WO2023102694A1

WO2023102694A1 - Thermally conductive insulating housing and electronic device

Info

Publication number: WO2023102694A1
Application number: PCT/CN2021/135805
Authority: WO
Inventors: 周子轩; 曾智; 吴成龙; 张永德
Original assignee: 华为数字能源技术有限公司
Priority date: 2021-12-06
Filing date: 2021-12-06
Publication date: 2023-06-15
Also published as: CN117121646A

Abstract

The present application relates to the technical field of heat dissipation, and provides a thermally conductive insulating housing (100) and electronic device. A thermally conductive insulating material composed of a fiber material and a thermally conductive filler according to a set ratio is selected for a heat dissipation assembly (110) in the thermally conductive insulating housing (100); since the thermally conductive insulating material comprises a fiber material, the structural strength and the structural toughness of the thermally conductive insulating material can be improved, so that the thermally conductive insulating material can be repeatedly bent and is not prone to be damaged; moreover, by filling pores in the fiber material with a thermally conductive filler, not only the thermal conduction capability of the thermally conductive insulating material can be provided, but also the pressure resistance level of the thermally conductive insulating material is improved, so that the thermally conductive insulating material can be bent into the shape of a component having a heat dissipation assembly, the stability of the structure is high, and the manufacturing process is simple, thereby reducing the costs of an electronic device.

Description

A thermally conductive insulating case and electronic equipment

technical field

The invention relates to the technical field of heat dissipation, in particular to a heat-conducting insulating case and electronic equipment.

Background technique

With the trend of miniaturization of electronic equipment, the integration of components in electronic equipment is getting higher and higher. When various components work, a large amount of heat will be generated inside the electronic equipment. If the heat generated cannot be discharged in time The outside of the electronic equipment will cause the internal temperature of the electronic equipment to become higher and higher, which not only affects the normal operation of the electronic equipment, but also may cause the danger of explosion. So far, one of the best ways to improve the heat dissipation capacity of electronic equipment is to improve the thermal conductivity of the thermally conductive insulating material placed inside the electronic equipment. The thermally conductive insulating material with high thermal conductivity can quickly transfer the heat inside the electronic device to the outside. .

Among the existing thermally conductive insulating materials, the thermally conductive insulating material of polyimide (PI) film is used most, which includes PI material and thermally conductive filler. Wherein, during the production process of the thermally conductive insulating material, thermally conductive fillers are added to the PI material by physical blending, so as to obtain the thermally conductive insulating material of the PI film. Due to the disadvantages of weak structural strength, relatively poor structural toughness, and relatively low puncture resistance of this thermally conductive insulating material, the existing thermally conductive insulating material cannot be bent, so it can only be arranged in electronic equipment in a tiled manner. However, most components in electronic equipment exist in a three-dimensional form. If only thermally conductive insulating materials are laid on top of each component, the heat dissipation effect of electronic equipment will be relatively poor.

Contents of the invention

In order to solve the above problems, the embodiments of the present application provide a thermally conductive insulating case and electronic equipment, using a bendable thermally conductive insulating material, and bending the material into a predetermined shape, nested in the components On the surface, the heat on the components can be well transferred to the outside world, which greatly improves the heat dissipation effect of electronic equipment.

For this reason, adopt following technical scheme in the embodiment of the application:

In the first aspect, an embodiment of the present application provides a thermally conductive insulating case, including: a heat dissipation component, used to be nested on a component, and transfer the heat on the component to the outside; wherein, the heat dissipation component is through The thermally conductive insulating material is made into a three-dimensional structure with a predetermined shape, and the thermally conductive insulating material includes a fiber material and a thermally conductive filler, the fiber material includes at least two types of fibers, and the thermally conductive filler is filled in the fiber material. in the pores in the matrix.

