CN210379021U - Battery protection board - Google Patents
Battery protection board Download PDFInfo
- Publication number
- CN210379021U CN210379021U CN201920868324.5U CN201920868324U CN210379021U CN 210379021 U CN210379021 U CN 210379021U CN 201920868324 U CN201920868324 U CN 201920868324U CN 210379021 U CN210379021 U CN 210379021U
- Authority
- CN
- China
- Prior art keywords
- radiating piece
- top surface
- heat dissipation
- battery protection
- chip
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model discloses a battery protection shield, including base plate and protection chip, be provided with the bottom radiating piece in the base plate, protection chip bottom surface is fixed on the bottom radiating piece, and protection chip top surface is fixed with the top radiating piece. The utility model discloses a set up the radiating piece at the upper and lower side of chip, upper and lower side radiating piece constitutes perpendicular heat conduction channel, under the prerequisite that need not increase too many costs and influence device volume, has realized the heat dissipation.
Description
Technical Field
The utility model relates to a battery protection shield belongs to the battery protection field.
Background
When overcharge or overcurrent occurs in a mobile phone or the like, a battery is heated, and an increase in the battery temperature inevitably leads to an increase in the temperature of a battery protection board (mainly, the temperature of a protection chip). The heat dissipation problem of the existing battery protection board is solved by increasing the number of layers of the PCB or increasing the area of the PCB. However, increasing the number of PCB layers increases the cost greatly, and increasing the PCB area is relatively more difficult due to the miniaturization requirement of the mobile device.
SUMMERY OF THE UTILITY MODEL
The utility model provides a battery protection shield has solved the above-mentioned problem that current battery protection shield heat dissipation exists.
In order to solve the technical problem, the utility model discloses the technical scheme who adopts is:
the utility model provides a battery protection shield, includes base plate and protection chip, is provided with lower radiating piece in the base plate, and protection chip bottom surface is fixed on lower radiating piece, and protection chip top surface is fixed with upper radiating piece.
The protection chip and the lower heat dissipation piece are fixed through insulating heat conduction glue.
The base plate is provided with a through hole, the lower heat radiating piece is embedded in the through hole, and the top surface and the bottom surface of the lower heat radiating piece are respectively flush with the top surface and the bottom surface of the base plate.
The lower radiating piece is a radiating copper block.
The protection chip is fixed with the upper heat dissipation part through insulating heat conduction glue.
The top surface of the substrate is provided with an encapsulating layer, and the top surface of the upper radiating piece is exposed through the encapsulating layer.
The top surface of the upper heat dissipation part is flush with the top surface of the encapsulating layer.
The upper heat dissipation piece is a heat dissipation silicon chip.
The utility model discloses the beneficial effect who reaches: the utility model discloses a set up the radiating piece at the upper and lower side of chip, upper and lower side radiating piece constitutes perpendicular heat conduction channel, under the prerequisite that need not increase too many costs and influence device volume, has realized the heat dissipation.
Drawings
Fig. 1 is a schematic structural diagram of the present invention.
Detailed Description
The present invention will be further described with reference to the accompanying drawings. The following examples are only for illustrating the technical solutions of the present invention more clearly, and the protection scope of the present invention is not limited thereby.
As shown in fig. 1, a battery protection board includes a substrate 1 (i.e., a PCB board) and a protection chip 4, a lower heat sink 2 is disposed in the substrate 1, a bottom surface of the protection chip 4 is fixed on the lower heat sink 2, and an upper heat sink 5 is fixed on a top surface of the protection chip 4.
The base plate 1 is provided with a through hole, the lower heat dissipation part 2 is embedded in the through hole, the top surface and the bottom surface of the lower heat dissipation part 2 are respectively flushed with the top surface and the bottom surface of the base plate 1, the lower heat dissipation part 2 and the protection chip 4 are fixed through the insulating heat conduction glue 3, and the lower heat dissipation part 2 is a heat dissipation copper block with high heat dissipation performance.
Go up radiating piece 5 and protection chip 4 and pass through insulating heat-conducting glue 3 fixedly, after the electronic component installation on the base plate 1 was accomplished, need encapsulate, set up the encapsulated layer on 1 top surface of base plate promptly, the encapsulated layer constitutes for the encapsulated glue, goes up radiating piece 5 top surface and passes the encapsulated layer and expose, in order to guarantee encapsulating neatly of back top surface, goes up radiating piece 5 top surface and encapsulated layer top surface and flushes, goes up radiating piece 5 and is the heat-dissipating silicon chip.
The heat dissipation of battery protection shield mainly is the heat dissipation of protection chip 4, and the heat of protection chip 4 dispels through lower heat dissipation piece 2 and upper heat dissipation piece 5, and lower heat dissipation piece 2 and upper heat dissipation piece 5 have constituted the perpendicular heat conduction passageway of protection chip 4, do not need to increase under the prerequisite of too much cost and influence device volume, have realized the heat dissipation.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications and variations can be made without departing from the technical principle of the present invention, and these modifications and variations should also be considered as the protection scope of the present invention.
Claims (7)
1. The utility model provides a battery protection shield, includes base plate and protection chip, its characterized in that: a lower radiating piece is arranged in the substrate, the bottom surface of the protection chip is fixed on the lower radiating piece, and an upper radiating piece is fixed on the top surface of the protection chip;
the base plate is provided with a through hole, the lower heat radiating piece is embedded in the through hole, and the top surface and the bottom surface of the lower heat radiating piece are respectively flush with the top surface and the bottom surface of the base plate.
2. A battery protection plate as claimed in claim 1, wherein: the protection chip and the lower heat dissipation piece are fixed through insulating heat conduction glue.
3. The battery protection sheet according to any one of claims 1 to 2, wherein: the lower radiating piece is a radiating copper block.
4. A battery protection plate as claimed in claim 1, wherein: the protection chip is fixed with the upper heat dissipation part through insulating heat conduction glue.
5. A battery protection plate as claimed in claim 1, wherein: the top surface of the substrate is provided with an encapsulating layer, and the top surface of the upper radiating piece is exposed through the encapsulating layer.
6. The battery protection plate as claimed in claim 5, wherein: the top surface of the upper heat dissipation part is flush with the top surface of the encapsulating layer.
7. The battery protection sheet as claimed in any one of claims 4 to 6, wherein: the upper heat dissipation piece is a heat dissipation silicon chip.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920868324.5U CN210379021U (en) | 2019-06-11 | 2019-06-11 | Battery protection board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920868324.5U CN210379021U (en) | 2019-06-11 | 2019-06-11 | Battery protection board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN210379021U true CN210379021U (en) | 2020-04-21 |
Family
ID=70264094
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201920868324.5U Active CN210379021U (en) | 2019-06-11 | 2019-06-11 | Battery protection board |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN210379021U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113438831A (en) * | 2021-06-03 | 2021-09-24 | 中国电子科技集团公司第三十八研究所 | Microwave multifunctional assembly with interconnected embedded chips in any layer and manufacturing method thereof |
-
2019
- 2019-06-11 CN CN201920868324.5U patent/CN210379021U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113438831A (en) * | 2021-06-03 | 2021-09-24 | 中国电子科技集团公司第三十八研究所 | Microwave multifunctional assembly with interconnected embedded chips in any layer and manufacturing method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CP01 | Change in the name or title of a patent holder |
Address after: 518000 101, No.3 huanping Road, Gaoqiao community, Pingdi street, Longgang District, Shenzhen City, Guangdong Province Patentee after: Tianxin Internet Technology Co.,Ltd. Address before: 518000 101, No.3 huanping Road, Gaoqiao community, Pingdi street, Longgang District, Shenzhen City, Guangdong Province Patentee before: Shenzhen Tianxin Internet Technology Co.,Ltd. |
|
| CP01 | Change in the name or title of a patent holder | ||
| CP03 | Change of name, title or address |
Address after: 518000 101, No.3 huanping Road, Gaoqiao community, Pingdi street, Longgang District, Shenzhen City, Guangdong Province Patentee after: Shenzhen Tianxin Internet Technology Co.,Ltd. Address before: 214028 East Building, China sensor network innovation park, 200 Linghu Avenue, Xinwu District, Wuxi City, Jiangsu Province Patentee before: WUXI SKY CHIP INTERCONNECTION TECHNOLOGY Co.,Ltd. |
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| CP03 | Change of name, title or address |