CN212380417U

CN212380417U - IGBT substrate with strong ventilation

Info

Publication number: CN212380417U
Application number: CN202021588914.1U
Authority: CN
Inventors: 邓泽龙; 冯小平; 许新星
Original assignee: Suzhou Guishi Technology Co ltd
Current assignee: Suzhou Guishi Technology Co ltd
Priority date: 2020-08-04
Filing date: 2020-08-04
Publication date: 2021-01-19
Anticipated expiration: 2030-08-04

Abstract

The utility model discloses an IGBT substrate with strong ventilation, which comprises a shell, wherein the top of the shell is fixedly connected with an insulating plate, the top of the insulating plate is movably connected with a main terminal, the front of the shell is fixedly connected with an auxiliary terminal, the edge of the front of the shell is provided with a first fixing hole, the inner cavity of the shell is provided with a substrate, the left wall of the substrate is provided with a water filling port, the inner cavity of the substrate is provided with a water cooling tank, the top of the substrate is provided with a vent, the port part of the vent is provided with a first heat dissipation net, the bottom of the substrate is provided with a second heat dissipation net, the edge of the top of the substrate is provided with a second fixing hole, the shell adopts a resin shell, the high temperature resistance can strengthen the hardness of an IGBT module, the hardness of the module can be increased, the water cooling tank arranged in, carry out water-cooling heat dissipation to the IGBT module, seted up the vent simultaneously at the top of base plate, can strengthen the air permeability of IGBT module.

Description

IGBT substrate with strong ventilation

Technical Field

The utility model relates to a IGBT base plate technical field specifically is a strong IGBT base plate of air permeability.

Background

The base plate is the basic material for manufacturing PCB, generally, the base plate is the copper clad laminate, the single-sided and double-sided printed boards are manufactured by selectively processing hole processing, chemical copper plating, electrolytic copper plating, etching and the like on the base plate material-the copper clad laminate to obtain the required circuit pattern, the other type of multilayer printed board is manufactured by using an inner core thin copper clad laminate as a base and alternately laminating and bonding a conductive pattern layer and a prepreg together through one-step lamination to form interconnection among more than 3 conductive pattern layers, and the IGBT base plate has the functions of conduction, insulation and support, mainly plays a role in cooling and heat dissipation, easily causes the phenomenon that the load charge of an IGBT circuit is too high to cause short circuit in the state of poor heat dissipation, and easily causes the reduction of the running efficiency of a machine body to influence the working progress.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a strong IGBT base plate of air permeability to solve the problem that proposes among the above-mentioned background art.

In order to achieve the above object, the utility model provides a following technical scheme: the utility model provides a high-ventilation IGBT substrate, includes the casing, the top fixedly connected with insulation board of casing, the top swing joint of insulation board has the main terminal, the positive fixedly connected with auxiliary terminal of casing, first fixed orifices has been seted up at the positive edge of casing, the base plate is installed to the inner chamber of casing, the water filling port has been seted up to the left wall of base plate, the water-cooling tank has been seted up to the inner chamber of base plate, the vent has been seted up at the top of base plate, first radiator-grid is installed to the port department of vent, the second radiator-grid is installed to the bottom of base plate, the second fixed orifices has been seted up at the edge at base plate top.

Preferably, the bottom of the first fixing hole is attached to the top of the second fixing hole.

Preferably, the water cooling tank is in a double H-shaped design, and an inner port of the water injection port is in through connection with the right wall of the water cooling tank.

Preferably, the vent hole penetrates through the inner cavity of the substrate and extends to the bottom of the substrate, and the bottom of the vent hole is connected with the inner cavity of the substrate in a penetrating manner.

Preferably, the first heat dissipation net and the second heat dissipation net are symmetrically distributed.

Preferably, the four walls of the base plate are movably connected with the inner cavity of the shell through nuts.

Compared with the prior art, the beneficial effects of the utility model are that:

1. this IGBT base plate that air permeability is strong, the casing adopts the resin shell, high temperature resistant hardness that can strengthen the IGBT module, can also increase module hardness simultaneously, it can be under the condition that does not influence base plate work to install the water-cooling tank at the inner chamber of base plate, carry out the water-cooling heat dissipation to the IGBT module, the vent has been seted up at the top of base plate simultaneously, the air permeability that can strengthen the IGBT module, under dual ventilation and radiating condition, the work efficiency of the enhancement IGBT that can the at utmost, in the IGBT module operation in-process, can produce more heat energy, in the water-cooling tank of two H shapes, pour into cold water through the water filling port, because cold water in the water-cooling tank can carry out the hydrologic cycle by the principle of expend heat and contract cold and can reach good cooling effect, the ventilation hole of seting up at the top of base plate can help the IGBT module to ventilate.

Drawings

FIG. 1 is a schematic structural view of the present invention;

FIG. 2 is a schematic view of the structural substrate of the present invention;

fig. 3 is a bottom view of the structure substrate of the present invention.

In the figure: the heat dissipation structure comprises a shell 1, an insulating plate 2, a main terminal 3, an auxiliary terminal 4, a first fixing hole 5, a base plate 6, a water injection port 7, a water cooling groove 8, a ventilation opening 9, a first heat dissipation net 10, a second heat dissipation net 11 and a second fixing hole 12.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-3, the present invention provides a technical solution: an IGBT substrate with strong ventilation performance comprises a shell 1, an insulating plate 2 is fixedly connected to the top of the shell 1, a main terminal 3 is movably connected to the top of the insulating plate 2, an auxiliary terminal 4 is fixedly connected to the front of the shell 1, a first fixing hole 5 is formed in the edge of the front of the shell 1, a substrate 6 is installed in an inner cavity of the shell 1, a water filling port 7 is formed in the left wall of the substrate 6, a water cooling groove 8 is formed in the inner cavity of the substrate 6, a ventilation port 9 is formed in the top of the substrate 6, a first heat dissipation net 10 is installed at the port of the ventilation port 9, a second heat dissipation net 11 is installed at the bottom of the substrate 6, a second fixing hole 12 is formed in the edge of the top of the substrate 6, the bottom of the first fixing hole 5 is attached to the top of the second fixing hole 12, the water cooling groove 8 is in a double-H shape, the inner port of the water filling port 7 is connected with, the bottom of the vent 9 is connected with the inner cavity of the substrate 6 in a penetrating way, the first heat dissipation net 10 and the second heat dissipation net 11 are symmetrically distributed, and the four walls of the substrate 6 are movably connected with the inner cavity of the shell 1 through nuts.

The working principle is as follows: in the IGBT module operation in-process, can produce more heat energy, in the water-cooling tank of two H shapes, pour into cold water through the water filling port, because cold water in the water-cooling tank can carry out hydrologic cycle by the principle of expend with heat and contract with cold and can reach good cooling effect, the ventilation hole of seting up at the top of base plate can help the IGBT module to ventilate, it takes place to reduce the too high phenomenon of carrying load, the casing adopts the resin casing, high temperature resistant hardness that can strengthen the IGBT module, simultaneously can also increase module hardness, it can be under the condition that does not influence base plate work to install the water-cooling tank at the inner chamber of base plate, carry out water-cooling heat dissipation to the IGBT module, the vent has been seted up at the top of base plate simultaneously, can strengthen the air permeability of IGBT module, under the dual ventilation and radiating circumstances.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a strong IGBT base plate of air permeability, includes casing (1), its characterized in that: the top fixedly connected with insulation board (2) of casing (1), the top swing joint of insulation board (2) has main terminal (3), positive fixedly connected with auxiliary terminal (4) of casing (1), first fixed orifices (5) have been seted up at the positive edge of casing (1), base plate (6) are installed to the inner chamber of casing (1), water filling port (7) have been seted up to the left wall of base plate (6), water-cooling tank (8) have been seted up to the inner chamber of base plate (6), vent (9) have been seted up at the top of base plate (6), first radiator-grid (10) are installed to the port department of vent (9), second radiator-grid (11) are installed to the bottom of base plate (6), second fixed orifices (12) have been seted up at the edge at base plate (6) top.

2. The IGBT substrate with strong ventilation property according to claim 1, characterized in that: the bottom of the first fixing hole (5) is attached to the top of the second fixing hole (12).

3. The IGBT substrate with strong ventilation property according to claim 1, characterized in that: the water cooling tank (8) is in a double H-shaped design, and the inner port of the water injection port (7) is in through connection with the right wall of the water cooling tank (8).

4. The IGBT substrate with strong ventilation property according to claim 1, characterized in that: the vent (9) penetrates through the inner cavity of the substrate (6) and extends to the bottom of the substrate (6), and the bottom of the vent (9) is connected with the inner cavity of the substrate (6) in a penetrating manner.

5. The IGBT substrate with strong ventilation property according to claim 1, characterized in that: the first heat dissipation net (10) and the second heat dissipation net (11) are symmetrically distributed.

6. The IGBT substrate with strong ventilation property according to claim 1, characterized in that: the four walls of the base plate (6) are movably connected with the inner cavity of the shell (1) through nuts.