CN206242623U - A kind of heat conduction wave absorbing patch - Google Patents
A kind of heat conduction wave absorbing patch Download PDFInfo
- Publication number
- CN206242623U CN206242623U CN201621183200.6U CN201621183200U CN206242623U CN 206242623 U CN206242623 U CN 206242623U CN 201621183200 U CN201621183200 U CN 201621183200U CN 206242623 U CN206242623 U CN 206242623U
- Authority
- CN
- China
- Prior art keywords
- layer
- insulating barrier
- wave absorbing
- heat conduction
- tack coat
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
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Abstract
The utility model discloses a kind of heat conduction wave absorbing patch, successively including protective layer, reflecting layer, suction ripple layer, insulating barrier, tack coat and release layer；Wherein, protective layer is polyimide covercoat, and reflecting layer is to sputter at aluminum membranous layer 200nm thick on protective layer inner surface, and it is that the silicon rubber for being mixed with nano combined wave absorbing agent inhales ripple layer to inhale ripple layer, and insulating barrier is PET film layer, and surface of insulating layer resistivity is more than 1013Ω cm, graphite fibre layer is covered with insulating barrier and the contact surface of tack coat；Inhale ripple layer and be provided with multiple projections on the contact surface with insulating barrier, insulating barrier be provided with multiple grooves on ripple layer contact surface with inhaling, in each projection corresponding groove of insertion；Reflecting layer, suction ripple layer, insulating barrier and tack coat are fixed by adhesive and binded, and release layer is pasted in the outside of the tack coat.The utility model heat conduction wave absorbing patch has thickness of thin, wave absorbing efficiency high and good heat conductivity advantage.
Description
Technical field
The utility model is related to a kind of paster for having heat conduction concurrently and inhaling ripple, be electromagnetically shielded for integrated circuit surface.
Background technology
Various electronics, communication and electrical equipment have been widely used, and these equipment not only need to shield external electromagnetic wave
Interference, while being also required to reduce itself electromagnetic leakage to environment, and avoid enclosure interior each element mutual
Electromagnetic interference.Therefore, housing internal shield should not only have preferable shielding action, also need good absorbing property to enter one
Step reduces the mutual electromagnetic interference of electromagnetic leakage and interelement.Miniaturization, lightweight with consumer electronics, these electronics are produced
Product internal integrated circuit block is more and more intensive, interfere it is also increasing, while produce heat ratio relatively concentrate, it is necessary in time
Distribute.Therefore one kind can shield extraneous electromagnetic wave interference, reflection of electromagnetic wave rate in housing can be reduced again, while can lead
The exploitation of the wave absorbing patch of heat is necessary.
Utility model content
Utility model purpose：Technical problem to be solved in the utility model be to provide a kind of thickness of thin, wave absorbing efficiency it is high,
The heat conduction wave absorbing patch of good heat conductivity.
In order to solve the above technical problems, the technical scheme that is used of the utility model for：
A kind of heat conduction wave absorbing patch, successively including protective layer, reflecting layer, suction ripple layer, insulating barrier, tack coat and release layer；
Wherein, the protective layer is polyimide covercoat, and the reflecting layer is to sputter at aluminium film 200nm thick on protective layer inner surface
Layer, described to inhale ripple layer to be mixed with the silicon rubber suction ripple layer of nano combined wave absorbing agent, the insulating barrier is PET film layer, described exhausted
Edge layer surface resistivity is more than 1013Ω cm, graphite fibre layer is covered with the insulating barrier and the contact surface of tack coat；The suction
Ripple layer is provided with multiple projections on the contact surface with insulating barrier, and the insulating barrier be provided with multiple recessed on ripple layer contact surface with inhaling
Groove, in each described raised corresponding groove of insertion；The reflecting layer, suction ripple layer, insulating barrier and tack coat are by bonding
Bonding is fixed in agent, and the release layer is pasted in the outside of the tack coat.
Wherein, the thickness of the protective layer is 0.01~0.02mm.
Wherein, the sheet resistance in the reflecting layer is not more than 200 ohm.
Wherein, the thickness for inhaling ripple layer is 0.03~0.07mm.
Wherein, the nano combined wave absorbing agent is Graphene/ferrite nano composite wave-absorbing agent.
Wherein, the thickness of the insulating barrier is 0.01~0.02mm.
Wherein, the tack coat is acrylate glue-line or pressure-sensitive adhesive layer.
Compared to prior art, technical solutions of the utility model have the advantage that for：
The utility model heat conduction wave absorbing patch is easy to use, pastes in surface-mounted integrated circuit paster by tearing off after release layer
On, and the insulation of surface-mounted integrated circuit and shell can be realized；Secondly, the utility model paster thickness of thin, can and integrated circuit
Plate is brought into close contact, and also facilitates cross cutting；Again, the suction ripple layer of the utility model paster is mixed with composite nano wave-absorbing material, the material
Material has resistance loss and magnetic loss simultaneously, and wave-absorbing effect is good, and reflection of electromagnetic wave rate is low in shell, reduces electromagnetic leakage and shell
Interior electronic component is interfered；Finally, the utility model paster good heat conductivity, its horizontal thermal conductivity factor is higher than 1000W/
M.K, thermal conductivity is high, and the heat of high energy consumption electronic component is easily spread apart, and can also be distributed well.
Brief description of the drawings
Fig. 1 is the structural representation of the utility model heat conduction wave absorbing patch；
Fig. 2 is the top view of suction ripple layer in the utility model heat conduction wave absorbing patch；
Fig. 3 is the top view of insulating barrier in the utility model heat conduction wave absorbing patch.
Specific embodiment
According to following embodiments, the utility model may be better understood.However, those skilled in the art easily manages
Solution, the content described by embodiment is merely to illustrate the utility model, without should also without limitation on institute in claims in detail
The utility model of thin description.
With reference to Fig. 1~3, heat conduction wave absorbing patch of the present utility model includes that (protective layer 1 is located at protective layer 1 successively on longitudinal direction
Outermost layer), reflecting layer 2, inhale ripple layer 3, insulating barrier 4, tack coat 5 and release layer 6；Wherein, protective layer 1 is polyimides protection
Layer, the thickness of protective layer 1 is 0.02mm；Reflecting layer 2 is to sputter at aluminum membranous layer 200nm thick on the inner surface of protective layer 1, reflecting layer
2 sheet resistance is not more than 200 ohm；It is that the silicon rubber for being mixed with nano combined wave absorbing agent inhales ripple layer, nano combined suction ripple to inhale ripple layer 3
Agent is Graphene/ferrite nano composite wave-absorbing agent, and the thickness for inhaling ripple layer is 0.05mm；Insulating barrier 4 is PET film layer, insulating barrier 4
Thickness be 0.02mm, the surface resistivity of insulating barrier 4 be more than 1013Ω cm, insulating barrier 4 can guarantee that surface-mounted integrated circuit and shell
Insulation, graphite fibre layer 9 is covered with insulating barrier 4 and the contact surface of tack coat 5；Inhale ripple layer 3 with the contact surface of insulating barrier 4 on set
Have multiple raised 7, insulating barrier 4 be provided with multiple grooves 8 on ripple 3 contact surface of layer with inhaling, and each raised 7 insertion is corresponding recessed
In groove 8, or it is in undaform to inhale ripple layer 3 with the cross section of the contact surface of insulating barrier 4, so that inhale ripple layer 3 can be more preferable with insulating barrier 4
Laminating；The utility model protective layer 1, reflecting layer 2, suction ripple layer 3, insulating barrier 4 and tack coat 5 are fixed bonding and are existed by adhesive
Together, release layer 6 is pasted in the outside of tack coat 5, and tack coat 5 is that pressure-sensitive adhesive layer is made every effort to overcome in acrylate glue-line or Asia.
When using the utility model heat conduction wave absorbing patch, release layer 6 is torn off from tack coat 5, then by tack coat 5
Integrated circuit plate surface is directly adhered to, the insulating barrier 4 in paster ensure that the insulation of surface-mounted integrated circuit and shell.
The utility model heat conduction wave absorbing patch has heat conduction concurrently, inhales ripple and electro-magnetic screen function, its simple structure, user
Just, thickness of thin, suction ripple and effectiveness are good, and the suction ripple and effectiveness in 1K-100GHz band limits are good, lead to
For the suction ripple and electromagnetic shielding of high and low frequency electromagnetic wave, also with preferable heat conductivility.
Claims (7)
1. a kind of heat conduction wave absorbing patch, it is characterised in that：Include protective layer, reflecting layer successively, inhale ripple layer, insulating barrier, tack coat
And release layer；Wherein, the protective layer is polyimide covercoat, and the reflecting layer is to sputter on protective layer inner surface
200nm thick aluminum membranous layer, the suction ripple layer is that the silicon rubber for being mixed with nano combined wave absorbing agent inhales ripple layer, and the insulating barrier is
PET film layer, the surface of insulating layer resistivity is more than 1013Ω cm, stone is covered with the insulating barrier and the contact surface of tack coat
Black fibrage；The suction ripple layer is provided with multiple projections on the contact surface with insulating barrier, and the insulating barrier is contacted with suction ripple layer
Face is provided with multiple grooves, in each described raised corresponding groove of insertion；The reflecting layer, inhale ripple layer, insulating barrier and
Tack coat is fixed by adhesive and binded, and the release layer is pasted in the outside of the tack coat.
2. heat conduction wave absorbing patch according to claim 1, it is characterised in that：The thickness of the protective layer be 0.01~
0.02mm。
3. heat conduction wave absorbing patch according to claim 1, it is characterised in that：The sheet resistance in the reflecting layer is not more than 200 Europe
Nurse.
4. heat conduction wave absorbing patch according to claim 1, it is characterised in that：The thickness for inhaling ripple layer for 0.03~
0.07mm。
5. heat conduction wave absorbing patch according to claim 1, it is characterised in that：The nano combined wave absorbing agent be Graphene/
Ferrite nano composite wave-absorbing agent.
6. heat conduction wave absorbing patch according to claim 1, it is characterised in that：The thickness of the insulating barrier be 0.01~
0.02mm。
7. heat conduction wave absorbing patch according to claim 1, it is characterised in that：The tack coat is acrylate glue-line or pressure
Quick glue-line.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621183200.6U CN206242623U (en) | 2016-10-28 | 2016-10-28 | A kind of heat conduction wave absorbing patch |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201621183200.6U CN206242623U (en) | 2016-10-28 | 2016-10-28 | A kind of heat conduction wave absorbing patch |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN206242623U true CN206242623U (en) | 2017-06-13 |
Family
ID=58997030
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201621183200.6U Expired - Fee Related CN206242623U (en) | 2016-10-28 | 2016-10-28 | A kind of heat conduction wave absorbing patch |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN206242623U (en) |
Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110268812A (en) * | 2017-07-10 | 2019-09-20 | 拓自达电线株式会社 | Electromagnetic shielding film and the shielding printed wiring board for having the electromagnetic shielding film |
| CN110446407A (en) * | 2019-07-15 | 2019-11-12 | 川泽科技(武汉)有限公司 | A kind of high-performance wave-absorbing material |
| CN111132531A (en) * | 2018-11-01 | 2020-05-08 | 江苏蓝沛新材料科技有限公司 | Wave-absorbing material and laminating process thereof |
| CN112351575A (en) * | 2019-12-30 | 2021-02-09 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN113337248A (en) * | 2021-06-01 | 2021-09-03 | 浙江原邦材料科技有限公司 | Composite wave-absorbing material and preparation method thereof |
| CN115746362A (en) * | 2022-09-09 | 2023-03-07 | 东莞市零度导热材料有限公司 | Wave-absorbing heat-conducting fin and preparation method thereof |
-
2016
- 2016-10-28 CN CN201621183200.6U patent/CN206242623U/en not_active Expired - Fee Related
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110268812A (en) * | 2017-07-10 | 2019-09-20 | 拓自达电线株式会社 | Electromagnetic shielding film and the shielding printed wiring board for having the electromagnetic shielding film |
| CN111132531A (en) * | 2018-11-01 | 2020-05-08 | 江苏蓝沛新材料科技有限公司 | Wave-absorbing material and laminating process thereof |
| CN111132531B (en) * | 2018-11-01 | 2022-03-04 | 无锡蓝沛新材料科技股份有限公司 | Wave-absorbing material and laminating process thereof |
| CN110446407A (en) * | 2019-07-15 | 2019-11-12 | 川泽科技(武汉)有限公司 | A kind of high-performance wave-absorbing material |
| CN112351575A (en) * | 2019-12-30 | 2021-02-09 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN113337248A (en) * | 2021-06-01 | 2021-09-03 | 浙江原邦材料科技有限公司 | Composite wave-absorbing material and preparation method thereof |
| CN115746362A (en) * | 2022-09-09 | 2023-03-07 | 东莞市零度导热材料有限公司 | Wave-absorbing heat-conducting fin and preparation method thereof |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20170613 Termination date: 20181028 |
|
| CF01 | Termination of patent right due to non-payment of annual fee |