CN208754593U - Electromagnetic shielding film and wiring board - Google Patents
Electromagnetic shielding film and wiring board Download PDFInfo
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- CN208754593U CN208754593U CN201821215028.7U CN201821215028U CN208754593U CN 208754593 U CN208754593 U CN 208754593U CN 201821215028 U CN201821215028 U CN 201821215028U CN 208754593 U CN208754593 U CN 208754593U
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Abstract
The utility model embodiment provides a kind of electromagnetic shielding film and wiring board, wherein, electromagnetic shielding film includes first screen layer, secondary shielding layer and adhesive film, first screen layer is equipped with first through hole, resin protrusion is equipped at first through hole, resin protrusion solidifies after flowing to the other side from the side of first through hole by resin to be formed；Secondary shielding layer is set to first screen layer close to the side of resin protrusion, and covering resin is raised, to form lug boss in the outer surface of secondary shielding layer position corresponding with resin protrusion；Adhesive film is set to side of the secondary shielding layer far from first screen layer, lug boss protrudes into adhesive film, and lug boss is enabled to guarantee that secondary shielding layer successfully pierces through adhesive film, contacts with wiring board stratum during pressing, guarantee that interference charge normally exports, realizes function of shielding.
Description
Technical field
The utility model relates to electronic field more particularly to a kind of electromagnetic shielding films and wiring board.
Background technique
With the rapid development of electronics industry, electronic product is further to miniaturization, lightweight, assembling densification hair
Exhibition greatly pushes the development of flexible electric circuit board, to realize component arrangement and conducting wire connecting integration.Flexible electric circuit board can be wide
It is general to be applied to the industries such as mobile phone, liquid crystal display, communication and space flight.
Under the promotion of international market, function flexible electric circuit board is occupied an leading position in flexible electric circuit board market, and is evaluated
One important indicator of function flexible electric circuit board performance is electromagnetic shielding ((Electromagnetic Interference
Shielding, abbreviation EMI Shielding).With the integration of the communication apparatus function such as mobile phone, internal component sharply high frequency
High speed.Such as: for cell-phone function other than original audio communication function, camera function has become necessary function, and WLAN
(Wireless Local Area Networks, WLAN), GPS (Global Positioning System, the whole world
Positioning system) and function of surfing the Net popularized, along with the integration of following sensing component, sharply high-frequency high-speed becomes component
Gesture is more inevitable.The component internal and the electromagnetic interference of outside, signal caused under the driving of high frequency and high speed exists
Decaying and insertion loss and jitter problem are gradually serious in transmission.
Currently, the common screened film of existing line plate includes shielded layer and conductive adhesive layer, by conductive adhesive layer by shielded layer
It is connect with wiring board stratum, and then interference charge is imported into wiring board stratum, realize shielding.But at high temperature, due to conduction
Glue-line expansion, so that the conducting particles contacted with each other originally in conductive adhesive layer pulls open or script is in contact with wiring board stratum
Conducting particles pull open, lead to earthing failure, cannot will interference charge export rapidly, cannot achieve function of shielding.
Summary of the invention
The purpose of the utility model embodiment is to provide a kind of electromagnetic shielding film and wiring board, can be realized screened film and line
Road plate stratum is reliably connected, and then realizes the function of shielding of high reliability.
To achieve the above object, the utility model embodiment provides a kind of electromagnetic shielding film, including first screen layer,
Two shielded layers and adhesive film, the first screen layer are equipped with the first through hole through its upper and lower surface, and the first through hole is set
There is resin raised, the resin protrusion solidifies after flowing to the other side from the side of the first through hole by resin to be formed；Described
Two shielded layers are set to the first screen layer close to the side of the resin protrusion, and cover the resin protrusion, thus in institute
The outer surface position corresponding with the resin protrusion for stating secondary shielding layer forms lug boss；The adhesive film is set to described second
Side of the shielded layer far from the first screen layer, the lug boss protrude into the adhesive film.
As an improvement of the above scheme, the resin protrusion is flow to from the side of the first through hole at normal temperature by resin
Behind the other side, solidification is formed at curing temperatures；Or,
After the resin protrusion flow to the other side from the side of the first through hole under fusion temperature by resin, through moment
It is cooled into.
