CN205488103U - Ultra -thin heat conduction component of application etch process and ultra -thin heat conduction component of buckling - Google Patents
Ultra -thin heat conduction component of application etch process and ultra -thin heat conduction component of buckling Download PDFInfo
- Publication number
- CN205488103U CN205488103U CN201620243163.7U CN201620243163U CN205488103U CN 205488103 U CN205488103 U CN 205488103U CN 201620243163 U CN201620243163 U CN 201620243163U CN 205488103 U CN205488103 U CN 205488103U
- Authority
- CN
- China
- Prior art keywords
- ultra
- coverboard
- etch process
- thin heat
- conducting element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Landscapes
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Abstract
The utility model relates to a heat conduction component field, the ultra -thin heat conduction component of application etch process for give off the heat that the heat production component produced, thin heat conduction component includes epitheca board and lower coverboard, the coverboard has the recess of being made by the etch process down, it covers to make at this recess and goes up coverboard and the airtight and vacuous cavity of formation between coverboard and the lower coverboard down to go up the coverboard, be filled with heat -conducting fluid in the cavity, the coverboard has the heat production component position of laminating on the heat production component down, ultra -thin heat conduction component includes further that the centre gripping is in go up the capillary body in coverboard and the cavity between the coverboard down, and the internal portion of capillary is densely covered has a microcellular structure that is used for receiving heat -conducting fluid, the partly of the capillary body covers in heat production component position. Cavity, location boss and the support boss application etch process of this ultra -thin heat conduction component are made, and the precision is higher.
Description
Technical field
This utility model relates to a kind of heat conducting element field, particularly one and can be applicable to electronic product radiating
In device, it is especially suitable for application and consumer highly integrated, the movement of compact conformation or handheld electric products
Wafer heat radiation system in.
Background technology
Along with the fast development of electronic chip technology, and electronic equipment for consumption is to thin, and light trend is sent out
Exhibition, and the performance of product is from strength to strength, and inner space is more and more narrower and small.Its internal core processes single
Unit heat dissipation problem become more and more important.Several outstanding features:
1. local heat flux density is increasing, and heat is easily locally focusing on, and causes local temperature mistake
High；Affect the stable performance of product.
2. heat flux distribution is uneven, and high heat flux is mostly just confined in the least scope.
3. the inner space of electronic equipment is abnormal narrow and small, and known conventional heat conducting element is laid without space.
So how produce during by the work of the core processing unit of the narrowest and small abnormal for inner space electronic product
Raw heat is quickly derived, and reduces local temperature too high, and preventing equipment from producing fault becomes crucial.
Generally known vapor chamber (as shown in Figure 1), by housing A, capillary layer B, support column
C and working fluid D is formed.This housing A comprises lower coverboard A1 and seals the upper of this lower coverboard
Coverboard A2, this capillary layer B are attached in this housing A, and coverboard all has capillary layer up and down；This support column
C is placed in this clearance space, in order to support this housing A；Finally by this lower coverboard A1, upper coverboard A2 tetra-
After working fluid D needed for limit solder joints, and perfusion, to internal evacuation, form this vacuum chamber equal
Hot plate.The manufacture characteristic of the capillary layer of this vapor chamber is that copper powder high temperature sintering is in the interior table of housing
Face, or copper mesh sinters or is welded in the inner surface of housing.
When above-mentioned vapor chamber uses, such as go up coverboard A2 in its one side and multiple radiating fin be set,
Another side A1 is then attached at heater element surface, make the working fluid that lower coverboard surface contacts by thermal evaporation,
Steam, via the gap of housing, flow in the sinter layer contacted with upper coverboard A2 surface, to be transmitted by heat
To radiating fin E, thus carry out the heat radiation of heater element.
But this working fluid D of above-mentioned vapor chamber is after the heat radiation of upper coverboard condenses, need to be through upper
Coverboard sinter layer edge is back to lower coverboard sinter layer, then is back to heat source position by lower coverboard capillary layer,
To realize circulation.
Another kind of known heat outlet parts is to form with flattening after heat pipe bending, the capillary structure inside it
Constitute and be similar to above-mentioned known vapor chamber.
This known vapor chamber system is in complex process, with high costs.And cannot accomplish ultra-thin
Size.The mode flattened again with heat pipe bending, the appearance profile of its product is the most restricted.And both
Three dimensions bending deformation scarce capacity.Cannot well adapt to highly integrated, structure is compact to design
Move or the wafer heat dissipation problem of handheld electric products (such as smart mobile phone, panel computer etc.).
