. In another embodiment, if the third outer bottom surface 133 is circular, the surface area of the third outer bottom surface 133 is 3.14 times the square of the radius of the third outer bottom surface 133. The diameter of the fourth opening 134 is equal to the diameter of the third opening 125, and the diameter of the fourth opening 134 is larger than the diameters of the first and

second openings

114, 124.

In a preferred embodiment, the heat dissipation area of the first housing 11 is greater than or equal to the heat absorption area of any one of the third housings 13, and the heat dissipation area of the second housing 12 is greater than the heat absorption area of any one of the third housings 13. In another preferred implementation, the heat dissipation area of the second casing 12 is larger than the sum of the heat absorption areas of the third casings 13.

Each of the first heat pipes 14 has a first pipe wall 141, a first extending portion 142 forming a first open end 1421, and a second extending portion 143 forming a second open end 1431, a first heat pipe channel 144 and a first heat pipe capillary structure 145 are disposed in the first pipe wall 141 and located between the first open end 1421 and the second open end 1431, and the first open end 1421 and the second open end 1431 are respectively located at two ends (i.e., a front end and a rear end) of the first heat pipe 14. The two ends of the first heat pipe 14 are respectively inserted into the third openings 125 of the second housing 12 and the fourth openings 134 of the third housing 13, that is, the first extending portion 142 of the first heat pipe 14 extends into the second housing chamber 121 from the corresponding third opening 125, so that the first open end 1421 abuts against a top 1211 of an inner wall of the second housing chamber 121, and the first heat pipe capillary structure 145 at the first open end 1421 is connected to and contacts the second housing capillary structure 126 on the top 1211 of the inner wall of the second housing chamber 121.

In addition, the second extending portion 143 of the first heat pipe 14 extends into the third casing chamber 131 from the corresponding fourth opening 134, such that the second open end 1431 abuts against the bottom side 1311 of the inner wall in the third casing chamber 131, and the first heat pipe capillary structure 145 at the second open end 1431 is connected to contact with the third casing capillary structure 136 on the bottom side 1311 of the inner wall in the third casing chamber 131. A first through opening 1422 and a second through opening 1432 are respectively disposed on the first extending portion 142 and the second extending portion 143 of the first heat pipe 14 to penetrate through the first pipe wall 141, and the first heat pipe channel 144 is communicated with the second housing chamber 121 and the third housing chamber 131 through the first through opening 1422 and the second through opening 1432.

In one implementation, as shown in fig. 3, the first pipe wall 141 of the first heat pipe 14 has a first inner surface 1411 facing the first heat pipe channel 144, the first inner surface 1411 is a flat inner annular surface, and the first heat pipe capillary structure 145 is disposed on the first inner surface 1411. However, in another alternative implementation as shown in fig. 4A and 4B, the first inner surface 1411 is provided with a plurality of first ribs 1412 spaced apart from each other, the first ribs 1412 have first grooves 1413 therebetween, the first ribs 1412 and the first grooves 1413 are staggered and extend along a length direction of the first heat pipe 14, and the first heat pipe capillary structure 145 is formed on the first ribs 1412 and the first grooves 1413, thereby increasing an area of the first heat pipe capillary structure 145.

The second heat pipes 15 in this embodiment show that each end of 2 second heat pipes 15 is connected to the first housing 11, and each other end thereof penetrates through the second housing 12 and penetrates through the corresponding first heat pipe chamber to the corresponding third housing chamber 131 so as to be connected to the corresponding third housing 13. Each second heat pipe 15 has a second pipe wall 151, a third extending portion 152 forming a third open end 1521 and a fourth extending portion 153 forming a fourth open end 1531, a second heat pipe channel 154 and a second heat pipe capillary structure 155 are disposed in the second pipe wall 151 and located between the third open end 1521 and the fourth open end 1531, and the third open end and the fourth open end are respectively located at two ends (i.e., the front end and the end) of the second heat pipe 15. One end of each second heat pipe 15 is inserted into the first opening 114 corresponding to the first housing 11, and the other end thereof penetrates through the second opening 124 of the second housing 12 and a first heat pipe channel 144 corresponding to the second opening 124 to a corresponding third housing chamber 131, in other words, the third extending portion 152 of the second heat pipe 15 extends from the corresponding first opening 114 into the first housing chamber 111, so that the third opening end 1521 abuts against a top side inner wall 1111 inside the first housing chamber 111, and further the second heat pipe capillary structure 155 at the third opening end 1521 contacts with the first housing capillary structure 115 on the top side 1111 of the inner wall inside the first housing chamber 111.

In addition, the fourth extension 153 of each second heat pipe 15 extends from the corresponding second opening 124 into the corresponding first heat pipe channel 144 to the inside of the third housing chamber 131, such that the fourth open end 1531 abuts against the bottom side 1311 of the inner wall inside the third housing chamber 131, and the second heat pipe capillary structure 155 at the fourth open end 1531 is connected to contact the third housing capillary structure 136 on the bottom side 1311 of the inner wall inside the third housing chamber 131. A third through hole 1522 and a fourth through hole 1532 are respectively disposed on the third extending portion 152 and the fourth extending portion 153 of the second heat pipe 15 and penetrate through the second pipe wall 151, and the second heat pipe channel 154 is communicated with the first housing chamber 111 and the third housing chamber 131 through the third through hole 1522 and the fourth through hole 1532.

Moreover, the first, second and

third housing chambers

111, 121 and 131 can be supported by the structural design that the two ends of the first heat pipe 14 are respectively abutted against the top 1211 of the inner wall of the second housing 12 and the bottom 1311 of the inner wall of the third housing 13, and the two ends of the second heat pipe 15 are respectively abutted against the top 1111 of the inner wall of the first housing 11 and the bottom 1311 of the inner wall of the third housing 13, so as to replace the supporting structure in the known temperature equalization plate, thereby effectively achieving the effect of saving cost. In addition, the upper side of the second housing 12 of the present embodiment shows only one layer of the first housing 11, but is not limited thereto. In other embodiments, the first housing 11 may be a plurality of layers of the first housing 11 above the second housing 12, that is, the first housing 11 may be stacked up through the second heat pipes 15 to form a plurality of layers of the first housing 11 at intervals, for example, two layers of the first housing 11 are disposed above the second housing 12, wherein the first housing 11 of the first layer above the second housing 12 is connected to the bottom side 1311 of the inner wall in the corresponding third housing chamber 131 through the second heat pipe 15 penetrating the second housing 12 and the first heat pipe channel 144, and the first housing 11 of the second layer (i.e., the uppermost layer) is connected to the bottom side 1311 of the inner wall in the corresponding third housing chamber 131 through the other second heat pipe 15 penetrating the first housing 11 of the first layer below and the first housing 111 of the first layer.

In one implementation, as shown in fig. 3, the second tube wall 151 of the second heat pipe 15 has a second inner surface 1511 facing the second heat pipe channel 154, the second inner surface 1511 is a flat inner annular surface, and the second heat pipe capillary structure 155 is disposed on the second inner surface 1511. However, in another alternative implementation as shown in fig. 4A and 4B, the second inner surface 1511 is provided with a plurality of second ribs 1512 arranged at intervals, the second ribs 1512 are provided with second grooves 1513 therebetween, the second ribs 1512 and the second grooves 1513 are arranged alternately and extend along a length direction of the second heat pipe 15, and the second heat pipe capillary structures 155 are formed on the second ribs 1512 and the second grooves 1513, thereby increasing the area of the second heat pipe capillary structures 155.

The first, second, and third

shell capillary structures

115, 126, 136 and the first, second heat

pipe capillary structures

145, 155 are, for example, sintered metal powder bodies or mesh weaved bodies or grooves or bundle fiber, etc., and provide capillary force to drive the working fluid 135 to flow for a porous structure. The diameter (or cross-sectional area) of each first heat pipe 14 is larger than that of each second heat pipe 15.

Therefore, when the third outer bottom surfaces 133 of the third housings 13 respectively contact a heat generating source (e.g., CPU, MC U, graphic processor, etc.), the heat of each heat generating source is transferred into each third housing chamber 131 through each third outer bottom surface 133, the working fluid 135 in the third housing chamber 131 is heated and converted into the evaporated working fluid 135, wherein a portion of the evaporated working fluid 135 flows from the first through opening 1422 into the second housing chamber 121 through the first heat pipe channel 144, after a portion of the evaporated working fluid 135 condenses and is converted into the liquid working fluid 135 in the second housing chamber 121, the liquid working fluid 135 on the second housing capillary structure 126 in the second housing chamber 121 flows back to the second open end 1431 by the capillary force and gravity of the first heat pipe capillary structure 145 of the first open end 1421, and then flows back to the third housing chamber 131 by connecting and contacting the third housing capillary structure 136 through the first heat pipe structure 145, and flows back to the third housing chamber 131 by the second capillary structure 1522, and flows back to the third housing chamber 135 by the effective heat pipe capillary effect of the second heat pipe capillary structure 145 and the liquid working fluid 135 flowing back to the third housing chamber 135 through the second heat pipe capillary structure 1521, and the second housing capillary structure 145 flows back to the third housing chamber 131 by the second capillary structure and the second housing chamber 135 through the second capillary structure 1522, and the effective heat pipe capillary structure 1522.

Referring to fig. 6, a heat dissipation unit, such as a heat sink 21 or a fan or a combination of the heat sink 21 and the fan, is selectively disposed on the first and second outer

top surfaces

112, 122 of the first and

second housings

11, 12, and a heat sink 21 is disposed in a preferred embodiment. Since the heat sink 21 has a plurality of fins to increase the contact area with air, the heat on the first and second outer

top surfaces

112, 122 can be dissipated quickly through the heat sink 21.

With the above arrangement, the working fluid 135 in the plurality of third housings 13 flows to the second housing 12 and the second heat pipes 15 respectively connected to the second housings 11 through the first heat pipes 14 respectively connected to the plurality of third housings 13, then dissipates heat through the first outer top surface 112 of the first housing 11 and the second outer top surface 122 of the second housing 12, and finally flows back to each third housing 13 from the first housing 11 through each second heat pipe 15 by gravity and capillary force and flows back to each third housing 13 from the second housing 12 through each first heat pipe 14 by gravity and capillary force, because the dual actions of gravity and capillary force accelerate the back flow speed of the working fluid 135, the efficiency of vapor-liquid circulation is improved, and the heat dissipation efficiency is increased accordingly. On the other hand, since the heat dissipation areas of the first and second outer

top surfaces

112 and 122 are larger than the heat absorption area of the third outer bottom surface 133 of any one of the third housings 13, or the sum of the heat absorption areas of the third housings 13, the working fluids 135 of the third housings 13 respectively flow to the first and

second housings

11 and 12 to be collected, and then are dissipated by the large heat dissipation areas of the first and

second housings

11 and 12, thereby improving the heat exchange efficiency.

FIG. 7 is a partial cross-sectional view of a second embodiment of the present invention. The structure, connection relationship and efficacy of this embodiment are substantially the same as those of the first embodiment, and therefore will not be described again, and the difference between them lies in: each of the second heat pipes 15 further has at least one supporting body 16, the supporting body 16 is disposed in the second heat pipe channel 154, and one end of the supporting body 16 abuts against the top side 1111 of the inner wall in the corresponding first housing chamber 111, and the other end abuts against the bottom side 1311 of the inner wall in the corresponding third housing chamber 131. Therefore, the first housing chamber 111 is supported by the structure that the two ends of the second heat pipe 15 respectively abut against the top 1111 of the inner wall of the first housing 11 and the bottom 1311 of the inner wall of the third housing 13, and the first housing chamber 111 is supported by the support 16, so as to achieve the effect of dual support, and further achieve the effect of increasing the support strength.

In addition, the supporting body 16 is provided with a capillary structure 161, the supporting body 16 is represented as a metal column (such as a copper column) on the outer periphery of which the capillary structure 161 is formed, the capillary structure 161 is, for example, a sintered powder body or a mesh weave or a groove or a combination of the foregoing, and the capillary structure 161 of the supporting body 16 is respectively connected and contacted with the first casing capillary structure 115 and the third casing capillary structure 136, so that the liquid working fluid 135 on the first casing capillary structure 115 can flow back into the third casing chamber 131 through the capillary force and gravity of the sintered powder body on the outer peripheral surface of the supporting body 16 in addition to flowing back into the third casing chamber 131 through the capillary force and gravity of the second heat pipe capillary structure 155, thereby effectively accelerating the flow back speed of the liquid working fluid 135. In practice, the support body 16 is not limited to the metal column, and the support body 16 may be formed by powder metallurgy sintering.

Please refer to fig. 8A and fig. 9A, which are exploded and assembled views of a third embodiment of the present invention, and refer to fig. 8B and fig. 9B. The structure, connection relationship and efficacy of this embodiment are substantially the same as those of the first embodiment, and therefore will not be described again, and the difference between them lies in: the first housing 11 has a first portion 116 and at least one second portion 117 integrally extending outward from at least one side of the first portion 116, the first portion 116 of the first housing 11 is located right above the second housing 12, and the first portion 116 and the second portion 117 of the first housing 11 jointly define the first housing chamber 111. The second portion 117 extends horizontally outward from a side of the first portion 116 toward a direction away from the first portion 116 to form an L-shaped first housing 11. In alternative embodiments, the second portion 117 may be a plurality of second portions 117, such as 2 second portions 117, extending outward from the same side of the first portion 116 in the same direction to form a U-shaped first housing 11, or 2 second portions 117 extending outward from two opposite sides of the first portion 116 in different directions to form a substantially Z-shaped first housing 11, or other geometric shapes of the first housing 11.

The two first openings 114 are formed through the first outer bottom surface 113 of the first portion 116 of the first housing 11 and communicate with the first housing chamber 111, the second portion 117 is formed with at least one fifth opening 118, and the fifth opening 118 is formed through the first outer bottom surface 113 of the second portion 117 of the first housing 11 and communicate with the first housing chamber 111. The third housings 13 are shown as three third housings 13 in this embodiment, two third housings 13 are located directly below the second housing 12, and the last third housing 13 is located below the second portion 117 of the first housing 11.

In addition, the integrated heat dissipation device further includes at least one third heat pipe 17, the third heat pipe 17 has a third pipe wall 171, a fifth extending portion 172 forming a fifth open end 1721 and a sixth extending portion 173 forming a sixth open end 1731, a third heat pipe channel 174 and a third heat pipe capillary structure 175 are disposed in the third pipe wall 171 and located between the fifth open end 1721 and the sixth open end 1731, and the fifth open end 1721 and the sixth open end 1731 are respectively located at two ends (i.e., the front end and the end) of the third heat pipe 17. In other words, as shown in fig. 9B, the fifth extending portion 172 of the third heat pipe 17 extends from the corresponding fifth opening 118 into the first housing chamber 111, so that the fifth open end 1721 abuts against a top side 1111 of the inner wall in the first housing chamber 111, and the third heat pipe capillary structure 175 at the fifth open end 1721 is connected to contact with the first housing capillary structure 115 on the top side 1111 of the inner wall in the first housing chamber 111.

In addition, the sixth extending portion 173 of the third heat pipe 17 extends into the third casing chamber 131 from the fourth opening 134 corresponding to the third casing 13 (i.e. the last third casing 13), such that the sixth open end 1731 abuts against the bottom side 1311 of the inner wall in the third casing chamber 131, and the third heat pipe capillary structure 175 at the sixth open end 1731 is connected to contact the third casing capillary structure 136 on the bottom side 1311 of the inner wall in the third casing chamber 131. A fifth through hole 1722 and a sixth through hole 1732 are respectively disposed on the fifth extending portion 172 and the sixth extending portion 173 of the third heat pipe 17 and penetrate through the third pipe wall 171, and the third heat pipe channel 174 is communicated with the first housing chamber 111 and the third housing chamber 131 through the fifth through hole 1722 and the sixth through hole 1732.

The third heat pipe capillary structure 175 is, for example, a sintered metal powder body or a mesh woven body or a groove or a bundle fiber, and provides a porous structure with capillary force to drive the working fluid 135 to flow.

Therefore, when the third outer bottom surface 133 of the third housing 13 (i.e. the last third housing 13) contacts the corresponding heat generating source (e.g. CPU, MC U, graphic processor or other electronic components, etc.), the heat of the heat generating source is transferred into the third housing chamber 131 through the third outer bottom surface 133, the working fluid 135 in the third housing chamber 131 is heated and converted into the evaporated working fluid 135, and the evaporated working fluid 135 flows into the first housing chamber 111 from the sixth through hole 1732 through the third heat pipe channel 174, after a portion of the evaporated working fluid 135 is condensed and converted into the liquid working fluid in the first housing chamber 111, the liquid working fluid on the first housing capillary structure 115 in the first housing chamber 111 flows back to the sixth open end 1731 by the capillary force and gravity of the third heat pipe capillary structure 175 of the fifth open end 1721, and then flows back to the third housing chamber 131 by the third heat pipe capillary structure 175, so as to continue to achieve the vapor-liquid circulation and heat dissipation effect.

Therefore, through the design of the second portion 117 of the first housing 11 integrally extending outward from at least one side of the first portion 116, the length and the extending direction position of the second portion 117 integrally extending outward from the first portion 116 can be adjusted in advance according to the number of the heat sources and the positions of the plurality of heat sources at different positions, so that the application of convenience and diversification can be achieved in use.

Please refer to fig. 10A and fig. 11A, which are schematic exploded and cross-sectional views of a fourth embodiment of the present invention, with reference to fig. 10B and fig. 11B. The structure, connection relationship and efficacy of this embodiment are substantially the same as those of the first embodiment, and therefore will not be described again, and the difference between them lies in: the second housing 12 has a first portion 127 and at least a second portion 128 integrally extending from at least one side of the first portion 127, the first portion 127 of the second housing 12 is located below the first housing 11, and the first portion 127 and the second portion 128 of the second housing 12 jointly define the second housing chamber 121. The second portion 128 extends horizontally and outwardly from a side of the first portion 127 away from the first portion 127 to form an L-shaped second housing 12. In alternative embodiments, the second portion 128 of the second housing 12 may be a plurality of second portions 128, such as 2 second portions 128, extending outward from the same side of the first portion 127 in the same direction to form a U-shaped second housing 12, or 2 second portions 128 extending outward from two opposite sides of the first portion 127 in different directions to form a substantially Z-shaped second housing 12, or other shaped second housings 12.

The two third openings 125 are formed through the first portion 127 of the second housing 12 on the second outer bottom surface 123 thereof and communicate with the second housing chamber 121, and the other third opening 125 is formed through the second portion 128 of the second housing 12. The third housings 13 are shown as three third housings 13 in this embodiment, two of the third housings 13 are located directly below the first portion 127 of the second housing 12, and the last third housing 13 is located below the second portion 128 of the second housing 12. In addition, the first heat pipes 14 are represented as three first heat pipes 14 in this embodiment, two ends (i.e., the first and second open ends 1421, 1431) of two first heat pipes 14 are respectively inserted into two third openings 125 and four fourth openings 134 corresponding to the two third housings 13 on the first portion 127 of the second housing 12, and two ends of another first heat pipe 14 are respectively inserted into the third opening 125 and the fourth opening 134 corresponding to the second portion 128 of the second housing 12 and the last third housing 13 on the third housing 13 (i.e., the last third housing 13). And the first heat pipe capillary structure 145 of another first heat pipe 14 connects the second housing capillary structure 126 in the second portion 128 corresponding to the second housing 12 with the third housing capillary structure 136 corresponding to the third housing 13 (i.e., the last third housing 13), respectively.

Through the design of the second portion 128 of the second casing 12 integrally extending outward from at least one side of the first portion 127, the length and the extending direction position of the second portion 128 integrally extending outward from the first portion 127 can be adjusted in advance according to the number of the heat sources and the positions of the plurality of heat sources at different positions, so that the application can be more convenient and diversified.

However, the above-described preferred embodiments of the present invention are illustrative only, and all changes in the form, shape, structure and apparatus that can be made by the present invention are intended to be embraced therein.

Claims

1. An integrated heat dissipation device, comprising:

at least one first shell defining a first shell cavity and having at least one first opening communicating with the first shell cavity, the first shell cavity having a first shell capillary structure therein, the first shell cavity having an inner wall with a top side spaced relative to the first opening;

the second shell is arranged below the at least one first shell, defines a second shell cavity and is provided with at least one second opening and a plurality of third openings, the second opening and the plurality of third openings are communicated with the second shell cavity, and a second shell capillary structure is arranged in the second shell cavity;

the plurality of third shells are arranged below the second shell, each third shell defines a third shell cavity, at least one fourth hole is arranged to be communicated with the third shell cavity, a working fluid and a third shell capillary structure are arranged in the third shell cavity, and the third shell cavity is provided with an inner wall bottom side which is opposite to the fourth hole at intervals;

the first heat pipe capillary structure is arranged in the first heat pipe channel and is respectively connected with the second shell capillary structure and the third shell capillary structure;

at least one second heat pipe with a second heat pipe channel, one end of the second heat pipe is inserted into the first opening, the other end of the second heat pipe penetrates through the second opening and a first heat pipe channel opposite to the second opening to the corresponding third shell cavity, the second heat pipe channel is respectively communicated with the corresponding first shell cavity and the third shell cavity, and a second heat pipe capillary structure is arranged in the second heat pipe channel and is respectively connected with the first shell capillary structure and the corresponding third shell capillary structure;

the working fluid in the plurality of third shell cavities flows to the second shell cavity through the plurality of first heat pipes and returns to the plurality of third shell cavities from the second shell cavity through the plurality of first heat pipes by gravity and capillary force, and therefore a first vapor-liquid circulation is formed; the working fluid in the third housing chamber flows to the first housing chamber through the second heat pipe and returns to the plurality of third housing chambers through the at least one second heat pipe from the first housing chamber by gravity and capillary force, thereby forming a second vapor-liquid circulation.

2. The integrated heat dissipation device as claimed in claim 1, wherein the first housing has a first top outer surface defining a heat dissipation area, the second housing has a second top outer surface defining a heat dissipation area, each third housing has a third bottom outer surface defining a heat absorption area, the heat dissipation area of the first housing is greater than or equal to the heat absorption area of any third housing, and the heat dissipation area of the second housing is greater than the heat absorption area of any third housing.

3. An integrated heat dissipation device as defined in claim 1, wherein each first heat pipe has a first pipe wall and a first extension forming a first open end and a second extension forming a second open end, the first heat pipe channel and the first heat pipe capillary structure being disposed within the first pipe wall and between the first open end and the second open end.

4. The integrated heat dissipation device according to claim 3, wherein the second heat pipe has a second pipe wall and a third extension forming a third open end and a fourth extension forming a fourth open end, and the second heat pipe channel and the second heat pipe wick structure are disposed in the second pipe wall and between the third open end and the fourth open end.

5. An integrated heat sink according to claim 3, wherein the first extension extends into the second housing cavity from the corresponding third opening such that the first open end abuts a top side of an inner wall within the second housing cavity, and the second extension extends into the third housing cavity from the corresponding fourth opening such that the second open end abuts a bottom side of the inner wall within the third housing cavity.

6. The integrated heat dissipation device according to claim 4, wherein the third extensions extend from the corresponding first openings into the first housing chamber such that the second open ends abut a top side of an inner wall within the first housing chamber, and the fourth extensions extend from the second openings into a corresponding first heat pipe channel into the third housing chamber such that the fourth open ends abut a bottom side of an inner wall within the third housing chamber.

7. The integrated heat dissipation device according to claim 5, wherein the first heat pipe capillary structure is connected to the second housing capillary structure and the third housing capillary structure via the first open end and the second open end.

8. The integrated heat dissipation device according to claim 6, wherein the second heat pipe wick structure connects the first housing wick structure and the third housing wick structure via the third open end and a fourth open end.

9. An integrated heat dissipation device according to claim 7, wherein the first and second extension portions have a first through hole and a second through hole respectively penetrating through the first tube wall, and the first heat pipe channel communicates with the second and third housing chambers through the first and second through holes.

10. An integrated heat dissipation device as defined in claim 8, wherein the third and fourth extension portions respectively have a third through hole and a fourth through hole penetrating through the second tube wall, and the second heat pipe channel communicates with the first and third housing cavities through the third and fourth through holes.

11. The integrated heat dissipation device as claimed in claim 9, wherein the first tube wall has a first inner surface facing the first heat pipe channel, the first heat pipe capillary structure is formed on the first inner surface, the first inner surface has a plurality of first ribs spaced apart from each other, the plurality of first ribs have first grooves therebetween, and the plurality of first ribs and the first grooves are staggered and extend along a length direction of the first heat pipe.

12. An integrated heat dissipation device as defined in claim 10, wherein the second tube wall has a second inner surface facing the second heat pipe channel, the second heat pipe capillary structure is formed on the second inner surface, the second inner surface has a plurality of second ribs spaced apart from each other, the plurality of second ribs have second grooves therebetween, and the plurality of second ribs and the second grooves are staggered and extend along a length direction of the second heat pipe.

13. An integrated heat dissipation device as defined in claim 1, wherein the first, second and third housings are vapor chambers or flat vapor heat pipes.

14. An integrated heat dissipation device as defined in claim 1, wherein a tube diameter of each first heat pipe is greater than a tube diameter of the second heat pipe.

15. An integrated heat sink according to claim 3, wherein the second heat pipe further comprises at least one support disposed in the second heat pipe channel, and one end of the support abuts against the top of the inner wall in the first housing chamber, and the other end abuts against the bottom side of the inner wall in a third housing chamber.

16. An integrated heat dissipation device as defined in claim 15, wherein the support body is provided with a capillary structure formed on an outer circumferential side of the support body.

17. An integrated heat dissipation device as defined in claim 1, wherein the first housing has a first portion and at least one second portion integrally extending outward from at least one side of the first portion, the first opening is formed through the first portion of the first housing, the second portion has at least one fifth opening formed through the second portion of the first housing, and two ends of at least one third heat pipe are respectively inserted into and communicated with the fifth opening and a fourth opening corresponding to one of the third housings.

18. An integrated heat dissipation device as defined in claim 1, wherein the second housing has a first portion and at least one second portion integrally extending outward from at least one side of the first portion, wherein at least two third openings are formed through the first portion of the second housing, at least one third opening is formed through the second portion of the second housing, two ends of at least one first heat pipe are respectively inserted into the at least one third opening and the fourth opening corresponding to the at least one third housing, and the first heat pipe capillary structures of the at least one first heat pipe are respectively connected to the second housing capillary structures in the second portion corresponding to the second housing and the third housing capillary structures corresponding to the at least one third housing.