CN212138172U

CN212138172U - Mobile phone heat dissipation plate

Info

Publication number: CN212138172U
Application number: CN202020604011.1U
Authority: CN
Inventors: 吴辉旺; 李军
Original assignee: Kunshan Folaiji Electron Technology Co ltd
Current assignee: Kunshan Folaiji Electron Technology Co ltd
Priority date: 2020-04-21
Filing date: 2020-04-21
Publication date: 2020-12-11
Anticipated expiration: 2030-04-21

Abstract

The utility model discloses a mobile phone heating panel, including the panel main part, the panel main part is equipped with heavy chamber, reaches the vacuum channel who extends by heavy chamber, is equipped with a plurality of protruding stands in the heavy chamber, is equipped with a plurality of laminating boards that are used for laminating mutually with the consumption component one-to-one in the panel main part, has the difference in height between two at least laminating boards to be equipped with the slope board between the adjacent laminating board that has the difference in height. The utility model discloses possessing the design of laminating board that has the difference in height, satisfying the laminating heat dissipation demand that there is the difference in height in the electronic equipment power dissipation component, need not to carry on high design such as power dissipation component, reduced design cost and equipment cost. By adopting the design of the convex column matrix, the targeted heat conduction effect can be realized, the high-efficiency heat conduction requirement of the part opposite to the power consumption element is met, and the heat dissipation is more uniform and stable. Through the design of L type panel main part, satisfy specific electronic equipment's consumption component demand of arranging, the pertinence is stronger, and the laminating is more reliable stable.

Description

Mobile phone heat dissipation plate

Technical Field

The utility model relates to a mobile phone heating panel belongs to the technical field of VC constant temperature heat dissipation base plate.

Background

VC (vapor chambers) is called steam chamber, which is commonly called as vapor chamber, vapor chamber and vapor cooling plate in the industry. With the increasing of chip power density, VC has been widely used in heat dissipation of high power consumption devices such as CPU, NP, ASIC, etc.

Electronic equipment such as mobile phones and notebook computers are designed to be thinner and thinner, so that the heat dissipation requirement on internal power consumption devices is higher and higher, the heat dissipation parts such as the heat dissipation pipes cannot meet the ultra-thin design requirement, and the heat dissipation requirement of the common heat dissipation copper plate is difficult to meet, so that the design of the VC temperature equalization plate is realized.

VC samming board closes sealed formation vacuum chamber by two-layer metal sheet lid, possesses netted filling layer in it to the vacuum filling has coolant, among the prior art, the metal soleplate of VC samming board is planar structure, and has a large amount of looks interval power consumption devices that set up among the electronic equipment, in order to laminate mutually with VC samming board, need carry out the parallel and level design with the top surface of power consumption device, so, increased design cost, and there is higher requirement to the assembly precision.

SUMMERY OF THE UTILITY MODEL

The utility model aims at solving the not enough of above-mentioned prior art, for the laminating problem that planar structure can't satisfy uneven consumption device to traditional VC samming board, provide a cell-phone heating panel.

In order to achieve the above purpose, the utility model discloses the technical scheme who adopts is:

a mobile phone heat dissipation plate is used for being attached to power dissipation elements of electronic equipment, a plurality of power dissipation elements with height difference are arranged in the electronic equipment, the mobile phone heat dissipation plate comprises a plate main body, the plate main body is provided with a sinking cavity and a vacuum channel extending from the sinking cavity, a plurality of protruding upright posts are arranged in the sinking cavity,

the plate main body is provided with a plurality of laminating plate parts which are used for being laminated with power consumption elements in a one-to-one correspondence mode, at least two of the laminating plate parts are different in height, and the laminating plate parts are adjacent to each other in height.

Preferably, a convex column matrix formed by a plurality of convex columns is arranged on any attaching plate part.

Preferably, the protruding upright post and the convex post are respectively cylinders, and the diameter of the convex post is smaller than that of the protruding upright post.

Preferably, the plate main body is an L-shaped plate body, the L-shaped plate body comprises a first extension plate, a second extension plate and an arc-shaped transition plate positioned between the first extension plate and the second extension plate,

the first extension plate, the second extension plate and the arc transition plate are respectively provided with at least one joint plate part.

Preferably, the first extension plate is provided with a first joint plate part and a second joint plate part, the arc transition plate is provided with a third joint plate part, the second extension plate is provided with a fourth joint plate part,

first laminating board with vacuum channel links to each other, first laminating board with be equipped with first slope board between the second laminating board, second laminating board with the transition plate is crossed to the arc is equipped with second slope board between, the transition plate is crossed to the arc with be equipped with the third slope board between the fourth laminating board.

Preferably, the plate main body is a copper plate.

Preferably, the plate body is an etched copper plate.

Preferably, the thickness of the copper plate is 0.4-0.6 mm, and the depth of the sinking cavity is 0.2-0.25 mm.

The beneficial effects of the utility model are mainly embodied in that:

1. possess the design of laminating board portion that has the difference in height, satisfy among the electronic equipment power consumption component and have the laminating heat dissipation demand of difference in height, need not to carry out high design such as power consumption component, reduced design cost and assembly cost.

2. By adopting the design of the convex column matrix, the targeted heat conduction effect can be realized, the high-efficiency heat conduction requirement of the part opposite to the power consumption element is met, and the heat dissipation is more uniform and stable.

3. Through the design of L type panel main part, satisfy specific electronic equipment's consumption component demand of arranging, the pertinence is stronger, and the laminating is more reliable stable.

4. The mode that adopts copper and etching to combine together for the panel main part satisfies current electronic equipment's ultra-thin design demand.

Drawings

Fig. 1 is a schematic structural diagram of a heat dissipating plate of a mobile phone according to the present invention.

Fig. 2 is a schematic side view of the heat dissipating plate of the mobile phone of the present invention.

Detailed Description

The utility model provides a mobile phone heat dissipation plate. The technical solution of the present invention will be described in detail below with reference to the accompanying drawings so as to be easier to understand and grasp.

A heat dissipation plate for a mobile phone is used for being attached to a power consumption element of an electronic device as shown in figures 1 and 2, and the electronic device is internally provided with a plurality of power consumption elements with different heights.

The mobile phone heat dissipation plate comprises a plate body 1, wherein the plate body 1 is provided with a sinking cavity 2 and a vacuum channel 3 extending from the sinking cavity 2, and a plurality of protruding upright posts 4 are arranged in the sinking cavity 2. The plate main body 1 and the cover plate are matched to form a sealed cavity, a filling net layer is arranged in the sealed cavity, and a cooling medium is injected after vacuum pumping is carried out through a vacuum channel.

In the present case, be equipped with a plurality of laminating board portions 5 that are used for laminating with the consumption component one-to-one on the panel main part 1, there is the difference in height between two at least laminating board portions 5 to be equipped with slope board portion 6 between the adjacent laminating board portion 5 that has the difference in height.

Specifically, as shown in fig. 2, when the mobile phone heat sink is mounted, the bonding plate portions 5 designed to have different height differences can be bonded to power consumption elements having different height differences, so that the requirement of contact heat dissipation is met, the power consumption elements do not need to be designed to have the same height, and the design cost and the element cost are saved. And the inclined plate portion 6 is used for compensating for the height difference communication.

In one embodiment, any of the attaching plate portions 5 is provided with a convex column matrix formed by a plurality of convex columns 7. The convex column matrix is mainly used for concentrating the heat dissipation requirement of the part and improving the local heat dissipation effect.

Specifically, the protruding columns 4 and the protruding columns 7 are cylinders respectively, and the diameter of the protruding columns 7 is smaller than that of the protruding columns 4.

That is, the raised columns 4 are used for the overall uniform heat conduction of the plate main body 1, and the convex columns 7 are used for the concentrated heat conduction at local positions, in the specific design, the diameter of the convex columns 7 is generally not more than 1/2 of the raised columns 4, that is, a relatively dense convex column matrix is formed in a limited space, so that the requirement of the local concentrated heat conduction is met.

In one embodiment, the sheet material main body 1 is an L-shaped sheet body, and the L-shaped sheet body includes a first extension sheet 11, a second extension sheet 12, and an arc-shaped transition sheet 13 located between the first extension sheet 11 and the second extension sheet 12.

The first extension plate 11, the second extension plate 12 and the arc transition plate 13 are respectively provided with at least one joint plate part 5.

Through the three-section design, the requirement of arranging specific power consumption elements is met, and the full-laminating requirement of the power consumption elements with the altitude difference of L-shaped linear arrangement is met.

In a more specific embodiment, the first extension board 11 is provided with a first attaching board portion 51 and a second attaching board portion 52, the arc-shaped transition board 13 is provided with a third attaching board portion 53, and the second extension board 12 is provided with a fourth attaching board portion 54.

The first bonding plate portion 51 is connected to the vacuum passage 3, a first inclined plate portion 61 is provided between the first bonding plate portion 51 and the second bonding plate portion 52, a second inclined plate portion 62 is provided between the second bonding plate portion 52 and the arc-shaped transition plate 13, and a third inclined plate portion 63 is provided between the arc-shaped transition plate 13 and the fourth bonding plate portion 54.

The specific arrangement mode meets the power consumption element arrangement, fitting and heat dissipation requirements of specific electronic equipment.

In the scheme, the plate main body 1 is a copper plate. The plate main body 1 is an etched copper plate. The thickness of the copper plate is 0.4-0.6 mm, and the depth of the sinking cavity is 0.2-0.25 mm.

The ultra-thin design is adopted, and the ultra-thin copper plate is formed through an etching process, so that the requirement of forming and processing the ultra-thin copper plate is met.

Can discover through the above description, the utility model relates to a cell-phone heating panel possesses the design of laminating board that has the difference in height, satisfies among the electronic equipment power consumption component and has the laminating heat dissipation demand of difference in height, need not to carry on high design such as power consumption component, has reduced design cost and equipment cost. By adopting the design of the convex column matrix, the targeted heat conduction effect can be realized, the high-efficiency heat conduction requirement of the part opposite to the power consumption element is met, and the heat dissipation is more uniform and stable. Through the design of L type panel main part, satisfy specific electronic equipment's consumption component demand of arranging, the pertinence is stronger, and the laminating is more reliable stable. The mode that adopts copper and etching to combine together for the panel main part satisfies current electronic equipment's ultra-thin design demand.

The above technical solutions of the present invention have been fully described, and it should be noted that the present invention is not limited by the above description, and all technical solutions formed by equivalent transformation or equivalent transformation adopted by the spirit of the present invention in the aspects of structure, method or function by those of ordinary skill in the art all fall within the protection scope of the present invention.

Claims

1. The utility model provides a cell-phone heating panel for the laminating is equipped with a plurality of power consumption components that have the difference in height in electronic equipment on electronic equipment's power consumption component, its characterized in that:

the mobile phone heat dissipation plate comprises a plate main body, the plate main body is provided with a sinking cavity and a vacuum channel extending from the sinking cavity, a plurality of protruding upright posts are arranged in the sinking cavity,

2. The heat dissipating plate for a cellular phone according to claim 1, wherein:

and a convex column matrix formed by a plurality of convex columns is arranged on the arbitrary attaching plate part.

3. The heat dissipating plate for cellular phone of claim 2, wherein:

the convex columns and the convex columns are respectively cylinders, and the diameters of the convex columns are smaller than those of the convex columns.

4. The heat dissipating plate for a cellular phone according to claim 1, wherein:

the plate main body is an L-shaped plate body which comprises a first extension plate, a second extension plate and an arc transition plate positioned between the first extension plate and the second extension plate,

5. The heat dissipating plate for cellular phone of claim 4, wherein:

the first extending plate is provided with a first attaching plate part and a second attaching plate part, the arc-shaped transition plate is provided with a third attaching plate part, the second extending plate is provided with a fourth attaching plate part,

6. The heat dissipating plate for a cellular phone according to claim 1, wherein:

the plate main body is a copper plate.

7. The heat dissipating plate for cellular phone of claim 6, wherein:

the plate main body is an etched copper plate.

8. The heat dissipating plate for cellular phone of claim 6, wherein:

the thickness of the copper plate is 0.4-0.6 mm, and the depth of the sinking cavity is 0.2-0.25 mm.