As an improvement of the above scheme, the surface of the lug boss is equipped with the conductive particles of convex；The conductive particles
Height is 0.1 μm -30 μm.
As an improvement of the above scheme, the adhesive film includes the adhesion layer containing conducting particles；Or, the adhesive film packet
Include the adhesion layer without conducting particles.
As an improvement of the above scheme, the first screen layer and secondary shielding layer respectively include metal screen layer, carbon is received
One of mitron shielded layer, ferrite shielded layer and graphene shielded layer are a variety of.
As an improvement of the above scheme, the metal screen layer includes monometallic shielded layer and/or alloy shielded layer；Its
In, the monometallic shielded layer is made of any one material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, described
Alloy shielded layer is made of two or more any material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
As an improvement of the above scheme, every 1cm2The number of the first through hole in the first screen layer is 10-
1000；And/or the cross-sectional area of the first through hole is 0.1 μm2-1mm2。
As an improvement of the above scheme, the electromagnetic shielding film further includes protective film layer, and the protective film layer is set to described
Side of the first screen layer far from the secondary shielding layer.
Compared with prior art, the utility model embodiment discloses a kind of electromagnetic shielding film, by first screen
It covers and the first through hole is set on layer, and be arranged at the first through hole and flow to separately by resin from the side of the first through hole
The resin protrusion of formation is solidified behind side, while the secondary shielding layer is set to the first screen layer close to the tree
The side of rouge protrusion, and the resin protrusion is covered, thus right in the outer surface of the secondary shielding layer and the resin protrusion
The position answered forms lug boss, and the adhesive film is set to side of the secondary shielding layer far from the first screen layer,
The lug boss is enabled to guarantee that the secondary shielding layer successfully pierces through the adhesive film during pressing, to realize
Reliable ground connection, and then the normal export of charge is interfered in guarantee under the cooperation of the first screen layer and secondary shielding layer, it is real
Existing high shielding.
The utility model embodiment also correspondence provides a kind of wiring board, including printed wiring board and above-mentioned any one institute
The electromagnetic shielding film stated, the electromagnetic shielding film are mutually pressed by its adhesive film with the printed wiring board；The lug boss thorn
The adhesive film is worn, and extends to the stratum of the printed wiring board.
Compared with prior art, the utility model embodiment discloses a kind of wiring board, and the wiring board includes track
Electromagnetic shielding film described in road plate and above-mentioned any one, the electromagnetic shielding film pass through its adhesive film and the printed wiring board
It mutually presses, the lug boss pierces through the adhesive film, and connect with the stratum of the printed wiring board, to realize interference charge
Smoothly export, realizes high shielding.
Detailed description of the invention
Fig. 1 is the structural schematic diagram of an angle of the electromagnetic shielding film in the utility model embodiment 1；
Fig. 2 is the structural schematic diagram of another angle of the electromagnetic shielding film in the utility model embodiment 1；
Fig. 3 is the structural schematic diagram of the electromagnetic shielding film in the utility model embodiment 2；
Fig. 4 is the structural schematic diagram of the wiring board in the utility model embodiment 3；
Fig. 5 is the flow diagram of the preparation method of the electromagnetic shielding film in the utility model embodiment 4.
Wherein, 1, first screen layer；11, first through hole；12, resin protrusion；13, first surface；14, second surface；2,
Secondary shielding layer；21, lug boss；22, conductive particles；3, adhesive film；4, protective film layer；5, printed wiring board.
Specific embodiment
The following will be combined with the drawings in the embodiments of the present invention, carries out the technical scheme in the embodiment of the utility model
Clearly and completely describe, it is clear that the described embodiments are only a part of the embodiments of the utility model, rather than whole
Embodiment.Based on the embodiments of the present invention, those of ordinary skill in the art are without creative efforts
Every other embodiment obtained, fall within the protection scope of the utility model.
It is the structural schematic diagram of an angle of electromagnetic shielding film provided by the utility model embodiment 1 referring to Fig. 1；
Referring to fig. 2, be electromagnetic shielding film provided by the utility model embodiment 1 another angle structural representation
Figure；
Referring to figs. 1 and 2, the electromagnetic shielding film, including first screen layer 1, secondary shielding layer 2 and adhesive film
3, the first screen layer 1 is equipped with the first through hole 11 through its upper and lower surface, and it is convex to be equipped with resin at the first through hole 11
12 are played, the resin protrusion 12 is flow to behind the other side to solidify and be formed by resin from the side of the first through hole 11；Described second
Shielded layer 2 is set to the first screen layer close to the side of the resin protrusion 12, and covers the resin protrusion 12, thus
The outer surface of the secondary shielding layer 2 position corresponding with the resin protrusion 12 forms lug boss 21；The adhesive film 3 is set to
Side of the secondary shielding layer 2 far from the first screen layer 1, the lug boss 21 protrude into the adhesive film 3.
In the utility model embodiment, by the way that the first through hole 11 is being arranged in the first screen layer 1, and
Described in solidification is formed after setting flow to the other side from the side of the first through hole 11 as resin at the first through hole 11
Resin protrusion 12, while the secondary shielding layer 2 is set to the first screen layer 1 close to the side of the resin protrusion 12,
And the resin protrusion 12 is covered, thus in outer surface and the raised 12 corresponding positions of the resin of the secondary shielding layer 2
Lug boss 21 is formed, and the adhesive film 3 is set to side of the secondary shielding layer 2 far from the first screen layer 1, so that
The lug boss 21 guarantees that the secondary shielding layer 2 can successfully pierce through the adhesive film 3 during pressing, to realize
Reliable ground connection, and then guarantee that interference charge normally exports under the cooperation of the first screen layer 1 and secondary shielding layer 2, it is real
Existing high shielding.The embodiment of the present invention electromagnetic shielding film no setting is required conductive adhesive layer, therefore efficiently avoid at high temperature,
The problem of earthing failure is led to due to conductive adhesive layer expansion.
Wherein, the process of the resin protrusion 12, specific manifestation are formed are as follows: in a wherein preferred embodiment, the tree
After rouge protrusion 12 flow to the other side from the side of the first through hole 11 under fusion temperature by resin, through instantaneous cooling shape
At.And in another preferred embodiment, the resin is solidification glue, the forming process specific manifestation of the resin protrusion 12 are as follows:
At normal temperature, after liquefied resin flow to the other side by the side of the first through hole 11, solidification is formed at curing temperatures.
In the utility model embodiment, it should be noted that the structure of the resin protrusion 12 shown in the drawings is only
It is exemplary.Since the resin protrusion 12 is to solidify shape after flowing to the other side from the side of the first through hole 11 by resin
At therefore, in a kind of wherein situation, resin is almost flowed out from the first through hole 11, in the first through hole 11
Without remnants, therefore the resin protrusion 12 formed can be as shown in the picture, and the resin protrusion 12 is formed in described first
The boundary of through-hole 11 and the secondary shielding layer 2；In another scenario, remnants have resin in the first through hole 11, institute
The one end for the resin protrusion 12 stating first through hole 11 or even being filled up by resin, therefore formed is located at the first through hole 11
Interior, the other end of the resin protrusion 12 stretches out the first through hole 11；In another situation, in the first screen layer 1
Side remained on surface far from the secondary shielding layer 2 has resin, and therefore, the resin protrusion 12 of formation can be through institute
State first through hole 11.In addition, the resin protrusion 12 in the utility model is by illustrating and above-mentioned shape is limited, only
If the resin protrusion with penetration ability, both is within the protection scope of the present invention.
In the utility model embodiment, ensures that and form the resin protrusion at the first through hole 11
12, it is preferable that the cross-sectional area of first through hole 11 described in the present embodiment is 0.1 μm2-1mm2。
In addition, every 1cm in the present embodiment2The number of the first through hole 11 in the first screen layer 1 is 10-
1000.Correspondingly, every 1cm2The number of the resin protrusion 12 in the first screen layer film 1 is 10-1000；It needs
Illustrate, since the secondary shielding layer 2 covers the resin protrusion 12, thus in the outer surface of the secondary shielding layer 2
Position corresponding with the resin protrusion 12 forms lug boss 21, therefore, the number of the lug boss 21 and resin protrusion
12 number is corresponding, to ensure that the secondary shielding layer 2 can successfully pierce through the adhesive film 3.
In the utility model embodiment, the first through hole 11 can regularly or irregularly be distributed in the screen first
It covers on layer 1；Wherein, the first through hole 11, which is regularly distributed in the first screen layer 1, refers to each first through hole 11
Shape is identical, and is evenly distributed in the first screen layer 1；The first through hole 11 is irregularly distributed in described first
Refer to the different of each first through hole 11 on shielded layer 1, and is disorderly distributed in the first screen layer 1.Preferably,
The shape of each first through hole 11 is identical, and each first through hole 11 is evenly distributed in the first screen layer 1.In addition, institute
Stating first through hole 11 can be circular through hole, can also be the through-hole of other arbitrary shapes, the utility model attached drawing is only with described
First through hole 11 is that circular through hole is illustrated, but the first through hole 11 of other any shapes is all in the utility model
Protection scope within.
In the utility model embodiment, it should be noted that the shape of the lug boss 21 can be convex with the resin
Rise 12 shape it is identical, can also be different from the shape of the resin protrusion 12, the shape of the lug boss 21 shown in the drawings
It is only exemplary.
In the utility model embodiment, the first screen layer 1 with a thickness of 0.1 μm -45 μm；The secondary shielding layer
2 with a thickness of 0.1 μm -45 μm.In order to guarantee that the first screen layer 1 and the secondary shielding layer 2 have good electric conductivity,
The first screen layer 1 includes one in metal screen layer, carbon nanotube shielded layer, ferrite shielded layer and graphene shielded layer
Kind is a variety of；The secondary shielding layer 2 includes metal screen layer, carbon nanotube shielded layer, ferrite shielded layer and graphene screen
Cover one of layer or a variety of.In addition, the metal screen layer includes monometallic shielded layer and/or alloy shielded layer；Wherein, institute
It states monometallic shielded layer to be made of any one material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, the alloy screen
Layer is covered to be made of two or more any material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
In the utility model embodiment, the first screen layer 1 includes the first surface 13 and the second table being oppositely arranged
Face 14, the first surface 13 are in contact with the secondary shielding layer 2；The second surface 14 connects with the protective film layer 4
Touching.It should be noted that the first surface 13 and second surface 14 can be the surface of any shape, for example, can be for such as
Flat surface shown in FIG. 1, or contoured non-smooth surface or other rough surfaces；In addition, the first surface
13 and second surface 14 can be rule surface, be also possible to irregular surface.The utility model attached drawing is only with described
One surface 13 and second surface 14 are that flat surface is illustrated, the first surface 13 of other any shapes and second
Surface 14 is within the protection scope of the utility model.
In the utility model embodiment, it should be noted that the first screen layer 1 of the present embodiment attached drawing and institute
Stating secondary shielding layer 2 all can be single layer structure, or multilayered structure.In addition, according to the needs of actual production and application,
The first screen layer 1 and secondary shielding layer 2 of the present embodiment attached drawing may be configured as latticed, foaming shape etc..
In the utility model embodiment, one of structure of the adhesive film 3, specific manifestation are as follows: the adhesive film 3
Including the adhesion layer containing conducting particles.By making the adhesive film 3 include the adhesion layer containing conducting particles, so that the glue
Film layer 3 has the function of bonding, so that terminal plate and the electromagnetic shielding film closely bind, while the adhesive film 3 also has
Conductive function, matches with the secondary shielding layer 2 and the first screen layer 1, will be described in interference electronics imports rapidly
In the stratum of terminal plate.Wherein, the conducting particles can be the conducting particles being separated from each other, or big made of reunion
Particle conducting particles；When the conducting particles is the conducting particles being separated from each other, the area of electrical contact can further improve,
Improve the uniformity of electrical contact；And bulky grain conducting particles made of being to reunite when the conducting particles, it is strong that puncture can be increased
Degree.
In the utility model embodiment, another structure of the adhesive film 3, specific manifestation are as follows: the adhesive film 3 wraps
Include the adhesion layer without conducting particles.By making the adhesive film 3 include the adhesion layer without conducting particles, so that the glue film
Layer 3 has the function of bonding, so that terminal plate and the electromagnetic shielding film closely bind, simultaneously because the adhesive film 3 includes
Without conducting particles, to reduce the insertion loss of wiring board in use process, improve wiring board while improving shield effectiveness
Bending.
In the utility model embodiment, the adhesive film 3 with a thickness of 1 μm -80 μm.3 material therefor of adhesive film
Selected from following several: modified epoxy class, acrylic compounds, modified rubber class, modified thermoplastic polyimide.In addition, institute
The outer surface for stating adhesive film 2 can be the flat surface without fluctuating, be also possible to the non-smooth surface gently to rise and fall.
As shown in Figure 1, in order to protect the first screen layer 1, electromagnetic shielding film described in the present embodiment further includes protection
Film layer 4, the protective film layer 4 are set to side of the first screen layer 1 far from the secondary shielding layer 2.The protective film layer 4
It plays a protective role, to guarantee that the first screen layer 1 is not scratched breakage in use, maintains first shielding
The high shield effectiveness of layer 1.The protective film layer 4 includes PPS film layer, PEN film layer, laminated polyester film, Kapton
Film layer that layer, the film layer that is formed after solidifying of epoxy resin ink, polyurethane ink are formed after solidifying, acrylic resin modified solidification
The film layer that the film layer or polyimide resin formed afterwards is formed after solidifying.
In the utility model embodiment, it should be noted that the electromagnetic shielding film can be duplicate multilayered structure.
Specifically, the electromagnetic shielding film can be including multiple first screen layers 1 being cascading, and by multiple described
The whole side that first screen layer 1 is formed is successively arranged the secondary shielding layer 2 and adhesive film 3, and the other side is equipped with the guarantor
Cuticular layer 4；Resin protrusion is equipped at the first through hole 11 in the first screen layer 1 being in contact with the secondary shielding layer 2
12, the secondary shielding layer 2 covers the resin protrusion 12, thus outer surface and the resin in the secondary shielding layer 2
The corresponding position of protrusion 12 forms lug boss 21, and the lug boss 21 protrudes into the adhesive film 2.
It is the structural schematic diagram of electromagnetic shielding film provided by the utility model embodiment 2 referring to Fig. 3；
As shown in figure 3, the electromagnetic shielding film in the present embodiment, the difference from embodiment 1 is that, the lug boss
21 surface is equipped with the conductive particles 22 of convex.By the way that the conductive particles 22 are arranged on the surface of the lug boss 21, so that
The lug boss 21 is easier to pierce through the adhesive film 3, to be grounded, improves the quality of electromagnetic shielding.
Preferably, on the position outwardly protruded on surface of 22 integrated distribution of conductive particles in the lug boss 21,
It is easier to pierce through the adhesive film 2 in this way.Certainly, the non-protrusion on the surface of the lug boss 21 can also have conductive particles 22 to divide
Cloth.In addition, the conductive particles 22 can also be distributed in the secondary shielding layer 2 close to the adhesive film 2 one side other
On position, and it is not only distributed in the surface of the lug boss 21, as shown in Figure 3.Certainly, the conductive particles 22 can also only divide
It is distributed in the lug boss 21.
In specific implementation, as shown in figure 3, the secondary shielding layer 2 can be initially formed, then pass through other techniques again
The conductive particles 22 are formed far from the side of the first screen layer 1 in the secondary shielding layer 2.Certainly, second screen
It covers layer 2 and conductive particles 22 is also possible to the overall structure formed by one-shot forming technique.Wherein, it should be noted that institute
22 integrated distribution of conductive particles is stated on the lug boss 21.
In the utility model embodiment, the conductive particles 22 can exist certain with the outer surface of the adhesive film 3
Distance can also be in contact with the outer surface of the adhesive film 3 or extend the outer surface of the adhesive film 3.
In the utility model embodiment, in order to further ensure that the lug boss 21 can smoothly pierce through the adhesive film
3, it is preferable that the height of the conductive particles 22 is 0.1 μm -30 μm.
In the utility model embodiment, the conductive particles 22 include metallic particles, carbon nanotube particulate and ferrite
One of particle is a variety of.In addition, the metallic particles includes monometallic particle and/or alloying pellet；Wherein, the Dan Jin
Metal particles are made of any one material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold, the alloying pellet by aluminium,
Two or more any material in titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold is made.Furthermore, it is necessary to explanation
It is that the conductive particles 22 can be identical as the material of the secondary shielding layer 2, it can not also be identical.
In the utility model embodiment, it should be noted that the shape of the conductive particles 22 as shown in Figure 3 is only
It is exemplary, due to the difference on process means and parameter, the conductive particles 22 can also be cluster-shaped, extension ice-like, clock
The other shapes such as mammary calculus shape, dendroid.In addition, the conductive particles 22 in the utility model are not illustrated and above-mentioned shape
Limitation, as long as have pierce through and conducting function conductive particles, both be within the protection scope of the present invention.
In the utility model embodiment, it should be noted that the electromagnetic shielding film can be duplicate multilayered structure；
Specifically, the electromagnetic shielding film can be including multiple first screen layers 1 being cascading, and by multiple described
The whole side that first screen layer 1 is formed is successively arranged the secondary shielding layer 2 and adhesive film 3, and the other side is equipped with the guarantor
Cuticular layer 4；Resin protrusion is equipped at the first through hole 11 in the first screen layer 1 being in contact with the secondary shielding layer 2
12, the secondary shielding layer 2 covers the resin protrusion 12, thus outer surface and the resin in the secondary shielding layer 2
The corresponding position of protrusion 12 forms lug boss 21, and the lug boss 21 protrudes into the adhesive film 2, and the surface of the lug boss 21
Equipped with the conductive particles 22.In addition, the other structures and working principle of the embodiment of the present invention electromagnetic shielding film and embodiment 1
It is identical, it does not do more repeat herein.
It referring to fig. 4, is the structural schematic diagram of wiring board provided by the utility model embodiment 3；
As shown in figure 4, it includes printed wiring board 5 and embodiment 1 that the utility model embodiment, which also provides a kind of wiring board,
The electromagnetic shielding film, the electromagnetic shielding film are pressed by its adhesive film 3 with 5 phase of printed wiring board；The protrusion
The adhesive film 3 is pierced through in portion 21, and extends to the stratum of the printed wiring board 5.
In the present embodiment, it can refer to the description of above-described embodiment 1 about the implementation of electromagnetic shielding film, herein no longer
It repeats.
Preferably, the printed wiring board 5 is flexible single-side, flexibility double face, flexible multi-layer plate, one in rigid-flex combined board
Kind.
In the utility model embodiment, by above structure, during the pressing process, using in the secondary shielding layer 2
The lug boss 21 adhesive film 3 is pierced through so that the secondary shielding layer 2 outer surface at least part and institute
The stratum connection for stating printed wiring board 5, so that realization will be done under the cooperation of the first screen layer 1 and secondary shielding layer 2
It disturbs charge to import in the stratum of wiring board, avoids the accumulation of interference charge and form interference source, to influence wiring board just
Often work.In addition, it should be noted that, the embodiment of the present invention wiring board can be by the institute of the embodiment 1 used in its structure
It states electromagnetic shielding film and replaces with electromagnetic shielding film as described in example 2, do not do more repeat herein.
It is the flow diagram of electromagnetic shielding membrane preparation method provided by the utility model embodiment 4 referring to Fig. 5；
As shown in figure 5, this method is suitable for the preparation of electromagnetic shielding film described in embodiment 1, comprising steps of
S1, first screen layer is formed；Wherein, the first screen layer has the first through hole through its upper and lower surface；
Wherein, the first screen layer is formed in the following manner in step sl:
Protective film layer is formed on a carrier film, forms the first screen layer in the side of the protective film layer；Or,
Strippable coating is formed on a carrier film, forms the first screen layer on the surface of the strippable coating, in institute
After first screen layer is stated far from the side formation protective film layer of the strippable coating, the carrier layer is removed.
In the utility model embodiment, the cross-sectional area of the first through hole is 0.1 μm2-1mm2；Every 1cm2It is described
The number of the first through hole in first screen layer is 10-1000.
S2, resin protrusion is formed at the first through hole；Wherein, the resin protrusion stretches out the first through hole；
Wherein, described that resin protrusion is formed at the first through hole specifically: resin is set at the first through hole,
And solidified after so that the resin is flow to the other side from the side of the first through hole, to form resin at the first through hole
Protrusion.Specifically, in a kind of wherein preferred embodiment, resin is set at the first through hole, and makes the resin in room temperature
Under flow to the other side from the side of the first through hole after, solidify at curing temperatures, to be formed at the first through hole
Resin protrusion；And in another preferred embodiment, resin is set at the first through hole, and makes the resin in fusion temperature
Under flow to the other side from the side of the first through hole after, through instantaneous cooling, thus at the first through hole formed resin it is convex
It rises.
S3, secondary shielding layer is formed in the side that the first screen layer is formed with the resin protrusion, and makes described the
Two shielded layers cover the resin protrusion, thus in the outer surface of secondary shielding layer position corresponding with the resin protrusion
Form lug boss；
S4, adhesive film is formed far from the side of the first screen layer in the secondary shielding layer.
Specifically, it is coated with adhesive film on release film, adhesive film pressing is then transferred to the secondary shielding layer
Side far from the first screen layer, to form glue film far from the side of the first screen layer in the secondary shielding layer
Layer；Or
It directly is coated with adhesive film far from the side of the first screen layer in the secondary shielding layer, thus described second
Shielded layer forms adhesive film far from the side of the first screen layer.
Suitable for another preferred embodiment for preparing electromagnetic shielding film as described in example 2, also wrapped before step S4
Include step:
It plated by physics feather plucking, chemical plating, physical vapour deposition (PVD), chemical vapor deposition, evaporation, sputter plating, be electroplated and is mixed
It closes one of plating or kinds of processes and forms conductive particles in the outer surface of the lug boss.
In the utility model embodiment, the preparation method of the electromagnetic shielding film, by the first screen layer shape
Secondary shielding layer is formed at the side for having the resin protrusion, while the secondary shielding layer being made to cover the resin protrusion, with
It realizes and forms lug boss in the outer surface of secondary shielding layer position corresponding with the resin protrusion, and in second screen
The side for covering layer forms the adhesive film, so that the lug boss formed can guarantee described the during pressing
Two shielded layers smoothly pierce through adhesive film, realize reliable ground connection, practical.
To sum up, the utility model embodiment provides the preparation method of a kind of electromagnetic shielding film, wiring board and electromagnetic shielding film,
Wherein, the electromagnetic shielding film includes first screen layer 1, secondary shielding layer 2 and adhesive film 3, and the first screen layer 1 is equipped with
Through the first through hole 11 of its upper and lower surface, resin protrusion 12 is equipped at the first through hole 11, the resin protrusion 12 is by setting
Rouge solidifies after flowing to the other side from the side of the first through hole 11 to be formed；The secondary shielding layer 2 is set to first shielding
Film 1 covers the resin protrusion 12 close to the side of the resin protrusion 12, thus in the appearance of the secondary shielding layer 2
Face position corresponding with the resin protrusion 12 forms lug boss 21；The adhesive film 3 is set to the secondary shielding layer 2 far from institute
The side of first screen layer 1 is stated, the lug boss 21 protrudes into the adhesive film 3.By the way that institute is arranged in the first screen layer 1
State first through hole 11, and after setting flow to the other side from the side of the first through hole 11 by resin at the first through hole 11
The resin protrusion 12 formed is solidified, while the secondary shielding layer 2 is set to first screened film 1 close to the resin
The side of protrusion 12, and the resin protrusion 12 is covered, thus convex in the outer surface of the secondary shielding layer 2 and the resin
It plays 12 corresponding positions and forms lug boss 21, and the adhesive film 3 is set to the secondary shielding layer 2 far from first shielding
The side of layer 1 enables the lug boss 21 to guarantee that the secondary shielding layer 2 successfully pierces through during pressing described
Adhesive film 3 to realize reliable ground connection, and then guarantees that interference charge normally exports, realizes high shielding.
The above is preferred embodiments of the present invention, it is noted that for the ordinary skill of the art
For personnel, without departing from the principle of this utility model, several improvements and modifications can also be made, these are improved and profit
Decorations are also considered as the protection scope of the utility model.
Claims (9)
1. a kind of electromagnetic shielding film, which is characterized in that including first screen layer, secondary shielding layer and adhesive film, first screen
Cover layer and be equipped with first through hole through its upper and lower surface, be equipped with resin protrusion at the first through hole, the resin protrusion by
Resin solidifies after flowing to the other side from the side of the first through hole to be formed；The secondary shielding layer is set to the first screen layer
Close to the side of the resin protrusion, and cover that the resin is raised, thus the secondary shielding layer outer surface with it is described
The corresponding position of resin protrusion forms lug boss；The adhesive film is set to the secondary shielding layer far from the first screen layer
Side, the lug boss protrude into the adhesive film.
2. electromagnetic shielding film as described in claim 1, which is characterized in that the resin protrusion is by resin at normal temperature from described
After the side of first through hole flow to the other side, solidification is formed at curing temperatures；Or,
After the resin protrusion flow to the other side from the side of the first through hole under fusion temperature by resin, through instantaneous cooling
It is formed.
3. electromagnetic shielding film as described in claim 1, which is characterized in that the surface of the lug boss is equipped with the conductor of convex
Grain；The height of the conductive particles is 0.1 μm -30 μm.
4. electromagnetic shielding film as described in claim 1, which is characterized in that the adhesive film includes sticking together containing conducting particles
Layer；Or,
The adhesive film includes the adhesion layer without conducting particles.
5. electromagnetic shielding film according to any one of claims 1-4, which is characterized in that the first screen layer and secondary shielding
Layer respectively includes one of metal screen layer, carbon nanotube shielded layer, ferrite shielded layer and graphene shielded layer.
6. electromagnetic shielding film as claimed in claim 5, which is characterized in that the metal screen layer includes monometallic shielded layer；
Wherein, the monometallic shielded layer is made of any one material in aluminium, titanium, zinc, iron, nickel, chromium, cobalt, copper, silver and gold.
7. electromagnetic shielding film according to any one of claims 1-4, which is characterized in that every 1cm2In the first screen layer
The number of the first through hole is 10-1000；And/or the cross-sectional area of the first through hole is 0.1 μm2-1mm2。
8. electromagnetic shielding film according to any one of claims 1-4, which is characterized in that the electromagnetic shielding film further includes protection
Film layer, the protective film layer are set to side of the first screen layer far from the secondary shielding layer.
9. a kind of wiring board, which is characterized in that including electromagnetic shielding described in printed wiring board and claim 1-8 any one
Film, the electromagnetic shielding film are mutually pressed by its adhesive film with the printed wiring board；The lug boss pierces through the adhesive film,
And extend to the stratum of the printed wiring board.
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|---|---|---|---|
| CN201821215028.7U CN208754593U (en) | 2018-07-27 | 2018-07-27 | Electromagnetic shielding film and wiring board |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201821215028.7U CN208754593U (en) | 2018-07-27 | 2018-07-27 | Electromagnetic shielding film and wiring board |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110769665A (en) * | 2018-07-27 | 2020-02-07 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
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2018
- 2018-07-27 CN CN201821215028.7U patent/CN208754593U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110769665A (en) * | 2018-07-27 | 2020-02-07 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
| CN110769665B (en) * | 2018-07-27 | 2023-12-05 | 广州方邦电子股份有限公司 | Electromagnetic shielding film, circuit board and preparation method of electromagnetic shielding film |
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