CN112492743A - Heat radiation structure of multilayer printed circuit board - Google Patents
Heat radiation structure of multilayer printed circuit board Download PDFInfo
- Publication number
- CN112492743A CN112492743A CN202011235385.1A CN202011235385A CN112492743A CN 112492743 A CN112492743 A CN 112492743A CN 202011235385 A CN202011235385 A CN 202011235385A CN 112492743 A CN112492743 A CN 112492743A
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- heat
- conducting
- circuit board
- printed circuit
- multilayer printed
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0204—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate
- H05K1/0206—Cooling of mounted components using means for thermal conduction connection in the thickness direction of the substrate by printed thermal vias
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0201—Thermal arrangements, e.g. for cooling, heating or preventing overheating
- H05K1/0203—Cooling of mounted components
- H05K1/0209—External configuration of printed circuit board adapted for heat dissipation, e.g. lay-out of conductors, coatings
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/14—Structural association of two or more printed circuits
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Insulated Metal Substrates For Printed Circuits (AREA)
- Structure Of Printed Boards (AREA)
- Production Of Multi-Layered Print Wiring Board (AREA)
Abstract
The invention discloses a heat dissipation structure of a multilayer printed circuit board, which comprises a plurality of layers of core boards, prepregs for connecting two core boards, and copper foil surfaces, wherein the core boards, the prepregs and the copper foil surfaces of all the layers are overlapped to form the multilayer printed circuit board; the core plate comprises a substrate, wherein a layer of heat-conducting metal particles and a layer of heat-conducting graphite film are laid on the upper surface and the lower surface of the substrate; the heat dissipation holes are divided into conduction holes and heat dissipation through holes, the conduction holes comprise round holes used for communicating printed conductors and a plurality of groups of tooth holes arranged on the outer edges of the round holes in a surrounding mode, and heat conduction media are filled in the heat dissipation through holes. The heat conduction of the longitudinal surface is accelerated by the heat conduction blocks, the conducting holes and the heat dissipation through holes, the heat conduction of the transverse surface is realized by combining the core plate with the multilayer composite structure, the heat conductivity coefficient of the multilayer PCB is effectively improved, the heat conduction efficiency is further improved, and the heat dissipation performance of the PCB is greatly improved.
Description
Technical Field
The invention belongs to the technical field of printed circuit boards, and particularly relates to a heat dissipation structure of a multilayer printed circuit board.
Background
Printed circuit boards (PCB for short) are providers of electrical connections for electronic components and are classified into single-sided boards, double-sided boards, and multilayer circuit boards according to the number of layers of the circuit boards. With the development of internet information, the development direction of PCBs is miniaturization and densification, and the increase in packaging density of integrated circuits leads to a high concentration of interconnection lines, which necessitates the use of multilayer circuit boards. The integrated circuit part loads on the circuit board, along with the more and more high of circuit board design number of piles, circuit element mounting density is bigger and bigger, make the heat that the PCB during operation produced also more and more, PCB is in relative confined operational environment mostly in addition, no matter the moisture of external entering or the condensation pearl that high temperature produced, make long-time operation back PCB periphery be the high temperature and high humidity environment, long-time work can make PCB material inside ionic electromigration appear, copper layer fracture in the connecting hole, phenomenon such as surface welding point fatigue, and then can cause electronic product electrical property to descend, the noise increase, the original characteristic of circuit has been changed and serious damage even. Therefore, the heat dissipation problem of PCBs, especially multilayer printed circuit boards, has been one of the concerns of the electronics industry.
The heat dissipation of the object mainly comprises four modes, namely radiation, conduction, convection, evaporation, radiation, convection, evaporation and the like, which mostly need external force, and for the multilayer printed circuit board, the heat dissipation contribution generated by internal leads and electronic components is small, so that the heat conductivity coefficient of the multilayer PCB is improved more effectively, the heat conduction efficiency is improved, and the heat dissipation performance of the PCB is greatly improved.
Disclosure of Invention
Aiming at the defects and difficulties in the prior art, the invention aims to provide a heat dissipation structure of a multilayer printed circuit board.
The invention is realized by the following technical scheme:
a heat dissipation structure of a multilayer printed circuit board comprises a plurality of layers of core boards, prepregs for connecting every two core boards and copper foil surfaces, wherein the core boards, the prepregs and the copper foil surfaces of all the layers are overlapped to form the multilayer printed circuit board, a heat conduction block is partially embedded in the multilayer printed circuit board, and heat dissipation holes are formed in the multilayer printed circuit board and penetrate through the multilayer printed circuit board from top to bottom; the core plate comprises a substrate, wherein a layer of heat-conducting metal particles and a layer of heat-conducting graphite film are paved on the upper surface and the lower surface of the substrate, a layer of heat-conducting metal particles is prepared on the upper surface and the lower surface of the substrate by adopting a magnetron sputtering method or a metal-assisted chemical corrosion method, and then heat-conducting graphite powder pressed into a target material is coated on the upper surface and the lower surface of the substrate by a physical vapor deposition method to form a layer of heat-conducting graphite film; the heat dissipation holes are divided into conduction holes and heat dissipation through holes, the conduction holes comprise round holes used for communicating printed conductors and a plurality of groups of tooth holes arranged on the outer edges of the round holes in a surrounding mode, and heat conduction media are filled in the heat dissipation through holes.
Further, a copper plating layer is arranged on the hole wall of the via hole; the heat conducting block is a copper block or an aluminum block.
Further, copper or aluminum or tin particles are used as the heat conducting metal particles.
Furthermore, the particle size of the heat-conducting metal particles is 10-500 μm.
Further, the thickness of the heat-conducting graphite film is more than 2 times of the particle size of the heat-conducting metal particles.
Further, the heat-conducting medium is formed by mixing fibrous carbon powder or flaky high-heat-conductivity carbon powder with a heat-conducting binder.
Further, when the substrate is prepared, an inorganic composite material is mixed into the reinforcing material, the inorganic composite material comprises an inorganic heat-conducting filler and an inorganic flame-retardant filler, and the volume fraction of the inorganic heat-conducting filler in the inorganic composite material is 40-80%.
Compared with the prior art, the invention has the beneficial effects that:
(1) the heat conduction of the longitudinal surface is accelerated by the heat conduction blocks, the conducting holes and the heat dissipation through holes, the heat conduction of the transverse surface is realized by combining the core plate with the multilayer composite structure, the heat conductivity coefficient of the multilayer PCB is effectively improved, the heat conduction efficiency is further improved, and the heat dissipation performance of the PCB is greatly improved.
(2) The core plate of the invention forms a multi-layer composite structure, and the upper surface and the lower surface of the core plate are respectively paved with a heat-conducting metal particle layer and a heat-conducting graphite film layer, so that the structural consistency and uniformity of the core plate can be ensured while the heat conductivity is enhanced, and the characterization heat conductivity coefficient of the core plate in the horizontal direction is greatly increased.
Drawings
FIG. 1 is a schematic view of a longitudinal section of the present invention.
Fig. 2 is a schematic longitudinal sectional view of the core board of the present invention.
FIG. 3 is a schematic top view of a via hole of the present invention
Illustration of the drawings: 1-core plate, 101-substrate, 102-heat conducting metal particles, 103-heat conducting graphite film, 2-prepreg, 3-copper foil surface, 4-heat conducting block, 5-via hole, 501-round hole, 502-tooth hole and 6-radiating hole.
In the description of the present invention, the terms "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.
In the description of the present invention, it is to be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, and may be, for example, fixedly connected, detachably connected, and integrally connected; can be mechanical connection and electrical connection; may be directly connected, indirectly connected through intervening agents, or may be interconnected between two elements. The specific meaning of the above terms in the present invention can be specifically understood by those of ordinary skill in the art.
Detailed Description
The invention will be further described with reference to the accompanying drawings.
As shown in fig. 1 and 2, a heat dissipation structure of a multilayer printed circuit board includes a plurality of layers of core boards 1, prepregs 2 and copper foil surfaces 3 connecting two core boards 1, each layer of core boards 1, prepregs 2 and copper foil surfaces 3 forming a multilayer printed circuit board, the copper foil surfaces 3 are disposed on the surfaces of the core boards 1, and are disposed according to the application of the actual multilayer printed circuit board, the copper foil surfaces of some PCBs are disposed on the surface of the outermost core board 1, and the copper foil surfaces 3 are also disposed on the two surfaces of some single-layer core boards 1.
And the heat conducting block 4 is partially embedded in the multilayer printed circuit board on the longitudinal layer surface, and heat radiating holes are formed. The embedded heat conduction block 4 integrates a high-heat-conductivity heat dissipation metal block in a certain local area of the multilayer PCB in a passive device embedding mode to realize heat dissipation, and the heat dissipation holes penetrate the multilayer PCB up and down and accelerate heat conduction by opening the longitudinal surface.
The heat conduction block 4 is made of a copper block or an aluminum block, the core plate 1 and the prepreg 2 are grooved, the heat conduction block 4 is embedded into the grooves, and the heat conduction block 4, the core plate 1 and the prepreg 2 are tightly bonded together through the processes of glue filling, fusion, lamination, high-temperature pressing and the like.
The heat dissipation holes are divided into a through hole 5 and a heat dissipation through hole 6, the through hole 5 belongs to a dual-role heat dissipation hole, the dual-role heat dissipation hole is used for communicating printed conductors among all layers and has the heat conduction function of all longitudinal layers, and the size and the position of the through hole 5 are determined according to the requirements of the conductors; the thermal dissipating vias 6 are "full-time" thermal dissipating holes, which are through holes that are specially perforated for heat dissipation. In the specific implementation, the positions and the sizes of the heat dissipation through holes 6 are both careful so as to avoid influencing the positions of the routing and the embedded heat conduction blocks.
Because the conducting hole 5 has the conducting wire to pass through inevitably when using, except the heat that multilayer printed circuit board self produced, the printed wiring also can produce the heat during operation, in order to improve its heat conduction function, be equipped with the copper coating in the pore wall of conducting hole 5, as shown in fig. 3, conducting hole 5 is including the round hole 501 that is used for the printed wiring intercommunication, encircle and set up a plurality of groups of pin holes 502 at the round hole 501 outer edge, pin hole 502 increases the surface area of conducting hole 5 when not influencing the printed wiring and walk the line, and then indirectly increases heat dispersion.
The cross-sectional shape of the heat dissipation via hole 6 is not fixed, and may be any shape such as a round hole, a square hole, an irregular hole, and the like, in order to increase the heat dissipation efficiency, the heat dissipation via hole 6 is filled with a heat conduction medium, and the heat conduction medium is a medium material which is convenient to fill and has a heat conduction function, and is filled into the heat dissipation via hole 6 after a binder such as fibrous carbon powder, scaly high-heat-conductivity carbon powder, and the like, mixed heat conduction silica gel, heat conduction paste, and. The fibrous carbon powder and the scale-shaped high-thermal-conductivity carbon powder are nano-scale powder with high thermal conductivity coefficient, the thermal conductivity coefficient of the fibrous carbon powder and the scale-shaped high-thermal-conductivity carbon powder is far higher than that of metals such as copper and aluminum, for example, the fibrous carbon powder can reach 700W/mk at most, and meanwhile, the fibrous carbon powder has good mechanical property and electrical conductivity and excellent heat conduction and radiation heat dissipation capabilities.
According to the PCB total heat dissipation coefficient equation
(wherein, λ)iIs the thermal conductivity of the i layer of the heat conductor, hiIs the thickness of the i-layer of the heat conductor, AiThe residual rate of the graph of the i layer of the heat conductor, H is the whole thickness of the PCB), the residual rate of the graph and the thickness of the PCB are determined according to the actual application of the circuit board, the routing requirement of the graph layer and other factors, and for a PCB bare board, the heat conductivity coefficient of the core board plays a key role in the heat dissipation performance of the PCB. The core board has the functions of conducting electricity, insulating electricity and supporting, and the base board materials of the core board can be divided into two categories: the rigid substrate material is a copper-clad plate, and is prepared by soaking a reinforcing material in a resin adhesive, drying, cutting, overlapping to form a blank, then coating a copper foil, using a steel plate as a die, and performing high-temperature and high-pressure forming processing in a hot press. It can be seen that the conventional core plate is made of organic resin and reinforcing materials, and has a small heat conductivity coefficient and poor heat dissipation performance. In order to further increase the thermal conductivity of the core plate 1, an inorganic composite material is proportionally mixed into the reinforcing material when the substrate 101 is prepared, the inorganic composite material comprises an inorganic thermal conductive filler and an inorganic flame-retardant filler, and the inorganic thermal conductive filler comprises but is not limited to micron-sized alumina, silica powder, nano-alumina, nitride powder, fibrous carbon powder and scale-shaped high thermal conductive carbon powder and is used for increasing the thermal conductivity of the substrate 101; inorganic flame retardant fillers include, but are not limited to, aluminum hydroxide, magnesium hydroxide, which are used to increase the difficulty of burning the substrate 101. Wherein the volume fraction of the inorganic heat-conducting filler in the inorganic composite material is 40-80%. The reinforcing material of the core board 1 adopts the materials allowed in the field, such as paper base, glass fiber cloth base, composite base, laminated multilayer board base and special material base (ceramic, metal core base and the like), and the details are not detailedAre set forth.
In a transverse layer, the heat conductivity coefficient of the core board is improved, so that the heat dissipation performance can be effectively enhanced, the core board 1 comprises a substrate 101, a layer of heat-conducting metal particles 102 and a layer of heat-conducting graphite film 103 are paved on the upper surface and the lower surface of the substrate 101, and a layer of heat-conducting metal particles 102 are prepared on the upper surface and the lower surface of the substrate 101 by a magnetron sputtering method or a metal-assisted chemical corrosion method; and then coating the heat-conducting graphite powder pressed into the target on the upper and lower surfaces of the substrate 101 by a physical vapor deposition method to form a layer of heat-conducting graphite film 103.
The heat-conducting metal particles 102 are copper, aluminum or tin particles, and have high heat conductivity and low cost; the particle size of the heat-conducting metal particles 102 is 10-500 microns, and the micron-level metal particles not only keep high heat conductivity, but also reduce weight and are more uniform.
The raw material of the heat-conducting graphite film 103 is powder made of graphite heat-radiating fins, the heat-conducting graphite film has unique crystal grain orientation, conducts heat uniformly along two directions, has high heat conductivity coefficient (up to 1500W/M.K in the horizontal direction), is light in weight and low in heat resistance, the thickness of the heat-conducting graphite film 103 is more than 2 times of the particle size of the heat-conducting metal particles 102, and the heat-conducting graphite film covers the heat-conducting metal particles 102 on one hand and has enough coating surface to keep heat conduction in the horizontal direction on the other hand.
The core plate 1 forms a multi-layer composite structure, the structural consistency and uniformity of the core plate can be ensured while the heat conductivity is enhanced, and the characterization heat conductivity coefficient of the core plate 1 in the horizontal direction is greatly increased.
The foregoing merely represents preferred embodiments of the invention, which are described in some detail and detail, and therefore should not be construed as limiting the scope of the invention. It should be noted that, for those skilled in the art, various changes, modifications and substitutions can be made without departing from the spirit of the present invention, and these are all within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.
Claims (7)
1. The utility model provides a heat radiation structure of multilayer printed circuit board which characterized in that: the printed circuit board comprises a plurality of layers of core boards (1), prepregs (2) and copper foil surfaces (3) which connect every two core boards (1), wherein the core boards (1), the prepregs (2) and the copper foil surfaces (3) of each layer are overlapped to form a multilayer printed circuit board, a heat conduction block (4) is embedded in the local part of the multilayer printed circuit board, and heat dissipation holes are formed in the multilayer printed circuit board and penetrate through the multilayer printed circuit board from top to bottom; the core plate (1) comprises a substrate (101), a layer of heat-conducting metal particles (102) is prepared on the upper surface and the lower surface of the substrate (101) by adopting a magnetron sputtering method or a metal-assisted chemical corrosion method, and then heat-conducting graphite powder pressed into a target is coated on the upper surface and the lower surface of the substrate (101) by a physical vapor deposition method to form a layer of heat-conducting graphite film (103), so that the upper surface and the lower surface of the substrate (101) are both paved with a layer of heat-conducting metal particles (102) and a layer of heat-conducting graphite film (103); the louvre divide into conducting hole (5) and heat dissipation via hole (6), conducting hole (5) include round hole (501), encircle to set up a plurality of groups tooth holes (502) on round hole (501) outer edge, heat-conducting medium packs in heat dissipation via hole (6).
2. The heat dissipating structure of a multilayer printed circuit board as claimed in claim 1, wherein: the hole wall of the via hole (5) is provided with a copper plating layer; the heat conducting block (4) is a copper block or an aluminum block.
3. The heat dissipating structure of a multilayer printed circuit board as claimed in claim 1, wherein: the heat conducting metal particles (102) adopt copper or aluminum or tin particles.
4. The heat dissipating structure of a multilayer printed circuit board as claimed in claim 1, wherein: the particle size of the heat-conducting metal particles (102) is 10-500 mu m.
5. The heat dissipating structure of a multilayer printed circuit board as claimed in claim 1, wherein: the thickness of the heat-conducting graphite film (103) is more than 2 times of the grain diameter of the heat-conducting metal particles (102).
6. The heat dissipating structure of a multilayer printed circuit board as claimed in claim 1, wherein: the heat-conducting medium is formed by mixing fibrous carbon powder or flaky high-heat-conducting carbon powder with a heat-conducting binder.
7. The heat dissipating structure of a multilayer printed circuit board as claimed in claim 1, wherein: when the substrate (101) is prepared, an inorganic composite material is mixed into a reinforcing material, the inorganic composite material comprises an inorganic heat-conducting filler and an inorganic flame-retardant filler, and the volume fraction of the inorganic heat-conducting filler in the inorganic composite material is 40-80%.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011235385.1A CN112492743A (en) | 2020-11-06 | 2020-11-06 | Heat radiation structure of multilayer printed circuit board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202011235385.1A CN112492743A (en) | 2020-11-06 | 2020-11-06 | Heat radiation structure of multilayer printed circuit board |
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| CN112492743A true CN112492743A (en) | 2021-03-12 |
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| CN202011235385.1A Pending CN112492743A (en) | 2020-11-06 | 2020-11-06 | Heat radiation structure of multilayer printed circuit board |
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Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN113075979A (en) * | 2021-03-26 | 2021-07-06 | 山东英信计算机技术有限公司 | Conduction structure using PCB for heat dissipation and implementation method |
| CN113708022A (en) * | 2021-08-21 | 2021-11-26 | 深圳市日升质电子科技有限公司 | Lithium battery with charging protection function |
| CN115835485A (en) * | 2023-02-15 | 2023-03-21 | 四川英创力电子科技股份有限公司 | Multilayer printed circuit board and processing method thereof |
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| CN108093559A (en) * | 2017-12-15 | 2018-05-29 | 徐州帝意电子有限公司 | A kind of electronic circuit board to conduct electricity very well |
| CN208781834U (en) * | 2018-08-10 | 2019-04-23 | 北京嘉楠捷思信息技术有限公司 | Heat radiation structure |
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Patent Citations (6)
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| NL1038892C2 (en) * | 2011-06-24 | 2013-01-02 | Holding B V Ges | Heat sinking coating. |
| CN102271456A (en) * | 2011-07-13 | 2011-12-07 | 东北大学 | Heat-conduction ceramic-based printed circuit board (PCB) and manufacture method thereof |
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| Publication number | Priority date | Publication date | Assignee | Title |
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| CN113075979A (en) * | 2021-03-26 | 2021-07-06 | 山东英信计算机技术有限公司 | Conduction structure using PCB for heat dissipation and implementation method |
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Application publication date: 20210312 |