In this embodiment, the thermally conductive insulating material composed of fiber material and thermally conductive filler according to a set ratio is selected. Since the thermally conductive insulating material includes fiber material, the structural strength and structural toughness of the thermally conductive insulating material can be improved, making the thermally conductive insulating material It can be bent repeatedly and is not easy to be damaged, and the pores in the fiber material are filled with thermally conductive fillers, which can not only provide the thermal conductivity of the thermally conductive insulating material, but also improve the withstand voltage level of the thermally conductive insulating material, so that the thermally conductive insulating material can be bent into a The shape of the components of the heat dissipation component, and then nested on the components, can better dissipate heat for electronic equipment. Compared with the PI film heat-conducting insulating material used in the prior art, the heat-conducting insulating material protected by this application is obtained by bending the heat-conducting insulating material into a set shape, and the structural stability is relatively high, and the manufacturing process is relatively simple, reducing the The cost of electronic equipment.

In one embodiment, the thermally conductive filler is a non-conductive material.

In this embodiment, by selecting non-conductive thermally conductive fillers, the heat dissipation component is also non-conductive, so as to avoid short circuit problems inside the electronic device due to the conductivity of the heat dissipation component.

In one embodiment, at least one fixing structure is provided on the heat dissipation component for coupling with the fixing structure on the component.

In this embodiment, one or more fixing structures are provided on the heat dissipation component, and the heat dissipation component can be fixed on the component by coupling with the fixing structure on the component, so as to prevent the thermally conductive insulating shell from falling off from the component.

In one embodiment, it further includes: at least one shielding component, disposed on the outer surface of the heat dissipation component, for shielding the electrical signals emitted by the components.

In this embodiment, for components that emit radiation signals, one or more shielding components can be provided on the outer surface of the heat dissipation component, so that the heat dissipation component is nested on the component, which can shield the component to The radiation signal emitted from the outside can avoid the radiation signal emitted by the component from affecting the normal operation of other components.

In one embodiment, the bonding method between the at least one shielding component and the outer surface of the heat dissipation component is one of physical contact, pressure bonding, adhesive bonding, PLD coating, CVD coating and fixing of a fixed component one or more species.

In this embodiment, the layered composite material is constructed by superimposing the shielding component and the heat dissipation component, so that the shielding function is increased without increasing the volume of the heat-conducting insulating case.

In one embodiment, the shape of the shielding component is graphene sheet, metal coating, metal sheet, mesh structure formed by interweaving metal wires, network structure formed by interweaving carbon fibers, and bonded metal powder. One or more of flakes.

In one embodiment, each shielding component is provided with at least one fixing structure for coupling with the fixing structure on the component.

In this embodiment, if the shielding assembly has a certain strength, one or more fixing structures can be provided on the shielding assembly, and the heat-conducting insulating shell can be fixed on the components by coupling with the fixing structures on the components to avoid The thermally conductive insulating shell is detached from the component.

In one embodiment, it further includes: an adhesive, disposed on the outer surface of the heat dissipation component, for fixing the heat dissipation component on the component.

In this embodiment, by applying an adhesive between the component and the heat dissipation component, the heat dissipation component can be fixed on the component and prevent the heat dissipation component from falling off the component. Compared with setting a fixed structure on the heat dissipation component or the shielding component, the realization process of this solution is simpler and the cost is lower.

In the second aspect, the embodiment of the present application provides an electronic device, including: at least one component, at least one heat-conducting and insulating shell that may be realized in the first aspect, and the at least one heat-conducting and insulating shell is respectively nested in the at least one components. Among them, the electronic equipment can be an adapter, a power module, an inverter, a lithium battery, etc., and the components refer to the heat-generating components in the electronic equipment. If the electronic equipment is a battery module, the above-mentioned components can be batteries, battery control Transformers, resistors, etc. in the module, if the electronic device is an adapter, the above-mentioned components can be frequency converters, transformers, etc., or even the entire circuit board in the adapter.

Description of drawings

The following briefly introduces the drawings used in the embodiments or the description of the prior art.

