CN202030694U - High peel strength conductive glue film with through holes - Google Patents
High peel strength conductive glue film with through holes Download PDFInfo
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- CN202030694U CN202030694U CN2011201427966U CN201120142796U CN202030694U CN 202030694 U CN202030694 U CN 202030694U CN 2011201427966 U CN2011201427966 U CN 2011201427966U CN 201120142796 U CN201120142796 U CN 201120142796U CN 202030694 U CN202030694 U CN 202030694U
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- conductor layer
- layer
- conductive adhesive
- conductive
- conductive glue
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- 239000003292 glue Substances 0.000 title abstract description 31
- 239000004020 conductor Substances 0.000 claims abstract description 87
- 229910052751 metal Inorganic materials 0.000 claims abstract description 39
- 239000002184 metal Substances 0.000 claims abstract description 39
- 239000010410 layer Substances 0.000 claims description 134
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 claims description 37
- 239000002313 adhesive film Substances 0.000 claims description 32
- 239000011347 resin Substances 0.000 claims description 27
- 229920005989 resin Polymers 0.000 claims description 27
- 239000012790 adhesive layer Substances 0.000 claims description 23
- 229910052759 nickel Inorganic materials 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 13
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical group [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 claims description 11
- 229910052709 silver Inorganic materials 0.000 claims description 8
- 239000004332 silver Substances 0.000 claims description 8
- 229910045601 alloy Inorganic materials 0.000 claims description 7
- 239000000956 alloy Substances 0.000 claims description 7
- 239000011889 copper foil Substances 0.000 claims description 5
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 claims description 5
- 241000784726 Lycaena thetis Species 0.000 claims description 3
- QRJOYPHTNNOAOJ-UHFFFAOYSA-N copper gold Chemical compound [Cu].[Au] QRJOYPHTNNOAOJ-UHFFFAOYSA-N 0.000 claims description 3
- YCKOAAUKSGOOJH-UHFFFAOYSA-N copper silver Chemical compound [Cu].[Ag].[Ag] YCKOAAUKSGOOJH-UHFFFAOYSA-N 0.000 claims description 3
- 239000002245 particle Substances 0.000 abstract description 25
- 230000000694 effects Effects 0.000 abstract description 3
- 230000009286 beneficial effect Effects 0.000 abstract description 2
- 238000000034 method Methods 0.000 description 11
- 238000004544 sputter deposition Methods 0.000 description 10
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 239000004593 Epoxy Substances 0.000 description 6
- 239000011248 coating agent Substances 0.000 description 6
- 238000000576 coating method Methods 0.000 description 6
- 239000000463 material Substances 0.000 description 6
- 230000015572 biosynthetic process Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 5
- 239000004925 Acrylic resin Substances 0.000 description 4
- 229920000178 Acrylic resin Polymers 0.000 description 4
- 238000007747 plating Methods 0.000 description 4
- 230000001681 protective effect Effects 0.000 description 4
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 3
- 229910000570 Cupronickel Inorganic materials 0.000 description 3
- ZBTDWLVGWJNPQM-UHFFFAOYSA-N [Ni].[Cu].[Au] Chemical compound [Ni].[Cu].[Au] ZBTDWLVGWJNPQM-UHFFFAOYSA-N 0.000 description 3
- 229910052799 carbon Inorganic materials 0.000 description 3
- YOCUPQPZWBBYIX-UHFFFAOYSA-N copper nickel Chemical compound [Ni].[Cu] YOCUPQPZWBBYIX-UHFFFAOYSA-N 0.000 description 3
- 239000000428 dust Substances 0.000 description 3
- 238000005516 engineering process Methods 0.000 description 3
- 239000003365 glass fiber Substances 0.000 description 3
- MSNOMDLPLDYDME-UHFFFAOYSA-N gold nickel Chemical compound [Ni].[Au] MSNOMDLPLDYDME-UHFFFAOYSA-N 0.000 description 3
- 238000009998 heat setting Methods 0.000 description 3
- 239000012528 membrane Substances 0.000 description 3
- 229920001721 polyimide Polymers 0.000 description 3
- 239000004642 Polyimide Substances 0.000 description 2
- 239000004820 Pressure-sensitive adhesive Substances 0.000 description 2
- 239000004809 Teflon Substances 0.000 description 2
- 229920006362 Teflon® Polymers 0.000 description 2
- 239000005030 aluminium foil Substances 0.000 description 2
- 239000002131 composite material Substances 0.000 description 2
- 238000000151 deposition Methods 0.000 description 2
- 229910052737 gold Inorganic materials 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 238000003698 laser cutting Methods 0.000 description 2
- 238000010329 laser etching Methods 0.000 description 2
- 239000007769 metal material Substances 0.000 description 2
- 239000004033 plastic Substances 0.000 description 2
- 229920003023 plastic Polymers 0.000 description 2
- 238000002360 preparation method Methods 0.000 description 2
- 238000007738 vacuum evaporation Methods 0.000 description 2
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 238000005452 bending Methods 0.000 description 1
- 230000007812 deficiency Effects 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000006261 foam material Substances 0.000 description 1
- 238000005187 foaming Methods 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 230000008407 joint function Effects 0.000 description 1
- 238000009940 knitting Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 229920006267 polyester film Polymers 0.000 description 1
- 239000004645 polyester resin Substances 0.000 description 1
- 229920001225 polyester resin Polymers 0.000 description 1
- 239000009719 polyimide resin Substances 0.000 description 1
- 239000011148 porous material Substances 0.000 description 1
- 229920002545 silicone oil Polymers 0.000 description 1
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- Shielding Devices Or Components To Electric Or Magnetic Fields (AREA)
Abstract
The invention discloses a high peel strength conductive glue film with through holes, which at least comprises a conductive glue layer. The at least one conductive glue layer is characterized in that: at least one conductor layer is arranged in the conductive glue layer; conductive glue is coated on the surfaces at the two sides of the conductor layer; a plurality of through holes are arranged in the conductor layer; the conductive glue coated on the two surfaces at the two sides of the conductor layer is contacted by the through holes; and the thickness of the conductor layer is 0.05-150 micrometers. The high peel strength conductive glue film with the through holes has the beneficial effects as follows: the metal conductor layer arranged in the conductive glue can increase the overlapping probability of conductive particles in the conductive glue and can effectively reduce the resistances; meanwhile, the number of the conductive particles in the conductive glue can be reduced and the cost is reduced; the shielding effect can be effectively reinforced and the shielding function more than 60dB can be achieved. Moreover, the peel strength of the conductive glue film is obviously improved through the arrangement of the through holes.
Description
Technical field
The utility model relates to a kind of conductive adhesive film with high-peeling strength of via.
Background technology
Existing conductive adhesive film with high-peeling strength of via generally only has independent conductive adhesive layer 3, when in use, as shown in Figure 1, conductive adhesive layer 3 is filled between the metallic conductor 2, the surface of conductive resin and described metallic conductor 2 closely attaches, and realizes conducting between the metallic conductor 2.
There is following shortcoming in existing conductive adhesive film: the conducting particles that stripping strength is low, resistance is high, needs use is many, production cost is high and shield effectiveness low (can only about 40dB), so is difficult to meet the need of market; When being used in particular for shielding, shield effectiveness requires to be difficult to reach service requirements more than the 60dB.
In order to overcome the shortcoming of existing conductive adhesive film.Number of patent application is 200410005594.1, patent name discloses a kind of conductive adhesive film manufacture method and product for the Chinese patent application of " its product of the manufacture method of conductive adhesive film ", it is by foam material foaming formation through hole, two-sided again formation conductive layer, and fill up through hole, form conductive path.Though conductive path and conductive layer have integrative-structure, have complex procedures, shortcoming with high costs.The simultaneously pore size of its via and the ununiformity and the uncertainty of aperture location have all limited the accuracy of its application.
Number of patent application is 200510060050.X, and patent name only has double-layer structure for the disclosed conductive adhesive film of Chinese patent application of " with electronic package and the conductive adhesive film and the manufacture method of conductive layer ": conductive layer and knitting layer.It can not satisfy two-sided joint function, does not have the effect of adhesive coating; And shield effectiveness can not satisfy the market requirement of 60dB.
The patent No. is 200680005088.X, and patent name then is mainly to consider to have double-layer structure: insulation layer and all-directional conductive glue from the flexible print circuit board of bending repeatedly for the Chinese patent application of " electromagnetic-wave-shielding adhesive film ".But because the restriction of structure can only be played bonding effect in a side, can't the two sides simultaneously bonding, to use inconveniently, limitation is bigger; And its effectiveness is lower than 45dB, far can not meet the need of market.
The utility model content
The purpose of this utility model is in order to overcome the deficiency that above-mentioned conductive adhesive film exists, the conductive adhesive film of the high-peeling strength with via that a kind of resistance is little, shielding properties is good to be provided.
In order to realize the utility model purpose, the utility model is achieved in that the conductive adhesive film of the high-peeling strength with via, the minimum conductive adhesive layer that comprises is provided with minimum one deck conductor layer in the described conductive adhesive layer, conductive resin is coated on the both side surface of described conductor layer; Described conductor layer is provided with some through holes, and the conductive resin that is coated on the conductor layer both side surface sees through the through hole contact, is bonded in one, can effectively increase the stripping strength between conductive resin and the conductor layer.
Be provided with 2-5 layer conductor layer in the described conductive adhesive layer, conductive resin is coated on the described conductor layer both side surface.
The thickness of described conductor layer can be the 0.05-150 micron.
Preferably, the thickness of described conductor layer can be the 2-70 micron.
Described conductor layer can be tinsels such as silver foil with grid, goldleaf, Copper Foil, nickel foil; Perhaps be composite metallic materials such as ambrose alloy nickel tinsel, ambrose alloy tinsel, silver-bearing copper silver metal paper tinsel and golden copper gold tinsel.
Described conductor layer can be the glasscloth through metalized formation conduction,
The thickness of described glasscloth can be the 10-150 micron.
Preferably, the thickness of described glasscloth can be the 20-70 micron.
Have the preparation method of conductive adhesive film of the high-peeling strength of via, it step that comprises is as follows:
(1) makes conductor layer with through hole;
(2) make conductive resin;
(3) conductive resin is coated with or is immersed on the described conductor layer surface.
Described conductor layer can be with glass fibre preimpregnation Teflon, polyimide or modified epoxy, completely solidified, and purpose fixing glass fiber relative position makes it have snappiness simultaneously; Can adopt chemical-copper-plating process or vacuum-evaporation depositing process or sputtering technology to form the metal conduction Seed Layer then, evaporate plating or electro-coppering, nickel, gold and silver or other metal levels then, also can be complex metal layer, form conductor layer with through hole;
Described conductive resin can be heat-curable glue or pressure sensitive adhesive.Have on the conductor layer of through hole coating or dipping anisotropy conductiving glue layer, the anisotropy conductiving glue layer is preferentially selected for use has resistant to elevated temperatures modified epoxy with thermofixation performance or acrylic resin modified, and thickness is 10um to 100um.Condition of cure is: temperature is 80 ℃ to 150 ℃, and the time is 20 to 60 minutes.According to the material difference, preferentially select 80 ℃/30 minutes; 100 ℃/20 minutes; 120 ℃/10 minutes.Conducting particles can be carbon, silver, nickel or copper particle, also can be the particle of coating nickel gold, copper nickel or copper nickel gold, and the volume ratio of conducting particles and glue is 3% to 50% not wait.According to actual requirement, preferentially selecting conductive resin thickness is 10um, 20um, 30um, 40um, 50um, and 60um is 10%, 20%, 30%, 40%.Consider that from reliability and two aspects of cost it is nickel particles or the silver-colored copper-clad particle of 2um to 35um that conducting particles is preferentially selected diameter.0 ℃ to 130 ℃, the time is 20 to 60 minutes.According to the material difference, preferentially select 80 ℃/30 minutes; 100 ℃/20 minutes; 120 ℃/10 minutes.
Described conductive resin can be different in nature conductive adhesive layer, at anisotropy conductiving glue layer covering protection fractal film.
At the outermost surfaces covering protection fractal film of different in nature conductive resin glue-line,, protection fractal film lattice metal fail can be transferred on the insulating cover when in use with protection anisotropy conductiving glue laminar surface.
Compared with prior art, the beneficial effects of the utility model are: be arranged on the overlapping possibility that the interior metal conductor layer of conductive resin can increase conducting particles in the conductive resin, resistance can effectively reduce; Can reduce simultaneously the number of conducting particles in the conductive resin, reduce cost; Shield effectiveness is effectively strengthened; Because the setting of through hole significantly improves the stripping strength of conductive adhesive film.
