CN208754591U - Electromagnetic shielding film and wiring board - Google Patents
Electromagnetic shielding film and wiring board Download PDFInfo
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- CN208754591U CN208754591U CN201821214741.XU CN201821214741U CN208754591U CN 208754591 U CN208754591 U CN 208754591U CN 201821214741 U CN201821214741 U CN 201821214741U CN 208754591 U CN208754591 U CN 208754591U
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Abstract
The utility model embodiment provides a kind of electromagnetic shielding film and wiring board, wherein, electromagnetic shielding film includes the first screen layer being cascading, conductive adhesive layer, secondary shielding layer and adhesive film, first screen layer is equipped with the first through hole through its upper and lower surface, and secondary shielding layer is equipped with the second through-hole through its upper and lower surface.By making first screen layer, conductive adhesive layer, secondary shielding layer and adhesive film be cascading, so that under the cooperation of first screen layer and secondary shielding layer, electromagnetic shielding film being capable of two secondary reflection high-frequency interferencing signals, to realize high shield effectiveness, it is suitable for hyperfrequency and high speed transmits.
Description
Technical field
The utility model relates to electronic field more particularly to a kind of electromagnetic shielding films and wiring board.
Background technique
With the rapid development of electronics industry, electronic product is further to miniaturization, lightweight, assembling densification hair
Exhibition greatly pushes the development of flexible electric circuit board, to realize component arrangement and conducting wire connecting integration.Flexible electric circuit board can be wide
It is general to be applied to the industries such as mobile phone, liquid crystal display, communication and space flight.
Under the promotion of international market, function flexible electric circuit board is occupied an leading position in flexible electric circuit board market, and is evaluated
One important indicator of function flexible electric circuit board performance is electromagnetic shielding ((Electromagnetic Interference
Shielding, abbreviation EMI Shielding).With the integration of the communication apparatus function such as mobile phone, internal component sharply high frequency
High speed.Such as: for cell-phone function other than original audio communication function, camera function has become necessary function, and WLAN
(Wireless Local Area Networks, WLAN), GPS (Global Positioning System, the whole world
Positioning system) and function of surfing the Net popularized, along with the integration of following sensing component, sharply high-frequency high-speed becomes component
Gesture is more inevitable.The component internal and the electromagnetic interference of outside, signal caused under the driving of high frequency and high speed exists
Decaying and insertion loss and jitter problem are gradually serious in transmission.
Currently, the common screened film of existing line plate includes shielded layer and conductive adhesive layer, by conductive adhesive layer by shielded layer
It is connect with wiring board stratum, and then interference charge is imported into wiring board stratum, realize shielding.But due to by screened film itself
The factors such as structure and characteristic influence, cause the shield effectiveness of common screened film lower, so that in high frequency and high speed
The problem of still having electromagnetic interference in the signal transmission of change.
Utility model content
The purpose of the utility model embodiment is to provide a kind of electromagnetic shielding film and wiring board, shielding effect with higher
Can, it is efficiently applied to hyperfrequency and high speed transmission.
To achieve the above object, the utility model embodiment provides a kind of electromagnetic shielding film, including is cascading
First screen layer, conductive adhesive layer, secondary shielding layer and adhesive film, the first screen layer is equipped with through its upper and lower surface
First through hole, the secondary shielding layer are equipped with the second through-hole through its upper and lower surface.
As an improvement of the above scheme, the secondary shielding layer includes the first surface contacted with the adhesive film, and institute
Stating first surface is flat surface；The adhesive film includes the adhesion layer containing conducting particles.
As an improvement of the above scheme, the secondary shielding layer includes the first surface contacted with the adhesive film, described
First surface is flat surface, and the conductive particles of convex are also formed on the first surface, and the conductive particles protrude into institute
State adhesive film.
As an improvement of the above scheme, the height of the conductive particles is 0.1 μm -30 μm.
As an improvement of the above scheme, the adhesive film includes the adhesion layer containing conducting particles；Or, the adhesive film packet
Include the adhesion layer without conducting particles.
As an improvement of the above scheme, the secondary shielding layer includes the first surface contacted with the adhesive film, described
First surface is the non-smooth surface to rise and fall.
As an improvement of the above scheme, the conductive particles of convex are also formed on the first surface；The conductive particles
Height be 0.1 μm -30 μm.
As an improvement of the above scheme, the first surface includes several protrusions, and the conductive particles integrated distribution is in institute
It states on protrusion.
As an improvement of the above scheme, the adhesive film includes the adhesion layer containing conducting particles；Or, the adhesive film packet
Include the adhesion layer without conducting particles.
As an improvement of the above scheme, the first screen layer and secondary shielding layer respectively include metal screen layer, carbon is received
One of mitron shielded layer, ferrite shielded layer and graphene shielded layer are a variety of.
As an improvement of the above scheme, the metal screen layer includes monometallic shielded layer and/or alloy shielded layer；Its
In, the monometallic shielded layer is made of any one material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, described
Alloy shielded layer is made of two or more any material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
As an improvement of the above scheme, the cross-sectional area of the first through hole is 0.1 μm2-1mm2；And/or described
The cross-sectional area of two through-holes is 0.1 μm2-1mm2。
As an improvement of the above scheme, every 1cm2The number of the first through hole in the first screen layer is 10-
1000；And/or every 1cm2The number of second through-hole in the secondary shielding layer is 10-1000.
As an improvement of the above scheme, the electromagnetic shielding film further includes protective film layer, and the protective film layer is set to described
Side of the first screen layer far from the conductive adhesive layer.
Compared with prior art, the utility model embodiment discloses a kind of electromagnetic shielding film, by described in setting simultaneously
First screen layer and the secondary shielding layer, and make the first screen layer, conductive adhesive layer, secondary shielding layer and adhesive film successively
It is stacked, enables the two secondary reflection high-frequency interferencing signal of electromagnetic shielding film, realize high shield effectiveness, be applicable in
It is transmitted in hyperfrequency and high speed；Meanwhile by the way that the conducting resinl is arranged between the first screen layer and secondary shielding layer
Layer, to increase the bending of the electromagnetic shielding film.In addition, logical by the way that described first is arranged in the first screen layer
Hole, while second through-hole is set in the secondary shielding layer, so that at high temperature, the volatile matter energy in the adhesive film
Enough to be discharged from the first through hole and the second through-hole, the volatile matter efficiently avoided in the adhesive film at high temperature is difficult to arrange
It the phenomenon that leading to electromagnetic shielding film blistering layering out, is shelled so as to avoid between the electromagnetic shielding film and the stratum of wiring board
From, and then ensure the good earth of electromagnetic shielding film, and will interference charge export.
Simultaneously as the setting of the first through hole and the second through-hole, so that being located at described first during pressing
The conductive adhesive layer between shielded layer and secondary shielding layer is partially protruded into and is connected in the first through hole and the second through-hole,
And the adhesive film is partially protruded into and is connected in second through-hole, so that the first screen layer, conductive adhesive layer,
Together with two shielded layers are closely attached with adhesive film, the peel strength of the electromagnetic shielding film is greatly increased.
The utility model embodiment discloses a kind of wiring board, including printed wiring board and electromagnetism described in any of the above embodiments
Screened film, the electromagnetic shielding film are mutually pressed by its adhesive film with the printed wiring board.
Compared with prior art, the utility model embodiment discloses a kind of wiring board, and the wiring board includes track
Electromagnetic shielding film described in road plate and above-mentioned any one, the electromagnetic shielding film pass through its adhesive film and the printed wiring board
It mutually presses, enables wiring board by the two secondary reflection high-frequency interferencing signal of electromagnetic shielding film, realize high shielding effect
Can, it is suitable for hyperfrequency and high speed transmits；Meanwhile by described in the setting between the first screen layer and secondary shielding layer
Conductive adhesive layer, to increase the bending of the electromagnetic shielding film.In addition, by described in the setting in the first screen layer
First through hole, while second through-hole is set in the secondary shielding layer, so that at high temperature, waving in the adhesive film
Sending out object can be discharged from the first through hole and the second through-hole, efficiently avoid the volatile matter in the adhesive film at high temperature
It is difficult to the phenomenon that being discharged and leading to screened film blistering layering, so as to avoid between the electromagnetic shielding film and the stratum of wiring board
Removing, and then ensure the good earth of electromagnetic shielding film, and will interference charge export.
Simultaneously as the setting of the first through hole and the second through-hole, so that being located at described first during pressing
The conductive adhesive layer between shielded layer and secondary shielding layer is partially protruded into and is connected in the first through hole and the second through-hole,
And the adhesive film is partially protruded into and is connected in second through-hole, so that the first screen layer, conductive adhesive layer,
Together with two shielded layers are closely attached with adhesive film, the peel strength of the electromagnetic shielding film is greatly increased.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of an angle of the electromagnetic shielding film in the utility model embodiment 1；
Fig. 2 is the structural schematic diagram of another angle of the electromagnetic shielding film in the utility model embodiment 1；
Fig. 3 is the structural schematic diagram of the electromagnetic shielding film in the utility model embodiment 2；
Fig. 4 is the structural schematic diagram of the electromagnetic shielding film in the utility model embodiment 3；
Fig. 5 is the structural schematic diagram of the electromagnetic shielding film in the utility model embodiment 4；
Fig. 6 is the structural schematic diagram of the wiring board in the utility model embodiment 5；
Fig. 7 is the flow diagram of the preparation method of the electromagnetic shielding film in the utility model embodiment 6.
Wherein, 1, first screen layer；11, first through hole；2, conductive adhesive layer；3, secondary shielding layer；31, the second through-hole；32,
Conductive particles；33, first surface；331, protrusion；332, recess portion；34, second surface；4, adhesive film；5, protective film layer；6, it prints
Wiring board.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without creative efforts
Every other embodiment obtained, fall within the protection scope of the utility model.
It is the structural schematic diagram of an angle of electromagnetic shielding film provided by the utility model embodiment 1 referring to Fig. 1；
Referring to fig. 2, be electromagnetic shielding film provided by the utility model embodiment 1 an another angle structural representation
Figure；
Referring to figs. 1 and 2, the electromagnetic shielding film, including be cascading first screen layer 1, conducting resinl
Layer 2, secondary shielding layer 3 and adhesive film 4, the first screen layer 1 is equipped with the first through hole 11 through its upper and lower surface, described
Secondary shielding layer 3 is equipped with the second through-hole 31 through its upper and lower surface.
In the utility model embodiment, by the way that the first screen layer 1 and the secondary shielding layer 3 is arranged simultaneously, and
The first screen layer 1, conductive adhesive layer 2, secondary shielding layer 3 and adhesive film 4 is set to be cascading, so that the electromagnetic shielding
Film can two secondary reflection high-frequency interferencing signals, realize high shield effectiveness, be suitable for hyperfrequency and high speed and transmit.Together
When, by the way that the conductive adhesive layer 2 is arranged between the first screen layer 1 and secondary shielding layer 3, to increase the electromagnetism
The bending of screened film；In addition, by the way that the first through hole 11 is arranged in the first screen layer 1, while described second
Second through-hole 31 is set on shielded layer 3, so that at high temperature, the volatile matter in the adhesive film 4 can be from described first
Through-hole 11 and the discharge of the second through-hole 31, the volatile matter efficiently avoided in the adhesive film 4 at high temperature are difficult to be discharged and lead
The phenomenon that causing screened film blistering layering, removes, and then really so as to avoid between the electromagnetic shielding film and the stratum of wiring board
The good earth of electromagnetic shielding film is protected, and will interference charge export.
Simultaneously as the setting of the first through hole 11 and the second through-hole 31, so that being located at described during pressing
The conductive adhesive layer 2 between first screen layer 1 and secondary shielding layer 3 partially protrudes into and is connected to the first through hole 11 and
In two through-holes 31, and the adhesive film 4 is partially protruded into and is connected in second through-hole 31, so that first shielding
Layer 1, conductive adhesive layer 2, secondary shielding layer 3 greatly increase the electromagnetic shielding film together with being closely attached with adhesive film 4
Peel strength.
In the utility model embodiment, the secondary shielding layer 3 includes the first surface contacted with the adhesive film 4
33, and the first surface 33 is flat surface；The adhesive film 4 includes the adhesion layer containing conducting particles.When described first
When surface 33 is flat surface, by making the adhesive film 2 include the adhesion layer containing conducting particles, so that the adhesive film 2
Has the function of bonding, so that the terminal plate and electromagnetic shielding film closely bind, while the adhesive film 2 also has conduction
Function is matched with the first screen layer 1, conductive adhesive layer 2 and secondary shielding layer 3, will interference electronics import rapidly described in
In the stratum of terminal plate.Wherein, the conducting particles can be the conducting particles being separated from each other, or big made of reunion
Particle conducting particles；When the conducting particles is the conducting particles being separated from each other, the area of electrical contact can further improve,
Improve the uniformity of electrical contact；And bulky grain conducting particles made of being to reunite when the conducting particles, it is strong that puncture can be increased
Degree.
In addition, the secondary shielding layer 3 further includes the second surface 34 opposite with the first surface 33, second table
Face 34 is in contact with the conductive adhesive layer 2.Second table 34 can be the surface of any shape, for example, can be such as Fig. 1 institute
The flat surface shown, or contoured non-smooth surface or other rough surfaces.The utility model attached drawing is only with described
Second surface 34 is illustrated for flat surface, and the second surface 34 of other any shapes is all in the protection of the utility model
Within the scope of.
In the utility model embodiment, the first screen layer 1 includes the third surface and the 4th surface being oppositely arranged,
The third surface is in contact with the conductive adhesive layer；4th surface is in contact with the protective film layer.It needs to illustrate
It is that the third surface and the 4th surface can be the surface of any shape, for example, can be as shown in Figure 1 smooth
Surface, or contoured non-smooth surface or other rough surfaces；In addition, the third surface and the 4th table
Face can be the surface of rule, be also possible to irregular surface.The utility model attached drawing is only with third surface and the 4th surface
It is illustrated for flat surface, other any shapes are within the protection scope of the utility model.
In the utility model embodiment, it is preferable that the cross-sectional area of the first through hole 11 is 0.1 μm2-1mm；
And/or the cross-sectional area of second through-hole 31 is 0.1 μm2-1mm.By being preferably by the area of the first through hole 11
0.1μm2-1mm2, the cross-sectional area by second through-hole 31 is preferably 0.1 μm2- 1mm, to ensure at high temperature, the glue
The volatile matter of film layer 4 can be discharged by the sufficiently large first through hole 11 and the second through-hole 31, to avoid at high temperature
Volatile matter is difficult to the phenomenon that being discharged and leading to screened film blistering layering in the adhesive film, and then ensures the good of electromagnetic shielding film
Good ground connection, to guarantee to interfere charge to export.
Moreover it is preferred that every 1cm in the present embodiment2The number of the first through hole 11 in the first screen layer 1 is
10-1000；And/or every 1cm2The number of second through-hole 31 in the secondary shielding layer 3 is 10-1000.Pass through
By every 1cm2The number of the first through hole 11 in the first screen layer 1 is set as 10-1000, by every 1cm2Described
The number of second through-hole 31 in two shielded layers 3 is a to be set as 10-1000, described to further ensure that at high temperature
The volatile matter of adhesive film 4 can be discharged by enough first through hole 11 and the second through-hole 31, to further avoid
Volatile matter is difficult to the phenomenon that being discharged and leading to screened film blistering layering in the adhesive film at high temperature, and then ensures electromagnetic screen
The good earth of film is covered, interference charge can be exported with further ensuring that.
In the utility model embodiment, the first through hole 11 can regularly or irregularly be distributed in first screen
It covers on layer 1；Wherein, the first through hole 11, which is regularly distributed in the first screen layer 1, refers to each first through hole 11
Shape is identical and is evenly distributed in the first screen layer 1；The first through hole 11 is irregularly distributed in described first
Refer to the different of each first through hole 11 on shielded layer 1 and is disorderly distributed in the first screen layer 1.Preferably,
The shape of each first through hole 11 is identical, and each first through hole 11 is evenly distributed in the first screen layer 1.In addition, institute
Stating first through hole 11 can be circular through hole, can also be the through-hole of other arbitrary shapes, the utility model attached drawing is only with described
First through hole 11 is that circular through hole is illustrated, but the first through hole 11 of other any shapes is all in the utility model
Protection scope within.
In the utility model embodiment, second through-hole 31 can regularly or irregularly be distributed in second screen
It covers on layer 3；Wherein, second through-hole 31, which is regularly distributed in the secondary shielding layer 3, refers to each second through-hole 31
Shape is identical and is evenly distributed in the secondary shielding layer 3；Second through-hole 31 is irregularly distributed in described second
Refer to the different of each second through-hole 31 on shielded layer 3 and is disorderly distributed in the secondary shielding layer 3.Preferably,
The shape of each second through-hole 11 is identical, and each second through-hole 31 is evenly distributed in the secondary shielding layer 3.In addition, institute
Stating the second through-hole 31 can be circular through hole, can also be the through-hole of other arbitrary shapes, the utility model attached drawing is only with described
Second through-hole 31 is that circular through hole is illustrated, but second through-hole 31 of other any shapes is all in the utility model
Protection scope within.
In the utility model embodiment, the first screen layer 1 with a thickness of 0.1 μm -45 μm；And/or described second
Shielded layer 3 with a thickness of 0.1 μm -45 μm.It should be understood that in order to guarantee the first screen layer 1 and the secondary shielding layer 3
With good electric conductivity, the first screen layer 1 and the secondary shielding layer 2 include metal screen layer, carbon nanotube screen
Cover one of layer, ferrite shielded layer and graphene shielded layer or a variety of.In addition, the metal screen layer includes monometallic screen
Cover layer and/or alloy shielded layer；Wherein, the monometallic shielded layer is by aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold
Any one material is made, the alloy shielded layer by any two kinds in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold or
Two or more materials are made.
In the utility model embodiment, it should be noted that the first screen layer 1, second of the present embodiment attached drawing
Shielded layer 3 all can be single layer structure, or multilayered structure.In addition, according to the needs of actual production and application, this implementation
The first screen layer 1 and the secondary shielding layer 2 of example attached drawing may be configured as latticed, foaming shape etc..
In the utility model embodiment, the adhesive film 4 with a thickness of 1 μm -80 μm.4 material therefor of adhesive film
Selected from following several: modified epoxy class, acrylic compounds, modified rubber class, modified thermoplastic polyimide.In addition, institute
The outer surface for stating adhesive film 4 can be the flat surface without fluctuating, be also possible to the non-smooth surface gently to rise and fall.
In the utility model embodiment, in order to protect the first screen layer 1, electromagnetic shielding film described in the present embodiment
It further include protective film layer 5, the protective film layer 5 is set to side of the first screen layer 1 far from the conductive adhesive layer 2.It is described
Protective film layer 5 plays a protective role, to guarantee that the first screen layer 1 is not scratched breakage in use, maintains institute
State the high shield effectiveness of first screen layer 1.The protective film layer 5 includes PPS film layer, PEN film layer, laminated polyester film, gathers
Film layer that film layer that imide membrane layer, epoxy resin ink are formed after solidifying, polyurethane ink are formed after solidifying, modified propylene
The film layer that the film layer or polyimide resin that acid resin is formed after solidifying are formed after solidifying.
In the utility model embodiment, it should be noted that the electromagnetic shielding film can be duplicate multilayered structure；
It specifically, is electromagnetic shielding membrane body, institute with the first screen layer 1, conductive adhesive layer 2 and the secondary shielding layer 3 that are cascading
Stating electromagnetic shielding film can be including multiple electromagnetic shielding membrane bodies stacked gradually, and by multiple electromagnetic shielding membrane bodies
The whole side of formation is equipped with the adhesive film 4, and the other side is equipped with the protective film layer 5.
It is the structural schematic diagram of electromagnetic shielding film provided by the utility model embodiment 2 referring to Fig. 3；
As shown in figure 3, the electromagnetic shielding film in the present embodiment, the difference from embodiment 1 is that, second screen
Covering layer 3 includes the first surface 33 contacted with the adhesive film 4, and the first surface 33 is flat surface, and first table
The conductive particles 32 of convex are also formed on face 33, the conductive particles 32 protrude into the adhesive film 4.When the secondary shielding layer
3 first surfaces 33 contacted with the adhesive film 4 be flat surface when, by the first surface 33 also formed described in lead
Body particle 32, and the conductive particles 32 is made to protrude into the adhesive film 4, so that the conductor can be passed through during pressing
Particle 32 pierces through the adhesive film 4, and then protects under the cooperation of the first screen layer 1, conductive adhesive layer 2 and secondary shielding layer 3
Card interference charge normally exports, to ensure that the electromagnetic shielding film has high shield effectiveness；In addition, the electromagnetic shielding film
It efficiently avoids charge buildup and generates eddy-current loss, therefore reduce the insertion loss in use process, be suitable for superelevation
Frequency and high speed transmission.
In specific implementation, as shown in figure 3, the secondary shielding layer 3 can be initially formed, then pass through other techniques again
The conductive particles 32 are formed in the first surface 33 of the secondary shielding layer 3.Certainly, the secondary shielding layer 3 and conductor
Grain 32 can be the overall structure formed by one-shot forming technique.
In the utility model embodiment, the conductive particles 32 can exist certain with the outer surface of the adhesive film 4
Distance can also be in contact with the outer surface of the adhesive film 4 or extend the outer surface of the adhesive film 4.
In the utility model embodiment, in order to further ensure that the secondary shielding layer 3 can smoothly pierce through the glue
Film layer 4, it is preferable that the height of the conductive particles 32 is 0.1 μm -30 μm.
In the utility model embodiment, the conductive particles 32 include metallic particles, carbon nanotube particulate and ferrite
One of particle is a variety of.In addition, the metallic particles includes monometallic particle and/or alloying pellet；Wherein, the Dan Jin
Metal particles are made of any one material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, the alloying pellet by aluminium,
Two or more any material in titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold is made.It should be noted that described
Conductive particles 32 can be identical as the material of the secondary shielding layer 3, can not also be identical.
In the utility model embodiment, it should be noted that the shape of the conductive particles 32 as shown in Figure 3 is only
It is exemplary, due to the difference on process means and parameter, the conductive particles 32 can also be cluster-shaped, extension ice-like, clock
The other shapes such as mammary calculus shape, dendroid.In addition, the conductive particles 32 in the utility model are not illustrated and above-mentioned shape
Limitation, as long as have pierce through and conducting function conductive particles, both be within the protection scope of the present invention.
In the utility model embodiment, one of structure of the adhesive film 4, specific manifestation are as follows: the adhesive film 4
Including the adhesion layer containing conducting particles.By making the adhesive film 4 include the adhesion layer containing conducting particles, so that the glue
Film layer 4 has the function of bonding, so that terminal plate and the electromagnetic shielding film closely bind, while the adhesive film 4 also has
Conductive function, matches with the first screen layer 1, conductive adhesive layer 2 and secondary shielding layer 3, and interference electronics is led rapidly
In the stratum for entering the terminal plate.Wherein, the conducting particles can be the conducting particles being separated from each other, or reunite and
At bulky grain conducting particles；When the conducting particles is the conducting particles being separated from each other, electrical contact can further improve
Area, improve the uniformity of electrical contact；And bulky grain conducting particles made of being to reunite when the conducting particles, it can increase
Puncture intensity.
In the utility model embodiment, another structure of the adhesive film 4, specific manifestation are as follows: the adhesive film 4 wraps
Include the adhesion layer without conducting particles.By making the adhesive film 4 include the adhesion layer without conducting particles, so that the glue film
Layer 4 has the function of bonding, so that terminal plate and the electromagnetic shielding film closely bind, simultaneously because the adhesive film 4 includes
Without conducting particles, to reduce the insertion loss of wiring board in use process, improve wiring board while improving shield effectiveness
Bending.
In the utility model embodiment, it should be noted that the electromagnetic shielding film can be duplicate multilayered structure；
It specifically, is electromagnetic shielding membrane body, institute with the first screen layer 1, conductive adhesive layer 2 and the secondary shielding layer 3 that are cascading
Stating electromagnetic shielding film can be including multiple electromagnetic shielding membrane bodies stacked gradually, and by multiple electromagnetic shielding membrane bodies
Whole one end of formation is equipped with the adhesive film 4, and the other end is equipped with the protective film layer 5；The institute contacted with the adhesive film 4
The first surface 33 for stating secondary shielding layer 3 is flat surface, and the conductive particles of convex are also formed on the first surface 33
32, the conductive particles 32 protrude into the adhesive film 4.In addition, the other structures and work of the embodiment of the present invention electromagnetic shielding film
It is same as Example 1 to make principle, does not do more repeat herein.
It referring to fig. 4, is the structural schematic diagram of electromagnetic shielding film provided by the utility model embodiment 3；
As shown in figure 4, the electromagnetic shielding film in the present embodiment, the difference from embodiment 1 is that, second screen
Covering layer 3 includes the first surface 33 contacted with the adhesive film 4, and the first surface 33 is the non-smooth surface to rise and fall.Work as institute
When to state first surface 33 that secondary shielding layer 3 is contacted with the adhesive film 4 be non-smooth surface, so that the secondary shielding layer 3
Non-smooth surface can guarantee that the secondary shielding layer 3 smoothly pierces through the adhesive film 4 during pressing, and then in institute
It states and guarantees that interference charge normally exports under the cooperation of first screen layer 1, conductive adhesive layer 2 and secondary shielding layer 3, to ensure the electricity
Magnetic shield film has high shield effectiveness；In addition, the electromagnetic shielding film efficiently avoids charge buildup and generates vortex
Loss, therefore the insertion loss in use process is reduced, it is suitable for hyperfrequency and transmits.
In the utility model embodiment, the first surface 33 is non-smooth surface, wherein the non-smooth surface is
The non-smooth surface or irregular non-smooth surface of rule.Specifically, when the non-smooth table that the non-smooth surface is rule
When face, the non-smooth surface is the structure of periodic undulations variation, the amplitude and fluctuating to rise and fall on the non-smooth surface
Interval be identical；When the non-smooth surface is irregular non-smooth surface, the non-smooth surface is aperiodic
Property fluctuations structure, the interval of the amplitude and fluctuating that rise and fall on the non-smooth surface is different.
In the utility model embodiment, one of structure of the adhesive film 4, specific manifestation are as follows: the adhesive film 4
Including the adhesion layer containing conducting particles.By making the adhesive film 4 include the adhesion layer containing conducting particles, so that the glue
Film layer 4 has the function of bonding, so that terminal plate and the electromagnetic shielding film closely bind, while the adhesive film 4 also has
Conductive function, matches with the first screen layer 1, conductive adhesive layer 2 and secondary shielding layer 3, and interference electronics is led rapidly
In the stratum for entering the terminal plate.Wherein, the conducting particles can be the conducting particles being separated from each other, or reunite and
At bulky grain conducting particles；When the conducting particles is the conducting particles being separated from each other, electrical contact can further improve
Area, improve the uniformity of electrical contact；And bulky grain conducting particles made of being to reunite when the conducting particles, it can increase
Puncture intensity.
In the utility model embodiment, another structure of the adhesive film 4, specific manifestation are as follows: the adhesive film 4 wraps
Include the adhesion layer without conducting particles.By making the adhesive film 4 include the adhesion layer without conducting particles, so that the glue film
Layer 4 has the function of bonding, so that terminal plate and the electromagnetic shielding film closely bind, simultaneously because the adhesive film 4 includes
Without conducting particles, to reduce the insertion loss of wiring board in use process, improve wiring board while improving shield effectiveness
Bending.
In the utility model embodiment, it should be noted that the electromagnetic shielding film can be duplicate multilayered structure；
It specifically, is electromagnetic shielding membrane body, institute with the first screen layer 1, conductive adhesive layer 2 and the secondary shielding layer 3 that are cascading
Stating electromagnetic shielding film can be including multiple electromagnetic shielding membrane bodies stacked gradually, and by multiple electromagnetic shielding membrane bodies
Whole one end of formation is equipped with the adhesive film 4, and the other end is equipped with the protective film layer 5；It is in contact with the adhesive film 4
The first surface 33 of secondary shielding layer 3 is the non-smooth surface to rise and fall.In addition, the embodiment of the present invention electromagnetic shielding film is other
Structure and working principle are same as Example 1, do not do more repeat herein.
It is the structural schematic diagram of electromagnetic shielding film provided by the utility model embodiment 4 referring to Fig. 5；
As shown in figure 5, the electromagnetic shielding film in the present embodiment, the difference from embodiment 1 is that, second screen
Covering layer 3 includes the first surface 33 contacted with the adhesive film 4, and the first surface 33 is the non-smooth surface to rise and fall, and institute
State the conductive particles 32 that convex is also formed on first surface 33.When the secondary shielding layer 3 contacted with the adhesive film 4
When one surface 33 is non-smooth surface, by also forming the conductive particles 32 on the first surface 33, so that pressing
During the conductive particles 32 can guarantee that the secondary shielding layer 3 successfully pierces through the adhesive film 4, and then described
Guarantee that interference charge normally exports under the cooperation of first screen layer 1, conductive adhesive layer 2 and secondary shielding layer 3, to ensure the electromagnetism
Screened film has high shield effectiveness；In addition, the electromagnetic shielding film efficiently avoids charge buildup and generates vortex damage
Consumption, therefore the insertion loss in use process is reduced, it is suitable for hyperfrequency and high speed transmits.
In specific implementation, as shown in figure 5, the secondary shielding layer 3 can be initially formed, then pass through other techniques again
The conductive particles 32 are formed in the first surface 33 of the secondary shielding layer 3.Certainly, the secondary shielding layer 3 and conductor
Grain 32 can be the overall structure formed by one-shot forming technique.
In the utility model embodiment, the first surface 33 is non-smooth surface, wherein the non-smooth surface is
The non-smooth surface or irregular non-smooth surface of rule.Specifically, when the non-smooth table that the non-smooth surface is rule
When face, the non-smooth surface is the structure of periodic undulations variation, the amplitude and fluctuating to rise and fall on the non-smooth surface
Interval be identical；When the non-smooth surface is irregular non-smooth surface, the non-smooth surface is aperiodic
Property fluctuations structure, the interval of the amplitude and fluctuating that rise and fall on the non-smooth surface is different.
In the utility model embodiment, the first surface includes several protrusions 331 and recess portion 332, the conductor
The preferably integrated distribution of grain 32 is on the protrusion 331, so that the secondary shielding layer 3 is easier to pierce during the pressing process
The adhesive film 4 is worn, to realize being reliably connected inside the wiring board.
It is being pressed based on above structure since the first surface 33 of the secondary shielding layer 3 is the non-smooth surface to rise and fall
The glue at the conductive particles 32 on the protrusion 331 for being located at the first surface 33 can be expressed to institute by the adhesive film 4 in the process
It states in the recess portion 332 of first surface 21, so as to avoid charging capacity is small and be easy to cause plate bursting phenomenon；Meanwhile fluctuating is non-flat
The conductive particles 32 of certain altitude are formed on whole surface again, can guarantee that the secondary shielding layer 3 is suitable during the pressing process
Benefit pierces through the adhesive film 4, practical.
In the utility model embodiment, in order to further ensure that the secondary shielding layer 3 can smoothly pierce through the glue
Film layer 4, it is preferable that the height of the conductive particles 32 is 0.1 μm -30 μm.
Preferably, the waviness (i.e. the distance between the highs and lows of first surface) of the first surface 33 is
0.1 μm~30 μm, within the above range by the waviness setting of the first surface 33, the secondary shielding layer 3 can be enhanced
Function is pierced through, guarantees that charge will be interfered to export.
Preferably, the thickness of the adhesive film 4 and the waviness of the first surface 33 and the height of the conductive particles 32
The sum of degree meets proportionate relationship 0.5~2, to guarantee enough puncture intensities and charging capacity, embodies are as follows: on the one hand prevent institute
The thickness of adhesive film 4 is stated relative to the waviness of the first surface 33 and the height of the conductive particles 32 and too small and lead
Cause charging capacity insufficient and then lead to plate bursting phenomenon, on the other hand prevent the first surface 33 waviness and the conductive particles
The sum of 32 height is too small relative to the thickness of the adhesive film 4 and causes puncture intensity insufficient.
In the utility model embodiment, the conductive particles 32 can exist certain with the outer surface of the adhesive film 4
Distance can also be in contact with the outer surface of the adhesive film 4 or extend the outer surface of the adhesive film 4.
In the utility model embodiment, the conductive particles 32 include metallic particles, carbon nanotube particulate and ferrite
One of particle is a variety of.In addition, the metallic particles includes monometallic particle and/or alloying pellet；Wherein, the Dan Jin
Metal particles are made of any one material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, the alloying pellet by aluminium,
Two or more any material in titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold is made.It should be noted that described
Conductive particles 32 can be identical as the material of the secondary shielding layer 3, can not also be identical.
In the utility model embodiment, it should be noted that the shape of the conductive particles 32 as shown in Figure 5 is only
It is exemplary, due to the difference on process means and parameter, the conductive particles 32 can also be cluster-shaped, extension ice-like, clock
The other shapes such as mammary calculus shape, dendroid.In addition, the conductive particles 32 in the utility model are not illustrated and above-mentioned shape
Limitation, as long as have pierce through and conducting function conductive particles, both be within the protection scope of the present invention.
In the utility model embodiment, one of structure of the adhesive film 4, specific manifestation are as follows: the adhesive film 4
Including the adhesion layer containing conducting particles.By making the adhesive film 4 include the adhesion layer containing conducting particles, so that the glue
Film layer 4 has the function of bonding, so that terminal plate and the electromagnetic shielding film closely bind, while the adhesive film 4 also has
Conductive function, matches with the first screen layer 1, conductive adhesive layer 2 and secondary shielding layer 3, and interference electronics is led rapidly
In the stratum for entering the terminal plate.Wherein, the conducting particles can be the conducting particles being separated from each other, or reunite and
At bulky grain conducting particles；When the conducting particles is the conducting particles being separated from each other, electrical contact can further improve
Area, improve the uniformity of electrical contact；And bulky grain conducting particles made of being to reunite when the conducting particles, it can increase
Puncture intensity.
In the utility model embodiment, another structure of the adhesive film 4, specific manifestation are as follows: the adhesive film 4 wraps
Include the adhesion layer without conducting particles.By making the adhesive film 4 include the adhesion layer without conducting particles, so that the glue film
Layer 4 has the function of bonding, so that terminal plate and the electromagnetic shielding film closely bind, simultaneously because the adhesive film 4 includes
Without conducting particles, the insertion loss of wiring board in use process is reduced, improves the curved of wiring board while improving shield effectiveness
Folding endurance.
In the utility model embodiment, it should be noted that the electromagnetic shielding film can be duplicate multilayered structure；
It specifically, is electromagnetic shielding membrane body, institute with the first screen layer 1, conductive adhesive layer 2 and the secondary shielding layer 3 that are cascading
Stating electromagnetic shielding film can be including multiple electromagnetic shielding membrane bodies stacked gradually, and by multiple electromagnetic shielding membrane bodies
The whole side of formation is equipped with the adhesive film 4, and the other side is equipped with the protective film layer 5；Contacted with the adhesive film 4
The first surface 33 of two shielded layers 3 is the non-smooth surface to rise and fall, and the conductor of convex is also formed on the first surface 33
Particle 32.In addition, the other structures and working principle of the embodiment of the present invention electromagnetic shielding film are same as Example 1, herein not
It does and more repeats.
It is the structural schematic diagram of wiring board provided by the utility model embodiment 5 referring to Fig. 6；
As shown in fig. 6, the utility model embodiment is also corresponding to provide a kind of wiring board, including printed wiring board 6 and
Electromagnetic shielding film described in embodiment 1, the electromagnetic shielding film are pressed by its adhesive film 4 with 6 phase of printed wiring board.
In the present embodiment, it can refer to the description of above-described embodiment 1 about the implementation of electromagnetic shielding film, herein no longer
It repeats.
Preferably, the printed wiring board 6 is flexible single-side, flexibility double face, flexible multi-layer plate, one in rigid-flex combined board
Kind.
In the utility model embodiment, by above structure, the electromagnetic shielding film by its adhesive film 4 with it is described
After the pressing of 6 phase of printed wiring board, enables wiring board by the two secondary reflection high-frequency interferencing signal of electromagnetic shielding film, realize
High shield effectiveness, is suitable for hyperfrequency and high speed transmits；Meanwhile passing through the first shielding in the electromagnetic shielding film
The conductive adhesive layer 2 is set between layer 1 and secondary shielding layer 3, to increase the bending of the electromagnetic shielding film.In addition,
It is arranged described second by the way that the first through hole 11 is arranged in the first screen layer 1, while in the secondary shielding layer 3
Through-hole 31, so that at high temperature, the volatile matter in the adhesive film can be discharged from the first through hole 11 and the second through-hole 31,
Volatile matter in the adhesive film 4 at high temperature is efficiently avoided to be difficult to be discharged and lead to showing for electromagnetic shielding film blistering layering
As, it is removed so as to avoid between electromagnetic shielding film and the stratum of wiring board, and then ensure the good earth of electromagnetic shielding film,
And it will interference charge export.
Simultaneously as the setting of the first through hole 11 and the second through-hole 31, so that being located at described during pressing
The conductive adhesive layer 2 between first screen layer 1 and secondary shielding layer 3 partially protrudes into and is connected to the first through hole 11 and
In two through-holes 31, and the adhesive film 4 is partially protruded into and is connected in second through-hole 31, so that first shielding
Layer 1, conductive adhesive layer 2, secondary shielding layer 3 greatly increase the electromagnetic shielding film together with being closely attached with adhesive film 4
Peel strength.In addition, it should be noted that, the embodiment 1 that the embodiment of the present invention wiring board can will use in its structure
The electromagnetic shielding film replace with the described in any item electromagnetic shielding films of embodiment 2-4, do not do more repeat herein.
Referring to Fig. 7, the flow diagram of electromagnetic shielding membrane preparation method is provided for the utility model embodiment 6；
As shown in fig. 7, this method is suitable for the preparation of electromagnetic shielding film described in embodiment 1, comprising steps of
S1, first screen layer is formed；Wherein, the first screen layer has the first through hole through its upper and lower surface；
Wherein, the first screen layer is formed in the following manner in step sl:
Protective film layer is formed on a carrier film, forms the first screen layer in the side of the protective film layer；Or,
Strippable coating is formed on a carrier film, forms the first screen layer on the surface of the strippable coating, in institute
After first screen layer is stated far from the side formation protective film layer of the strippable coating, the carrier layer is removed.
In the utility model embodiment, the cross-sectional area of the first through hole of formation is 0.1 μm2-1mm2；Often
1cm2The number of the first through hole in the secondary shielding layer is 10-1000.
S2, conductive adhesive layer is formed in the side of the first screen layer；
S3, secondary shielding layer is formed far from the side of the first screen layer in the conductive adhesive layer；Wherein, described second
Shielded layer has the second through-hole through its upper and lower surface；
In the utility model embodiment, the cross-sectional area of second through-hole of formation is 0.1 μm2-1mm2；Often
1cm2The number of second through-hole in the secondary shielding layer is 10-1000.
S4, adhesive film is formed far from the side of the conductive adhesive layer in the secondary shielding layer.
Specifically, it is coated with adhesive film on release film, adhesive film pressing is then transferred to the secondary shielding layer
Side far from the conductive adhesive layer, to form adhesive film far from the side of the conductive adhesive layer in the secondary shielding layer；
Or
It directly is coated with adhesive film far from the side of the conductive adhesive layer in the secondary shielding layer, thus in second screen
It covers layer and forms adhesive film far from the side of the conductive adhesive layer.
Suitable for another preferred embodiment for preparing electromagnetic shielding film as described in example 2, also wrapped before step S4
Include step:
It plated by physics feather plucking, chemical plating, physical vapour deposition (PVD), chemical vapor deposition, evaporation, sputter plating, be electroplated and is mixed
The first surface that one of plating or kinds of processes are closed in the secondary shielding layer forms conductive particles；Wherein, first table
Face is the surface that the secondary shielding layer is contacted with the adhesive film, and the first surface is flat surface.
Suitable for another preferred embodiment for preparing electromagnetic shielding film as described in example 4, also wrapped before step S4
Include step:
It plated by physics feather plucking, chemical plating, physical vapour deposition (PVD), chemical vapor deposition, evaporation, sputter plating, be electroplated and is mixed
The first surface that one of plating or kinds of processes are closed in the secondary shielding layer forms conductive particles；Wherein, first table
Face is the surface that the secondary shielding layer is contacted with the adhesive film, and the first surface is non-smooth surface.
To sum up, the utility model embodiment provides the preparation method of a kind of electromagnetic shielding film, wiring board and electromagnetic shielding film,
Wherein, the electromagnetic shielding film includes the first screen layer 1 being cascading, conductive adhesive layer 2, secondary shielding layer 3 and glue film
Layer 4, the first screen layer 1 are equipped with the first through hole 11 through its upper and lower surface, and the secondary shielding layer 3, which is equipped with, to be run through
Second through-hole 31 of its upper and lower surface.By the way that the first screen layer 1 and the secondary shielding layer 3 is arranged simultaneously, and make described
First screen layer 1, conductive adhesive layer 2, secondary shielding layer 3 and adhesive film 4 are cascading, and enable the electromagnetic shielding film
Two secondary reflection high-frequency interferencing signals, realize high shield effectiveness, are suitable for hyperfrequency and high speed transmits；Meanwhile passing through
The conductive adhesive layer 2 is set between the first screen layer 1 and secondary shielding layer 3, to increase the electromagnetic shielding film
Bending；In addition, by the way that first through hole 11 is arranged in first screen layer 1, while in secondary shielding layer 3, setting second is logical
Hole 31, so that at high temperature, the volatile matter in the adhesive film 4 can be discharged from the first through hole 11 and the second through-hole 31,
Volatile matter in the adhesive film 4 at high temperature is efficiently avoided to be difficult to be discharged and lead to showing for electromagnetic shielding film blistering layering
As, it is removed so as to avoid between electromagnetic shielding film and the stratum of wiring board, and then ensure the good earth of electromagnetic shielding film,
And it will interference charge export.
Further, since the setting of the first through hole 11 and the second through-hole 31, so that being located at described during pressing
The conductive adhesive layer 2 between first screen layer 1 and secondary shielding layer 3 partially protrudes into and is connected to the first through hole 11 and
In two through-holes 31, and the adhesive film 4 is partially protruded into and is connected in second through-hole 31, so that first shielding
Layer 1, conductive adhesive layer 2, secondary shielding layer 3 greatly increase the electromagnetic shielding film together with being closely attached with adhesive film 4
Peel strength.
The above is preferred embodiments of the present invention, it is noted that for the ordinary skill of the art
For personnel, without departing from the principle of this utility model, several improvements and modifications can also be made, these are improved and profit
Decorations are also considered as the protection scope of the utility model.
Claims (15)
1. a kind of electromagnetic shielding film, which is characterized in that including be cascading first screen layer, conductive adhesive layer, the second screen
Layer and adhesive film are covered, the first screen layer is equipped with the first through hole through its upper and lower surface, sets in the secondary shielding layer
There is the second through-hole through its upper and lower surface.
2. electromagnetic shielding film as described in claim 1, which is characterized in that the secondary shielding layer includes connecing with the adhesive film
The first surface of touching, and the first surface is flat surface；The adhesive film includes the adhesion layer containing conducting particles.
3. electromagnetic shielding film as described in claim 1, which is characterized in that the secondary shielding layer includes connecing with the adhesive film
The first surface of touching, the first surface is flat surface, and the conductive particles of convex, institute are also formed on the first surface
It states conductive particles and protrudes into the adhesive film.
4. electromagnetic shielding film as claimed in claim 3, which is characterized in that the height of the conductive particles is 0.1 μm -30 μm.
5. electromagnetic shielding film as claimed in claim 3, which is characterized in that the adhesive film includes sticking together containing conducting particles
Layer；Or,
The adhesive film includes the adhesion layer without conducting particles.
6. electromagnetic shielding film as described in claim 1, which is characterized in that the secondary shielding layer includes connecing with the adhesive film
The first surface of touching, the first surface are the non-smooth surface to rise and fall.
7. electromagnetic shielding film as claimed in claim 6, which is characterized in that be also formed with the conductor of convex on the first surface
Particle；The height of the conductive particles is 0.1 μm -30 μm.
8. electromagnetic shielding film as claimed in claim 7, which is characterized in that the first surface includes several protrusions, described to lead
Body particle integrated distribution is on the protrusion.
9. electromagnetic shielding film as claimed in claim 6, which is characterized in that the adhesive film includes sticking together containing conducting particles
Layer；Or,
The adhesive film includes the adhesion layer without conducting particles.
10. such as the described in any item electromagnetic shielding films of claim 1-9, which is characterized in that the first screen layer and the second screen
It covers layer and respectively includes one of metal screen layer, carbon nanotube shielded layer, ferrite shielded layer and graphene shielded layer.
11. electromagnetic shielding film as claimed in claim 10, which is characterized in that the metal screen layer includes monometallic shielding
Layer；Wherein, the monometallic shielded layer is made of any one material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
12. such as the described in any item electromagnetic shielding films of claim 1-9, which is characterized in that the cross section face of the first through hole
Product is 0.1 μm2-1mm2；And/or the cross-sectional area of second through-hole is 0.1 μm2-1mm2。
13. such as the described in any item electromagnetic shielding films of claim 1-9, which is characterized in that every 1cm2In the first screen layer
The number of the first through hole is 10-1000；And/or every 1cm2Of second through-hole in the secondary shielding layer
Number is 10-1000.
14. such as the described in any item electromagnetic shielding films of claim 1-9, which is characterized in that the electromagnetic shielding film further includes protecting
Cuticular layer, the protective film layer are set to side of the first screen layer far from the conductive adhesive layer.
15. a kind of wiring board, which is characterized in that including printed wiring board and the described in any item electromagnetic screens of claim 1 to 14
Film is covered, the electromagnetic shielding film is mutually pressed by its adhesive film with the printed wiring board.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821214741.XU CN208754591U (en) | 2018-07-27 | 2018-07-27 | Electromagnetic shielding film and wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821214741.XU CN208754591U (en) | 2018-07-27 | 2018-07-27 | Electromagnetic shielding film and wiring board |
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| Publication Number | Publication Date |
|---|---|
| CN208754591U true CN208754591U (en) | 2019-04-16 |
Family
ID=66058760
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN201821214741.XU Active CN208754591U (en) | 2018-07-27 | 2018-07-27 | Electromagnetic shielding film and wiring board |
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| Country | Link |
|---|---|
| CN (1) | CN208754591U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111163625A (en) * | 2020-01-08 | 2020-05-15 | 李志宏 | Semi-anechoic chamber and floor structure thereof |
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2018
- 2018-07-27 CN CN201821214741.XU patent/CN208754591U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN111163625A (en) * | 2020-01-08 | 2020-05-15 | 李志宏 | Semi-anechoic chamber and floor structure thereof |
| CN111163625B (en) * | 2020-01-08 | 2022-05-13 | 李志宏 | Semi-anechoic chamber and floor structure thereof |
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