FIG. 1 is a schematic structural diagram of a heat-conducting insulating case provided in an embodiment of the present application;

Fig. 2 is the production process flowchart of the thermally conductive insulating material provided in the embodiment of the present application;

Fig. 3 (a) is the heat-conducting insulating material of cuboid shape provided in the embodiment of the present application;

Fig. 3 (b) is the thermally conductive insulating material provided in the embodiment of the present application after cutting the redundant part;

Figure 3(c) is a schematic diagram of the shape of the heat-conducting insulating material bent into a heat-dissipating component provided in the embodiment of the present application;

Figure 4(a) is a schematic diagram of the shielding assembly provided in the embodiment of the present application attached to the heat dissipation assembly by spraying;

Figure 4(b) is a schematic diagram of the shielding assembly provided in the embodiment of the present application being attached to the heat dissipation assembly in a physical contact or press-fitting manner;

Figure 4(c) is a schematic diagram of the shielding assembly provided in the embodiment of the present application attached to the heat dissipation assembly by using an adhesive;

FIG. 4( d ) is a schematic diagram of the shielding component provided in the embodiment of the present application directly pasted on the heat dissipation component.

Detailed ways

The technical solutions in the embodiments of the present application will be described below with reference to the drawings in the embodiments of the present application.

In the description of this application, the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", " The orientation or positional relationship indicated by "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the application and simplifying the description, rather than indicating or implying the referred device or Elements must have certain orientations, be constructed and operate in certain orientations, and thus should not be construed as limiting the application.

In the description of this application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection" and "connection" should be understood in a broad sense, for example, it can be a fixed connection or a detachable connection , can also be a contradictory connection or an integrated connection; those skilled in the art can understand the specific meanings of the above terms in this application according to specific situations.

In the description of this specification, specific features, structures, materials or characteristics may be combined in any one or more embodiments or examples in an appropriate manner.

Due to the disadvantages of weak structural strength, relatively poor structural toughness, and relatively low puncture resistance, the existing thermally conductive insulating materials of PI films can only be arranged on top of each component in a tiled manner. If it is necessary to dissipate heat from components with a three-dimensional structure, it is necessary to cut out multiple thermally conductive insulating materials of PI films with the same shape as each side of the component, and then splice and fix the thermally conductive insulating materials of each PI film together. A three-dimensional heat dissipation structure in the shape of components can be nested on components. However, the manufacturing process of the existing three-dimensional heat dissipation structure is relatively complicated, which increases the cost of electronic equipment, and the three-dimensional heat dissipation structure is formed by splicing multiple materials, and its stability is relatively poor.

FIG. 1 is a schematic structural diagram of a heat-conducting insulating case provided in an embodiment of the present application. As shown in FIG. 1 , the heat conducting insulating case 100 includes a heat dissipation component 110 and a shielding component 120 . Among them, the structure and interconnection of each component are as follows:

The heat dissipation component 110 is formed by bending a thermally conductive insulating material, and the thermally conductive insulating material is composed of fiber material and thermally conductive filler according to a set ratio. Among them, the fiber material is generally used as a matrix material, so that the thermally conductive insulating material can be molded into a predetermined shape, and can be wrapped with thermally conductive fillers. In this application, the structural strength and structural toughness of the thermally conductive insulating material with fiber material as the matrix have been greatly improved, allowing the thermally conductive insulating material to have higher structural strength and structural toughness, so that the thermally conductive insulating material can be repeated. Bending is not easy to damage.

In the embodiment of the present application, the fiber material may be selected from a variety of materials such as aramid fiber, polyester fiber, kraft paper fiber, polyphenylene sulfide (polyphenylene sulfide, PPS) fiber, polyethylene fiber, and cellulose. Among them, aramid fiber has high strength and toughness, which can better improve the structural strength and structural toughness of thermally conductive insulating materials, but its price is relatively expensive; polyester fiber, kraft fiber, PPS fiber, polyethylene fiber, cellulose Compared with fiber materials such as aramid fiber, although the structural strength and toughness of the aramid fiber are reduced, the price of this type of fiber is relatively cheap, which can reduce the cost of thermally conductive and insulating materials.

Therefore, in the fiber material of the present application, two types of fibers can be selected, one type of fiber is aramid fiber, and the other type of fiber is polyester fiber, kraft fiber, PPS fiber, polyethylene fiber, cellulose, etc. One or several types of fiber materials, by mixing these two types of fibers, the cost of the thermally conductive insulating material can be appropriately reduced on the premise of ensuring the strength and flexibility of the thermally conductive insulating material, making the conductor insulating material It combines the advantages of various types of fibers. Wherein, the first type of fiber may not be limited to aramid fiber, it only needs to be able to improve the structural strength and structural toughness of the thermally conductive insulating material.

In the present application, the respective weight ratios of the first type of fiber and the second type of fiber to the total fiber material can be any value, which is specifically determined according to the application scenario of the thermally conductive insulating material. If the cost requirements for thermally conductive insulating materials are relatively high, the second type of fiber can be made to account for more. If the structural strength and structural toughness requirements for thermally conductive insulating materials are relatively high, the proportion of the first type of fiber can be relatively high. many.

The thermally conductive filler can make the thermally conductive insulating material have a strong thermal conductivity by being mixed in the fiber material. In this application, the thermally conductive filler can be selected from boron nitride (BN), aluminum oxide (Al2O3), magnesium hydroxide (Mg(OH)2) and other materials with relatively strong thermal conductivity and no electrical conductivity, which can not only improve the thermal conductivity of insulating materials. The thermal conductivity of the thermal conductivity, and to avoid the electrical conductivity of the thermal conductive filler, which makes the thermal conductive insulating material including the thermal conductive filler conductive, which will cause a short circuit problem inside the electronic device. Optionally, the thermally conductive insulating material composed of insulating thermally conductive fillers not only requires insulation, but also meets the 3kV AC withstand voltage to meet safety regulations.

Preferably, a small amount of graphite, graphene and other thermally conductive fillers with relatively excellent thermal conductivity can also be added. Since the addition of such thermally conductive fillers is relatively small, it does not affect the insulation performance of the thermally conductive insulating material.

In the process of making thermally conductive insulating materials in this application, the "papermaking process" is generally used to make thermally conductive insulating materials. Of course, it is not limited to this kind of manufacturing process, and other manufacturing processes can also be used, which is not limited in this application. Among them, the specific process of making thermally conductive insulating materials through the papermaking process can be combined as shown in Figure 2, specifically:

Step S201, mixing the fiber material and water in a set ratio to obtain an aqueous solution of the fiber material.

Fibrous materials generally exist in the form of solid filaments and are intertwined and cannot be separated. Therefore, a large amount of water is required to dilute the fibrous materials so that the fibrous materials are separated from each other and evenly distributed in the water. Optionally, the fiber material and water can be mixed according to the ratio that one kilogram of water dissolves one gram of the fiber material, so that the fiber material can be fully decomposed in water and evenly distributed in the water for subsequent reshaping of the fiber material.

For water mixed with fiber materials, operations such as centrifugation and stirring can be used to decompose the fiber materials in water to obtain an aqueous solution of fiber materials. If the fiber material is a thermoplastic material, which is difficult to decompose at normal temperature, the aqueous solution mixed with the fiber material can be heated so that the fiber material can be better decomposed in water. Optionally, the heating temperature is generally related to the type of fiber material. If the melting and boiling point of the fiber material is relatively high, the heating temperature will also increase accordingly. If the melting and boiling point of the fiber material is relatively low, the heating temperature will also increase accordingly. Low.

Step S202, filtering the moisture in the aqueous solution of the fiber material to obtain the fiber material from which moisture has been removed.

After obtaining the aqueous solution of the fiber material, the aqueous solution of the fiber material can be poured on the filter screen to filter the water, and the fiber material can be evenly spread on the filter screen. Among them, after the aqueous solution of the fiber material is subjected to solid-liquid separation, the shape of the fiber material paper laid flat on the filter screen, and there is a hole in the middle, so that the thermal conductive filler can be filled later.

After the solid-liquid separation, there is still a large amount of water in the fibrous material left on the filter screen, which will affect the subsequent filling of thermally conductive fillers, so it is necessary to remove the water in the fibrous material. Exemplarily, the way of removing moisture in the fiber material can be natural drying, baking and other ways, which are not limited by the present application.

Step S203, filling the thermally conductive filler in the pores on the fiber material from which moisture has been removed, to obtain a thermally conductive insulating material.

After removing the moisture in the fiber material, remove the fiber material from the sieve, and then put the fiber material into the thermally conductive filler powder. The thermally conductive filler can be fully filled on the fiber material by means of ultrasonic vibration, pressure extrusion, etc. In the pores, the fibrous material filled with thermally conductive fillers is finally cut to obtain a thermally conductive insulating material with a set shape.

In this application, in the thermally conductive insulating material, if the thermally conductive filler accounts for more of the total weight of the thermally conductive insulating material, the fiber material in the thermally conductive insulating material will be less, although the thermal conductivity of the thermally conductive insulating material can be improved, but it will be reduced. The structural strength and structural toughness of the thermally conductive insulating material; similarly, if the fiber material accounts for more of the total weight of the thermally conductive insulating material, the less thermally conductive filler in the thermally conductive insulating material will be, although the structural strength and structure of the thermally conductive insulating material can be improved. Toughness, but will reduce the thermal conductivity of thermal insulation materials. Therefore, the present application has verified through experiments that the selected fiber material accounts for 20%-95% of the total weight of the thermally conductive insulating material, and the thermally conductive filler accounts for 5%-80% of the total weight of the thermally conductive insulating material, so that the obtained thermally conductive insulating material The thermal conductivity, structural strength and structural toughness are the best.

In the embodiment of the present application, by mixing the fiber material and the thermally conductive filler in proportion, in the obtained conductor insulating material, since the fiber material is included, the structural strength and structural toughness of the thermally conductive insulating material can be improved, and because the thermally conductive filler is included, and Filling the pores of the fiber material can not only improve the thermal conductivity of the thermally conductive insulating material, but also improve the withstand voltage level of the thermally conductive insulating material, so that the thermally conductive insulating material can be bent into the shape of a component with a heat dissipation component, wrapped in an electronic The outer surface of the device can better dissipate heat for electronic devices.

In this application, if the fiber material is made of cellulose and other materials with poor adhesion, when the thermally conductive insulating material produced is bent, there will be problems such as chapping on the outer surface and falling off of the material in the thermally conductive insulating material, which will seriously affect the product. quality. Therefore, high molecular polymers can be added to the thermally conductive insulating material to improve the adhesion of the thermally conductive insulating material and avoid problems such as surface cracking and material shedding of the thermally conductive insulating material. Exemplarily, the heat-conducting insulating material also includes a high molecular polymer as an adhesive between the fiber material and the heat-conducting material, so that between the fiber material and the fiber material, between the fiber material and the heat-conducting filler, and between the heat-conducting filler and the heat-conducting filler Better stick together. Wherein, the main component of the high molecular polymer is a high molecular polymer, which may be one or more combinations of materials such as epoxy resin, polyvinyl chloride, polyethylene, and natural rubber, which are not limited in this application.

In the present application, the added high molecular polymer accounts for 0%-10% of the total weight of the thermally conductive insulating material. Among them, in thermally conductive insulating materials, the more polymers are added, the higher the adhesion of thermally conductive insulating materials, but the thermal conductivity, structural strength, structural toughness and other properties of thermally conductive insulating materials will decrease. Therefore, the present application has verified through experiments that the high molecular polymer is selected to account for 0%-10% of the total weight of the thermally conductive insulating material, so that the obtained thermally conductive insulating material has the best properties such as adhesion, thermal conductivity, structural strength and structural toughness. .

In the embodiment of the present application, in the process of making thermally conductive insulating materials through fiber materials and thermally conductive fillers, high molecular polymers can be added to make the gap between the fiber materials and the fiber materials, between the fiber materials and the thermally conductive fillers, and between the thermally conductive fillers and the thermally conductive fillers They are better pasted together, so that the heat-conducting insulating material will not have problems such as chapping on the outer surface and material falling off during the bending process.

In this application, the heat-conducting insulating material can be combined with cutting, bending and other processes to produce the heat dissipation component 110 . Exemplarily, as shown in FIG. 3( a ), a cuboid-shaped heat-conducting insulating material is selected first. Wherein, the heat dissipation component 110 is used to be nested on the outer surface of the component, so the surface of the largest side of the selected heat-conducting insulating material is at least larger than the surface of the component, so that it can be bent and nested on the component.

Combined with Figure 3(b), cut the heat-conducting insulating material shown in Figure 3(a), and cut off the unnecessary parts, so as not to affect the bending of the heat-conducting insulating material into a set shape. Wherein, the cutting method of the thermally conductive insulating material may be cutting by machine, cutting by manual tools, etc., which is not limited in this application. Optionally, while the machine is cutting, shallow creases are made on the place that needs to be bent, so as to facilitate subsequent bending.

As shown in FIG. 3(c), bend the cut thermally conductive insulating material shown in FIG. 3(b), and turn up the edge parts on both sides of the thermally conductive insulating material so that The middle section of the thermally conductive insulating material is at a set angle. Among them, when the two sides of the thermally conductive insulating material are bent upwards to form a set angle, the bending place is generally arc-shaped, so as to avoid excessive bending of the thermally conductive insulating material, resulting in cracks on the outer surface of the thermally conductive insulating material, internal Problems such as material falling off. Of course, if the structural strength and structural toughness of the thermally conductive insulating material are relatively high, the bending angle can be a right angle.

In this application, one or more fixed structures can be provided on the heat dissipation assembly 110, so that the heat dissipation assembly 110 is nested on the components, and the fixed structures on the heat dissipation assembly 110 can be coupled with the fixed structures on the components, so that the thermally conductive insulating shell 100 is fixed on the components to prevent the thermally conductive insulating shell 100 from falling off from the components.

Wherein, the fixing structure on the heat dissipation assembly 110 can be a plurality of through holes, which can be nested on the raised parts on the components to achieve the fixing effect; it can also be aligned with the through holes in the components, using screws, buckles, etc. component, and fix the shielding assembly 120 on the components. The fixing structure on the heat dissipation component 110 can be a groove part on the heat dissipation component 110, which can be coupled with a convex part on the component to achieve a fixing effect. The fixing structure on the heat dissipation assembly 110 can be a raised portion on the heat dissipation assembly 110, which can be coupled with the groove portion on the components to achieve a fixing effect. The fixing structure on the heat dissipation component 110 may also have other shapes, which are not limited in this application.

In the implementation of this application, the thermally conductive insulating material composed of fiber material and thermally conductive filler according to the set ratio is selected. Since the thermally conductive insulating material includes fiber material, the structural strength and structural toughness of the thermally conductive insulating material can be improved, so that the thermally conductive insulating material can Repeated bending is not easy to damage, and the pores in the fiber material are filled with thermally conductive fillers, which can not only provide the thermal conductivity of the thermally conductive insulating material, but also improve the withstand voltage level of the thermally conductive insulating material, so that the thermally conductive insulating material can be bent into a heat-dissipating material. The shape of the components of the component, and then nested on the components, can better dissipate heat for electronic equipment. Compared with the PI film heat-conducting insulating material used in the prior art, the heat-dissipating effect of the heat-dissipating assembly made of the heat-conducting insulating material protected by the application is nearly doubled, and the heat-dissipating assembly is obtained by bending the heat-conducting insulating material into a set shape Yes, the stability of the structure is relatively high, and the manufacturing process is relatively simple, which reduces the cost of electronic equipment.

The shielding assembly (120-1, 120-2) is used to shield the radiation signal emitted by the component to prevent the radiation signal emitted by the component from affecting the normal operation of other components. Wherein, the shielding components (120-1, 120-2) are made of materials capable of shielding electromagnetic waves, such as metal, graphene, etc., which are not limited in this application. The structure of the shielding component (120-1, 120-2) can be one or more of graphene sheets, metal coatings, metal foils, mesh structures formed by interweaving metal wires, sheets formed by bonding metal powders, and other structures. Various, the present application is not limited here.

The thermally conductive insulating material used in this application is generally presented in the form of paper. The thickness of the thermally conductive insulating material is generally several millimeters to several hundred millimeters, so as not to be too thick to dissipate heat and occupy the already tight space inside the electronic device. Optionally, for safety considerations, the thickness of the thermally conductive insulating material is generally between 200 microns and 450 microns.

In the present application, the bonding method between the shielding component (120-1, 120-2) and the heat dissipation component 110 may be one or more of physical contact, adhesive sticking, fixed component fixing and the like. Exemplarily, as shown in Figure 4(a), if the material of the shielding component 120 is powder such as graphene or metal powder, graphene can be sprayed on the outer surface of the heat dissipation component 110 to form a thin film and adhere to the heat dissipation Component 110 on. As shown in Figure 4(b), if the material of the shielding component 120 is a metal material, the shielding component 120 can be pasted on the outer surface of the heat dissipation component 110 through physical contact or pressure bonding, so as to realize the shielding The assembly 120 is fixed on the heat dissipation assembly 110 . As shown in Figure 4(c), if the material of the shielding assembly 120 is a metal material, an adhesive can also be used to paste the shielding assembly 120 on the outer surface of the heat dissipation assembly 110, thereby realizing that the shielding assembly 120 is fixed on the heat dissipation assembly 110 superior. As shown in Figure 4(d), if the material of the shielding assembly 120 is graphene, metal powder and other powders, it can be mixed with the adhesive and then pasted on the outer surface of the heat dissipation assembly 110, so that the shielding assembly 120 can be fixed. on the heat sink assembly 110 .

As another example, if the fiber material is aramid fiber or cellulose in the thermally conductive insulating material constituting the heat dissipation component 110, the physical contact shown in FIG. 4(b) or The shielding assembly 120 is pasted on the outer surface of the heat dissipation assembly 110 by means of pressure bonding, so as to realize fixing the shielding assembly 120 on the heat dissipation assembly 110 . If the fiber material of the heat-conducting insulating material constituting the heat dissipation assembly 110 is kraft paper fiber, an adhesive as shown in FIG. 110 , so that the shielding component 120 is fixed on the heat dissipation component 110 . When the fiber material is other materials, any combination method between Figure 4(a)-Figure 4(d) can be used, as well as other pasting methods, such as pulsed laser deposition (pulsed laser deposition, PLD) coating, chemical vapor deposition (chemical vapor deposition, CVD) coating, etc., the present application is not limited here.

In this application, if the shielding assembly 120 is a structure with a certain strength such as a graphene sheet or a metal sheet, one or more fixed structures can be arranged on the shielding assembly 120, so that when the heat-conducting insulating shell 100 is nested on the component, The fixing structure on the shielding assembly 120 can be coupled with the fixing structure on the component, so as to fix the thermally conductive insulating case 100 on the component and prevent the thermally conductive insulating case 100 from falling off from the component. Wherein, the fixing structure on the shielding assembly 120 has the same effect as the fixing structure on the heat dissipation assembly 110 described above, so the fixing method and shape of the fixing structure on the shielding assembly 120 and the fixing structure on the components are the same as those of the heat dissipation assembly described above. The fixing structure on 110 is exactly the same, and the present application will not repeat them here.