Utility model content
For solving the problems referred to above, the utility model proposes a kind of utilization ultra-thin heat conducting element of etch process, this
Heat conducting element integrated level is high, thickness ultrathin, can be integrated in and move or in handheld electric products, originally lead simultaneously
Thermal element has the highest tensile strength, comprcssive strength.
For solving to realize above-mentioned purpose, the technical solution adopted in the utility model is: a kind of utilization etches work
The ultra-thin heat conducting element of skill, for distributing the heat that heat producing element produces, described thin heat conducting element includes upper casing
Plate and lower coverboard, described lower coverboard has the groove being fabricated to by etch process, and described upper coverboard covers
This groove makes to be formed between coverboard and lower coverboard the airtight and cavity of vacuum；It is filled with heat conduction in described cavity
Fluid, described lower coverboard has the heat producing element position being fitted on heat producing element, described ultra-thin heat conducting element
Farther include the capillary body being clamped in the cavity between described upper coverboard and lower coverboard, and in capillary body
Portion is densely covered with the microcellular structure for receiving heat-conducting fluid, and a part for described capillary body covers in heat production unit
Part position.
Further, covering the part in heat producing element position in described capillary body is covering part, described capillary
Body also includes the extension being connected with covering part and extending along cavity setting direction.
Further, described groove also has multiple positioning boss being fabricated to by etch process, and many
Formed between individual positioning boss and match with capillary shape and install for fixing the capillary body of capillary body
Position.
Further, also there is multiple cylinder for supporting upper coverboard and lower coverboard in described cavity
Support rim.
Further, described support rim is positioned at by capillary body, and multiple described support rim enclose with
The space that described capillary shape matches.
Further, described lower coverboard has at least one described cavity of connection and described utilization etch process
Connector outside ultra-thin heat conducting element, this connector inhales the logical of vacuum as filling heat-conductive fluid and cavity
Road, described connector is provided with dismountable plugging device.
Further, the frame of described lower coverboard at least has a depressed part, and gone up coverboard covers at this
Depressed part makes described depressed part as connector.
Further, the described ultra-thin heat conducting element of utilization etch process is L-type.
The ultra-thin heat conducting element of bending, including the utilization etch process ultra-thin heat conduction unit described in as above any one
Part, the ultra-thin heat conducting element of described bending at least includes not first in a plane and second.
Use the beneficial effects of the utility model are: this ultra-thin heat conducting element receives heat conduction stream by capillary body
Body, the heat-conducting fluid in capillary body corresponding at heat producing element position is converted into steam state, vapour because of heat by liquid
The heat-conducting fluid of state dispels the heat at upper coverboard and lower coverboard and is converted into liquid by steam state, then is inhaled by capillary body
Receive, it is achieved heat producing element is dispelled the heat by this heat conducting element, realizes the fast of heat producing element by a kind of new construction
Speed heat radiation.This cavity of ultra-thin heat conducting element, positioning boss and support rim use etch process to make,
Precision is higher.
Accompanying drawing explanation
Fig. 1 is the sectional view of vapor chamber in prior art.
Fig. 2 is the explosive view that this utility model uses the ultra-thin heat conducting element of etch process.
Fig. 3 is the vertical view that this utility model uses after removing upper coverboard in the ultra-thin heat conducting element of etch process
Figure.
Fig. 4 is the top view that this utility model uses the ultra-thin heat conducting element of etch process.
Fig. 5 is the section view that this utility model uses in etch process ultra-thin heat conducting element Fig. 4 along A-A face
Figure.
Fig. 6 is the partial enlarged drawing that this utility model uses in etch process ultra-thin heat conducting element Fig. 5 at B.
Reference includes:
Coverboard 210-capillary body installation position under 100-upper coverboard 200-
211-heat producing element position 220-positioning boss 230-support rim
240-connector 300-capillary body 310-covering part
320-extension 400-solder
Detailed description of the invention
Below in conjunction with accompanying drawing, this utility model is described in detail.
Embodiment 1
As shown in Fig. 2-Fig. 6, a kind of utilization ultra-thin heat conducting element of etch process, it is used for distributing heat producing element
Produce heat, thin heat conducting element includes coverboard 100 and lower coverboard 200, lower coverboard 200 have by
The groove that etch process is fabricated to, upper coverboard 100 covers coverboard 100 and lower coverboard 200 on this groove makes
Between form the airtight and cavity of vacuum；Being filled with heat-conducting fluid in cavity, lower coverboard 200 has and is fitted in
Heat producing element position 211 on heat producing element, ultra-thin heat conducting element farther includes to be clamped in upper coverboard 100
And the capillary body 300 in the cavity between lower coverboard 200, and capillary body 300 is internal is densely covered with for inhaling
Receiving the microcellular structure of heat-conducting fluid, a part for capillary body 300 covers in heat producing element position 211.
As in figure 2 it is shown, concrete, this ultra-thin heat conducting element is by independent upper coverboard 100, lower coverboard 200
Form with capillary body 300, use laser welding to make the flange of coverboard 100 and lower coverboard 200 weld,
The heating face of heat producing element (such as chip processor etc.) is attached to heat producing element position 211 and keeps being fully contacted,
Absorption heat-conducting fluid in capillary body 300 can steam by low temperature under conditions of vacuum at a lower temperature
Sending out vaporization, absorb the heat that heat producing element produces, then high-temperature steam carries heat rapidly to cavity surrounding
Diffusion, sends to the opposite proximal end in cavity so that even heat is distributed to coverboard 100 and lower coverboard 200
Each position.When heat-conducting fluid runs into cold upper coverboard 100 or lower coverboard 200, heat-conducting fluid is released
After putting latent heat, regelation becomes liquid and forms one layer of liquid film at upper coverboard 100 or lower coverboard 200 surface,
When liquid film touches capillary body 300, the capillary absorption power suction by capillary body 300 is back to heat source side.
The steam being vaporized into again heat after the heat-conducting fluid heat absorption of heat source side carries heat and sends to each portion of heat conducting element
Position, so, then can form the cyclic process of the liquid-vapour-liquid of heat-conducting fluid, take away heat simultaneously.
Covering the part in heat producing element position 211 in capillary body 300 is covering part 310, capillary body 300
Also include the extension 320 being connected with covering part 310 and extending along cavity setting direction.In this enforcement
In example, cavity has certain development length, and extension 320 can increase capillary body 300 and adsorb liquid film
Area.
Groove also has multiple positioning boss 220 being fabricated to by etch process, and multiple positioning boss
Formed with capillary body 300 mating shapes between 220 and install for fixing the capillary body of capillary body 300
Position 210.Positioning boss 220 is generally square, with lower house upper surface one bottom positioning boss 220
Body formed, and upwardly extend, positioning boss 220 top is concordant with the frame of lower house, when upper shell covers
When covering on lower house, the top of positioning boss 220 contacts with upper shell, and positioning boss 220 is along hair
The edge of light face type 300 is arranged so that capillary body 300 can be stably mounted in multiple positioning boss 220
Between.
As it is shown on figure 3, one end of the capillary body installation position 210 on lower coverboard 200 is heat producing element position 211,
In other embodiments, heat producing element position 211 may be alternatively located at capillary body 300 middle part.
The support also in cavity with multiple cylinder for supporting upper coverboard 100 and lower coverboard 200 is convex
Platform 230.Similar with positioning boss 220, support rim 230 is also fabricated to for etch process, supports convex
Platform 230 has the effect preventing capillary body 300 to be crushed, and simultaneously works as supporting coverboard 100 and lower casing
Plate 200, makes both will not bend easily in the case of by external force.
It is other that support rim 230 is positioned at capillary body 300, and multiple support rim 230 encloses and capillary body
The space of 300 mating shapes.In the present embodiment, support rim 230 encloses positioning boss 220, fixed
Position boss 220 encloses the extension 320 of capillary body 300.
Lower coverboard 200 has at least one connection cavity and uses outside the ultra-thin heat conducting element of etch process
Connector 240, this connector 240 inhales the passage of vacuum, connector as filling heat-conductive fluid and cavity
240 are provided with dismountable plugging device.
Because cavity thickness is less, cavity thickness is less than 0.5mm, as in cavity during filling heat-conductive fluid,
Heat-conducting fluid is difficult to enter cavity from connector 240, therefore two connectors 240 of design, in a company
Filling heat-conductive fluid at interface 240, the air in cavity is discharged at another connector 240, to reach empty
Gas internal gas pressure balances.Preferably, when coverboard 200 has two connectors 240 instantly, two connectors
240 answer spacing farther out, preferably at the two ends that cavity is distant.
As preferably, the frame of lower coverboard 200 at least has a depressed part, and gone up coverboard 100 covers
Cover and make depressed part as connector 240 at this depressed part.Connector 240 is upper coverboard 100 and lower casing
Plate 200 encloses, and has connector 240 and lower both coverboards 200 junction seals firm advantage,
Simultaneously also can simplification of flowsheet.
Using the ultra-thin heat conducting element of etch process is L-type.The edge of upper coverboard 100 and lower coverboard 200
Edge is laser welded by solder 400, and ensures cavities seals.
Embodiment 2
The ultra-thin heat conducting element of the bending in the present embodiment and embodiment 1 use the ultra-thin heat conduction of etch process
Element is similar to, and difference is that the ultra-thin heat conduction unit of bending can be ultra-thin by the utilization etch process in embodiment 1
Heat conducting element is bent to form the heat conducting element of three-dimensional.
Concrete, the ultra-thin heat conducting element of a kind of bending, including the above-mentioned ultra-thin heat conduction of utilization etch process
Element, the ultra-thin heat conducting element of bending at least includes not first in a plane and second.
The ultra-thin heat conducting element bent in the present embodiment is bent to form two faces, such as " L " type, at it
In his embodiment, the ultra-thin heat conducting element of bending is bent to form three faces, such as " U " type or " Z " type.
Requirement with designing according to consumer products, arbitrarily changes.
Above content is only preferred embodiment of the present utility model, for those of ordinary skill in the art,
According to thought of the present utility model, may be made that many changes in specific embodiments and applications,
As long as these changes are without departing from design of the present utility model, belong to protection domain of the present utility model.
Claims (9)
1. use the ultra-thin heat conducting element of etch process, for distributing the heat that heat producing element produces, institute
State thin heat conducting element and include coverboard (100) and lower coverboard (200), it is characterised in that: described lower coverboard
(200) having the groove being fabricated to by etch process, described upper coverboard (100) covers and makes at this groove
Airtight and the cavity of vacuum is formed between upper coverboard (100) and lower coverboard (200)；Fill in described cavity
Heat-conducting fluid, described lower coverboard (200) is had to have the heat producing element position (211) being fitted on heat producing element,
Described ultra-thin heat conducting element farther include to be clamped in described upper coverboard (100) and lower coverboard (200) it
Between cavity in capillary body (300), and capillary body (300) is internal is densely covered with for receiving heat-conducting fluid
Microcellular structure, described capillary body (300) a part cover in heat producing element position (211).
The ultra-thin heat conducting element of utilization etch process the most according to claim 1, it is characterised in that: institute
Stating and covering the part in heat producing element position (211) in capillary body (300) is covering part (310), described
Capillary body (300) also includes the extension being connected with covering part (310) and extending along cavity setting direction
Portion (320).
The ultra-thin heat conducting element of utilization etch process the most according to claim 1, it is characterised in that: institute
State and groove also has multiple positioning boss (220) being fabricated to by etch process, and multiple positioning boss
(220) formed and capillary body (300) mating shapes and be used for fixing the hair of capillary body (300) between
Light face type installation position (210).
The ultra-thin heat conducting element of utilization etch process the most according to claim 1, it is characterised in that: institute
Also there is in stating cavity multiple cylindrical propping up for supporting upper coverboard (100) and lower coverboard (200)
Support boss (230).
The ultra-thin heat conducting element of utilization etch process the most according to claim 4, it is characterised in that: institute
State support rim (230) and be positioned at capillary body (300) side, and multiple described support rim (230) encloses
Become the space with described capillary body (300) mating shapes.
The ultra-thin heat conducting element of utilization etch process the most according to claim 1, it is characterised in that: institute
State lower coverboard (200) and there is at least one described cavity of connection and described utilization etch process ultra-thin heat conduction unit
Connector (240) outside part, this connector (240) inhales vacuum as filling heat-conductive fluid and cavity
Passage, described connector (240) is provided with dismountable plugging device.
The ultra-thin heat conducting element of utilization etch process the most according to claim 6, it is characterised in that: institute
The frame stating lower coverboard (200) at least has a depressed part, and gone up coverboard (100) covers recessed at this
Sunken portion makes described depressed part as connector (240).
The ultra-thin heat conducting element of utilization etch process the most according to claim 1, it is characterised in that: institute
Stating the utilization ultra-thin heat conducting element of etch process is L-type.
9. the ultra-thin heat conducting element of bending, it is characterised in that: include institute as any one of claim 1-8
The ultra-thin heat conducting element of utilization etch process stated, the ultra-thin heat conducting element of described bending at least includes not one
In individual plane first and second.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620243163.7U CN205488103U (en) | 2016-03-28 | 2016-03-28 | Ultra -thin heat conduction component of application etch process and ultra -thin heat conduction component of buckling |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201620243163.7U CN205488103U (en) | 2016-03-28 | 2016-03-28 | Ultra -thin heat conduction component of application etch process and ultra -thin heat conduction component of buckling |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN205488103U true CN205488103U (en) | 2016-08-17 |
Family
ID=56648696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201620243163.7U Expired - Fee Related CN205488103U (en) | 2016-03-28 | 2016-03-28 | Ultra -thin heat conduction component of application etch process and ultra -thin heat conduction component of buckling |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN205488103U (en) |
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109443060A (en) * | 2018-09-25 | 2019-03-08 | 广东工业大学 | A kind of ultra-thin panel heat pipe and its manufacturing process |
| CN110645815A (en) * | 2019-09-29 | 2020-01-03 | 联想(北京)有限公司 | Vapor chamber and preparation method thereof |
| CN111432598A (en) * | 2020-03-04 | 2020-07-17 | Oppo广东移动通信有限公司 | Shell assembly of electronic equipment and electronic equipment |
| CN111465273A (en) * | 2020-04-21 | 2020-07-28 | 昆山弗莱吉电子科技有限公司 | Production process of mobile phone heat dissipation plate |
| CN113212250A (en) * | 2020-01-21 | 2021-08-06 | 广州力及热管理科技有限公司 | Large-area ultra-thin temperature-equalizing plate element and manufacturing method thereof |
| TWI738179B (en) * | 2019-01-18 | 2021-09-01 | 李克勤 | Thin heat dissipation device and manufacturing method thereof |
| CN114459268A (en) * | 2020-11-09 | 2022-05-10 | 欣兴电子股份有限公司 | Soaking plate structure and manufacturing method thereof |
-
2016
- 2016-03-28 CN CN201620243163.7U patent/CN205488103U/en not_active Expired - Fee Related
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN109443060A (en) * | 2018-09-25 | 2019-03-08 | 广东工业大学 | A kind of ultra-thin panel heat pipe and its manufacturing process |
| TWI738179B (en) * | 2019-01-18 | 2021-09-01 | 李克勤 | Thin heat dissipation device and manufacturing method thereof |
| CN110645815A (en) * | 2019-09-29 | 2020-01-03 | 联想(北京)有限公司 | Vapor chamber and preparation method thereof |
| CN113212250A (en) * | 2020-01-21 | 2021-08-06 | 广州力及热管理科技有限公司 | Large-area ultra-thin temperature-equalizing plate element and manufacturing method thereof |
| CN111432598A (en) * | 2020-03-04 | 2020-07-17 | Oppo广东移动通信有限公司 | Shell assembly of electronic equipment and electronic equipment |
| CN111465273A (en) * | 2020-04-21 | 2020-07-28 | 昆山弗莱吉电子科技有限公司 | Production process of mobile phone heat dissipation plate |
| CN111465273B (en) * | 2020-04-21 | 2022-08-30 | 昆山弗莱吉电子科技有限公司 | Production process of mobile phone heat dissipation plate |
| CN114459268A (en) * | 2020-11-09 | 2022-05-10 | 欣兴电子股份有限公司 | Soaking plate structure and manufacturing method thereof |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN205488103U (en) | Ultra -thin heat conduction component of application etch process and ultra -thin heat conduction component of buckling | |
| TWI236870B (en) | Heat dissipation apparatus with microstructure layer and manufacture method thereof | |
| TWI601933B (en) | Heat-conducting structure | |
| CN106794656B (en) | Vacuum reinforced radiator | |
| CN102760709B (en) | Loop heat pipe structure | |
| TW201248110A (en) | Electronic device | |
| CN205488104U (en) | Ultra -thin heat conduction component and ultra -thin heat conduction component of buckling | |
| CN201844724U (en) | Flat-plate soaking plate | |
| TW201248109A (en) | Electronic equipment | |
| TWI701992B (en) | Temperature-uniformizing board | |
| WO2016127579A1 (en) | Heat radiation shielding device and terminal | |
| CN211429852U (en) | Heat dissipation plate and electronic device with same | |
| EP4333580A1 (en) | Heat dissipation member and electronic device | |
| TW201537336A (en) | Electrical device having thermal isolation effect | |
| TW200532158A (en) | Heat-dissipating module | |
| CN115597412A (en) | Loop heat pipe | |
| CN203206599U (en) | Casing structure of hand-held device | |
| TWM517812U (en) | Vapor chamber and upper shell member thereof | |
| WO2021244448A1 (en) | Vapor chamber and electronic device | |
| CN213343091U (en) | Temperature equalization plate and electronic equipment | |
| CN207852661U (en) | Hand-hold communication device and its thin heat radiation structure | |
| WO2016095507A1 (en) | Heat dissipation device, circuit board, and terminal | |
| TWI533791B (en) | Handheld communication apparatus and thin heat-dissipating structure thereof | |
| CN113950232B (en) | Manufacturing method of heat conduction device, heat conduction device and terminal equipment | |
| CN108601286B (en) | Electronic device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| C14 | Grant of patent or utility model | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20160817 Termination date: 20200328 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |