CN211607218U - A new structure that dispels heat that is used for 5G cell-phone and has shielding function - Google Patents
A new structure that dispels heat that is used for 5G cell-phone and has shielding function Download PDFInfo
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- CN211607218U CN211607218U CN202020593913.XU CN202020593913U CN211607218U CN 211607218 U CN211607218 U CN 211607218U CN 202020593913 U CN202020593913 U CN 202020593913U CN 211607218 U CN211607218 U CN 211607218U
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Abstract
The utility model provides a new heat dissipation structure that is used for 5G cell-phone and has shielding function, including graphite alkene radiation layer and heat conduction substrate, graphite alkene radiation layer sets gradually with the heat conduction substrate from the top down, the heat conduction substrate includes heat conduction copper foil, at least one deck first heat conduction double-sided adhesive layer and at least one deck first artificial graphite layer, and a plurality of first heat conduction double-sided adhesive layer and first artificial graphite layer all set up between heat conduction copper foil and graphite alkene radiation layer, first artificial graphite layer is connected with heat conduction copper foil through first heat conduction double-sided adhesive layer, heat conduction copper foil thickness is 9-12 um; the utility model discloses a new heat dissipation structure possesses high radiation heat-sinking capability, can realize the three-dimensional high-efficient heat radiation characteristic of X-Y-Z fast, and heat conduction copper foil has good anti-interference EM characteristic moreover.
Description
Technical Field
The utility model relates to a technical field of 5G cell-phone accessory, especially a heat dissipation new construction that is used for 5G cell-phone and has shielding function.
Background
The 5G mobile phone is a smart phone using a fifth generation communication system, and because the smart phone uses a shorter signal wavelength and a higher frequency, the transmission speed is faster than that of 4G, and in recent years, several mobile phone manufacturers place the 5G mobile phones at different times, and take over the technical advancement. The processing capacity and the processing speed of the 5G mobile phone are dozens of times larger than those of the 4G mobile phone, so that the heat productivity of the 5G mobile phone is much larger than that of the 4G mobile phone, and the traditional heat dissipation structure cannot meet the requirements of the 5G mobile phone.
In view of the above, the present inventors have specially designed a new heat dissipation structure with shielding function for a 5G mobile phone, and have resulted from the present disclosure.
SUMMERY OF THE UTILITY MODEL
In order to solve the above problem, the technical scheme of the utility model is as follows:
the utility model provides a new heat dissipation structure that is used for 5G cell-phone and has shielding function, includes graphite alkene radiation layer and heat conduction substrate, graphite alkene radiation layer sets gradually with heat conduction substrate from the top down, the heat conduction substrate includes heat conduction copper foil, the first heat conduction double-sided adhesive layer of at least one deck and the first artificial graphite layer of at least one deck, and is a plurality of first heat conduction double-sided adhesive layer and first artificial graphite layer all set up between heat conduction copper foil and graphite alkene radiation layer, first artificial graphite layer is connected with heat conduction copper foil through first heat conduction double-sided adhesive layer, heat conduction copper foil thickness is 9-12 um.
Furthermore, the number of the first heat-conducting double-sided adhesive layer and the number of the first artificial graphite layer are 1-3.
Furthermore, the number of layers of the first heat-conducting double-sided adhesive layer and the first artificial graphite layer is two, and the new heat dissipation structure sequentially comprises a graphene radiation layer, the first artificial graphite layer, the first heat-conducting double-sided adhesive layer and a heat-conducting copper foil from top to bottom.
Further, the thickness of the graphene radiation layer is 6-10um, the thickness of the first artificial graphite layer is 25-30um, and the thickness of the first heat-conducting double-sided adhesive tape layer is 5-8 um.
Further, the graphene radiation layer thickness is 6um, the first artificial graphite layer thickness is 25um, the first heat conduction double faced adhesive tape layer thickness is 5um, heat conduction copper foil thickness is 9 um.
Further, the new heat dissipation structure further comprises an auxiliary heat dissipation layer, the auxiliary heat dissipation layer comprises a second heat conduction double-sided adhesive layer and a second artificial graphite layer, and the second artificial graphite layer is connected with the other end face of the heat conduction copper foil through the second heat conduction double-sided adhesive layer.
Further, the thickness of the second artificial graphite layer is 25-30um, and the thickness of the second heat-conducting double-sided adhesive tape layer is 5-8 um.
Further, the thickness of the second artificial graphite layer is 25um, and the thickness of the second heat-conducting double-sided adhesive tape layer is 5 um.
The utility model discloses the new structure that dispels the heat is through setting up graphite alkene radiation layer and heat conduction substrate, and wherein the heat conduction substrate includes heat conduction copper foil, the first heat conduction double-sided adhesive layer of at least one deck and the first artificial graphite layer of at least one deck, utilizes heat conduction copper foil to realize hot quick transfer, and the artificial graphite layer of deuterogamying realizes the three-dimensional high-efficient heat radiation characteristic of X-Y-Z with graphite alkene radiation layer, and heat conduction copper foil has good anti-interference EM characteristic moreover.
Drawings
The accompanying drawings, which are described herein, serve to provide a further understanding of the invention and constitute a part of this specification, and the exemplary embodiments and descriptions thereof are provided for explaining the invention without unduly limiting it.
Wherein:
fig. 1 is a schematic structural view of an embodiment 1 of the novel heat dissipation structure of the present invention;
fig. 2 is a schematic structural view of a new heat dissipation structure of embodiment 2 of the present invention;
fig. 3 is a schematic structural diagram of a new heat dissipation structure of embodiment 3 of the present invention.
Description of reference numerals:
01-graphene radiation layer, 02-heat-conducting base material, 03-auxiliary heat dissipation layer, 10-heat-conducting copper foil, 20-first heat-conducting double-sided adhesive layer, 30-first artificial graphite layer, 40-second heat-conducting double-sided adhesive layer and 50-second artificial graphite layer.
Detailed Description
In order to make the technical problem, technical solution and advantageous effects to be solved by the present invention clearer and more obvious, the following description of the present invention with reference to the accompanying drawings and embodiments is provided for further details. It should be understood that the specific embodiments described herein are for purposes of illustration only and are not intended to limit the invention.
Example 1
Referring to fig. 1, a new heat dissipation structure with shielding function for a 5G mobile phone according to embodiment 1 of the present invention includes a graphene radiation layer 01 and a heat conduction substrate 02, the graphene radiation layer 01 and the heat conduction substrate 02 are sequentially disposed from top to bottom, the heat conduction substrate 02 includes a heat conduction copper foil 10, at least one first heat conduction double-sided adhesive layer 20, and at least one first artificial graphite layer 30, the number of the first heat conduction double-sided adhesive layer 20 and the first artificial graphite layer 30 can be selected according to the requirement, for example, the thickness of the new heat dissipation structure is required to be thinner, only one first artificial graphite layer 30 and one first heat-conducting double-sided adhesive layer 20 need to be arranged, the first heat-conducting double-sided adhesive layers 20 and the first artificial graphite layer 30 are arranged between the heat-conducting copper foil 10 and the graphene radiation layer 01, and the first artificial graphite layer 30 is connected with the heat-conducting copper foil 10 through the first heat-conducting double-sided adhesive layer 20; the heat conductive copper foil 10 may be a high heat conductive copper foil 10, which not only can realize rapid heat dissipation but also can realize the function of shielding EMI (shielding electromagnetic waves).
The number of the first heat-conducting double-sided adhesive layer 20 and the number of the first artificial graphite layer 30 are 1-3; the number of layers of the first heat-conducting double-sided adhesive layer 20 and the first artificial graphite layer 30 in embodiment 1 is two, that is, the new heat-dissipating structure sequentially includes, from top to bottom, the graphene radiation layer 01, the first artificial graphite layer 30, the first heat-conducting double-sided adhesive layer 20, and the heat-conducting copper foil 10.
The thickness of the graphene radiation layer 01 is 6-10um, the thickness of the first artificial graphite layer 30 is 25-30um, the thickness of the first heat-conducting double-sided adhesive layer 20 is 5-8um, and the thickness of the heat-conducting copper foil 10 is 9-12 um; preferably, the 01 thickness in graphite alkene radiation layer is 6um, and first artificial graphite layer 30 thickness is 25um, and first heat conduction double-sided adhesive layer 20 thickness is 5um, and heat conduction copper foil 10 thickness is 9 um.
Example 2
Referring to fig. 2, as a new heat dissipation structure with shielding function for a 5G mobile phone in embodiment 2 of the present invention, compared with embodiment 1, there is an additional auxiliary heat dissipation layer 03, specifically, the new heat dissipation structure further includes an auxiliary heat dissipation layer 03, the auxiliary heat dissipation layer 03 includes a second heat-conducting double-sided adhesive layer 40 and a second artificial graphite layer 50, and the second artificial graphite layer 50 is connected to the other end surface of the heat-conducting copper foil 10 through the second heat-conducting double-sided adhesive layer 40; the auxiliary heat dissipation layer 03 can rapidly transfer heat to the heat conductive copper foil 10, thereby increasing the heat dissipation speed.
The thickness of the second artificial graphite layer 50 is 25-30um, and the thickness of the second heat-conducting double-sided adhesive layer 40 is 5-8 um; preferably, the thickness of the second artificial graphite layer 50 is 25um, and the thickness of the second heat-conducting double-sided adhesive layer 40 is 5 um.
Example 3
Please refer to fig. 3, which is a new heat dissipation structure with shielding function for a 5G mobile phone according to embodiment 3 of the present invention, wherein embodiment 3 has one layer of the first heat-conductive double-sided adhesive layer 20 and one layer of the first artificial graphite layer 30 less than embodiment 2, that is, the one layer of the first heat-conductive double-sided adhesive layer 20 and one layer of the first artificial graphite layer 30 are adopted, so that the overall thickness of the new heat dissipation structure can be reduced, and more requirements can be met.
To sum up, the utility model discloses new structure of heat dissipation is through setting up graphite alkene radiation layer and heat conduction substrate, wherein the heat conduction substrate includes the heat conduction copper foil, the first heat conduction double-sided adhesive layer of at least one deck is with the first artificial graphite layer of at least one deck, utilize the heat conduction copper foil to realize hot quick transfer, deuterogamy artificial graphite layer and graphite alkene radiation layer make horizontal heat conductivity can reach 1400 ~ 1600W/m.K, the surface radiance reaches more than 0.94, consequently, possess high radiation heat-sinking capability, can realize the three-dimensional high-efficient heat radiation characteristic of X-Y-Z fast, and the heat conduction copper foil has good anti-interference EM characteristic.
The present invention has been described above with reference to the accompanying drawings, and it is obvious that the present invention is not limited by the above-mentioned manner, and various insubstantial improvements can be made without modification to the method and technical solution of the present invention, or the present invention can be directly applied to other occasions without modification, all within the scope of the present invention.
Claims (8)
1. The utility model provides a new heat dissipation structure that is used for 5G cell-phone and has shielding function, its characterized in that, includes graphite alkene radiation layer and heat conduction substrate, graphite alkene radiation layer sets gradually with heat conduction substrate from the top down, the heat conduction substrate includes heat conduction copper foil, the first heat conduction double-sided adhesive layer of at least one deck and at least one deck first artificial graphite layer, and is a plurality of first heat conduction double-sided adhesive layer all sets up between heat conduction copper foil and graphite alkene radiation layer with first artificial graphite layer, first artificial graphite layer is connected with the heat conduction copper foil through first heat conduction double-sided adhesive layer, heat conduction copper foil thickness is 9-12 um.
2. The new heat dissipation structure with shielding function for a 5G mobile phone according to claim 1, wherein the number of the first thermal double-sided adhesive layer and the first artificial graphite layer is 1-3.
3. The new heat dissipation structure with shielding function for a 5G mobile phone according to claim 2, wherein the number of the first heat-conducting double-sided adhesive layer and the first artificial graphite layer are two, and the new heat dissipation structure sequentially comprises, from top to bottom, a graphene radiation layer, the first artificial graphite layer, the first heat-conducting double-sided adhesive layer and a heat-conducting copper foil.
4. The new heat dissipation structure with shielding function for 5G mobile phone according to claim 1, wherein the graphene radiation layer is 6-10um thick, the first artificial graphite layer is 25-30um thick, and the first double-sided thermal adhesive tape is 5-8um thick.
5. The new heat dissipation structure with shielding function for 5G mobile phone according to claim 4, wherein the graphene radiation layer is 6um thick, the first artificial graphite layer is 25um thick, the first thermally conductive double-sided adhesive tape is 5um thick, and the thermally conductive copper foil is 9um thick.
6. The new heat dissipation structure with shielding function for a 5G mobile phone according to claim 1, wherein the new heat dissipation structure further comprises an auxiliary heat dissipation layer, the auxiliary heat dissipation layer comprises a second heat-conducting double-sided adhesive layer and a second artificial graphite layer, and the second artificial graphite layer is connected to the other end face of the heat-conducting copper foil through the second heat-conducting double-sided adhesive layer.
7. The new heat dissipation structure with shielding function for a 5G mobile phone according to claim 6, wherein the thickness of the second artificial graphite layer is 25-30um, and the thickness of the second double-sided adhesive-tape layer is 5-8 um.
8. The new heat dissipation structure with shielding function for 5G mobile phone according to claim 7, wherein the second artificial graphite layer is 25um thick, and the second double-sided adhesive tape layer is 5um thick.
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| Application Number | Priority Date | Filing Date | Title |
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| CN202020593913.XU CN211607218U (en) | 2020-04-20 | 2020-04-20 | A new structure that dispels heat that is used for 5G cell-phone and has shielding function |
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| CN202020593913.XU CN211607218U (en) | 2020-04-20 | 2020-04-20 | A new structure that dispels heat that is used for 5G cell-phone and has shielding function |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023102694A1 (en) * | 2021-12-06 | 2023-06-15 | 华为数字能源技术有限公司 | Thermally conductive insulating housing and electronic device |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2023102694A1 (en) * | 2021-12-06 | 2023-06-15 | 华为数字能源技术有限公司 | Thermally conductive insulating housing and electronic device |
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Address after: 361000 Fujian Xiamen torch high tech Zone (Xiangan) Industrial Zone, Xiang Xing Road 88, Taiwan science and technology enterprise breeding center south E1007A room, Xiamen Patentee after: Xiamen Naifu new materials Co., Ltd Address before: 361000 Fujian Xiamen torch high tech Zone (Xiangan) Industrial Zone, Xiang Xing Road 88, Taiwan science and technology enterprise breeding center south E1007A room, Xiamen Patentee before: XIAMEN NAIFU ELECTRONICS Co.,Ltd. |