CN208095044U - Electromagnetic shielding film and wiring board - Google Patents
Electromagnetic shielding film and wiring board Download PDFInfo
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- CN208095044U CN208095044U CN201820352076.4U CN201820352076U CN208095044U CN 208095044 U CN208095044 U CN 208095044U CN 201820352076 U CN201820352076 U CN 201820352076U CN 208095044 U CN208095044 U CN 208095044U
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Abstract
The utility model provides a kind of electromagnetic shielding film and wiring board, wherein the electromagnetic shielding film includes first screen layer, secondary shielding layer, adhesive film and several convex particles；The first screen layer includes opposite first surface and second surface, and the second surface is flat surface；Several convex particles are attached on the second surface of the first screen layer；The secondary shielding layer configuration covers several convex particles on the second surface of the first screen layer, to form lug boss in the outer surface of secondary shielding layer position corresponding with the convex particle, and forms gentle portion in other positions；The adhesive film configuration is on the outer surface of the secondary shielding layer, then the lug boss ensures that shielded layer smoothly pierces through adhesive film in bonding processes, ensure that interference charge normally exports, while the gentle portion of secondary shielding layer can reduce the insertion loss during use again, is suitable for hyperfrequency and transmits.
Description
Technical field
The utility model is related to electronic field more particularly to a kind of electromagnetic shielding films and wiring board.
Background technology
With the rapid development of electronics industry, electronic product is further to miniaturization, lightweight, assembling densification hair
Exhibition greatly pushes the development of flexible electric circuit board, to realize component arrangement and conducting wire connecting integration.Flexible electric circuit board can be wide
It is general to be applied to the industries such as mobile phone, liquid crystal display, communication and space flight.
Under the promotion of international market, function flexible electric circuit board is occupied an leading position in flexible electric circuit board market, and is evaluated
One important indicator of function flexible electric circuit board performance is electromagnetic shielding ((Electromagnetic Interference
Shielding, abbreviation EMI Shielding).With the integration of the communication apparatus function such as mobile phone, internal component drastically high frequency
High speed.Such as：For cell-phone function other than original audio communication function, camera function has become necessary function, and WLAN
(Wireless Local Area Networks, WLAN), GPS (Global Positioning System, the whole world
Positioning system) and function of surfing the Net popularized, along with the integration of following sensing component, drastically high-frequency high-speed becomes component
Gesture is more inevitable.The component internal and the electromagnetic interference of outside, signal caused under the driving of high frequency and high speed exists
Decaying and insertion loss and jitter problem are gradually serious in transmission.
Currently, the common screened film of existing line plate includes shielded layer and conductive adhesive layer, by conductive adhesive layer by shielded layer
It is connect with wiring board stratum, and then interference charge is imported into wiring board stratum, realize shielding.It is conductive but in high-frequency transmission
Conducting particles in glue-line will produce eddy-current loss, and then the insertion loss of wiring board is caused to increase, and it is complete to influence signal transmission
Property.
Invention content
The purpose of the utility model embodiment is to provide a kind of electromagnetic shielding film and wiring board, can reduce insertion loss, have
Effect is transmitted for hyperfrequency.
To achieve the above object, the utility model embodiment provides a kind of electromagnetic shielding film, including first screen layer,
Two shielded layers, adhesive film and several convex particles；The first screen layer includes opposite first surface and second surface, described
Second surface is flat surface；Several convex particles are attached on the second surface of the first screen layer；Described second
Shielded layer configures on the second surface of the first screen layer, and covers several convex particles, to described second
Position corresponding with the convex particle forms lug boss on the outer surface of shielded layer, and forms gentle portion in other positions；Institute
Adhesive film configuration is stated on the outer surface of the secondary shielding layer.
As the improvement of said program, the convex particle includes conductive particles, semiconductor grain, insulator particle and packet
Cover the one or more of composite particles.
As the improvement of said program, the height of the convex particle is 0.1 μm -30 μm.
As the improvement of said program, several conductive bumps are also formed on the outer surface of the secondary shielding layer.
As the improvement of said program, the conductive bumps integrated distribution is in the lug boss.
As the improvement of said program, the adhesive film includes the adhesion layer containing conducting particles.
As the improvement of said program, the adhesive film includes the adhesion layer without conducting particles.
As the improvement of said program, the first screen layer and secondary shielding layer include metal screen layer, carbon nanotube
It is one or more in shielded layer, ferrite shielded layer and graphene shielded layer.
As the improvement of said program, the metal screen layer includes monometallic shielded layer and/or alloy shielded layer；Its
In, the monometallic shielded layer is made of any one material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, described
Alloy shielded layer is made of two or more the arbitrary material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
As the improvement of said program, the electromagnetic shielding film further includes protection film layer, and the first of the first screen layer
Surface is formed with the protection film layer.
Compared with prior art, the utility model embodiment discloses a kind of electromagnetic shielding film, in the secondary shielding layer
Outer surface on corresponding with convex particle position form lug boss, and form gentle portion in other positions, described second
The outer surface of shielded layer is equipped with the adhesive film, and the lug boss ensures that shielded layer smoothly pierces through glued membrane in bonding processes
Layer ensures that interference charge normally exports, while gentle portion can reduce the insertion loss during use again, be kept pouring in suitable for superelevation
It is defeated.
The utility model embodiment also correspondence provides a kind of wiring board, including printed wiring board and above-mentioned any one institute
The electromagnetic shielding film stated, the electromagnetic shielding film are mutually pressed by its adhesive film and the printed wiring board；The lug boss thorn
The adhesive film is worn, and extends to the stratum of the printed wiring board.
Compared with prior art, the utility model embodiment discloses a kind of wiring board, and the wiring board includes track
Electromagnetic shielding film described in road plate and above-mentioned any one, the electromagnetic shielding film pass through its adhesive film and the printed wiring board
It mutually presses, the lug boss pierces through the adhesive film, and extends to the stratum of the printed wiring board, realizes that interference charge is smooth
Export, while the gentle portion can reduce the insertion loss during use again, be suitable for hyperfrequency and transmit.
Description of the drawings
Fig. 1 is a kind of structural schematic diagram of electromagnetic shielding film in the utility model embodiment 1.
Fig. 2 is a kind of structural schematic diagram of electromagnetic shielding film in the utility model embodiment 2.
Fig. 3 is a kind of structural schematic diagram of wiring board in the utility model embodiment 3.
Fig. 4 is a kind of structural schematic diagram of wiring board in the utility model embodiment 4.
Specific implementation mode
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without creative efforts
The every other embodiment obtained, shall fall within the protection scope of the present invention.
It is a kind of structural schematic diagram of electromagnetic shielding film in the utility model embodiment 1, as shown in Figure 1, institute referring to Fig. 1
It includes first screen layer 1, secondary shielding layer 2, adhesive film 3 and several convex particles, the first screen layer 1 to state electromagnetic shielding film
Including opposite first surface 11 and second surface 12, the second surface 12 is flat surface, and several convex particles are attached
It on the second surface 12 of the first screen layer 1；The secondary shielding layer 2 is configured the second of the first screen layer 1
On surface 12, and cover several convex particles, on the outer surface of the secondary shielding layer 2 21 with the convex
4 corresponding position of grain forms lug boss 212, and forms gentle portion 211 in other positions；The configuration of the adhesive film 3 is described the
On the outer surface 21 of two shielded layers 2.
The first screen layer 1 and secondary shielding layer 2 all have conduction free electron function, used in material can phase
Together also can be different, specifically include one in metal screen layer, carbon nanotube shielded layer, ferrite shielded layer and graphene shielded layer
Kind is a variety of.Wherein, the metal screen layer includes monometallic shielded layer and/or alloy shielded layer；Wherein, the monometallic screen
Layer is covered to be made of any one material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, the alloy shielded layer by aluminium,
Two or more arbitrary material in titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold is made.In addition, the adhesive film 3
Material therefor preferably is selected from following several：Modified epoxy class, modified acrylic acid, modified rubber class, modified thermoplastic polyamides
Imines, modified poly ester class.
In the present embodiment, the convex particle 4 is distributed on the second surface 12 of the first screened film that (second surface 12 is
Flat surface), function be so that secondary shielding film outer surface 21 formed lug boss 212 so that electromagnetic shielding film with
In printed wiring board bonding processes, which can smoothly pierce through the stratum of adhesive film 3 and printed wiring board, realize reliable
Ground connection.The convex particle 4 includes conductive particles, semiconductor grain, insulator particle and covered composite yarn particle (conductor cladding
Another insulator particle etc. of insulator particle or insulator cladding) it is one or more, further include little particle reunite and
At bulky grain.In practical application, the convex particle 4 is diamond dust, titanium dioxide, Si powder, silicide powder, silica
Powder, aluminide powder, graphene powder, iron powder, nickel powder, copper powder, nickel plating diamond dust, plating metal inorganic particle etc..It needs
Bright, the shape of the convex particle 4 in the utility model is not limited by illustrating, and material is not also limited by above-mentioned material
System, as long as with so that the outer surface 21 of the secondary shielding layer forms the particle of lug boss 212, in the utility model
Within protection domain.
Outer surface 21 in order to meet the secondary shielding film forms the lug boss 212 for piercing through adhesive film 3 enough, described convex
The height of shape particle 4 is 0.1 μm -30 μm.In addition, the thickness of the adhesive film 3 and the outer surface 21 of the secondary shielding layer
Waviness (height for being equivalent to lug boss 212) meets proportionate relationship and is preferably：0.8~2, with ensure enough puncture intensities and
Charging capacity is embodied as：On the one hand prevent the thickness of adhesive film 3 from being spent relative to the fluctuating of the outer surface 21 of secondary shielding film
It is small and cause charging capacity insufficient, and then lead to plate bursting phenomenon；On the other hand the waviness of the outer surface 21 of secondary shielding film is prevented
Thickness relative to adhesive film 3 is too small and leads to puncture intensity deficiency and earthing failure phenomenon is caused to generate.It should be noted that
The waviness of the outer surface 21 of the secondary shielding film is the highs and lows of the outer surface 21 of the secondary shielding film
Distance.
Based on above structure, the position shape corresponding with the convex particle 4 on the outer surface of the secondary shielding layer 2 21
At lug boss 212, and gentle portion 211 is formed in other positions, the outer surface 21 of the secondary shielding layer 2 is equipped with the glued membrane
Layer 3, the lug boss 212 of the outer surface 21 of the secondary shielding layer 2 ensures that secondary shielding layer smoothly pierces through glue in bonding processes
Film layer 3 ensures that interference charge normally exports, while gentle portion 211 can reduce the insertion loss during use again, be suitable for super
High-frequency transmission.
Preferably, the adhesive film 3 is the adhesion layer without conducting particles, reduces the insertion damage of wiring board during use
Consumption improves the bending of wiring board while improving shield effectiveness.
In another preferred embodiment, the adhesive film 3 is the adhesion layer with conducting particles, then the adhesive film 3 removes
Have the function of bonding, so that the terminal plate and electromagnetic shielding film is closely binded, also have the function of conduction, with the second screen
It covers layer 2 to match, interference electronics is imported rapidly in the stratum of the terminal plate.Wherein, the conducting particles can be mutual
The conducting particles of separation, or bulky grain conducting particles made of reunion；When the conducting particles is leading of being separated from each other
When charged particle, the area of electrical contact is can further improve, improves the uniformity of electrical contact；And when the conducting particles is group
Bulky grain conducting particles made of poly-, can increase puncture intensity.
Preferably, the electromagnetic shielding film further includes protection film layer, and the first surface 11 of the first screen layer 1 is formed with
The protection film layer.The protection film layer plays insulating effect to ensure the screen of the first screen layer 1 and secondary shielding layer 2
Cover efficiency.The protection film layer is PPS film layers, PEN film layers, laminated polyester film, polyimide film layer, Epoxy Resin Oil
The film layer that is formed after the film layer that is formed after ink solidification, polyurethane ink solidification, the film layer formed after acrylic resin modified solidification,
One kind in the film layer formed after polyimide resin solidification.
It should be noted that the first screen layer 1 and secondary shielding layer 2 of the present embodiment attached drawing can be single layer structure, also may be used
Think multilayered structure.In addition, according to the needs of actual production and application, the first screen layer and secondary shielding of the present embodiment attached drawing
Layer may be configured as latticed, foaming shape etc..
It is a kind of structural schematic diagram of electromagnetic shielding film in the utility model embodiment 2, as shown in Fig. 2, institute referring to Fig. 2
It includes first screen layer 1, secondary shielding layer 2, adhesive film 3 and several convex particles 4, several convex particles 4 to state electromagnetic shielding film
Set on first 1 layer of the shielding between secondary shielding layer 2, the first screen layer 1 includes opposite first surface 11 and the
Two surfaces 12, the second surface 12 are flat surface；Several convex particles 4 are attached to the second of the first screen layer
On surface；The secondary shielding layer 2 configures on the second surface 12 of the first screen layer 1, and covers several convexs
Particle 4, to which position corresponding with the convex particle 4 forms lug boss on the outer surface of the secondary shielding layer 2 21
212, and form gentle portion 211 in other positions；The adhesive film 3 configures on the outer surface of the secondary shielding layer 2 21；Institute
It states and is also formed with several conductive bumps 5 on the outer surface 21 of secondary shielding layer 2.
The conductive bumps 5 include one or more in metal bump, carbon nanotube protrusion and ferrite protrusion.This
Outside, the metal bump includes monometallic protrusion and/or alloy protrusion；Wherein, the monometallic protrusion by aluminium, titanium, zinc, iron,
Any one material in nickel, chromium, cobalt, copper, silver and gold is made, the alloy protrusion by aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper,
Two or more arbitrary material in silver and gold is made.It should be noted that conductive bumps 5 can with first screen layer
1, the material identical of secondary shielding layer 2 can also differ.
The preferably integrated distribution of the conductive bumps 5 is on the lug boss 212, then the secondary shielding layer 2 is pressing
It is easier puncture adhesive film 3 in the process and improves the quality of electromagnetic shielding to be grounded.
The first screen layer 1 and secondary shielding layer 2 all have conduction free electron function, used in material can phase
Together also can be different, specifically include one in metal screen layer, carbon nanotube shielded layer, ferrite shielded layer and graphene shielded layer
Kind is a variety of.Wherein, the metal screen layer includes monometallic shielded layer and/or alloy shielded layer；Wherein, the monometallic screen
Layer is covered to be made of any one material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, the alloy shielded layer by aluminium,
Two or more arbitrary material in titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold is made.In addition, the adhesive film 3
Material therefor preferably is selected from following several：Modified epoxy class, modified acrylic acid, modified rubber class, modified thermoplastic polyamides
Imines, modified poly ester class.
In the present embodiment, the convex particle 4 is distributed on the second surface 12 of the first screened film that (second surface 12 is
Flat surface), function be so that secondary shielding film outer surface 21 formed lug boss 212 so that electromagnetic shielding film with
In printed wiring board bonding processes, which can smoothly pierce through the stratum of adhesive film 3 and printed wiring board, realize reliable
Ground connection.The convex particle 4 includes conductive particles, semiconductor grain, insulator particle and covered composite yarn particle (conductor cladding
Another insulator particle etc. of insulator particle or insulator cladding) it is one or more, further include little particle reunite and
At bulky grain.In practical application, the convex particle 4 is diamond dust, titanium dioxide, Si powder, silicide powder, silica
Powder, aluminide powder, graphene powder, iron powder, nickel powder, copper powder, nickel plating diamond dust, plating metal inorganic particle etc..It needs
Bright, the shape of the convex particle 4 in the utility model is not limited by illustrating, and material is not also limited by above-mentioned material
System, as long as with so that the outer surface 21 of the secondary shielding layer forms the particle of lug boss 212, in the utility model
Within protection domain.
Outer surface 21 in order to meet the secondary shielding layer forms the lug boss 212 for piercing through adhesive film 3 enough, described convex
The height of shape particle 4 is 0.1 μm -30 μm.In addition, the thickness of the adhesive film 3 and the outer surface 21 of the secondary shielding layer
The height of waviness (height for being equivalent to lug boss 212) and the conductive bumps 5 and meet proportionate relationship and be preferably：0.8
~2, to ensure enough puncture intensities and charging capacity, it is embodied as：On the one hand prevent the thickness of adhesive film 3 relative to described
It is the waviness of the outer surface 21 of secondary shielding layer and the height of the conductive bumps 5 and too small and lead to charging capacity deficiency in turn
Lead to plate bursting phenomenon, on the other hand prevents the height of the waviness and the conductive bumps 5 of the outer surface 21 of the secondary shielding layer
Degree and relative to adhesive film 3 thickness is too small and causes puncture intensity insufficient and then earthing failure phenomenon is caused to generate.It needs
Illustrate, the waviness of the outer surface 21 of the secondary shielding layer is the highest of the outer surface 21 of the secondary shielding layer
The distance of point and minimum point.
Based on above structure, due in the position corresponding with the convex particle 4 of the outer surface of the secondary shielding layer 2 21
It sets to form lug boss 212, and gentle portion 211 is formed in other positions, the adhesive film 3 is configured in the secondary shielding layer 2
On outer surface 21, and several conductive bumps 5 are also formed on the outer surface 21 of secondary shielding layer 2, then the appearance of secondary shielding layer
The lug boss 212 in face 21 and conductive bumps 5 thereon mutually cooperate with, and function is pierced through in enhancing, ensure that secondary shielding layer 2 smoothly pierces through
Adhesive film 3 realizes reliable ground so that it is guaranteed that interference charge normally exports；Gentle portion 211 can reduce use simultaneously again during
Insertion loss, be suitable for hyperfrequency transmit.
Preferably, the adhesive film 3 is the adhesion layer without conducting particles, reduces the insertion damage of wiring board during use
Consumption improves the bending of wiring board while improving shield effectiveness.
In addition, the preferably integrated distribution of the conductive bumps 5 is on the lug boss 212, then the secondary shielding layer 2 exists
It is easier puncture adhesive film 3 in bonding processes and improves the quality of electromagnetic shielding to realize more reliable ground connection.
In another preferred embodiment, the adhesive film 3 is the adhesion layer with conducting particles, then the adhesive film 3 removes
Have the function of bonding, so that the terminal plate and electromagnetic shielding film is closely binded, also have the function of conduction, with the second screen
It covers layer 2 to match, interference electronics is imported rapidly in the stratum of the terminal plate.Wherein, the conducting particles can be mutual
The conducting particles of separation, or bulky grain conducting particles made of reunion；When the conducting particles is leading of being separated from each other
When charged particle, the area of electrical contact is can further improve, improves the uniformity of electrical contact；And when the conducting particles is group
Bulky grain conducting particles made of poly-, can increase puncture intensity.
Preferably, the electromagnetic shielding film further includes protection film layer, and the first surface 11 of the first screen layer 1 is formed with
The protection film layer.The protection film layer plays insulating effect to ensure the screen of the first screen layer 1 and secondary shielding layer 2
Cover efficiency.The protection film layer is PPS film layers, PEN film layers, laminated polyester film, polyimide film layer, Epoxy Resin Oil
The film layer that is formed after the film layer that is formed after ink solidification, polyurethane ink solidification, the film layer formed after acrylic resin modified solidification,
One kind in the film layer formed after polyimide resin solidification.
It should be noted that the first screen layer 1 and secondary shielding layer 2 of the present embodiment attached drawing can be single layer structure, also may be used
Think multilayered structure.In addition, according to the needs of actual production and application, the first screen layer and secondary shielding of the present embodiment attached drawing
Layer may be configured as latticed, foaming shape etc..
Referring to Fig. 3, for a kind of structural schematic diagram for wiring board that the utility model embodiment 3 provides, the wiring board packet
Printed wiring board 6 and electromagnetic shielding film described in embodiment 1 are included, the electromagnetic shielding film passes through its adhesive film 3 and the printing
6 phase of wiring board presses；The lug boss 212 pierces through the adhesive film 3, and extends to the stratum of the printed wiring board 6.
In the present embodiment, the description of above-described embodiment 1 is can refer to about the realization method of electromagnetic shielding film, herein no longer
It repeats.
Preferably, the printed wiring board 6 is one in flexible single-side, flexibility double face, flexible multi-layer plate, rigid-flex combined board
Kind.
By above structure, in bonding processes, adhesive film 3 is pierced using the lug boss 212 of the secondary shielding layer 2
It wears, so that 21 at least part of outer surface of secondary shielding layer 2 is connect with the stratum of the printed circuit board, to realize
Interference charge in first screen layer 1 and secondary shielding layer 2 imports in ground, avoids the accumulation of interference charge and forms interference
Source influences the normal work of wiring board；Gentle portion 211 can reduce the insertion loss during use again simultaneously, be suitable for superelevation
It keeps pouring in defeated.
Referring to Fig. 4, for a kind of structural schematic diagram for wiring board that the utility model embodiment 4 provides, the wiring board packet
The electromagnetic shielding film described in printed wiring board 6 and embodiment 2 is included, the electromagnetic shielding film passes through its adhesive film 3 and the printing
6 phase of wiring board presses；The lug boss 212 pierces through the adhesive film 3, and extends to the stratum of the printed wiring board 6.
In the present embodiment, the description of above-described embodiment 2 is can refer to about the realization method of electromagnetic shielding film, herein no longer
It repeats.
By above structure, in bonding processes, conductive bumps 5 using the lug boss 212 and thereon mutually cooperate with
The adhesive film 3 is pierced through, so that 21 at least part of outer surface of the secondary shielding layer and the printed circuit board
Stratum connects, and to realize that the interference charge in first screen layer 1 and secondary shielding layer 2 imports in ground, avoids interference charge
Accumulation and form interference source, influence the normal work of wiring board；Gentle portion 211 can reduce the insertion during use again simultaneously
Loss is suitable for hyperfrequency and transmits.
The above is preferred embodiments of the present invention, it is noted that for the ordinary skill of the art
For personnel, without departing from the principle of this utility model, several improvements and modifications can also be made, these are improved and profit
Decorations are also considered as the scope of protection of the utility model.
Claims (11)
1. a kind of electromagnetic shielding film, which is characterized in that including first screen layer, secondary shielding layer, adhesive film and several convexs
Grain；The first screen layer includes opposite first surface and second surface, and the second surface is flat surface；It is described several
Convex particle is attached on the second surface of the first screen layer；The secondary shielding layer configuration is in the first screen layer
On second surface, and several convex particles are covered, in the outer surface of the secondary shielding layer and the convex
The corresponding position of grain forms lug boss, and forms gentle portion in other positions；The adhesive film configuration is in the secondary shielding layer
Outer surface on.
2. electromagnetic shielding film as described in claim 1, which is characterized in that the convex particle includes conductive particles, semiconductor
Particle, insulator particle and covered composite yarn particle it is one or more.
3. electromagnetic shielding film as described in claim 1, which is characterized in that the height of the convex particle is 0.1 μm -30 μm.
4. electromagnetic shielding film as described in claim 1, which is characterized in that be also formed on the outer surface of the secondary shielding layer
Several conductive bumps.
5. electromagnetic shielding film as claimed in claim 4, which is characterized in that the conductive bumps integrated distribution is in the protrusion
Portion.
6. electromagnetic shielding film as described in claim 1, which is characterized in that the adhesive film includes sticking together containing conducting particles
Layer.
7. electromagnetic shielding film as described in claim 1, which is characterized in that the adhesive film includes sticking together without conducting particles
Layer.
8. electromagnetic shielding film as described in claim 1, which is characterized in that the first screen layer and secondary shielding layer include gold
Belong to one or more in shielded layer, carbon nanotube shielded layer, ferrite shielded layer and graphene shielded layer.
9. electromagnetic shielding film as claimed in claim 8, which is characterized in that the metal screen layer includes monometallic shielded layer
And/or alloy shielded layer；Wherein, the monometallic shielded layer is by arbitrary in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold
A kind of material is made, and the alloy shielded layer is by arbitrary two kinds or two kinds in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold
Above material is made.
10. electromagnetic shielding film as described in claim 1, which is characterized in that the electromagnetic shielding film further includes protection film layer, institute
The first surface for stating first screen layer is formed with the protection film layer.
11. a kind of wiring board, which is characterized in that including the electromagnetism described in printed wiring board and claims 1 to 10 any one
Screened film, the electromagnetic shielding film are mutually pressed by its adhesive film and the printed wiring board；The lug boss pierces through the glue
Film layer, and extend to the stratum of the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820352076.4U CN208095044U (en) | 2018-03-14 | 2018-03-14 | Electromagnetic shielding film and wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201820352076.4U CN208095044U (en) | 2018-03-14 | 2018-03-14 | Electromagnetic shielding film and wiring board |
Publications (1)
| Publication Number | Publication Date |
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| CN208095044U true CN208095044U (en) | 2018-11-13 |
Family
ID=64062811
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| Application Number | Title | Priority Date | Filing Date |
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| CN201820352076.4U Active CN208095044U (en) | 2018-03-14 | 2018-03-14 | Electromagnetic shielding film and wiring board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022016686A1 (en) * | 2020-07-24 | 2022-01-27 | 广州方邦电子股份有限公司 | Shielding film and circuit board |
-
2018
- 2018-03-14 CN CN201820352076.4U patent/CN208095044U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| WO2022016686A1 (en) * | 2020-07-24 | 2022-01-27 | 广州方邦电子股份有限公司 | Shielding film and circuit board |
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