Description of drawings
Fig. 1 is existing conductive adhesive film utilization structure figure with high-peeling strength of via;
Fig. 2 is the structural representation of conductive adhesive film embodiment 1 that the utlity model has the high-peeling strength of via
Fig. 3 is the structural representation of conductive adhesive film embodiment 2 that the utlity model has the high-peeling strength of via
Fig. 4 is the structural representation of conductive adhesive film embodiment 3 that the utlity model has the high-peeling strength of via
Fig. 5 the utlity model has the structural representation of conductive adhesive film embodiment 4 of the high-peeling strength of via
Fig. 6 the utlity model has the structural representation of conductive adhesive film embodiment 5 of the high-peeling strength of via
Embodiment
Be described in detail below in conjunction with the conductive adhesive film of the drawings and specific embodiments the high-peeling strength that the utlity model has via.
Embodiment 1
Conductive adhesive film with high-peeling strength of via as shown in Figure 2, comprises conductive adhesive layer 3, and the outside surface of described conductive adhesive layer 3 can be covered with protection fractal film 4.Described protective membrane can have only layer protecting film; Also can be two-layer protective membrane, wherein one deck can be a release film, and another layer can be a separate-type paper.Protective membrane can effectively be protected the outside surface of conductive adhesive layer 3, avoids being subjected to contaminating impurities such as extraneous dust.Be provided with one deck conductor layer 5 in the described conductive adhesive layer 3, conductive resin is coated on the both side surface of described conductor layer 5; Described conductor layer 5 is provided with some through holes, and the conductive resin that is coated with or is immersed in conductor layer 5 both side surface sees through the through hole contact, is bonded in one, can effectively increase the stripping strength between conductive resin and the conductor layer.
Through hole on the described conductor layer 5 can be to have mesh or grid through hole.The thickness of described conductor layer 5 can be between the 0.05-150 micron.Preferably, the thickness of described conductor layer 5 can be between the 2-20 micron.Described conductor layer can be tinsels such as silver foil with grid, goldleaf, Copper Foil, nickel foil; Perhaps be composite metallic materials such as ambrose alloy nickel tinsel, ambrose alloy tinsel, silver-bearing copper silver metal paper tinsel, golden copper gold tinsel.Described conductor layer also can be for forming the glasscloth of conduction through metalized, the thickness of described glasscloth is the 10-150 micron.Preferably, the thickness of described glasscloth is the 20-70 micron.Glasscloth can improve the bent performance of the conductive adhesive film of the high-peeling strength with via.
Embodiment 2
As shown in Figure 3, described conductor layer 5 can be provided with 2 layers in described conductive adhesive layer 3, is respectively first conductor layer 51 and second conductor layer 52.First conductor layer 51 and second conductor layer 52 are divided into three layers with conductive adhesive layer 3, promptly fill or be coated with conductive adhesive layer 3 by the mode that is coated with or soak between first conductor layer 51 and second conductor layer 52, form the laminate structure of piling up; To strengthen conduction and shield effectiveness.
As shown in Figure 4, described conductor layer 5 can be provided with in described conductive adhesive layer 3 and have three layers, and is respectively first conductor layer 51, second conductor layer 52 and the 3rd conductor layer 53.Described first conductor layer 51, second conductor layer 52 and the 3rd conductor layer 53 are divided into four layers with conductive adhesive layer 3, form the laminate structure of piling up, to strengthen conduction and shield effectiveness.
As shown in Figure 5, described conductor layer 5 can be provided with 4 layers in described conductive adhesive layer 3, is respectively first conductor layer 51, second conductor layer 52, the 3rd conductor layer 53 and the 4th conductor layer 54.Described first conductor layer 51, second conductor layer 52, the 3rd conductor layer 53 and the 3rd conductor layer 54 are divided into five layers with conductive adhesive layer 3, form the laminate structure of piling up, to strengthen conduction and shield effectiveness.
Embodiment 5
As shown in Figure 6, described conductor layer 5 can be provided with 4 layers in described conductive adhesive layer 3, is respectively first conductor layer 51, second conductor layer 52, the 3rd conductor layer 53, the 4th conductor layer 54 and the 5th conductor layer 55.Described first conductor layer 51, second conductor layer 52, the 3rd conductor layer 53, the 4th conductor layer 54 and the 5th conductor layer 55 are divided into six layers with conductive adhesive layer 3, form the laminate structure of piling up, to strengthen conduction and shield effectiveness.
Described conductor layer 5 can be provided with the number of plies flexibly according to requirements such as the specific conductivity of conductive adhesive layer 3, resistance, can be more than 5 layers.The thickness of the conductive resin of coating is 1um-100um between the described conductor layer 5.
Have the preparation method of conductive adhesive film of the high-peeling strength of via, it step that comprises is as follows:
(1) makes conductor layer 5 with through hole.Described conductor layer 5 can be that completely solidified, purpose are fixed its relative position with glass fibre preimpregnation Teflon, polyimide or modified epoxy, makes it have snappiness simultaneously; Can adopt chemical-copper-plating process, vacuum-evaporation depositing process or sputtering technology to form the metal conduction Seed Layer then, evaporate plating or electro-coppering, nickel, gold and silver or other metal levels then, also can be complex metal layer, forms the conductor layer with through hole.
(2) make conductive resin.Described conductive resin can be heat-curable glue or pressure sensitive adhesive.Have on the conductor layer of through hole coating anisotropy conductiving glue layer, the anisotropy conductiving glue layer is preferentially selected for use has resistant to elevated temperatures modified epoxy with thermofixation performance or acrylic resin modified, and thickness is 10um to 100um.Condition of cure is: temperature is 80 ℃ to 150 ℃, and the time is 20 to 60 minutes.According to the material difference, preferentially select 80 ℃/30 minutes; 100 ℃/20 minutes; 120 ℃/10 minutes.Conducting particles can be carbon, silver, nickel or copper particle, also can be the particle of coating nickel gold, copper nickel or copper nickel gold, and the volume ratio of conducting particles and glue is 3% to 50% not wait.According to actual requirement, preferentially selecting conductive resin thickness is 10um, 20um, 30um, 40um, 50um, 60um, and volume ratio is 10%, 20%, 30%, 40%.Consider that from reliability and two aspects of cost it is nickel particles or the silver-colored copper-clad particle of 2um to 35um that conducting particles is preferentially selected diameter.Condition of cure is: temperature is 80 ℃ to 130 ℃, and the time is 20 to 60 minutes.According to the material difference, preferentially select 80 ℃/30 minutes; 100 ℃/20 minutes; 120 ℃/10 minutes.
(3) conductive resin is coated with or is immersed on the described conductor layer surface.
Described conductor layer can be the band lattice metal fail.Can on the band lattice metal fail, form the anisotropy conductiving glue layer; At anisotropy conductiving glue layer covering protection fractal film.At the outermost surfaces covering protection fractal film of different in nature conductive resin glue-line,, protection fractal film lattice metal fail can be transferred on the insulating cover when in use with protection anisotropy conductiving glue laminar surface.
On the band lattice metal fail, form the anisotropy conductiving glue layer manufacturing method thereof, its concrete making step:
1), on carrier, forms strippable band lattice metal fail;
2), at the lattice metal fail face outer shielding protection film transfer layer of fitting;
3), the band lattice metal fail on the carrier is transferred on the outer shielding protection film transfer layer;
4), on tectal transfer layer coated insulating cover, Procuring: 60 ℃ to 120 ℃ of temperature, 15 minutes to 45 minutes time;
5), will be with lattice metal fail and insulating cover to fit together completely solidified; 100 ℃ to 180 ℃ of temperature, 15 minutes to 45 minutes time;
6), remove outer shielding protection film transfer layer, formation anisotropy conductiving glue layer on the band lattice metal fail;
7) at anisotropy conductiving glue layer covering protection fractal film.
The step that forms with peelable lattice metal fail on the described carrier is: the splash-proofing sputtering metal layer that can improve copper, nickel or other metal and carrier stripping strength in advance at side surface vacuum sputtering one deck of carrier, require the size of design vector grid then according to the impedance of product, adopt methods such as boring, die-cut, laser cutting or etching on carrier, to form onesize grid; At last at this splash-proofing sputtering metal layer metallized foils layer that powers on.
Described carrier can be chosen tinsel or other plastics film, and thickness is 8um to 50um, and width is 100mm to 1000mm; The thickness of splash-proofing sputtering metal layer is 100 dust to 1000 dusts; Lattice metal fail is to comprise Copper Foil, nickel foil, ambrose alloy or aluminium foil etc. for the band lattice metal fail; Described plated metal paper tinsel layer is that web-like is electroplated thin copper layer, thin nickel dam, corronel layer, and thickness can be 1um to 6um.
Described is to be coated with insulating cover as required at a tectal transfer layer that scribbles silicone oil on the shape film at coated insulating cover on the tectal transfer layer, insulating protective film has certain tack, thickness be 2um to 25um, the material of selecting for use is modified epoxy, acrylic resin modified, polyester or polyimide resin; Procuring: 60 ℃ to 120 ℃ of temperature, 15 minutes to 45 minutes time; To be with lattice metal fail and insulating cover to fit together; Completely solidified: 100 ℃ to 180 ℃ of temperature, 15 minutes to 45 minutes time.
Described anisotropy conductiving glue is selected for use has resistant to elevated temperatures modified epoxy with thermofixation performance or acrylic resin modified, and thickness is 10um to 100um; Conducting particles can be carbon, silver, nickel, copper particle, nickel gold, copper nickel or copper nickel gold grain, and the volume ratio of its conducting particles and glue is 3% to 30%; According to actual requirement, preferentially selecting conductive resin thickness is 8um, 10um, 12um, 15um, 20um, and volume ratio is 5%, 8%, 12%, 15%.Consider that from reliability and two aspects of cost it is nickel particles or the silver-colored copper-clad particle of 2um to 5um that conducting particles is preferentially selected diameter; Condition of cure is: temperature is 80 ℃ to 130 ℃, and the time is 20 to 60 minutes.According to the material difference, preferentially select 80 ℃/30 minutes; 100 ℃/20 minutes; 120 ℃/10 minutes.Described protection fractal film is selected for use with low cost and can be tolerated the polyester film of certain temperature, and thickness is that 15um is to 50um.
Be preferably as follows in the method that forms strippable band lattice metal fail on the carrier: the step that forms peelable lattice metal fail 3 on carrier is: the side surface vacuum sputtering one deck at carrier can improve copper in advance, the splash-proofing sputtering metal layer of nickel or other metal and described carrier stripping strength, require the size of design vector grid then according to the impedance of product, adopt boring, die-cut, method such as laser cutting or etching forms onesize grid on carrier, electroplate thin copper layer by web-like at last on this splash-proofing sputtering metal layer, thin nickel dam or corronel layer etc. form band lattice metal fail layer 3.Described band lattice metal fail is to comprise Copper Foil, nickel foil, aluminium foil etc.Carrier can be chosen the film of tinsel or other plastics formation, and the thickness of carrier is 8um to 50um, and width is 100mm to 1000mm.The thickness of splash-proofing sputtering metal layer is 100 dust to 1000 dusts; The band lattice metal fail layer thickness that web-like is electroplated thin copper layer, thin nickel dam or corronel layer can be 1um to 6um.
The foregoing description is the utility model preferred implementation; but not merely be restricted to the described embodiments; other any do not deviate from change, the modification done under spirit of the present utility model and the principle, substitutes, combination, simplify; all should be the substitute mode of equivalence, all be included within the protection domain of the present utility model.
Claims (6)
1. the conductive adhesive film that has the high-peeling strength of via, the minimum conductive adhesive layer that comprises is characterized in that: minimum one deck conductor layer is set in the described conductive adhesive layer, and conductive resin is coated on the both side surface of described conductor layer; Described conductor layer is provided with some through holes, and the conductive resin that is coated on the conductor layer both side surface sees through the through hole contact.
2. the conductive adhesive film with high-peeling strength of via as claimed in claim 1 is characterized in that: be provided with 2-5 layer conductor layer in the described conductive adhesive layer, conductive resin is coated on the described conductor layer both side surface.
3. the conductive adhesive film with high-peeling strength of via as claimed in claim 2 is characterized in that: the thickness of described conductor layer is the 0.05-150 micron.
4. the conductive adhesive film with high-peeling strength of via as claimed in claim 3 is characterized in that: the thickness of described conductor layer is the 2-70 micron.
5. the conductive adhesive film with high-peeling strength of via as claimed in claim 2, it is characterized in that: described conductor layer is silver foil, goldleaf, Copper Foil, nickel foil, be ambrose alloy nickel tinsel, ambrose alloy tinsel, silver-bearing copper silver metal paper tinsel and golden copper gold tinsel, or form the glasscloth of conduction through metalized
Conductive adhesive film with high-peeling strength of via as claimed in claim 5 is characterized in that: the thickness of described glasscloth is the 10-150 micron.
6. the conductive adhesive film with high-peeling strength of via as claimed in claim 6 is characterized in that: the thickness of described glasscloth is the 20-70 micron.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201427966U CN202030694U (en) | 2011-05-06 | 2011-05-06 | High peel strength conductive glue film with through holes |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN2011201427966U CN202030694U (en) | 2011-05-06 | 2011-05-06 | High peel strength conductive glue film with through holes |
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| Publication Number | Publication Date |
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| CN202030694U true CN202030694U (en) | 2011-11-09 |
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| CN2011201427966U Expired - Lifetime CN202030694U (en) | 2011-05-06 | 2011-05-06 | High peel strength conductive glue film with through holes |
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Cited By (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102286254A (en) * | 2011-05-06 | 2011-12-21 | 广州方邦电子有限公司 | High-peeling-strength conductive adhesive film with through holes and preparation method thereof |
| CN102510712A (en) * | 2011-11-14 | 2012-06-20 | 广州方邦电子有限公司 | Paper-thin screened film with extremely high screening efficiency and manufacturing method therefor |
| CN105940072A (en) * | 2014-01-24 | 2016-09-14 | 3M创新有限公司 | Electrically conductive adhesive tapes and articles therefrom |
| CN106916546A (en) * | 2015-12-28 | 2017-07-04 | 严能进 | A kind of enhanced Nail-free glue sheet and its manufacture method |
| CN108531092A (en) * | 2018-03-13 | 2018-09-14 | 昆山翰辉电子科技有限公司 | Composite conducting glued membrane and preparation method thereof |
| CN116082976A (en) * | 2022-11-07 | 2023-05-09 | 昆山雅森电子材料科技有限公司 | Porous metal type conductive adhesive film and preparation method thereof |
-
2011
- 2011-05-06 CN CN2011201427966U patent/CN202030694U/en not_active Expired - Lifetime
Cited By (8)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN102286254A (en) * | 2011-05-06 | 2011-12-21 | 广州方邦电子有限公司 | High-peeling-strength conductive adhesive film with through holes and preparation method thereof |
| CN102510712A (en) * | 2011-11-14 | 2012-06-20 | 广州方邦电子有限公司 | Paper-thin screened film with extremely high screening efficiency and manufacturing method therefor |
| CN102510712B (en) * | 2011-11-14 | 2016-01-06 | 广州方邦电子有限公司 | Ultra-thin shielding film of a kind of high screening effectiveness and preparation method thereof |
| CN105940072A (en) * | 2014-01-24 | 2016-09-14 | 3M创新有限公司 | Electrically conductive adhesive tapes and articles therefrom |
| CN106916546A (en) * | 2015-12-28 | 2017-07-04 | 严能进 | A kind of enhanced Nail-free glue sheet and its manufacture method |
| CN108531092A (en) * | 2018-03-13 | 2018-09-14 | 昆山翰辉电子科技有限公司 | Composite conducting glued membrane and preparation method thereof |
| CN108531092B (en) * | 2018-03-13 | 2020-12-11 | 昆山翰辉电子科技有限公司 | Composite conductive adhesive film and manufacturing method thereof |
| CN116082976A (en) * | 2022-11-07 | 2023-05-09 | 昆山雅森电子材料科技有限公司 | Porous metal type conductive adhesive film and preparation method thereof |
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Address after: 510660, A5 building, No. 11, Kaiyuan Avenue, Guangzhou hi tech Industrial Development Zone, Guangdong, Guangzhou, Sixth Patentee after: GUANGZHOU FANGBANG ELECTRONICS CO., LTD. Address before: 510660, A5 building, No. 11, Kaiyuan Avenue, Guangzhou Science City, Guangdong, Guangzhou, Sixth Patentee before: Guangzhou Fangbang Electronic Co., Ltd. |
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