CN220845978U - Conductive adhesive tape - Google Patents
Conductive adhesive tape Download PDFInfo
- Publication number
- CN220845978U CN220845978U CN202321578871.2U CN202321578871U CN220845978U CN 220845978 U CN220845978 U CN 220845978U CN 202321578871 U CN202321578871 U CN 202321578871U CN 220845978 U CN220845978 U CN 220845978U
- Authority
- CN
- China
- Prior art keywords
- conductive
- layer
- conductive adhesive
- adhesive film
- film layer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
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Links
- 239000002390 adhesive tape Substances 0.000 title claims abstract description 31
- 239000002313 adhesive film Substances 0.000 claims abstract description 53
- 239000002245 particle Substances 0.000 claims abstract description 24
- 239000000758 substrate Substances 0.000 claims abstract description 19
- 239000004020 conductor Substances 0.000 claims abstract description 15
- 239000010410 layer Substances 0.000 claims description 79
- 239000000853 adhesive Substances 0.000 claims description 10
- 230000001070 adhesive effect Effects 0.000 claims description 10
- 239000011241 protective layer Substances 0.000 claims description 10
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 claims description 3
- 229920006332 epoxy adhesive Polymers 0.000 claims description 3
- 239000004814 polyurethane Substances 0.000 claims description 3
- 229920002635 polyurethane Polymers 0.000 claims description 3
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 7
- 239000000463 material Substances 0.000 description 7
- BQCADISMDOOEFD-UHFFFAOYSA-N Silver Chemical compound [Ag] BQCADISMDOOEFD-UHFFFAOYSA-N 0.000 description 5
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 4
- 229910052709 silver Inorganic materials 0.000 description 3
- 239000004332 silver Substances 0.000 description 3
- OKTJSMMVPCPJKN-UHFFFAOYSA-N Carbon Chemical compound [C] OKTJSMMVPCPJKN-UHFFFAOYSA-N 0.000 description 2
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 2
- 239000004840 adhesive resin Substances 0.000 description 2
- 229920006223 adhesive resin Polymers 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000011231 conductive filler Substances 0.000 description 2
- 239000011889 copper foil Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000002923 metal particle Substances 0.000 description 2
- 239000000203 mixture Substances 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 229920002799 BoPET Polymers 0.000 description 1
- VYZAMTAEIAYCRO-UHFFFAOYSA-N Chromium Chemical compound [Cr] VYZAMTAEIAYCRO-UHFFFAOYSA-N 0.000 description 1
- 239000004952 Polyamide Substances 0.000 description 1
- 239000004642 Polyimide Substances 0.000 description 1
- RTAQQCXQSZGOHL-UHFFFAOYSA-N Titanium Chemical compound [Ti] RTAQQCXQSZGOHL-UHFFFAOYSA-N 0.000 description 1
- HCHKCACWOHOZIP-UHFFFAOYSA-N Zinc Chemical compound [Zn] HCHKCACWOHOZIP-UHFFFAOYSA-N 0.000 description 1
- 239000012790 adhesive layer Substances 0.000 description 1
- 230000009286 beneficial effect Effects 0.000 description 1
- 229910052799 carbon Inorganic materials 0.000 description 1
- 239000002041 carbon nanotube Substances 0.000 description 1
- 229910021393 carbon nanotube Inorganic materials 0.000 description 1
- 229910052804 chromium Inorganic materials 0.000 description 1
- 239000011651 chromium Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229910017052 cobalt Inorganic materials 0.000 description 1
- 239000010941 cobalt Substances 0.000 description 1
- GUTLYIVDDKVIGB-UHFFFAOYSA-N cobalt atom Chemical compound [Co] GUTLYIVDDKVIGB-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 239000004744 fabric Substances 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052742 iron Inorganic materials 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000004745 nonwoven fabric Substances 0.000 description 1
- 229920002647 polyamide Polymers 0.000 description 1
- 229920000728 polyester Polymers 0.000 description 1
- 229920001721 polyimide Polymers 0.000 description 1
- 239000010936 titanium Substances 0.000 description 1
- 229910052719 titanium Inorganic materials 0.000 description 1
- 229910052725 zinc Inorganic materials 0.000 description 1
- 239000011701 zinc Substances 0.000 description 1
- 229910000859 α-Fe Inorganic materials 0.000 description 1
Landscapes
- Adhesives Or Adhesive Processes (AREA)
- Adhesive Tapes (AREA)
Abstract
The utility model provides a conductive adhesive tape, which relates to the technical field of electronic devices and comprises a substrate layer, a conductive base coat coated on the upper surface of the substrate layer and a conductive adhesive film layer coated on the upper surface of the conductive base coat, wherein the conductive adhesive film layer is filled with a conductive medium for enabling the conductive base coat and a conductor to be glued to be in conductive communication. Wherein the conductive primer layer is a sheet-shaped conductive layer, and the conductive medium is conductive particles. Because the conductive adhesive film layer is filled with the conductive medium which enables the conductive primer layer to be in conductive communication with the conductor to be glued on the upper surface of the conductive primer layer, when the conductive adhesive film is used, one end of the conductive adhesive film layer is communicated with the conductor to be glued, the other end of the conductive adhesive film layer is contacted with the conductive primer layer, and the conductive primer layer is contacted with the substrate layer, so that the conductive stability of the conductive adhesive tape is improved; in addition, the conductive undercoat layer is a sheet-shaped conductive layer, so that the contact area can be increased, and a better conductive path can be formed.
Description
Technical Field
The utility model relates to the technical field of electronic devices, in particular to a conductive adhesive tape.
Background
The conductive adhesive tape is an adhesive structure with certain conductivity. It can connect various conductive parts together to form conductive paths between the connected parts. In the electronics industry, conductive tape has become an essential connecting component. The main components of the conductive adhesive tape comprise conductive materials, glue and a base material. Wherein the conductive material is generally made of copper foil, aluminum foil, gold-plated copper foil, carbon and other materials for conducting current; the base material is a supporting material of the conductive adhesive tape and is used for ensuring that the conductive adhesive tape has certain mechanical strength and high temperature resistance.
In order to improve the conductivity of the conductive adhesive tape, CN217173609U discloses a conductive adhesive tape, which improves the conductivity by adhering conductive wires on the surface of the adhesive layer, but this way can cause the wettability of the surface of the adhesive film to be poor, and the adhesion capability to be poor; CN215924834U discloses a high-stability conductive adhesive film, which adopts a mode of combining a large conductive particle adhesive film layer and a small-size conductive particle adhesive film layer to obtain better bonding stability and conductive stability, but the conductive adhesive film is unfavorable for production due to higher practical implementation difficulty, and meanwhile, the problem of degumming of a substrate (such as conductive cloth, conductive non-woven fabric, etc.) which is difficult to paste cannot be solved.
Therefore, the conductive adhesive tape which has good conductive performance, is convenient to produce and is difficult to degum on a substrate which is difficult to be adhered is to be designed.
Disclosure of utility model
The utility model aims to overcome the defects and shortcomings of the prior art, and provides a conductive adhesive tape which at least solves one of the technical problems, and has the advantages of good conductive performance, convenience in production and difficulty in degumming a difficult-to-attach substrate.
To achieve the above object, the present utility model provides a conductive tape comprising:
The conductive adhesive film comprises a substrate layer, a conductive base coat coated on the upper surface of the substrate layer and a conductive adhesive film layer coated on the upper surface of the conductive base coat, wherein the conductive adhesive film layer is filled with a conductive medium which enables the conductive base coat and a conductor to be glued to be in conductive communication.
Optionally, the conductive primer is a sheet-like conductive layer having a thickness of 0.2-2um.
Optionally, the conductive filler in the conductive primer layer is one or more of silver powder, copper powder, silver-coated copper powder or nickel powder.
Optionally the conductive medium is a conductive particle.
Optionally, the particle size of the conductive particles is greater than or equal to the thickness of the conductive adhesive film layer.
Optionally the conductive particles are spherical and/or massive in shape.
Optionally, the thickness of the conductive adhesive film layer is 6-50um.
Optionally, the adhesive in the conductive adhesive film layer adopts one of acrylate adhesive, polyurethane adhesive or epoxy adhesive.
Optionally, a release protective layer adhered to the upper side of the conductive adhesive film layer is also included.
Optionally, the release protective layer is a release film or release paper.
After the technical scheme is adopted, the utility model has the beneficial effects that:
The conductive adhesive film layer is filled with a conductive medium which enables the conductive primer layer to be in conductive communication with the conductor to be glued, when the conductive adhesive film is used, one end of the conductive adhesive film layer is communicated with the conductor to be glued, the other end of the conductive adhesive film layer is in contact with the conductive primer layer, and the conductive primer layer is in contact with the substrate layer, so that the conductive stability of the conductive adhesive tape is improved; the release protective layer is adhered to the upper side of the conductive adhesive film layer and can play a role in stripping and protecting the conductive adhesive film layer; in addition, the conductive undercoat layer is a sheet-shaped conductive layer, so that the contact area can be increased, and a better conductive path can be formed.
Drawings
In order to more clearly illustrate the embodiments of the utility model or the technical solutions of the prior art, the drawings which are used in the description of the embodiments or the prior art will be briefly described, it being obvious that the drawings in the description below are only some embodiments of the utility model, and that other drawings can be obtained according to these drawings without inventive faculty for a person skilled in the art.
Fig. 1 is a schematic cross-sectional view of an embodiment of the conductive tape of the present utility model.
Reference numerals illustrate:
1-a substrate layer;
2-a conductive primer layer;
3-a conductive adhesive film layer;
4-release protective layer.
Detailed Description
The present utility model will be described in further detail with reference to the accompanying drawings.
The present embodiment is only for explanation of the present utility model and is not to be construed as limiting the present utility model, and those skilled in the art can make modifications to the present embodiment which do not contribute to the utility model as required after reading the present specification, but are protected by the patent laws within the scope of the appended claims.
It should be noted that the azimuth or positional relationship indicated by the terms "upper" and "lower" of the present utility model are based on the azimuth or positional relationship shown in the drawings, and are merely for convenience of describing the present utility model and simplifying the description, and are not indicative or implying that the apparatus or element to be referred must have a specific azimuth, be constructed and operated in a specific azimuth, and thus should not be construed as limiting the present utility model.
Referring to fig. 1, the embodiment relates to a conductive adhesive tape, which comprises a substrate layer 1, a conductive primer layer 2, and a conductive adhesive film layer 3, wherein the conductive adhesive film layer 3 is coated on the upper surface of the substrate layer 1, the conductive adhesive film layer 3 is coated on the upper surface of the conductive primer layer 2, and the conductive adhesive film layer 3 is filled with a conductive medium for electrically connecting the conductive primer layer 2 and a conductor to be glued, and preferably, the conductive adhesive tape further comprises a release protective layer 4 adhered on the upper side of the conductive adhesive film layer 3.
The substrate layer 1 is a supporting material of the conductive adhesive tape, and is used for ensuring that the conductive adhesive tape has certain mechanical strength and high temperature resistance, and is generally made of polyimide, polyamide, polyester and other materials, and can bear various force and temperature changes in electronic equipment, so that the stability and reliability of the conductive adhesive tape are ensured.
The conductive filler in the conductive primer layer 2 is formed by coating one or more of silver powder, copper powder, silver-coated copper powder or nickel powder on the upper surface of the substrate layer 1, and the conductive primer layer 2 is coated on the upper surface of the substrate layer 1. The conductive undercoat layer 2 may be formed in one or more of a sheet, a line, a network, and a pattern. In order to increase the contact area and form a better conductive path, the conductive primer layer 2 is preferably a sheet-like conductive layer, and the thickness thereof is selected to be 0.2-2um. Specifically, in the present embodiment, the thickness of the conductive primer 2 may be selected to be 0.2um,1um,1.5um,2um, although in other embodiments, the thickness of the conductive primer 2 may be selected to be 0.5um,0.8um,1.2um, provided that the thickness is in the range of 0.2-2um, and the specific limitation is not imposed herein. The conductivity, strength and flexibility of the conductive primer 2 can be adjusted by setting different thicknesses, selecting materials and selecting shapes.
The adhesive resin of the conductive adhesive film layer 3 can be made by filling conductive media in one of acrylate adhesive, polyurethane adhesive or epoxy adhesive according to the required adhesive performance, and the conductive media can be conductive particles, conductive wires and the like. So long as the conductive primer 2 and the conductor to be glued are brought into conductive communication in use. The conductive medium in this embodiment is preferably conductive particles. The conductive particles are preferably spherical and/or block-shaped, and may be selected as at least one of metal particles, carbon nanotube particles and ferrite particles according to desired conductive properties, the metal particles including particles of at least one of aluminum, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, and the thickness of the conductive adhesive film layer 3 is selected in the range of 6-50um according to requirements. In this embodiment, the thickness of the conductive adhesive film layer 3 may be selected to be 6um,10um,15um,20um,30um,40um,20um,50um, although in other embodiments, the thickness of the conductive adhesive film layer 3 may be selected to be 16um,25um,35um,45um, etc., as long as the thickness is in the range of 6-50um, which is not particularly limited herein. Specifically, the thickness of the conductive adhesive film layer 3, the composition and shape of the conductive particles, and the composition of the adhesive resin may be set to be the same or different according to performance requirements. When the conductive adhesive film layer 3 is used, one end of the conductive adhesive film layer 3 is communicated with a conductor to be glued, the other end of the conductive adhesive film layer is contacted with the conductive primer layer 2, and the conductive primer layer 2 is contacted with the substrate layer 1, so that the conductive stability of the conductive adhesive tape is improved.
In order to further improve the conductive stability of the conductive adhesive tape, in this embodiment, the particle size of the conductive particles is greater than or equal to the thickness of the conductive adhesive film layer 3, preferably, the particle size of the conductive particles is the same as the thickness of the conductive adhesive film layer 3, that is, the conductive particles may penetrate through the conductive adhesive film layer 3. Therefore, when the conductive adhesive tape is used, the conductive base coat 2 can be ensured to be directly communicated with a conductor to be glued through the conductive particles, and the conductive stability of the conductive adhesive tape is further improved.
The release protective layer 4 is a release film or release paper, and can be one of a PET film, a PE film, a PP film or a PBT film, and the release protective layer 4 can protect the conductive adhesive tape when not in use and is convenient to strip when in use.
Because the conductive adhesive film layer 3 is filled with the conductive medium which enables the conductive primer layer 2 to be in conductive communication with the conductor to be glued on the upper surface of the conductive primer layer, when the conductive adhesive film is used, one end of the conductive adhesive film layer is communicated with the conductor to be glued, the other end of the conductive adhesive film layer is contacted with the conductive primer layer 2, and the conductive primer layer 2 is contacted with the substrate layer 1, so that the conductive stability of the conductive adhesive tape is improved; the release protective layer 4 is adhered to the upper side of the conductive adhesive film layer and can play a role in stripping and protecting the conductive adhesive film 3; in addition, the conductive undercoat layer 2 is a sheet-like conductive layer, which can increase the contact area and form a better conductive path.
The above description is only for the purpose of illustrating the technical solution of the present utility model and not for the purpose of limiting the same, and other modifications and equivalents thereof by those skilled in the art should be included in the scope of the claims of the present utility model without departing from the spirit and scope of the technical solution of the present utility model.
Claims (9)
1. The conductive adhesive tape is characterized by comprising a substrate layer (1), a conductive base coat (2) coated on the upper surface of the substrate layer (1) and a conductive adhesive film layer (3) coated on the upper surface of the conductive base coat (2), wherein the conductive adhesive film layer (3) is filled with a conductive medium which enables the conductive base coat (2) and a conductor to be glued to be in conductive communication, and the conductive base coat (2) is a sheet-shaped conductive layer.
2. The conductive tape according to claim 1, wherein the thickness of the conductive primer layer (2) is 0.2-2um.
3. The conductive tape of claim 1, wherein the conductive medium is conductive particles.
4. A conductive adhesive tape according to claim 3, wherein the particle size of the conductive particles is greater than or equal to the thickness of the conductive adhesive film layer (3).
5. A conductive tape according to claim 3, wherein the conductive particles are spherical and/or massive in shape.
6. The conductive adhesive tape according to claim 1, wherein the thickness of the conductive adhesive film layer (3) is 6-50um.
7. The conductive adhesive tape according to claim 1, wherein the adhesive in the conductive adhesive film layer (3) is one of acrylate adhesive, polyurethane adhesive or epoxy adhesive.
8. The conductive adhesive tape according to claim 1, further comprising a release protective layer (4) adhered to the upper side of the conductive adhesive film layer (3).
9. The conductive adhesive tape according to claim 8, wherein the release protective layer (4) is a release film or a release paper.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321578871.2U CN220845978U (en) | 2023-06-19 | 2023-06-19 | Conductive adhesive tape |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202321578871.2U CN220845978U (en) | 2023-06-19 | 2023-06-19 | Conductive adhesive tape |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN220845978U true CN220845978U (en) | 2024-04-26 |
Family
ID=90772416
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202321578871.2U Active CN220845978U (en) | 2023-06-19 | 2023-06-19 | Conductive adhesive tape |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN220845978U (en) |
-
2023
- 2023-06-19 CN CN202321578871.2U patent/CN220845978U/en active Active
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |