CN111465273B - Production process of mobile phone heat dissipation plate - Google Patents
Production process of mobile phone heat dissipation plate Download PDFInfo
- Publication number
- CN111465273B CN111465273B CN202010318401.7A CN202010318401A CN111465273B CN 111465273 B CN111465273 B CN 111465273B CN 202010318401 A CN202010318401 A CN 202010318401A CN 111465273 B CN111465273 B CN 111465273B
- Authority
- CN
- China
- Prior art keywords
- plate
- developing
- heat dissipation
- edges
- cutting
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/20—Modifications to facilitate cooling, ventilating, or heating
- H05K7/2039—Modifications to facilitate cooling, ventilating, or heating characterised by the heat transfer by conduction from the heat generating element to a dissipating body
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/26—Processing photosensitive materials; Apparatus therefor
Abstract
The invention discloses a production process of a mobile phone heat dissipation plate, which comprises the steps of firstly establishing a developing plate type, arranging a plurality of developing areas, wherein two rows of plates in the developing areas are in a 180-degree complementary structure, and the second edges of L-shaped copper plate main bodies in any row of plates are arranged in a collinear manner; then carrying out development and etching operation, then carrying out double-row cutting on the development area, cutting second edges of a plurality of L-shaped copper plate main bodies on the plate into a whole in a linear connection mode, and cutting and forming a first edge; and then synchronously bending and forming the first edges, and finally synchronously punching and cutting the second edges. The invention can realize the production molding of the specific mobile phone heat dissipation plate, meet the high-precision molding requirement of the plate-shaped structure main body through the developing and etching process, simultaneously meet the requirement of continuous synchronous bending by utilizing the ingenious developing type design, and improve the uniformity of the finished product. The mobile phone heat dissipation plate can meet the heat dissipation requirement of electronic equipment with height difference power consumption elements, and is high in bonding stability and matching degree with the power consumption elements.
Description
Technical Field
The invention relates to a production process of a mobile phone heat dissipation plate, and belongs to the technical field of heat dissipation plate production processes.
Background
VC (vapor chambers) direct-translation is called a steam chamber, and is generally called a temperature equalizing plate, a heat equalizing plate and a temperature equalizing heat radiating plate in the industry. With the increasing of chip power density, VC has been widely used in heat dissipation of high power consumption devices such as CPU, NP, ASIC, etc.
Electronic equipment such as mobile phones and notebook computers are designed to be thinner and thinner, so that the heat dissipation requirement on internal power consumption devices is higher and higher, the heat dissipation parts such as the heat dissipation pipes cannot meet the ultra-thin design requirement, and the heat dissipation requirement of the common heat dissipation copper plate is difficult to meet, so that the design of the VC temperature equalization plate is realized.
VC samming board closes sealed formation vacuum chamber by two-layer metal sheet lid, possesses netted filling layer in it to the vacuum filling has coolant, among the prior art, the metal soleplate of VC samming board is planar structure, and has a large amount of looks interval power consumption devices that set up among the electronic equipment, in order to laminate mutually with VC samming board, need carry out the parallel and level design with the top surface of power consumption device, so, increased design cost, and there is higher requirement to the assembly precision. The bottom plate of the VC temperature-uniforming plate is made into a bent structure, so that great difficulty exists, the size of the single plate is small, the etching operation is complicated, the single plate is bent, the shape is uniform, and the later-stage assembly of the VC temperature-uniforming plate is influenced.
Disclosure of Invention
The invention aims to innovatively provide a production process of a VC (polyvinyl chloride) vapor chamber.
In order to achieve the purpose, the technical scheme adopted by the invention is as follows:
the production process of the mobile phone heat dissipation plate comprises an L-shaped copper plate main body formed by a first edge and a second edge, wherein the L-shaped copper plate main body is provided with a sinking cavity, a plurality of raised heat dissipation columns are arranged in the sinking cavity, the first edge is a bent plate body with a bending section,
the production process comprises the following steps:
s1, establishing a developing plate type, and arranging a plurality of developing areas which are uniformly arranged at intervals along the direction of the copper plate coil, wherein each developing area comprises two rows of plates which are arranged perpendicular to the direction of the copper plate coil, the two rows of plates are of a 180-degree complementary structure, the second edges of the L-shaped copper plate main bodies in any row of plates are arranged in a collinear manner, and the developing areas are positioned by aiming at a plurality of linear holes in the collinear manner;
s2 developing operation, developing the developing plate on the copper plate coil stock by screen printing or exposure;
s3, etching, namely forming the sinking cavity and the raised heat dissipation column in an etching mode;
s4, cutting, namely performing double-row cutting on the developing area to obtain two rows of cut plates, linearly connecting second edge lines of a plurality of L-shaped copper plate main bodies on the cut plates into a whole, and cutting and molding the first edges;
s5, bending, fixing a plurality of second edges which are linearly connected into a whole, and synchronously bending and forming the plurality of first edges to form a semi-finished cut plate;
and S6, cutting the finished product, and synchronously punching and cutting a plurality of second edges of the semi-finished cut plate to obtain the finished product.
Preferably, in step S2, the plate material of the copper plate coil stock is cleaned, dried, and a bottom protective film is coated.
Preferably, in step S2, the developing is performed by film exposure.
Preferably, the thickness of the copper plate coil stock is 0.4-0.5 mm, and the depth of the sinking cavity is 0.2mm +/-0.01 mm.
Preferably, the first edge includes a connecting plate portion connected to the second edge, a parallel plate portion parallel to the connecting plate portion and having a height difference, and an inclined plate portion located between the connecting plate portion and the parallel plate portion.
Preferably, a connection R angle is provided between each of the inclined plate portion and the parallel plate portion and between each of the connection plate portions, and a diameter of the connection R angle is at least 2 times a thickness of the copper plate.
The invention has the following beneficial effects:
1. the production molding of specific cell-phone heating panel can be realized, the high-accuracy shaping demand of platelike structure main part is satisfied through the technology of development etching, utilizes ingenious development version type design simultaneously, satisfies the synchronous demand of buckling of arranging in succession, improves finished product unity, easily equipment, and the product percent of pass is higher.
2. The mobile phone heat dissipation plate can meet the heat dissipation requirement of electronic equipment with height difference power consumption elements, and is high in bonding stability and matching degree with the power consumption elements.
3. The method is easy for batch production, reduces the production cost and improves the production efficiency.
Drawings
Fig. 1 is a schematic structural diagram of a heat dissipation plate of a mobile phone according to the present invention.
Fig. 2 is a schematic view of the structure of the copper plate after etching in the production process of the present invention.
FIG. 3 is a schematic structural diagram of a cut sheet in the production process of the present invention.
Detailed Description
The invention provides a production process of a mobile phone heat dissipation plate. The technical solution of the present invention is described in detail below with reference to the accompanying drawings so that it can be more easily understood and appreciated.
Production technology of cell-phone heating panel, as shown in fig. 1, the cell-phone heating panel includes the L type copper main part that is formed by first border 1 and second border 2, and L type copper main part possesses heavy chamber 3, is equipped with a plurality of protruding heat dissipation posts 4 in the heavy chamber 3, and first border 1 is for possessing the bent plate body of tortuous section.
Specifically, the heat dissipation plate of the mobile phone in the present application is a bottom plate of a conventional VC balanced heat dissipation plate, and the conventional VC balanced heat dissipation plate is in a flat plate shape and includes a bottom plate, a cover plate, and a filler net layer. The process aims to manufacture the heat dissipation plate body with the bending part, and meets the bonding requirements of power consumption elements with different height differences.
In the prior art, a general zigzag material can be formed by punching, but the thickness of a mobile phone heat dissipation plate is only 0.4-0.5 mm, and the depth of an inner sinking cavity is 0.2mm +/-0.01 mm. The traditional punch forming process cannot meet the high-precision machining requirement.
The production process of the scheme is explained in detail and comprises the following steps:
as shown in fig. 2, establish the development version type, set up the development district 5 of a plurality of even interval arrangements along copper book of material direction, development district 5 includes two ranks of perpendicular to copper book of material direction setting, and two ranks of board are 180 complementary structures, and the second edgewise 2 collineation setting of the L type copper main part in arbitrary rank of board is arranged to the development district possesses to collineation a plurality of linear hole location 6.
The developing operation is to perform development of a developing plate pattern on the copper plate coil material by screen printing or exposure, and it should be noted that, before the developing operation, the plate material of the copper plate coil material is firstly cleaned, dried and coated with a bottom protective film.
Specifically, the VC balanced heat dissipation plate requires a smooth plate surface, so that a protective film is adopted to protect a non-etched surface, and the situation that the bottom plate is corroded in the etching process to influence the plate surface quality is prevented.
The development generally comprises two modes of screen printing and exposure, and because the internal design of the scheme is compact, the development is generally carried out by adopting a film exposure mode, and multiple exposure of double film films can be adopted, so that the development precision is improved.
Etching operation, the shaping of heavy chamber and protruding heat dissipation post is carried out through the mode of etching, and etching process belongs to prior art, consequently does not prescribe a limit to etching solution and etching process parameter, only need satisfy the shaping tolerance of heavy chamber and protruding heat dissipation post can.
The scheme is characterized in that cutting is performed, namely, the developing area is subjected to double-row cutting to obtain two rows of cutting plates shown in the figure 3, the second edges of a plurality of L-shaped copper plate main bodies on the cutting plates are linearly connected into a whole, and the first edges are cut and formed.
Namely, a plurality of single-row L-shaped copper plate main bodies can be connected into a whole by cutting, and the first edge precision cutting is realized. By using the plurality of linear hole positioning 6 as a reference, the cutting precision of the first edge can be improved, and the uniformity of the plurality of first edges is met.
When the bending operation is carried out, the plurality of second edges 2 which are linearly connected into a whole are fixed, and the plurality of first edges 1 are synchronously bent and formed to form a semi-finished product cutting plate.
The linear integrated second edge 2 is fixed, so that the first edges can be kept parallel, and the first edges 1 are kept consistent in height when being synchronously bent.
And finally, cutting the finished product, and synchronously punching and cutting a plurality of second edges of the semi-finished product cut plate to obtain the finished product. The punching uses the excess material as a fixing part, and precisely cuts the second edge 2 connected with the excess material, thereby obtaining a finished product.
In the present case, the finished product can carry out the heavy chamber spraying and handle, evenly sprays corrosion resistance coating in the heavy chamber to can reduce the cooling medium to the corruption in heavy chamber, improve the life of heating panel.
In one embodiment, the first edge 1 comprises a web portion 11 connected to the second edge 2, a parallel plate portion 12 parallel to the web portion 11 and having a height difference, and an inclined plate portion 13 between the web portion and the parallel plate portion. A connection R corner 14 is provided between the inclined plate part 13 and the parallel plate part and between the inclined plate part and the connection plate part, and the diameter of the connection R corner 14 is at least 2 times of the thickness of the copper plate.
Specifically, the second rim 2, the connecting plate portion 11, and the parallel plate portion 12 are used for bonding with the power consumption element, and the inclined plate portion 13 is used for height difference compensation as a continuation of the internal cavity. Because there is protruding heat dissipation post 4 in the heavy intracavity, and the later stage needs splice with the roof, consequently require L type copper main part tortuous back need keep the heavy intracavity outer along possessing certain ground roughness, and the protruding heat dissipation post 4 of wall the butt of buckling appears, connect the design of R angle 14, can satisfy above-mentioned demand.
Through the above description, it can be found that the production process of the mobile phone heat dissipation plate can realize the production molding of the specific mobile phone heat dissipation plate, the high-precision molding requirement of the plate-shaped structure main body is met through the developing and etching process, meanwhile, the continuous synchronous bending requirement is met by utilizing the ingenious developing type design, the uniformity of the finished product is improved, the assembly is easy, and the product percent of pass is high. The mobile phone heat dissipation plate can meet the heat dissipation requirement of electronic equipment with height difference power consumption elements, and is high in bonding stability and matching degree with the power consumption elements. The method is easy for batch production, reduces the production cost and improves the production efficiency.
While the technical solutions of the present invention have been fully described above, it should be noted that the embodiments of the present invention are not limited by the above description, and all technical solutions formed by equivalent or equivalent changes in structure, method, or function according to the spirit of the present invention by those skilled in the art are within the scope of the present invention.
Claims (6)
1. Production technology of cell-phone heating panel, its characterized in that:
the mobile phone heat dissipation plate comprises an L-shaped copper plate main body formed by a first edge and a second edge, the L-shaped copper plate main body is provided with a sinking cavity, a plurality of raised heat dissipation columns are arranged in the sinking cavity, the first edge is a bent plate body with a bent section,
the production process comprises the following steps:
s1, establishing a developing plate type, arranging a plurality of developing areas which are uniformly arranged at intervals along the direction of a copper plate material coil, wherein each developing area comprises two rows of plates which are arranged perpendicular to the direction of the copper plate material coil, the two rows of plates are in a 180-degree complementary structure, the second edges of the L-shaped copper plate main bodies in any row of the plates are arranged in a collinear manner, and the developing areas are positioned by aiming at a plurality of linear holes which are in the collinear manner;
s2 developing operation, namely developing the developing plate type on the copper plate coil stock in a screen printing or exposure mode;
s3, etching, namely forming the sinking cavity and the raised heat dissipation column in an etching mode;
s4, cutting, namely performing double-row cutting on the developing area to obtain two rows of cut plates, linearly connecting second edge lines of a plurality of L-shaped copper plate main bodies on the cut plates into a whole, and cutting and molding the first edges;
s5, bending, fixing a plurality of second edges which are linearly connected into a whole, and synchronously bending and forming the plurality of first edges to form a semi-finished cut plate;
and S6, cutting the finished product, and synchronously punching and cutting a plurality of second edges of the semi-finished cut plate to obtain the finished product.
2. The process for producing a radiating plate for a cellular phone according to claim 1, wherein:
in step S2, the sheet material of the copper plate coil stock is cleaned, dried, and coated with a bottom protective film.
3. The process for producing a heat dissipating plate for a cellular phone according to claim 1, wherein:
in step S2, development is performed by film exposure.
4. The process for producing a radiating plate for a cellular phone according to claim 1, wherein:
the thickness of the copper plate coil stock is 0.4-0.5 mm, and the depth of the sinking cavity is 0.2mm +/-0.01 mm.
5. The process for producing a radiating plate for a cellular phone according to claim 4, wherein:
the first edge includes a connecting plate portion connected to the second edge, a parallel plate portion parallel to the connecting plate portion and having a height difference, and an inclined plate portion located between the connecting plate portion and the parallel plate portion.
6. The process for producing a radiating plate of a cellular phone according to claim 5, wherein:
and connecting R angles are respectively arranged between the inclined plate part and the parallel plate part and between the inclined plate part and the connecting plate part, and the diameter of each connecting R angle is at least 2 times of the thickness of the copper plate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010318401.7A CN111465273B (en) | 2020-04-21 | 2020-04-21 | Production process of mobile phone heat dissipation plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202010318401.7A CN111465273B (en) | 2020-04-21 | 2020-04-21 | Production process of mobile phone heat dissipation plate |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| CN111465273A CN111465273A (en) | 2020-07-28 |
| CN111465273B true CN111465273B (en) | 2022-08-30 |
Family
ID=71679581
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202010318401.7A Active CN111465273B (en) | 2020-04-21 | 2020-04-21 | Production process of mobile phone heat dissipation plate |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN111465273B (en) |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1798495A (en) * | 2004-12-22 | 2006-07-05 | 珍通科技股份有限公司 | Temperature equalization plate, and fabricating method |
| CN205488103U (en) * | 2016-03-28 | 2016-08-17 | 深圳市智通电子有限公司 | Ultra -thin heat conduction component of application etch process and ultra -thin heat conduction component of buckling |
| WO2017124754A1 (en) * | 2016-01-22 | 2017-07-27 | 华南师范大学 | Ultrathin soaking plate and manufacturing method thereof |
| CN107877108A (en) * | 2017-12-05 | 2018-04-06 | 扬州华盟电子有限公司 | A kind of heat dissipation metal module and preparation method thereof |
-
2020
- 2020-04-21 CN CN202010318401.7A patent/CN111465273B/en active Active
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1798495A (en) * | 2004-12-22 | 2006-07-05 | 珍通科技股份有限公司 | Temperature equalization plate, and fabricating method |
| WO2017124754A1 (en) * | 2016-01-22 | 2017-07-27 | 华南师范大学 | Ultrathin soaking plate and manufacturing method thereof |
| CN205488103U (en) * | 2016-03-28 | 2016-08-17 | 深圳市智通电子有限公司 | Ultra -thin heat conduction component of application etch process and ultra -thin heat conduction component of buckling |
| CN107877108A (en) * | 2017-12-05 | 2018-04-06 | 扬州华盟电子有限公司 | A kind of heat dissipation metal module and preparation method thereof |
Also Published As
| Publication number | Publication date |
|---|---|
| CN111465273A (en) | 2020-07-28 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN101668389B (en) | Method for making high alignment printed circuit board | |
| US20190249938A1 (en) | Vapor chamber with support structure and manufacturing method therefor | |
| US20110099779A1 (en) | Method of manufacturing capacitor-embedded PCB | |
| CN114727473B (en) | PCB with high heat dissipation structure and processing method thereof | |
| CN111465273B (en) | Production process of mobile phone heat dissipation plate | |
| CN108391368B (en) | Manufacturing method of copper-embedded block plate | |
| CN105704914A (en) | Thick copper plate for different types of circuit boards and production method for circuit board | |
| CN111565523A (en) | Manufacturing method of second-order copper block-buried circuit board | |
| CN112533355A (en) | PCB with embedded copper block and manufacturing method thereof | |
| US20160349796A1 (en) | Etched multi-layer sheets | |
| US20080174969A1 (en) | Printed Board Assembly With Improved Heat Dissipation | |
| US20150044424A1 (en) | Bottom electrode and manufacturing method thereof | |
| CN105916291A (en) | Method for manufacturing high-density interconnected printed circuit board | |
| CN115064065A (en) | Display device | |
| CN108990262B (en) | Manufacturing process of double-sided thick copper circuit board | |
| CN114016030A (en) | Processing technology of ultrathin VC copper sheet heat dissipation plate for 5G mobile phone | |
| CN218066058U (en) | Liquid absorption core structure formed by etching and composite sintering | |
| CN111733381A (en) | Mask frame, manufacturing method thereof and mask assembly | |
| CN212138172U (en) | Mobile phone heat dissipation plate | |
| CN213515206U (en) | Novel capillary structure for vapor chamber and novel vapor chamber | |
| CN213026290U (en) | Battery and electronic device | |
| CN213547932U (en) | Auxiliary frame plate for flexible circuit board production | |
| CN220144390U (en) | Rectangular array 5G antenna element shaping tool | |
| JP7432832B2 (en) | Method for manufacturing fuel cell stack and method for manufacturing bonded separator | |
| CN210406041U (en) | Radiator and electronic equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| PB01 | Publication | ||
| PB01 | Publication | ||
| SE01 | Entry into force of request for substantive examination | ||
| SE01 | Entry into force of request for substantive examination | ||
| GR01 | Patent grant | ||
| GR01 | Patent grant |