TWI601933B - Heat-conducting structure - Google Patents

Description

Thermal conductivity structure

The invention relates to a heat conducting structure, in particular to a heat guiding structure which utilizes a metal mesh as a capillary structure to simplify the process and combines the temperature equalizing plate and the heat pipe.

With the evolution of the generation, the requirements for electronic products are getting higher and higher, and with the increase in the processing speed and performance of the central processing unit (CPU), the current heat production of the CPU is increased, and the electronic products that are not valued for a long time are thermally controlled ( THERMAL MANAGEMENT) The problem has gradually surfaced and become a problem that cannot be ignored. The operating clock of the central processor has been increased from 1 GHz to 3 GHz, so that the power consumption has increased from 20 W to 130 W, and even higher, and the heat flux has increased. To more than 150W/cm ² , while the conditions of multiplexing of electronic products are required, more wafers must be embedded in a limited volume, and the heat generated by each wafer will affect each other, making the operating environment of the wafer increasingly The worse the damage to the normal operation and life of the wafer.

However, today's electronic components are only used in a single heat pipe or a uniform temperature plate, because the heat pipe has a problem of high diffusion heat resistance, and the temperature plate has a problem of narrow heat transfer direction, and how to combine the heat pipe and the temperature equalization plate. Effectively controlling the heat to allow the internal working fluid to circulate between the heat pipe and the temperature equalizing plate, so that the electronic product can operate effectively and continue to develop in the direction of multiplex operation, which becomes an important issue that needs to be solved urgently.

In view of the above, the inventors of the present invention have focused on the prior art and have devoted themselves to the use of academics to solve the above problems, which is the object of research and improvement of the present invention.

The main object of the present invention is to provide a thermal conductive structure that utilizes a metal mesh structure as a capillary structure and is coupled to a temperature equalizing plate and a heat pipe to form a heat conducting structure with better heat dissipation efficiency.

In order to achieve the above object, the present invention provides a heat conducting structure comprising a temperature equalizing plate and at least one heat pipe, wherein the temperature equalizing plate comprises a casing and at least one through opening formed on one side of the casing, and a casing interior defines a The chamber is connected to the through hole, and the inner wall surface of the chamber is covered with a metal mesh; the heat pipe comprises a pipe body and one end of the pipe body is formed, and the pipe body is connected to the through hole at one end of the opening, and the pipe A cavity is defined inside the body, and an inner wall surface of the cavity is covered with a capillary member; wherein the metal mesh passes through the opening to connect the capillary member.

In order to achieve the above object, the present invention provides a heat conducting structure comprising a temperature equalizing plate and at least one heat pipe, wherein the temperature equalizing plate comprises a casing and at least one through opening formed on one side of the casing, and a casing interior defines a a chamber communicating with the through hole, the inner wall surface of the chamber is covered with a capillary member; the heat pipe comprises a tube body and one opening formed on one side of the tube body, and the tube body is connected to the through hole at one end of the opening, the tube A cavity is defined inside the body, and the inner wall surface of the cavity is covered with a metal mesh; wherein the metal mesh passes through the opening to connect the capillary member.

In an embodiment of the invention, the metal mesh is selected from a capillary structure comprising copper, aluminum, and stainless steel.

In an embodiment of the invention, the metal mesh in the temperature equalizing plate comprises a capillary body portion and a capillary extension portion connecting the capillary body portions, wherein the capillary extension portion has a vertical bending structure at the connection portion, and the capillary extension portion Extending into the cavity to attach the capillary member.

In an embodiment of the invention, the metal mesh in the heat pipe comprises a capillary body portion and a capillary extension portion connecting the capillary body portions, the capillary extension portion has a vertical bending structure at the connection portion, and the capillary extension portion extends to The capillary is attached to the chamber.

In an embodiment of the invention, the heat pipe and the through port are respectively plural, and the heat pipes are respectively disposed on the same side or different sides of the temperature equalizing plate.

