CN209098564U - A kind of NEW TYPE OF COMPOSITE adhesive tape - Google Patents
A kind of NEW TYPE OF COMPOSITE adhesive tape Download PDFInfo
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- CN209098564U CN209098564U CN201821896999.2U CN201821896999U CN209098564U CN 209098564 U CN209098564 U CN 209098564U CN 201821896999 U CN201821896999 U CN 201821896999U CN 209098564 U CN209098564 U CN 209098564U
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- film
- adhesive tape
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Abstract
The utility model discloses a kind of NEW TYPE OF COMPOSITE adhesive tapes, including substrate, copper foil layer, protection film layer, conductive membrane layer, conductive adhesive layer and release film layer；Substrate is non-woven fabrics；Copper foil layer stackup is compounded in the outer surface of non-woven fabrics；Protection film layer is covered in copper foil layer surface；Protection film layer is polytetrafluoroethylene film；Conductive membrane layer is compounded in the inner surface of substrate；Conductive membrane layer includes PET film and graphene conductive layer；Graphene conductive layer with a thickness of 5-25 μm；Graphene conductive layer is compounded in the inner surface of PET film；The outer surface of PET film and substrate are compound；Composite conducting adhesive layer is laminated on conductive membrane layer surface；Release film layer lid is located at conductive adhesive layer surface.The frivolous softness of the utility model, flexibility is good, has good conductive property and electromagnetic shielding performance, can be used in the transmission of high-frequency signal, stability is good, perfect heat-dissipating, and using effect is good.
Description
Technical field
The utility model relates to gum field, in particular to a kind of NEW TYPE OF COMPOSITE adhesive tape.
Background technique
With the development of the consumer electronics industry, consumption electronic product increasingly shows miniaturization, lightweight, slimming
Feature, under this trend, the integrated level of electronic product is higher and higher, volume is smaller and smaller, power is more and more stronger；Therefore, high
The narrow trend in power, high integration, application space just brings a series of conductive, radiation interference for consumption electronic product
The problems such as；However, traditional conductive connection scheme, such as metal spring leaf, wire and cable are online, connector, because volume is larger,
It needs space more, is unable to satisfy consumption electronic product lightweight and using the demand in small space.
Conductive tape is extensive because of light-weight, thickness is thin, has certain cementability and corresponding electric conductivity
Apply in consumer electronics industry, Lai Shixian electronic product internal electrostatic ground connection with electromagnetic shielding needs.Existing conduction
That there are electric conductivities is undesirable for adhesive tape, and stability is poor, the problem of heat dissipation performance difference.
Utility model content
In order to solve the above technical problems, the utility model provides a kind of NEW TYPE OF COMPOSITE adhesive tape, using multi-layer compound structure,
Change single electric current transmission mode, solve existing conductive tape there are electric conductivities undesirable, stability is poor, thermal diffusivity
The problem of energy difference.
In order to achieve the above objectives, the technical solution of the utility model is as follows: a kind of NEW TYPE OF COMPOSITE adhesive tape, including substrate, copper
Layers of foil, protection film layer, conductive membrane layer, conductive adhesive layer and release film layer；The substrate is non-woven fabrics；The copper foil is layer by layer
The folded outer surface for being compounded in the non-woven fabrics；The protection film layer is covered in the copper foil layer surface；The protection film
Layer is polytetrafluoroethylene film；The conductive membrane layer is compounded in the inner surface of the substrate；The conductive membrane layer includes PET
Film and graphene conductive layer；The graphene conductive layer is the layer structure formed by chemical vapour deposition technique；The stone
Black alkene conductive layer with a thickness of 5-25 μm；The graphene conductive layer is compounded in the inner surface of the PET film；The PET is thin
The outer surface of film and the substrate are compound；The compound conductive adhesive layer is laminated on the conductive membrane layer surface；It is described release
Film layer lid is located at the conductive adhesive layer surface.
As a kind of preferred embodiment of the utility model, the conductive adhesive layer is using silver powder as filler；The silver powder exists
It is 1-2.5g/cm in the conductive adhesive layer3。
As a kind of preferred embodiment of the utility model, the colloid of the conductive adhesive layer is anacidity acrylate.
As a kind of preferred embodiment of the utility model, the conductive adhesive layer with a thickness of 30-40 μm.
As a kind of preferred embodiment of the utility model, the polytetrafluoroethylene film with a thickness of 0.12-0.25mm.
As a kind of preferred embodiment of the utility model, the non-woven fabrics is glass non-woven fabrics.
As a kind of preferred embodiment of the utility model, the copper foil layer with a thickness of 10-15 μm.
Through the above technical solutions, the beneficial effect of technical solutions of the utility model is: the frivolous softness of the utility model, it is soft
Good toughness, has good conductive property and electromagnetic shielding performance, can be used in the transmission of high-frequency signal, and stability is good, heat dissipation
Performance is good, and using effect is good.
Detailed description of the invention
In order to illustrate the embodiment of the utility model or the technical proposal in the existing technology more clearly, below will be to embodiment
Or attached drawing needed to be used in the description of the prior art is briefly described, it should be apparent that, the accompanying drawings in the following description is only
It is some embodiments of the utility model, for those of ordinary skill in the art, in the premise not made the creative labor
Under, it is also possible to obtain other drawings based on these drawings.
Fig. 1 is the structural schematic diagram of the utility model.
Number and corresponding component title represented by letter in figure:
1. 2. copper foil layer of protection film layer, 3. substrate
4. 5. conductive adhesive layer of conductive membrane layer, 6. release film layer.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without creative efforts
Every other embodiment obtained, fall within the protection scope of the utility model.
Embodiment
In conjunction with Fig. 1, the utility model discloses a kind of NEW TYPE OF COMPOSITE adhesive tapes to be produced as a kind of conductive tape for electronics
On product.The utility model includes substrate 3, copper foil layer 2, protection film layer 1, conductive membrane layer 4, conductive adhesive layer 5 and release film
Layer 6.Substrate 3 is non-woven fabrics, and flexibility is good, and combined strength bination is high.Preferably, non-woven fabrics is glass non-woven fabrics.The stacking of copper foil layer 2 is multiple
It closes in the outer surface of non-woven fabrics, primarily serves effectiveness.Copper foil layer 2 with a thickness of 10-15 μm.On 2 surface of copper foil layer
It is covered with protection film layer 1.Preferably, polytetrafluoroethylene film with a thickness of 0.12-0.25mm.Protection film layer 1 is poly- four
Fluoroethylene film, insulating radiation performance is good, can be good at protecting copper foil layer 2.
The utility model is using conductive membrane layer 4 and conductive adhesive layer 5 as conductive functional layers.Conductive membrane layer 4 is compounded in
The inner surface of substrate 3；Conductive membrane layer 4 includes PET film and graphene conductive layer.Graphene conductive layer is to pass through chemical gaseous phase
The layer structure that sedimentation is formed.Graphene conductive layer with a thickness of 5-25 μm.Graphene conductive layer is compounded in the interior of PET film
Surface.The outer surface of PET film and substrate 3 are compound.Composite conducting adhesive layer 5 is laminated on 4 surface of conductive membrane layer.Conductive gluing
Layer 5 with a thickness of 30-40 μm.The colloid of conductive adhesive layer 5 is anacidity acrylate.Conductive adhesive layer 5 is using silver powder as filler.
The adhesion property and electric conductivity of adhesive tape in order to balance, silver powder are 1-2.5g/cm in conductive adhesive layer 53。
The lid of release film layer 6 is located at 5 surface of conductive adhesive layer, prevents adhesive tape viscous.
By above-mentioned specific embodiment, the beneficial effects of the utility model are: the frivolous softness of the utility model, flexibility
It is good, it has good conductive property and electromagnetic shielding performance, can be used in the transmission of high-frequency signal, stability is good, heat dissipation performance
It is good, using effect.
The foregoing description of the disclosed embodiments can be realized professional and technical personnel in the field or using originally practical new
Type.Various modifications to these embodiments will be readily apparent to those skilled in the art, and determine herein
The General Principle of justice can be realized in other embodiments without departing from the spirit or scope of the present utility model.Cause
This, the present invention will not be limited to the embodiments shown herein, and is to fit to and principles disclosed herein
The widest scope consistent with features of novelty.
Claims (7)
1. a kind of NEW TYPE OF COMPOSITE adhesive tape, which is characterized in that including substrate, copper foil layer, protection film layer, conductive membrane layer, conduction
Adhesive layer and release film layer；The substrate is non-woven fabrics；The copper foil layer stackup is compounded in the outer surface of the non-woven fabrics；Institute
It states copper foil layer surface and is covered with the protection film layer；The protection film layer is polytetrafluoroethylene film；The conductive film
Layer is compounded in the inner surface of the substrate；The conductive membrane layer includes PET film and graphene conductive layer；The graphene is led
Electric layer is the layer structure formed by chemical vapour deposition technique；The graphene conductive layer with a thickness of 5-25 μm；The stone
Black alkene conductive layer is compounded in the inner surface of the PET film；The outer surface of the PET film and the substrate are compound；Described
The compound conductive adhesive layer is laminated in conductive membrane layer surface；The release film layer lid is located at the conductive adhesive layer surface.
2. NEW TYPE OF COMPOSITE adhesive tape according to claim 1, which is characterized in that the conductive adhesive layer is using silver powder as filling out
Material；The silver powder is 1-2.5g/cm in the conductive adhesive layer3。
3. NEW TYPE OF COMPOSITE adhesive tape according to claim 2, which is characterized in that the colloid of the conductive adhesive layer is anacidity third
Olefin(e) acid ester.
4. NEW TYPE OF COMPOSITE adhesive tape according to claim 2, which is characterized in that the conductive adhesive layer with a thickness of 30-40 μ
m。
5. NEW TYPE OF COMPOSITE adhesive tape according to claim 4, which is characterized in that the polytetrafluoroethylene film with a thickness of
0.12-0.25mm。
6. NEW TYPE OF COMPOSITE adhesive tape according to claim 5, which is characterized in that the non-woven fabrics is glass non-woven fabrics.
7. NEW TYPE OF COMPOSITE adhesive tape according to claim 6, which is characterized in that the copper foil layer with a thickness of 10-15 μm.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821896999.2U CN209098564U (en) | 2018-11-16 | 2018-11-16 | A kind of NEW TYPE OF COMPOSITE adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821896999.2U CN209098564U (en) | 2018-11-16 | 2018-11-16 | A kind of NEW TYPE OF COMPOSITE adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN209098564U true CN209098564U (en) | 2019-07-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821896999.2U Active CN209098564U (en) | 2018-11-16 | 2018-11-16 | A kind of NEW TYPE OF COMPOSITE adhesive tape |
Country Status (1)
| Country | Link |
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| CN (1) | CN209098564U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111040656A (en) * | 2019-12-26 | 2020-04-21 | 上海至纯洁净系统科技股份有限公司 | Heat-conducting and electric-conducting composite film and integrated heating module |
-
2018
- 2018-11-16 CN CN201821896999.2U patent/CN209098564U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111040656A (en) * | 2019-12-26 | 2020-04-21 | 上海至纯洁净系统科技股份有限公司 | Heat-conducting and electric-conducting composite film and integrated heating module |
| CN111040656B (en) * | 2019-12-26 | 2022-03-11 | 上海至纯洁净系统科技股份有限公司 | Heat-conducting and electric-conducting composite film and integrated heating module |
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