In addition, in the thermally conductive insulating shell protected by the present application, an adhesive can also be coated on the outer surface of the heat dissipation component, so that the thermally conductive insulating shell is nested on the component and fixed on the component by the adhesive. The method of arranging the fixing structure on the heat dissipation component 110 or the shielding component 120 not only has a simpler implementation process, but also has a lower cost. Exemplarily, the manner of fixing the heat-conducting insulating shell on the components may also be welding, press-fitting, etc., which is not limited in this application.

In the embodiment of the present application, by arranging one or more shielding components on the heat dissipation component made of thermally conductive insulating material, the radiation signal emitted by the component can be shielded when the heat dissipation component is nested on the component of the corresponding shape, Avoid the radiation signal emitted by this component from affecting the normal operation of other components.

The embodiment of the present application also provides an electronic device, which includes at least one component and at least one heat-conducting and insulating case as described in Fig. 1-Fig. Put it on the corresponding shape of the components. Since the electronic device includes the heat-conducting and insulating case, the electronic device has all or at least part of the advantages of the heat-conducting and insulating case. Among them, the electronic equipment can be an adapter, a power module, an inverter, a lithium battery, etc., and the components refer to the heat-generating components in the electronic equipment. If the electronic equipment is a battery module, the above-mentioned components can be batteries, battery control Transformers, resistors, etc. in the module, if the electronic device is an adapter, the above-mentioned components can be frequency converters, transformers, etc., or even the entire circuit board in the adapter; and so on.

Finally, it is noted that the above embodiments are only used to illustrate the technical solutions of the present application, and limit it; although the application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: it can still be used for the foregoing The technical solutions recorded in each embodiment are modified, or some of the technical features are equivalently replaced; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions in the various embodiments of the application.

Claims

A heat-conducting insulating case, characterized in that it comprises:

The heat dissipation component (110) is used to be nested on the component, and transfer the heat on the component to the outside; wherein, the heat dissipation component is a three-dimensional structure made of a heat-conducting insulating material, and the heat-conducting The insulating material includes a fibrous material comprising at least two types of fibers and a thermally conductive filler filled in pores in a matrix composed of the fibrous material.
The thermally conductive insulating case according to claim 1, wherein the thermally conductive filler is a non-conductive material.
The heat-conducting and insulating case according to claim 1 or 2, wherein at least one fixing structure is provided on the heat dissipation component for coupling with the fixing structure on the component.
The thermally conductive insulating case according to any one of claims 1-3, further comprising:

At least one shielding component (120) is arranged on the outer surface of the heat dissipation component, and is used for shielding the electric signals emitted by the components.
The heat-conducting insulating case according to claim 4, wherein the bonding method between the at least one shielding component and the outer surface of the heat-dissipating component is physical contact, pressure bonding, adhesive sticking and fixing the component. one or more of .
The heat-conducting insulating case according to claim 4 or 5, characterized in that, the shape of the shielding component is a graphene sheet, a metal coating, a metal sheet, a network structure formed by interweaving metal wires, or a network formed by interweaving carbon fibers. One or more of the flakes formed by bonding metal powders and metal powders.
The heat-conducting insulating case according to any one of claims 4-6, wherein each shielding component is provided with at least one fixing structure for coupling with the fixing structure on the component.
The thermally conductive insulating case according to any one of claims 1-8, further comprising:

The adhesive is arranged on the outer surface of the heat dissipation component, and is used for fixing the heat dissipation component on the component.
An electronic device, characterized in that it comprises:

at least one component,

At least one heat-conducting and insulating case according to claims 1-8, wherein the at least one heat-conducting and insulating case is respectively nested on the at least one component.