The invention also has the following effects to directly sinter the metal mesh and extend directly to the capillary member, and the direct sintering of the metal mesh is easier to manufacture and has a lower contact thermal resistance to make the working fluid more efficient by the heat pipe. Returning to the temperature equalizing plate, it has the advantages of low diffusion heat resistance of the temperature equalizing plate and wide heat transfer direction of the heat pipe.

The detailed description and technical content of the present invention are set forth in the accompanying drawings.

Referring to Figures 1 to 3, the present invention provides a first embodiment of a thermally conductive structure comprising a temperature equalizing plate 10 and at least one heat pipe 20 connecting the temperature equalizing plates 10.

The temperature equalizing plate 10 includes a casing 11 and at least one through opening 100 formed on one side of the casing 11. The casing 11 is stamped, forged or machined by a first casing member 11a and a second casing member 11b. The manners are joined to each other to form a sealed casing 11, and the first or second casing has a wall portion 122 to define a chamber 101 inside the vacuum of the casing 11, and the chamber 101 communicates with the through opening 100 for work. A fluid (not shown) flows therein, and the upper, lower and outer portions of the chamber 101 are an inner top wall 111a, an inner bottom wall 111b and an inner ring wall 112, respectively, and the through hole 100 is disposed in the housing 11. The side hole, that is, the through hole 100 is opened in the wall portion 122, and the top bottom wall 111b is provided with a plurality of spaced-apart top pillars 120, and is abutted against the inner top wall 111a to form a support. Further, the first The case member 11a and the second case member 11b are made of a metal material such as copper.

As shown above, the inner wall surface of the chamber 101 is covered with a metal mesh 13. In this embodiment, the metal mesh 13 can be completely coated on the inner top wall 111a and the inner bottom wall 111b to form a capillary structure of the temperature equalizing plate 10. The metal mesh 13 may be formed by forming a copper-containing metal mesh structure by using a sintered copper powder, directly sintering the metal copper mesh, or separately adhering to the inner top wall 111a and the inner bottom wall 111b by diffusion bonding, or by the foregoing The metal mesh 13 is formed on the inner top wall 111a, the inner bottom wall 111b, and the inner ring wall 112, and is not limited thereto. The metal mesh 13 may also be selected from a copper, aluminum or stainless steel material. It is not limited, and is selected according to the actual situation. In this embodiment, the capillary structure is formed by directly sintering the metal copper mesh, which has simple process, high stability, and strong capillary force to effectively reduce the contact heat between the metal mesh layers. Resistance.

The heat pipe 20 includes a pipe body 21 and an opening 200 formed at a free end of the pipe body 21. The inside of the pipe body 21 defines a cavity 201, and the free end of the pipe body 21 is connected to the through hole 100 and a part of the pipe body 21 extends to the cavity. In the chamber 101, wherein the inner wall surface of the tubular body 21 is completely covered with a capillary member 23, the capillary member 23 is selected from a mesh, a fiber, a sintered powder and a groove. The foregoing one of the grooves is not limited thereto, and the metal mesh 13 is connected to the capillary member 23 through the opening 200. Further, the heat pipe 20 and the temperature equalizing plate 10 are sealed and sealed. An indentation P is formed through the stamping process at the joint of the casing 11 and the tubular body 21 to form the joint bonding of the foregoing.

As described above, the metal mesh 13 includes a capillary body portion 131 and a capillary extension 132 connecting the capillary body portions 131, and the capillary extension portion 132 has a vertical bend at the junction with the capillary member 23 in the heat pipe 20. a folding structure 1320, the capillary extension 132 is formed from the vertical bending structure to extend into the cavity 201 to adhere to the capillary member 23, and when the metal mesh 13 is sintered in the housing 11, the top pillars 120 are After the sintering of the metal mesh 13 is completed, a plurality of through holes 133 are formed in the capillary body portion 131. The top posts 120 are inserted through the through holes 133 to abut against the inner top wall 111a. Thereby, the heat pipe 20 and the temperature equalizing plate 10 is used in combination, and the working fluid can flow between the heat pipe 20 and the interior of the temperature equalizing plate 10.

Referring to FIG. 4, the present invention provides a second embodiment of a capillary member of a thermally conductive structure. The main difference between this embodiment and the previous embodiment is the difference in capillary structure between the housing 11 and the tubular body 21.

In this embodiment, the inner wall surface of the cavity 201 in the tubular body 20 is covered with a metal mesh 24, and the chamber 101 in the casing 11 is covered with a capillary member 14, wherein the metal mesh 24 is connected through the opening 200. The capillary member 14 and the metal mesh 24 may be formed by forming a copper-containing metal mesh structure by using a sintered copper powder, directly sintering the metal copper mesh, or attaching to the inner wall surface of the pipe body 21 by diffusion bonding, and the metal mesh 24 may also be It is selected from a material containing copper, aluminum or stainless steel, which is not limited herein, and is selected according to the actual situation. In this embodiment, the capillary structure is formed by directly sintering the metal copper mesh, and further, the capillary member 14 in the casing 11 is selected. Attached to the inner top wall 111a and the inner bottom wall 111b, or formed on the inner top wall 111a, the inner bottom wall 111b and the inner ring wall 112, or more attached to the outer peripheral wall of the top pillar 120 to form a connected capillary structure, and The capillary member 14 is selected from any one of the foregoing, a mesh, a fiber, a sintered powder, and a groove, and is not limited herein.

As described above, the metal mesh 24 includes a capillary body portion 241 and a capillary extension portion 242 connecting the capillary body portion 241, and the capillary extension portion 242 has a joint at the joint with the capillary member 14 in the temperature equalization plate 10. The vertical bending structure 2420 extends from the vertical bending structure into the cavity 201 to abut the capillary member 14, whereby the heat pipe 20 and the temperature equalizing plate 10 are combined, and the working fluid can be It flows between the heat pipe 20 and the inside of the temperature equalizing plate 10.

Referring to Figures 3 and 5, the present invention provides a third embodiment of a capillary member of a thermally conductive structure. The main difference between this embodiment and the first embodiment of the present invention is that the heat pipe 20 is combined with the configuration of the temperature equalizing plate 10, and the following will be directed to The difference is explained.

In the present embodiment, the through hole 200 is disposed on an outer wall 110a of the first case member 11a, and the tube body 21 is disposed through the through hole 200 but does not protrude beyond the inner top wall 111a and is disposed upright on the outer wall 11a to The housing 11 is vertically disposed, wherein the capillary body portion 131 of the metal mesh 13 in the chamber 101 is coated on the inner top wall 111a and the inner bottom wall 111b, and the capillary body portion 131 covering the inner top wall 111a is adjacent to the through opening. The 200 is bent and extends toward the tubular body 21 to extend the capillary extension 132, and the capillary extension 132 abuts the capillary member 23 in the tubular body 21.

Referring to Figures 4 and 6, the present invention provides a fourth embodiment of a capillary member of a thermally conductive structure. The main difference between this embodiment and the second embodiment of the present invention is that the heat pipe 20 is combined with the configuration of the temperature equalizing plate 10, and the following will be directed to The difference is explained.

In the present embodiment, the through hole 200 is disposed on an outer wall 110a of the first case member 11a, and the tube body 21 is disposed through the through hole 200 but does not protrude beyond the inner top wall 111a and is disposed upright on the outer wall 11a to The housing 11 is in a vertical configuration, wherein the capillary body portion 241 of the metal mesh 24 covering the cavity 201 is bent adjacent to the through opening 200 and extends along the inner top wall 111a of the first case member 11a to extend the capillary extension portion. 242, and the capillary extension 242 is attached to the capillary member 14 that is coated on the inner top wall 111a.

Referring to FIGS. 1 to 2, in the foregoing first, second, third and fourth embodiments of the present invention, the heat pipe 20 described in the embodiments may be selected from a round tube structure or a round flat tube structure. In some embodiments, a round flat tube structure is selected to effectively save space and facilitate the fitting of the heat source, but not limited thereto, and the heat pipe 20 can be configured in plural, in the first and second embodiments as an example, the wall The plurality of through holes 200 can be formed in the plurality of through holes 200, and the plurality of heat pipes 20 are respectively disposed on the same side of the temperature equalizing plate and disposed parallel to the temperature equalizing plate 10. Or at least one through hole 200 is opened on different sides of the wall portion 122 and is opened in the same number as the heat pipe 20, so that the heat pipes 20 are respectively disposed on different sides of the temperature equalizing plate and arranged in parallel with the temperature equalizing plate 10. There is no limit here, and the design is based on actual needs. Thereby, the metal mesh is directly sintered and extended directly to the capillary member, and the method of directly sintering the metal mesh is simpler and has lower contact thermal resistance, so that the working fluid can be more efficiently returned from the heat pipe to the temperature equalization. The plate has the advantages of low diffusion heat resistance of the uniform temperature plate and wide heat transfer direction of the heat pipe.

In summary, the thermal conductivity structure of the present invention can achieve the intended use purpose, and solve the lack of the conventional, and because of the novelty and the progressiveness, fully meet the requirements of the invention patent application, and apply according to the patent law. Please check and grant the patent in this case to protect the rights of the creator.

10‧‧‧Wall plate

100‧‧‧through

101‧‧‧ chamber

11‧‧‧Shell

11a‧‧‧First shell

11b‧‧‧Second shell

110a‧‧‧ outer wall

110b‧‧‧ outer wall

111a‧‧‧ inner wall

111b‧‧‧ inner bottom wall

112‧‧‧ Inner Ring Wall

120‧‧‧Top column

122‧‧‧ enclosure

13‧‧‧Metal net

131‧‧‧Capillary body

132‧‧‧Capillary extension

1320‧‧‧Vertical bending structure

133‧‧‧through holes

14‧‧‧Capillary components

20‧‧‧heat pipe

200‧‧‧ openings

201‧‧‧ cavity

21‧‧‧ tube body

23‧‧‧Capillary components

232‧‧‧Capillary extension

2320‧‧‧Vertical bending structure

24‧‧‧Metal net

241‧‧‧Capillary body

242‧‧‧Capillary extension

2420‧‧‧Vertical bending structure

P‧‧‧Indentation

BRIEF DESCRIPTION OF THE DRAWINGS Figure 1 is an exploded perspective view of a thermally conductive structure of the present invention.

Figure 2 is a perspective assembled view of the thermally conductive structure of the present invention.

Figure 3 is a cross-sectional view showing a first embodiment of the capillary member of the present invention.

Figure 4 is a cross-sectional view showing a second embodiment of the capillary member of the present invention.

Figure 5 is a cross-sectional view showing a third embodiment of the capillary member of the present invention.

Figure 6 is a cross-sectional view showing a fourth embodiment of the capillary member of the present invention.

10‧‧‧Wall plate

101‧‧‧ chamber

11‧‧‧Shell

11a‧‧‧First shell

11b‧‧‧Second shell

110a‧‧‧ outer wall

110b‧‧‧ outer wall

111a‧‧‧ inner wall

111b‧‧‧ inner bottom wall

120‧‧‧Top column

13‧‧‧Metal net

131‧‧‧Capillary body

132‧‧‧Capillary extension

1320‧‧‧Vertical bending structure

20‧‧‧heat pipe

200‧‧‧ openings

201‧‧‧ cavity

21‧‧‧ tube body

23‧‧‧Capillary components

Claims (17)

A heat conducting structure comprising: a temperature equalizing plate comprising a casing and at least one through opening formed on one side of the casing, the casing defining a chamber and communicating with the through hole, the inner wall surface of the chamber a metal mesh; and at least one heat pipe, comprising a tube body and an opening formed at one end of the tube body, the tube body is connected to the through hole at one end of the opening body, and a cavity is defined inside the tube body, The inner wall surface of the cavity is covered with a capillary member; wherein the metal mesh comprises a capillary body portion and a capillary extension portion connecting the capillary body portion, and a vertical bend at a joint of the capillary extension portion and the capillary body portion a folded structure, the capillary extension penetrating from the opening and extending into the cavity to abut the capillary member such that an internal space forming the capillary extension at the opening is smaller than an internal space of the capillary member. The heat guide structure of claim 1, wherein the housing comprises a first shell member and a second shell member, wherein the second shell member is provided with a plurality of top pillars on an inner bottom wall of the chamber. The capillary body portion has a plurality of through holes, and the top posts penetrate the through holes and abut against an inner top wall of the first case member in the chamber. The thermally conductive structure of claim 2, wherein the metal mesh system completely covers the inner bottom wall and the inner top wall, respectively. The thermally conductive structure of claim 2, wherein any one of the first shell member and the second shell member has a retaining portion to form an inner annular wall of the chamber, and the metal mesh is completely covered Covering the inner bottom wall, the inner ring wall, and the inner top wall. The thermally conductive structure of claim 4, wherein the metal mesh system further comprises a peripheral wall completely covered by the top pillars. A heat conducting structure comprising: a temperature equalizing plate comprising a casing and at least one through opening formed in a side of the casing, the casing defining a chamber and communicating with the through hole, the inside of the chamber The wall surface is covered with a capillary member; and the at least one heat pipe comprises a pipe body and an opening formed on one side of the pipe body, the pipe body is connected to the through hole at one end of the pipe body, and the pipe body defines an empty interior a cavity, the inner wall surface of the cavity is covered with a metal mesh; wherein the metal mesh comprises a capillary body portion and a capillary extension connecting the capillary body portion, and a vertical portion at the junction of the capillary extension portion and the capillary body portion In the bent structure, the capillary extension extends from the opening and extends into the chamber to abut the capillary member such that an internal space in which the capillary extension is formed in the chamber is smaller than an internal space of the capillary member. The thermally conductive structure of claim 6, wherein the metal mesh is completely covered on the inner wall surface of the heat pipe. The heat guide structure of claim 6, wherein the housing comprises a first shell member and a second shell member, wherein the second shell member is provided with a plurality of top pillars on an inner bottom wall of the chamber. The top pillars abut against an inner top wall of the first shell member in the chamber, and the first shell member and the second shell member have a retaining portion to form one of the chambers The inner ring wall, the capillary member is completely covered on the inner bottom wall, the inner ring wall and the inner top wall. The thermally conductive structure of claim 8 wherein the capillary member further comprises a complete Covering the outer peripheral wall of the top pillars. The thermally conductive structure of claim 6, wherein the capillary member is selected from the group consisting of a metal mesh, a fibrous structure, a powder sintered body, and a groove structure. The thermally conductive structure of claim 6, wherein the metal mesh is selected from the group consisting of copper, aluminum or stainless steel. The heat guide structure according to claim 8, wherein the through hole is formed in the wall portion, and the heat pipe is disposed in parallel with the temperature equalization plate. The heat guide structure of claim 12, wherein the heat pipe and the through hole are respectively plural, and the heat pipes are respectively disposed on the same side of the temperature equalizing plate. The heat guide structure of claim 12, wherein the heat pipe and the through hole are respectively plural, and the heat pipes are respectively disposed on different sides of the temperature equalizing plate. The heat guide structure of claim 6, wherein the through hole is disposed on an outer wall of the first case member, and the heat pipe is disposed perpendicular to the temperature equalization plate. The thermally conductive structure of claim 6, wherein the heat pipe is selected from a round tube structure or a round tube structure. The thermally conductive structure of claim 6, wherein the tubular body has one end of the opening that passes through the through opening and partially extends into the chamber.